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Materials Science & Engineering (MSE) PhD lecture. 
Advanced Materials Synthesis. 
Thin Films. 
By Toru Hara, PhD 
Oct. 23, 2014 
1
Research history of the lecturer. 
1. Thin film capacitor 
Sputtering 
Chemical Solution Deposition (CSD) 
Chemical Vapor Deposition (CVD) 
O 
O e 
2 
Electric Current 
(From top electrode) 
Electric Current 
(From botom electrode) 
Dielectric material 
Magnetic Ffux 
Solder ball 
+ - + 
- 
2. Thin film oxygen sensor 
Electron-Beam Evaporation 
Sputtering 
Pulsed Laser Deposition (PLD) 
Atomic Layer Deposition (ALD) 
Sr 
O 
Sr 
O 
O 
Sr 
O 
Sr 
Sr 
O 
Sr 
O 
Ti 
O 
Ti 
3. Novel batteries (in progress) 
Plating 
Electrospray Deposition 
Polaron diameter 
Larger polaron diameter: 
Higher conductance 
(Lower resistance) 
Smaller polaron diameter: 
Lower conductance 
(Higher resistance) 
Film 
thickness 
TiO6 unit cell
Why thin film? 
3 
Flexible Solar Cell 
Smaller Electronic Circuit 
퐶 = Δ0Δ푟 
퐎 
푑 
C, Capacitance; 
Δ0, vacuum permittivity; 
Δr, relative dielectric constant of a material; 
A, electrode area; 
d: thickness of a dielectric material. 
The thinner the dielectric layer, the higher 
the capacitance  even small capacitors can 
give great enough capacitance. 
Polaron diameter 
Larger polaron diameter: 
Higher conductance 
(Lower resistance) 
Smaller polaron diameter: 
Lower conductance 
(Higher resistance) 
Film 
thickness 
TiO6 unit cell 
New functional device
Contents. 
Definition of thin films. 
General applications & Required theory. 
Brief introduction on each application. 
Thin film deposition technique as an advanced 
materials synthesis method 
Research topics. 
4
Definition of thin films. 
General applications & Required theory. 
Brief introduction on each application. 
Thin film deposition technique as an advanced 
materials synthesis method 
Research topics. 
5
Definition of thin films. 
A thin film is a layer of material ranging from 
fractions of a sub-nanometer to several micrometers in 
thickness. 
Help for imagining. 
Bulk: 1022-1023 atoms exist in 1.0*1.0*1.0 cm3 
Thin Film: 1015-1016 atoms exist in 1.0*1.0 cm2 
(one-atom-thick thin film) 
6
Definition of thin films. 
General applications & Required theory. 
Brief introduction on each application. 
Thin film deposition technique as an advanced 
materials synthesis method 
Research topics. 
7
General applications & Required theory. 
1. Electronic semiconductor devices 
Band engineering 
2. Optical coatings 
Refractive indices engineering 
3. Optoelectronic semiconductor devices 
Band engineering & 
Refractive indices engineering 
4. Quantum devices 
Quantum dynamics/design 
8
1. Electronic semiconductor devices 
Band engineering 
It uses semiconductor alloys, in which a wide-gap 
semiconductor and a narrow-gap semiconductor are combined 
to give a substance with a desired intermediate band gap. 
The left figure shows the 
band gaps and lattice 
parameters for some of the 
more common elemental and 
binary semiconductors. 
*The practical band 
engineering involves making 
ternary alloys such as 
(Ga,Al)As and (Hg,Cd)Te. 
9
2. Optical coatings 
Refractive indices engineering 
Optical transmission/reflection can be modulated by refractive 
indices engineering (destructive/constructive interferences). 
10 
http://www.intechopen.com/books/electromagnetic-waves/propagation-of-electromagnetic- 
waves-in-thin-dielectric-and-metallic-films
3. Optoelectronic semiconductor devices 
Band engineering & Refractive indices engineering 
Band gap modulation causes the refractive indices modulation 
at the same time, resulting in “optical guide.” 
http://www.tf.uni-kiel.de/matwis/amat/semitech_en/kap_2/backbone/r2_3_1.html 
http://optipedia.info/lsource-index/fiberlaser-index/fiber/parameters/numerical_aperture/ 
11
4. Quantum devices Quantum dynamics/design 
(L) Quantum well structure is made by the combination of a layer of a wider gap 
material such as (Ga,Al)As, and a very thin layer of a narrower gap material such as 
(GaAs). The narrower-gap material forms a one-dimensional potential well in the 
conduction and valence bands; thus, the electron and hole levels are bound states of the 
well, known as subbands. The well will contain three sets of subbands, the electron 
subbands, the light hole subbands and the heavy hole subbands. By intersubband 
absorption/emission of light realizes the use of long-wavelength light. The merits of 
quantum well structure are (1) all of the transitions are excitonic (i.e. sharp features at a 
well-defined energy, rather than broad edges), even at 300 K; (2) electrons and holes are 
held in close proximity, to encourage more efficient recombination in lasers and LEDs. 
(R) A superlattice contains a set of quantum wells which are sufficiently closely spaced 
for the carriers to tunnel between wells. The subbands will broaden out to form 
minibands with minigaps, resulting in the longer-wavelength (far-infrared) light 
12 
response.
Definition of thin films. 
General applications & Required theory. 
Brief introduction on each application. 
Thin film deposition technique as an advanced 
materials synthesis method 
Research topics. 
13
Brief introduction on each application. 
1. Electronic semiconductor devices 
Schematic diagrams of a GaAs metal-semiconductor 
field effect transistor (MESFET). Si3N4 is deposited by using 
Chemical Vapor deposition (CVD) in order to passivate the 
single-crystal-based GaAs electronic device. 
A. R. Barron, CVD of Nonmetals, Ed. W. S. Rees, Jr., Wiley, NY (1996). 
14
Brief introduction on each application. 
2. Optical coatings 
Optical coating films are deposited onto the substrate, 
which is a usually optically transparent glass, in order to 
modulate the optical reflection. Electron beam physical vapor 
deposition is often used in order to modulate the optical 
reflection. 
http://www.calctool.org/CALC/phys/optics/thin_film 
15
Brief introduction on each application. 
3. Optoelectronic semiconductor devices 
One of the most famous application is probably Light 
Emitting Diodes (LEDs) application. Each layer is deposited 
by Chemical Vapor Deposition (CVD). 
http://creativentechno.wordpress.com/2012/01/07/how-led-works/ 
16
Brief introduction on each application. 
17 
4. Quantum devices 
One of the important 
concept in order to realize 
quantum devices is the concept, 
“Superlattice.” This is a periodic 
structure of layers of two or more 
materials; the thickness of one 
layer is typically several 
nanometers. Molecular beam 
epitaxy (MBE) is a popular 
deposition technique in order to 
make superlattice structures. 
http://www.semiconductor-today. 
com/news_items/2011/FEB/MEIJO_0202 
11.htm
Definition of thin films. 
General applications & Required theory. 
Brief introduction on each application. 
Thin film deposition technique as an advanced 
materials synthesis method 
Research topics. 
18
Thin film deposition technique as an advanced 
materials synthesis method 
1. Chemical deposition 
2. Physical deposition 
19
Thin film deposition technique as an advanced 
materials synthesis method 
1. Chemical deposition 
Fluid/Gas precursor undergoes a chemical change at a 
solid surface, leaving a solid layer. 
20
Thin film deposition technique as an advanced 
materials synthesis method 
Various types of chemical deposition technique 
- Plating 
- Chemical Solution Deposition (CSD) 
- Chemical Vapor Deposition (CVD) 
- Atomic Layer Deposition (ALD) 
21
Plating 
(1)Liquid precursors (a solution of water with a salt of 
the metal to be deposited) are used. 
(2) Some plating processes are driven by reagents, 
e.g., reducing agents, in the solution. 
(3) Electroplating is done through the use of an 
external electron supply. Electroplating is a process in 
which a metal or two or more metals is/are reductively 
deposited onto the surface of a negatively biased 
electrode. 
22
http://worldofsecrets.org/en/2014/06/batte 
rie-von-bagdad/ 
This is the world oldest 
electroplating equipment that 
found in an ancient tomb in 
Bagdad in 1936. It consists of a 
14-centimeter-high egg-shaped 
clay jar with an asphalt stopper. 
An iron rod protruding out of 
the asphalt is the anode, which 
is surrounded by a copper 
cylinder used as the cathode. 
Filled with vinegar as an 
electrolytic solution. 
23
http://www.sparknotes.com/chemistry/ele 
ctrochemistry/electrolytic/section1.rhtml 
This is the setup for gold 
electroplating. At the cathode 
surface, Au3+ ion will be 
reduced into metal Au. 
Thanks to this technique, we 
can use golden spoons at an 
inexpensive cost. 
24
In today's nanoscience researches, electroplating is quite 
popular. This is the picture of electroelectroplated patterned 
surface. 
P. Kim et al., Nano Lett. ,12 (2012) 527–533. 
25 
5 ÎŒm
Electroplating can be used for novel battery research. At the 
conductive carbon fiber surface, nano-sized electrochemically 
active materials are directly plated: highly durable (expected 
life = 25 years) battery will be realized. 
http://toruhara.page.tl/_-Research-plan- 
26 
1.htm 
For this purpose, nano-crystals are 
preferred rather than thin films.
Chemical Solution Deposition (CSD) 
Chemical Bath Deposition (CBD) 
(1)Liquid precursor, usually a solution of 
organometallic powders dissolved in an organic 
solvent, are used in order to gain thin films. 
(2)This is a relatively inexpensive, simple thin film 
process that is able to produce stoichiometrically 
accurate crystalline phases. 
(3)This technique is also known as the sol-gel method 
because the 'sol' (or solution) gradually evolves 
towards the formation of a gel-like system. 
27
K Sarkar et al., J. Mater. Chem. A, 2 
(2014) 6945-6951. 
This is a schematic of the sol-gel 
process for zinc-oxide-based 
28 
solar cell. Onto the 
silicon substrate, a solution is 
spin-coated; then, dehydrated; 
and finally, calcinated.
Chemical vapor deposition (CVD) 
It uses a gas-phase precursor, often a halide or hydride 
of the element to be deposited. In the case of 
MOCVD, an organometallic gas is used. Commercial 
techniques often use very low pressures of precursor 
gas. 
29
This shows the schematic mechanism of CVD. Precursors 
deposit onto the substrate surface; then, surface reaction takes 
place; and finally, reaction products form thin films. 
http://cnx.org/contents/1096167b-8518-4159-a88d-3b2ae4df6645@9.4:35 
30
Atomic layer deposition (ALD) 
It uses gaseous precursor to deposit conformal thin 
films one layer at a time. The process is split up into 
two half reactions, run in sequence and repeated for 
each layer, in order to ensure total layer saturation 
before beginning the next layer. Therefore, one 
reactant is deposited first, and then the second reactant 
is deposited, during which a chemical reaction occurs 
on the substrate, forming the desired composition. 
31
This shows ALD process of Strontium Titanate thin film, (20- 
nm-thick) which is used for novel oxygen sensor [T. Hara et 
al., Sens. Actuators B 136 (2009) 489.]. 
32
Thin film deposition technique as an advanced 
materials synthesis method 
2. Physical deposition 
Mechanical, electromechanical or thermodynamic 
energy is used in order to produce a thin film of solid. 
Since most engineering materials are held together by 
relatively high energies, and chemical reactions are not 
used to store these energies, commercial physical 
deposition systems tend to require a low-pressure 
vapor environment to function properly; most can be 
classified as physical vapor deposition (PVD). 
33
Thin film deposition technique as an advanced 
materials synthesis method 
Various types of physical deposition technique 
- Thermal Evaporation 
- Electron-Beam Evaporation 
- Molecular Beam Epitaxy (MBE) 
- Sputtering 
- Pulsed Laser Deposition (PLD) 
- Cathodic Arc Deposition 
- Electrospray Deposition 
34
Thermal Evaporation 
It uses an electric resistance heater to melt the material 
and raise its vapor pressure to a useful range. This is 
done in a high vacuum, both to allow the vapor to 
reach the substrate without reacting with or scattering 
against other gas-phase atoms in the chamber, and 
reduce the incorporation of impurities from the 
residual gas in the vacuum chamber. 
35
This is the schematic of 
thermal evaporation 
equipment. Under the high 
vacuum atmosphere, heated 
material will evaporate and 
deposit onto the substrate. 
http://www.ece.utep.edu/research/cdte/Fab 
rication/index.htm 
36
Electron-Beam Evaporation 
It fires a high-energy beam from an electron gun to 
boil a small spot of material; since the heating is not 
uniform, lower vapor pressure materials can be 
deposited. The beam is usually bent through an angle 
of 270° in order to ensure that the gun filament is not 
directly exposed to the evaporant flux. 
37
This is the schematic of 
electron-beam evaporation 
equipment. Under the high 
vacuum atmosphere, heated 
material will evaporate and 
deposit onto the substrate. The 
difference between the 
thermal evaporation and 
electron-beam evaporation is 
the heating method. 
http://www.optics.rochester.edu/workgrou 
ps/cml/opt307/spr13/greg/ 
38
Molecular Beam Epitaxy (MBE) 
Slow streams of an element can be directed at the 
substrate, so that material deposits one atomic layer at 
a time. Compounds such as gallium arsenide are 
usually deposited by repeatedly applying a layer of 
one element (i.e., gallium), then a layer of the other 
(i.e., arsenic), so that the process is chemical, as well 
as physical. The beam of material can be generated by 
either physical means (that is, by a furnace) or by a 
chemical reaction (chemical beam epitaxy). 
39
This is the schematic of 
molecular beam epitaxy 
equipment. 
http://en.rusnano.com/portfolio/com 
panies/semiteq 
40
Sputtering 
It relies on a plasma (usually a noble gas, such as 
argon) to knock material from a "target" a few atoms 
at a time. The target can be kept at a relatively low 
temperature, since the process is not one of 
evaporation, making this one of the most flexible 
deposition techniques. It is especially useful for 
compounds or mixtures, where different components 
would otherwise tend to evaporate at different rates. 
41
This is the schematic of 
sputtering equipment. 
Argon atom is ionized 
into argon cation under 
static and/or alternative 
electric field; argon cation 
knocks the target surface; 
knocked atoms will be 
deposited onto the 
substrte. 
http://en.wikipedia.org/wiki/File:Spu 
ttering.gif 
42
Pulsed Laser Deposition 
This systems work by an ablation process. Pulses of 
focused laser light vaporize the surface of the target 
material and convert it to plasma; this plasma usually 
reverts to a gas before it reaches the substrate. 
43
This is the schematic of 
pulsed laser deposition 
equipment. Target 
materials are knocked by 
laser irraduiation, then, 
deposited onto the 
substrte. 
http://groups.ist.utl.pt/rschwarz/rsch 
warzgroup_files/PLD_files/PLD.ht 
m 
44
Cathodic Arc Deposition 
It is a kind of ion beam deposition where an electrical 
arc is created that literally blasts ions from the 
cathode. The arc has an extremely high power density 
resulting in a high level of ionization (30–100%), 
multiply charged ions, neutral particles, clusters and 
macro-particles (droplets). 
45
This is the schematic of 
pulsed laser deposition 
equipment. Target 
materials are set as a part 
of electrode, and 
evaporated by a plasma-induced 
excitation, then 
deposited onto the 
substrate. 
http://groups.ist.utl.pt/rschwarz/rsch 
warzgroup_files/PLD_files/PLD.ht 
m 
46
Electrospray deposition 
The liquid to be deposited, either in the form of nano-particle 
solution or simply a solution, is fed to a small capillary nozzle 
(usually metallic) which is connected to a high voltage. The 
substrate on which the film has to be deposited is connected to 
ground. Through the influence of electric field, the liquid 
coming out of the nozzle takes a conical shape and at the apex 
of the cone a thin jet emanates which disintegrates into very 
fine and small positively charged droplets. The droplets keep 
getting smaller and smaller and ultimately get deposited on the 
substrate as a uniform thin layer. 
47
This is the schematic of electrospray deposition equipment. (1) 
Precursors are fed to the nozzle. (2) The substrate is connected to ground. 
(3) Through the influence of electric field, the liquid coming out of the 
nozzle. (4) The liquid disintegrates into very fine and small positively 
charged droplets. The droplets keep getting smaller and smaller and (5) 
ultimately get deposited on the substrate as a uniform thin layer. 
http://www.nanowerk.com/spotlight/spotid=9685.php 
48 
(1) 
(4) (3) 
(2) 
(5)
Definition of thin films. 
General applications & Required theory. 
Brief introduction on each application. 
Thin film deposition technique as an advanced 
materials synthesis method 
Research topics. 
49
50 
Research Topics. 
L. Bovo et al., “Restoration of the third law in spin ice thin films,” Nat. Commun. DOI: 
10.1038/ncomms4439. 
Spin liquid found in the pyrochlore structure is the apparent violation of the third law of 
thermodynamics. The authors found that even in a pyrochlore compound the third law 
can be restored by fabricating thin epitaxial films: this restoration results from strain-induced 
(the lattice constant difference between the substrate and the film deposited 
onto the substrate) ordering of the spins. showing how the physics of frustrated 
pyrochlore magnets such as spin ice may be significantly modified in thin-film samples.
51 
Research Topics. 
http://phys.org/news204201232.html 
The third law of thermodynamics 
is sometimes stated as follows, 
regarding the properties of 
systems in equilibrium at absolute 
zero temperature: the entropy of a 
perfect crystal, at absolute zero 
(zero kelvins), is exactly equal to 
zero. However, the large quantum 
fluctuation of the magnetic spins 
(see, it is tetrahedral) melt the spin 
ice structure and form the spin 
liquid (or spin liquid-crystal).
52 
Research Topics. 
T. Hara et al., “Effect of Oxygen Adsorption on Polaron Conduction in Nanometer- 
Scale Nb5+-, Fe3+-, and Cr3+-Doped SrTiO3 Thin Films,” Jpn. J. Appl. Phys., 50 (2011) 
065807. 
The polaron diameter in SrTiO3-based epitaxial thin films decreases owing to oxygen 
adsorption, resulting in the decrease in electronic conductivity; this can be understood 
by assuming that oxygen adsorbates induce local distortions of TiO6 unit cells at which 
conduction electrons are frequently trapped.
53 
Research Topics.
54 
Research Topics. 
What was new? 
Although SrTiO3 is 
paraelectric, 
near the surface of STO 
adsorbed oxygen can 
induce the 
ferroelectric-like 
Ionic displacement. 
Sr 
O 
Sr 
O 
O 
Sr 
O 
Sr 
Sr 
O 
Sr 
O 
O e 
O 
Ti 
O 
Ti

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MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.

  • 1. Materials Science & Engineering (MSE) PhD lecture. Advanced Materials Synthesis. Thin Films. By Toru Hara, PhD Oct. 23, 2014 1
  • 2. Research history of the lecturer. 1. Thin film capacitor Sputtering Chemical Solution Deposition (CSD) Chemical Vapor Deposition (CVD) O O e 2 Electric Current (From top electrode) Electric Current (From botom electrode) Dielectric material Magnetic Ffux Solder ball + - + - 2. Thin film oxygen sensor Electron-Beam Evaporation Sputtering Pulsed Laser Deposition (PLD) Atomic Layer Deposition (ALD) Sr O Sr O O Sr O Sr Sr O Sr O Ti O Ti 3. Novel batteries (in progress) Plating Electrospray Deposition Polaron diameter Larger polaron diameter: Higher conductance (Lower resistance) Smaller polaron diameter: Lower conductance (Higher resistance) Film thickness TiO6 unit cell
  • 3. Why thin film? 3 Flexible Solar Cell Smaller Electronic Circuit 퐶 = Δ0Δ푟 퐎 푑 C, Capacitance; Δ0, vacuum permittivity; Δr, relative dielectric constant of a material; A, electrode area; d: thickness of a dielectric material. The thinner the dielectric layer, the higher the capacitance  even small capacitors can give great enough capacitance. Polaron diameter Larger polaron diameter: Higher conductance (Lower resistance) Smaller polaron diameter: Lower conductance (Higher resistance) Film thickness TiO6 unit cell New functional device
  • 4. Contents. Definition of thin films. General applications & Required theory. Brief introduction on each application. Thin film deposition technique as an advanced materials synthesis method Research topics. 4
  • 5. Definition of thin films. General applications & Required theory. Brief introduction on each application. Thin film deposition technique as an advanced materials synthesis method Research topics. 5
  • 6. Definition of thin films. A thin film is a layer of material ranging from fractions of a sub-nanometer to several micrometers in thickness. Help for imagining. Bulk: 1022-1023 atoms exist in 1.0*1.0*1.0 cm3 Thin Film: 1015-1016 atoms exist in 1.0*1.0 cm2 (one-atom-thick thin film) 6
  • 7. Definition of thin films. General applications & Required theory. Brief introduction on each application. Thin film deposition technique as an advanced materials synthesis method Research topics. 7
  • 8. General applications & Required theory. 1. Electronic semiconductor devices Band engineering 2. Optical coatings Refractive indices engineering 3. Optoelectronic semiconductor devices Band engineering & Refractive indices engineering 4. Quantum devices Quantum dynamics/design 8
  • 9. 1. Electronic semiconductor devices Band engineering It uses semiconductor alloys, in which a wide-gap semiconductor and a narrow-gap semiconductor are combined to give a substance with a desired intermediate band gap. The left figure shows the band gaps and lattice parameters for some of the more common elemental and binary semiconductors. *The practical band engineering involves making ternary alloys such as (Ga,Al)As and (Hg,Cd)Te. 9
  • 10. 2. Optical coatings Refractive indices engineering Optical transmission/reflection can be modulated by refractive indices engineering (destructive/constructive interferences). 10 http://www.intechopen.com/books/electromagnetic-waves/propagation-of-electromagnetic- waves-in-thin-dielectric-and-metallic-films
  • 11. 3. Optoelectronic semiconductor devices Band engineering & Refractive indices engineering Band gap modulation causes the refractive indices modulation at the same time, resulting in “optical guide.” http://www.tf.uni-kiel.de/matwis/amat/semitech_en/kap_2/backbone/r2_3_1.html http://optipedia.info/lsource-index/fiberlaser-index/fiber/parameters/numerical_aperture/ 11
  • 12. 4. Quantum devices Quantum dynamics/design (L) Quantum well structure is made by the combination of a layer of a wider gap material such as (Ga,Al)As, and a very thin layer of a narrower gap material such as (GaAs). The narrower-gap material forms a one-dimensional potential well in the conduction and valence bands; thus, the electron and hole levels are bound states of the well, known as subbands. The well will contain three sets of subbands, the electron subbands, the light hole subbands and the heavy hole subbands. By intersubband absorption/emission of light realizes the use of long-wavelength light. The merits of quantum well structure are (1) all of the transitions are excitonic (i.e. sharp features at a well-defined energy, rather than broad edges), even at 300 K; (2) electrons and holes are held in close proximity, to encourage more efficient recombination in lasers and LEDs. (R) A superlattice contains a set of quantum wells which are sufficiently closely spaced for the carriers to tunnel between wells. The subbands will broaden out to form minibands with minigaps, resulting in the longer-wavelength (far-infrared) light 12 response.
  • 13. Definition of thin films. General applications & Required theory. Brief introduction on each application. Thin film deposition technique as an advanced materials synthesis method Research topics. 13
  • 14. Brief introduction on each application. 1. Electronic semiconductor devices Schematic diagrams of a GaAs metal-semiconductor field effect transistor (MESFET). Si3N4 is deposited by using Chemical Vapor deposition (CVD) in order to passivate the single-crystal-based GaAs electronic device. A. R. Barron, CVD of Nonmetals, Ed. W. S. Rees, Jr., Wiley, NY (1996). 14
  • 15. Brief introduction on each application. 2. Optical coatings Optical coating films are deposited onto the substrate, which is a usually optically transparent glass, in order to modulate the optical reflection. Electron beam physical vapor deposition is often used in order to modulate the optical reflection. http://www.calctool.org/CALC/phys/optics/thin_film 15
  • 16. Brief introduction on each application. 3. Optoelectronic semiconductor devices One of the most famous application is probably Light Emitting Diodes (LEDs) application. Each layer is deposited by Chemical Vapor Deposition (CVD). http://creativentechno.wordpress.com/2012/01/07/how-led-works/ 16
  • 17. Brief introduction on each application. 17 4. Quantum devices One of the important concept in order to realize quantum devices is the concept, “Superlattice.” This is a periodic structure of layers of two or more materials; the thickness of one layer is typically several nanometers. Molecular beam epitaxy (MBE) is a popular deposition technique in order to make superlattice structures. http://www.semiconductor-today. com/news_items/2011/FEB/MEIJO_0202 11.htm
  • 18. Definition of thin films. General applications & Required theory. Brief introduction on each application. Thin film deposition technique as an advanced materials synthesis method Research topics. 18
  • 19. Thin film deposition technique as an advanced materials synthesis method 1. Chemical deposition 2. Physical deposition 19
  • 20. Thin film deposition technique as an advanced materials synthesis method 1. Chemical deposition Fluid/Gas precursor undergoes a chemical change at a solid surface, leaving a solid layer. 20
  • 21. Thin film deposition technique as an advanced materials synthesis method Various types of chemical deposition technique - Plating - Chemical Solution Deposition (CSD) - Chemical Vapor Deposition (CVD) - Atomic Layer Deposition (ALD) 21
  • 22. Plating (1)Liquid precursors (a solution of water with a salt of the metal to be deposited) are used. (2) Some plating processes are driven by reagents, e.g., reducing agents, in the solution. (3) Electroplating is done through the use of an external electron supply. Electroplating is a process in which a metal or two or more metals is/are reductively deposited onto the surface of a negatively biased electrode. 22
  • 23. http://worldofsecrets.org/en/2014/06/batte rie-von-bagdad/ This is the world oldest electroplating equipment that found in an ancient tomb in Bagdad in 1936. It consists of a 14-centimeter-high egg-shaped clay jar with an asphalt stopper. An iron rod protruding out of the asphalt is the anode, which is surrounded by a copper cylinder used as the cathode. Filled with vinegar as an electrolytic solution. 23
  • 24. http://www.sparknotes.com/chemistry/ele ctrochemistry/electrolytic/section1.rhtml This is the setup for gold electroplating. At the cathode surface, Au3+ ion will be reduced into metal Au. Thanks to this technique, we can use golden spoons at an inexpensive cost. 24
  • 25. In today's nanoscience researches, electroplating is quite popular. This is the picture of electroelectroplated patterned surface. P. Kim et al., Nano Lett. ,12 (2012) 527–533. 25 5 ÎŒm
  • 26. Electroplating can be used for novel battery research. At the conductive carbon fiber surface, nano-sized electrochemically active materials are directly plated: highly durable (expected life = 25 years) battery will be realized. http://toruhara.page.tl/_-Research-plan- 26 1.htm For this purpose, nano-crystals are preferred rather than thin films.
  • 27. Chemical Solution Deposition (CSD) Chemical Bath Deposition (CBD) (1)Liquid precursor, usually a solution of organometallic powders dissolved in an organic solvent, are used in order to gain thin films. (2)This is a relatively inexpensive, simple thin film process that is able to produce stoichiometrically accurate crystalline phases. (3)This technique is also known as the sol-gel method because the 'sol' (or solution) gradually evolves towards the formation of a gel-like system. 27
  • 28. K Sarkar et al., J. Mater. Chem. A, 2 (2014) 6945-6951. This is a schematic of the sol-gel process for zinc-oxide-based 28 solar cell. Onto the silicon substrate, a solution is spin-coated; then, dehydrated; and finally, calcinated.
  • 29. Chemical vapor deposition (CVD) It uses a gas-phase precursor, often a halide or hydride of the element to be deposited. In the case of MOCVD, an organometallic gas is used. Commercial techniques often use very low pressures of precursor gas. 29
  • 30. This shows the schematic mechanism of CVD. Precursors deposit onto the substrate surface; then, surface reaction takes place; and finally, reaction products form thin films. http://cnx.org/contents/1096167b-8518-4159-a88d-3b2ae4df6645@9.4:35 30
  • 31. Atomic layer deposition (ALD) It uses gaseous precursor to deposit conformal thin films one layer at a time. The process is split up into two half reactions, run in sequence and repeated for each layer, in order to ensure total layer saturation before beginning the next layer. Therefore, one reactant is deposited first, and then the second reactant is deposited, during which a chemical reaction occurs on the substrate, forming the desired composition. 31
  • 32. This shows ALD process of Strontium Titanate thin film, (20- nm-thick) which is used for novel oxygen sensor [T. Hara et al., Sens. Actuators B 136 (2009) 489.]. 32
  • 33. Thin film deposition technique as an advanced materials synthesis method 2. Physical deposition Mechanical, electromechanical or thermodynamic energy is used in order to produce a thin film of solid. Since most engineering materials are held together by relatively high energies, and chemical reactions are not used to store these energies, commercial physical deposition systems tend to require a low-pressure vapor environment to function properly; most can be classified as physical vapor deposition (PVD). 33
  • 34. Thin film deposition technique as an advanced materials synthesis method Various types of physical deposition technique - Thermal Evaporation - Electron-Beam Evaporation - Molecular Beam Epitaxy (MBE) - Sputtering - Pulsed Laser Deposition (PLD) - Cathodic Arc Deposition - Electrospray Deposition 34
  • 35. Thermal Evaporation It uses an electric resistance heater to melt the material and raise its vapor pressure to a useful range. This is done in a high vacuum, both to allow the vapor to reach the substrate without reacting with or scattering against other gas-phase atoms in the chamber, and reduce the incorporation of impurities from the residual gas in the vacuum chamber. 35
  • 36. This is the schematic of thermal evaporation equipment. Under the high vacuum atmosphere, heated material will evaporate and deposit onto the substrate. http://www.ece.utep.edu/research/cdte/Fab rication/index.htm 36
  • 37. Electron-Beam Evaporation It fires a high-energy beam from an electron gun to boil a small spot of material; since the heating is not uniform, lower vapor pressure materials can be deposited. The beam is usually bent through an angle of 270° in order to ensure that the gun filament is not directly exposed to the evaporant flux. 37
  • 38. This is the schematic of electron-beam evaporation equipment. Under the high vacuum atmosphere, heated material will evaporate and deposit onto the substrate. The difference between the thermal evaporation and electron-beam evaporation is the heating method. http://www.optics.rochester.edu/workgrou ps/cml/opt307/spr13/greg/ 38
  • 39. Molecular Beam Epitaxy (MBE) Slow streams of an element can be directed at the substrate, so that material deposits one atomic layer at a time. Compounds such as gallium arsenide are usually deposited by repeatedly applying a layer of one element (i.e., gallium), then a layer of the other (i.e., arsenic), so that the process is chemical, as well as physical. The beam of material can be generated by either physical means (that is, by a furnace) or by a chemical reaction (chemical beam epitaxy). 39
  • 40. This is the schematic of molecular beam epitaxy equipment. http://en.rusnano.com/portfolio/com panies/semiteq 40
  • 41. Sputtering It relies on a plasma (usually a noble gas, such as argon) to knock material from a "target" a few atoms at a time. The target can be kept at a relatively low temperature, since the process is not one of evaporation, making this one of the most flexible deposition techniques. It is especially useful for compounds or mixtures, where different components would otherwise tend to evaporate at different rates. 41
  • 42. This is the schematic of sputtering equipment. Argon atom is ionized into argon cation under static and/or alternative electric field; argon cation knocks the target surface; knocked atoms will be deposited onto the substrte. http://en.wikipedia.org/wiki/File:Spu ttering.gif 42
  • 43. Pulsed Laser Deposition This systems work by an ablation process. Pulses of focused laser light vaporize the surface of the target material and convert it to plasma; this plasma usually reverts to a gas before it reaches the substrate. 43
  • 44. This is the schematic of pulsed laser deposition equipment. Target materials are knocked by laser irraduiation, then, deposited onto the substrte. http://groups.ist.utl.pt/rschwarz/rsch warzgroup_files/PLD_files/PLD.ht m 44
  • 45. Cathodic Arc Deposition It is a kind of ion beam deposition where an electrical arc is created that literally blasts ions from the cathode. The arc has an extremely high power density resulting in a high level of ionization (30–100%), multiply charged ions, neutral particles, clusters and macro-particles (droplets). 45
  • 46. This is the schematic of pulsed laser deposition equipment. Target materials are set as a part of electrode, and evaporated by a plasma-induced excitation, then deposited onto the substrate. http://groups.ist.utl.pt/rschwarz/rsch warzgroup_files/PLD_files/PLD.ht m 46
  • 47. Electrospray deposition The liquid to be deposited, either in the form of nano-particle solution or simply a solution, is fed to a small capillary nozzle (usually metallic) which is connected to a high voltage. The substrate on which the film has to be deposited is connected to ground. Through the influence of electric field, the liquid coming out of the nozzle takes a conical shape and at the apex of the cone a thin jet emanates which disintegrates into very fine and small positively charged droplets. The droplets keep getting smaller and smaller and ultimately get deposited on the substrate as a uniform thin layer. 47
  • 48. This is the schematic of electrospray deposition equipment. (1) Precursors are fed to the nozzle. (2) The substrate is connected to ground. (3) Through the influence of electric field, the liquid coming out of the nozzle. (4) The liquid disintegrates into very fine and small positively charged droplets. The droplets keep getting smaller and smaller and (5) ultimately get deposited on the substrate as a uniform thin layer. http://www.nanowerk.com/spotlight/spotid=9685.php 48 (1) (4) (3) (2) (5)
  • 49. Definition of thin films. General applications & Required theory. Brief introduction on each application. Thin film deposition technique as an advanced materials synthesis method Research topics. 49
  • 50. 50 Research Topics. L. Bovo et al., “Restoration of the third law in spin ice thin films,” Nat. Commun. DOI: 10.1038/ncomms4439. Spin liquid found in the pyrochlore structure is the apparent violation of the third law of thermodynamics. The authors found that even in a pyrochlore compound the third law can be restored by fabricating thin epitaxial films: this restoration results from strain-induced (the lattice constant difference between the substrate and the film deposited onto the substrate) ordering of the spins. showing how the physics of frustrated pyrochlore magnets such as spin ice may be significantly modified in thin-film samples.
  • 51. 51 Research Topics. http://phys.org/news204201232.html The third law of thermodynamics is sometimes stated as follows, regarding the properties of systems in equilibrium at absolute zero temperature: the entropy of a perfect crystal, at absolute zero (zero kelvins), is exactly equal to zero. However, the large quantum fluctuation of the magnetic spins (see, it is tetrahedral) melt the spin ice structure and form the spin liquid (or spin liquid-crystal).
  • 52. 52 Research Topics. T. Hara et al., “Effect of Oxygen Adsorption on Polaron Conduction in Nanometer- Scale Nb5+-, Fe3+-, and Cr3+-Doped SrTiO3 Thin Films,” Jpn. J. Appl. Phys., 50 (2011) 065807. The polaron diameter in SrTiO3-based epitaxial thin films decreases owing to oxygen adsorption, resulting in the decrease in electronic conductivity; this can be understood by assuming that oxygen adsorbates induce local distortions of TiO6 unit cells at which conduction electrons are frequently trapped.
  • 54. 54 Research Topics. What was new? Although SrTiO3 is paraelectric, near the surface of STO adsorbed oxygen can induce the ferroelectric-like Ionic displacement. Sr O Sr O O Sr O Sr Sr O Sr O O e O Ti O Ti