This document provides information about logic families and semiconductors. It discusses the characteristics of different logic families including logic levels, power dissipation, propagation delay, noise margin, and fan-out. It describes transistor types used to implement logic circuits like BJT, MOSFET, NMOS, and PMOS. It discusses concepts like Moore's Law, transistor size scaling, TTL, CMOS logic families. It defines electrical parameters for logic gates like voltage and current levels, noise margins, propagation delay, power dissipation, and fan-out. It provides comparisons of different logic families and an overview of logic gate integration levels from SSI to VLSI.
1. Unit:4 Logic families &
Semiconductors
Basics of Digital Electronics
Course: B.Sc.(CS)
Sem.:1st
2. Logic FamiliesLogic Families
Logic Family :A collection of different IC’s that have
similar circuit characteristics
The circuit design of the basic gate of each logic family
is the same
The most important parameters for evaluating and
comparing logic families include :
Logic Levels
Power Dissipation
Propagation delay
Noise margin
Fan-out ( loading )
3. Example Logic FamiliesExample Logic Families
General comparison or three commonly available logic
families.
the most important to understand
4. Implementing Logic CircuitsImplementing Logic Circuits
There are several varieties of transistors – the
building blocks of logic gates – the most important
are:
BJT (bipolar junction transistors)
one of the first to be invented
FET (field effect transistors)
especially Metal-Oxide Semiconductor types (MOSFET’s)
MOSFET’s are of two types: NMOS and PMOS
5. Transistor Size ScalingTransistor Size Scaling
Performance improves as size is decreased: shorter switching
time, lower power consumption.
2 orders of magnitude reduction in transistor size
in 30 years.
6. Moore’s LawMoore’s Law
In 1965, Gordon Moore predicted that the number of
transistors that can be integrated on a die would
double every 18 to 14 months
i.e., grow exponentially with time
Considered a visionary – million transistor/chip
barrier was crossed in the 1980’s
2300 transistors, 1 MHz clock (Intel 4004/4040) -
1971
42 Million transistors, 2 GHz clock (Intel P4) - 2001
140 Million transistors, (HP PA-8500)
7. Moore’s Law and IntelMoore’s Law and Intel
From Intel’s 4040 (2300 transistors) to Pentium II
(7,500,000 transistors) and beyond
8. TTL and CMOSTTL and CMOS
Connecting BJT’s together gives rise to a family of logic gates
known as TTL
Connecting NMOS and PMOS transistors together gives rise
to the CMOS family of logic gates
BJT
MOSFET
(NMOS, PMOS)
TTL CMOS
transistor types
logic gate families
9. Electrical Parameters And InterpretationElectrical Parameters And Interpretation
Of Data SheetsOf Data Sheets
Voltages and Currents
Noise Margin
Power Dissipation
Propagation Delay
Speed-Power Product
Fan-In, Fan-Out
Comparison of Logic Families
Interpretation of Data Sheets
10. Electrical CharacteristicsElectrical Characteristics
TTL
faster (some versions)
strong drive capability
rugged
CMOS
lower power consumption
simpler to make
greater packing density
better noise immunity
• Complex IC’s contain many millions of transistors
• If constructed entirely from TTL type gates would melt
• A combination of technologies (families) may be used
• CMOS has become most popular and has had greatest development
11. Voltage & CurrentVoltage & Current
For a High-state gate driving a second gate, we define:
VOH (min), high-level output voltage, the minimum voltage
level that a logic gate will produce as a logic 1 output.
VIH (min), high-level input voltage, the minimum voltage
level that a logic gate will recognize as a logic 1 input.
Voltage below this level will not be accepted as high.
IOH, high-level output current, current that flows from an
output in the logic 1 state under specified load conditions.
IIH, high-level input current, current that flows into an input
when a logic 1 voltage is applied to that input.
Ground
VIH
VOH
IOH IIH
Test setup for
measuring values
12. Voltage & CurrentVoltage & Current
For a Low-state gate driving a second gate, we define:
VOL (max), low-level output voltage, the maximum voltage
level that a logic gate will produce as a logic 0 output.
VIL (max), low-level input voltage, the maximum voltage
level that a logic gate will recognize as a logic 0 input.
Voltage above this value will not be accepted as low.
IOL , low-level output current, current that flows from an
output in the logic 0 state under specified load conditions.
IIL , low-level input current, current that flows into an input
when a logic 0 voltage is applied to that input.
Inputs are
connected to Vcc
instead of
Ground
Ground
V IL
VOL
I OL I IL
13. Electrical CharacteristicsElectrical Characteristics
Important characteristics are:
VOHmin min value of output recognized as a ‘1’
VIHmin min value input recognized as a ‘1’
VILmax max value of input recognized as a ‘0’
VOLmax max value of output recognized as a ‘0’
Values outside the given range are not allowed.
logic 0logic 0
logic 1logic 1
indeterminateindeterminate
input voltageinput voltage
14. Logic Level & Voltage RangeLogic Level & Voltage Range
Typical acceptable voltage ranges for positive logic 1 and
logic 0 are shown below
A logic gate with an input at a voltage level within the
‘indeterminate’ range will produce an unpredictable output
level.
Logic 1
Logic 0
5.0V
0V
2.5V
Indeterminate
0.8V
TTL
Logic 1
Logic 0
5.0V
Indeterminate
0V
1.5V
CMOS
3.5V
15. Noise MarginNoise Margin
Manufacturers specify voltage limits to represent the logical 0
or 1.
These limits are not the same at the input and output sides.
For example, a particular Gate A may output a voltage of
4.8V when it is supposed to output a HIGH but, at its
input side, it can take a voltage of 3V as HIGH.
In this way, if any noise should corrupt the signal, there is
some margin for error.
16. Noise MarginNoise Margin
If noise in the circuit is high enough
it can push a logic 0 up or drop a
logic 1 down into the indeterminate
or “illegal” region
The magnitude of the voltage
required to reach this level is the
noise margin
Noise margin for logic high is:
NMH =VOHmin –VIHmin
VOHmin
VIHmin
VILmax
VOLmax
logic 0logic 0
logic 1logic 1
indeterminateindeterminate
input voltageinput voltage
17. Noise MarginNoise Margin
Difference between the worst case output voltage of
one stage and worst case input voltage of next stage
Greater the difference, the more unwanted signal that
can be added without causing incorrect gate
operation
NMNMhighhigh = V= VOHminOHmin - V- VIHminIHmin
NMNMlowlow = V= VILmaxILmax - V- VOLmaxOLmax
18. Worked ExampleWorked Example
Given the following parameters, calculate the noise
margin of 74LS series.
Parameter 74LS
VIH(min) 2V
VIL(max) 0.8V
VOH(min) 2.7V
VOL(max) 0.4V
Solution:
High Level Noise Margin, VNH = VOH (min) - VIH (min)=2.7V-2.0V=0.7V
Low Level Noise Margin, VNL = VIL (max) - VOL (max)=0.8V-0.4V=0.4V
19. Noise Margin & Noise ImmunityNoise Margin & Noise Immunity
Noise immunity of a logic circuit refers to the
circuit’s ability to tolerate noise voltages on its inputs.
A quantitative measure of noise immunity is called
noise margin
High Level Noise Margin,VNH =VOH (min) -VIH (min)
Low Level Noise Margin,VNL =VIL (max) -VOL (max)
Logic 1
Logic 0
Logic 0
Logic 1
VOH (min)
VOL (max)
VIH (min)
VIL (max)
VNH
VNL
Output Voltage Ranges Input Voltage Ranges
20. Further Important CharacteristicsFurther Important Characteristics
The propagation delay (tpd) which is the time taken
for a change at the input to appear at the output
The fan-out, which is the maximum number of
inputs that can be driven successfully to either
logic level before the output becomes invalid
21. Speed: Rise & Fall TimesSpeed: Rise & Fall Times
Rise Time
Time from 10% to 90% of signal, Low to High
Fall Time
Time from 90% to 10% of signal, High to Low
rise time
10% 90% 90% 10%
fall time
22. Speed: Propagation DelaySpeed: Propagation Delay
A logic gate always takes some time to change states
tPLH is the delay time before output changes from low to high
tPHL is the delay time before output changes from high to low
both tPLH & tPHL are measured between the 50% points on the
input and output transitions
50%
Input
Output
0
0
tPHL tPLH
23. Power DissipationPower Dissipation
Static
I2
R losses due to passive components, no input signal
Dynamic
I2
R losses due to charging and discharging capacitances through
resistances, due to input signal
24. Speed-Power ProductSpeed-Power Product
Speed (propagation delay) and power consumption are
the two most important performance parameters of a
digital IC.
A simple means for measuring and comparing the overall
performance of an IC family is the speed-power product
(the smaller, the better).
For example, an IC has
an average propagation delay of 10 ns
an average power dissipation of 5 mW
the speed-power product = (10 ns) x (5 mW)
= 50 picoJoules (pJ)
25. Logic Family TradeoffsLogic Family Tradeoffs
Looking for the best
speed/power product
tp and Pd are normally
included in the data
sheet for each device
Older logic families
are the worst
CMOS is one of the
best
FPGAs use CMOS
27. TTL -TTL - ExampleExample SN74LS00SN74LS00
Recommended operating conditions
Vcc supply voltage 5V ± 0.5V
input voltages VIH = 2V
VIL = 0.8V
Electrical Characteristics
output voltage VOH = 2.7V
(worst case) VOL = 0.5V
max input currents IIH = 20µA
IIL = -0.4mA
propagation delay tpd = 15 nS
noise margins for a logic 0 = 0.3V
for a logic 1 = 0.7V
Fan-out 20 TTL loads
5 Volt
0 Volt
0.8
0.5
2.0
2.7
Input
Range
for 1
Input
Range
for 0
Output
Range
for 0
Output
Range
for 1
28. Fan-InFan-In
Number of input signals to a gate
Not an electrical property
Function of the manufacturing process
NAND gate with a
Fan-in of 8
29. Fan-OutFan-Out
A measure of the ability of the output of one gate to
drive the input(s) of subsequent gates
Usually specified as standard loads within a single family
e.g., an input to an inverter in the same family
May have to compute based on current drive
requirements when mixing families
Although mixing families is not usually recommended
30. VOH
IIH
Low
VOL
IIL
High
Current Sourcing and SinkingCurrent Sourcing and Sinking
Current-source : the driving gate produces a outgoing
current
Current-sinking : the driving gate receives an incoming
current
32. Worked ExampleWorked Example
How many 74LS00 NAND gate inputs can be driven by a
74LS00 NAND gate outputs ?
Solution:
Refer to data sheet of 74LS00, the maximum values of
IOH = 0.4mA, IOL = 8mA, IIH = 20uA, and IIL = 0.4mA
Hence,
fan-out(high) = IOH(max) / IIH (max)=0.4mA/20uA=20
fan-out(low) = IOL(max) / IIL(max)=8mA/0.4mA=20,
the overall fan-out = fan-out(high) or fan-out(low) whichever is lower.
Hence, overall fan-out = 20
33. Gate Drive Capability: Fan-OutGate Drive Capability: Fan-Out
A logic gate can supply a maximum output current
IOH(max), in the high state or
IOL(max), in the low state
A logic gate requires a maximum input current
IIH(max), in the high state or
IIL(max), in the low state
Ratio of output and input current decide how many logic
gates can be driven by a logic gate
fan-out(high) = IOH(max) / IIH (max)
fan-out(low) = IOL(max) / IIL(max)
overall fan-out = fan-out(high) or fan-out(low) whichever
is lower
A typical figure of fan-out is ten (10)
34. Wired-ANDWired-AND
Open collector outputs connected together to a common
pull-up resistor
Any collector can pull the signal line low
Logically an AND gate
35. Tri-State LogicTri-State Logic
Both output transistors of totem-pole output are turned
off
Usually used to bus multiple signals on the same wire
Gates not enabled present high-Z to bus and therefore do
not interfere with other gates putting signals on the bus
36. Tri-State LogicTri-State Logic
Tri-state logic includes a switch at the output
In the figure below, the three states are illustrated:
a) Logic High output
b) Logic Low output
c) High impedance (Hi-Z) output
37. Electronic Combinational LogicElectronic Combinational Logic
Within each of these families there is a large variety of different
devices
We can break these into groups based on the number gates per
device
AcronymAcronym DescriptionDescription No GatesNo Gates ExampleExample
SSISSI Small-scale integrationSmall-scale integration <12<12 4 NAND gates4 NAND gates
MSIMSI Medium-scale integrationMedium-scale integration 12 – 10012 – 100 AdderAdder
LSILSI Large-scale integrationLarge-scale integration 100 – 1000100 – 1000 68006800
VLSIVLSI Very large-scale integrationVery large-scale integration 1000 – 1M1000 – 1M 6800068000
ULSIULSI Ultra large scale integrationUltra large scale integration > 1M> 1M 80486/8058680486/80586
38. SSI DevicesSSI Devices
Each package contains a code identifying the package
N74LS00
Manufacturers Code
N = National Semiconductors
SN = Signetics
Specification
Family
L
LS
H
Member
00 = Quad 2 input NAND
02 = Quad 2 input Nor
04 = Hex Invertors
20 = Dual 4 Input NAND
39. 7400 Series History7400 Series History
1960s space program drove
development of 7400 series
Consumed all available devices
for internal flight computer
$1000 / device (1960 dollars)
10:1 integration improvement
over discrete transistors
1963 Minuteman missile forced
7400 into mass production
Drove pricing down to $25 /
circuit (1963 dollars)
40. 7400 Series Evolution7400 Series Evolution
BJT storage time reduction by using a BC Schottky diode.
Schottky diode has aVfw=0.25V.When BC junction becomes
forward biased Schottky diode will bypass base current.
B
C
41. Too Much of a Good Thing?Too Much of a Good Thing?
Families
Packages
Reliability
options
Speed
grades
Features
Functions
An availability nightmare! >> 500K unique devices
43. Success Drives ProliferationSuccess Drives Proliferation
New families introduced based on
Higher performance
Lower power
New features
New signaling threshold
Spawned over 32 unique families!
19602003
44. Success Drives ProliferationSuccess Drives Proliferation
Products introduced in the 1960
are near the end of their life
cycle
Decreasing supplier base
Increasing prices
Not recommended for new
designs
Products considered to be
“mature” are about 2 decades
into their life cycle
High-volume production
Multiple suppliers
Low prices
Newer products are only a few
years into their life cycle
High performance
High level of vendor and supplier
support
Newest technologies
Higher prices
45. Characteristics: TTL and MOSCharacteristics: TTL and MOS
TTL stands for Transistor-Transistor Logic
uses BJTs
MOS stands for Metal Oxide Semiconductor
uses FETs
MOS can be classified into three sub-families:
PMOS (P-channel)
NMOS (N-channel)
CMOS (Complementary MOS, most common)
Remember:Remember:
46. TTL Circuit OperationTTL Circuit Operation
A
B Y O/P
+Vcc
Q
1
Q
2
Q
3
Q
4
4K 1.6K 130
R1 R2
R3
R4
1K
I CQ1
D 3
D
1 D2
A B I
CQ1
Q
1
Q
2
Q
3
Q
4
Y O/P
0 0 + ON OFF OFF ON 1
0 1 + ON OFF OFF ON 1
1 0 + ON OFF OFF ON 1
1 1 - OFF ON ON OFF 0
A standard TTL NAND gate circuit
Table explaining the operation of the
TTL NAND gate circuit
47. Transistor-Transistor Logic FamiliesTransistor-Transistor Logic Families
Transistor-Transistor Logic Families:
74L Low power
74H High speed
74S Schottky
74LS Low power Schottky
74AS Advanced Schottky
74ALS Advance Low power Schottky
48. MOS Circuit OperationMOS Circuit Operation
+VDD
O/P
I/P
S
D
D
S
Q
Q
1
2
I/P Q1 Q2 O/P
0 ON OFF 1
1 OFF ON 0
Table explaining the operation of
the CMOS inverter circuitA CMOS inverter circuit
So Far have been looking at how to specify digital circuits
Now going to look at practical implementation
CMOS - Complementary MOSFET
MOSFET - Metal-Oxide Semiconductor Field Effect Transistor
TTL - Transistor-Transistor Logic
for logic low is Vilmax - Volmax
for logic low is Vilmax - Volmax
So Far have been looking at how to specify digital circuits
Now going to look at practical implementation
CMOS - Complementary MOSFET
MOSFET - Metal-Oxide Semiconductor Field Effect Transistor
TTL - Transistor-Transistor Logic