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Integrated Circuits
 Advantages of the integrated circuit
 Reliable with complex circuits
 Low power consumption
 Small size and weight
 Economical to produce
 New and better solutions to system problems
 Disadvantages of the integrated circuit
 Cannot handle large amounts of current or voltage
 Cannot be repaired
 Components of integrated circuits
 Diodes
 Transistors
 Resistors
 Capacitors
 Monolithic integrated circuits
 Formed on a circular silicon wafer substrate
 Thin-film integrated circuits
 Formed on surface of an insulating substrate
 Glass
 Ceramic
Figure 25-1. Integrated circuits on wafer.
 Thick-film construction
 Components are formed using a screen printing
process
 Hybrid integrated circuits
 Formed using monolithic, thin-film, thick-film, and
discrete components
Figure 25-2. Integrated circuit dual-inline packages.
Figure 25-3. Families of integrated circuits.
Figure 25-4. Warning labels printed on packaging
for devices that can be easily damaged by ESD.
 Integrated circuits are popular because they:
are reliable with complex circuits; consume
little power; are small and light; are
economical to produce; etc.
 Integrated circuits cannot handle large
amounts of current or voltage
 Only diodes, transistors, resistors, and
capacitors are available as ICs
 Integrated circuits are constructed by
monolithic, thin-film, thick-film, or hybrid
techniques
 The most popular integrated circuit package is
the DIP (dual-inline package)
 Electrostatic discharge (ESD) can damage
integrated circuits

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integrated circuits

  • 2.  Advantages of the integrated circuit  Reliable with complex circuits  Low power consumption  Small size and weight  Economical to produce  New and better solutions to system problems
  • 3.  Disadvantages of the integrated circuit  Cannot handle large amounts of current or voltage  Cannot be repaired
  • 4.  Components of integrated circuits  Diodes  Transistors  Resistors  Capacitors
  • 5.  Monolithic integrated circuits  Formed on a circular silicon wafer substrate  Thin-film integrated circuits  Formed on surface of an insulating substrate  Glass  Ceramic
  • 6. Figure 25-1. Integrated circuits on wafer.
  • 7.  Thick-film construction  Components are formed using a screen printing process  Hybrid integrated circuits  Formed using monolithic, thin-film, thick-film, and discrete components
  • 8. Figure 25-2. Integrated circuit dual-inline packages.
  • 9. Figure 25-3. Families of integrated circuits.
  • 10. Figure 25-4. Warning labels printed on packaging for devices that can be easily damaged by ESD.
  • 11.  Integrated circuits are popular because they: are reliable with complex circuits; consume little power; are small and light; are economical to produce; etc.  Integrated circuits cannot handle large amounts of current or voltage  Only diodes, transistors, resistors, and capacitors are available as ICs
  • 12.  Integrated circuits are constructed by monolithic, thin-film, thick-film, or hybrid techniques  The most popular integrated circuit package is the DIP (dual-inline package)  Electrostatic discharge (ESD) can damage integrated circuits