1. By Muhammad Ali Asghar
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

2. Michael Faraday used PVD in 1838
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

3. Deposition
 Applying a thin film on a surface ranges from nano
meters to micro meters.
 Thin film is deposited on Substrates.
 Different techniques are used for deposition PVD,
CVD, sputtering, electroplating & coating.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

4. Physical vapor deposition
 Physical coating process involve,
condensation & evaporation of material
 PVD is used for high melting point & low
vapor pressure materials.
 PVD is carried out at high temperature and
vacuum.
 In contrary to PVD, CVD is a method in which
chemical adhesion or chemical deposition occurs.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

5. High temperature
is required to
vaporize the material
Vacuum of different
ranges is used which
depends on the mean
free path required in
the system.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

6. PVD methods are commonly used in followings:
Circuit & IC fabrications.
Aerospace in TBC & transparent coatings.
Reflectors and optics
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

7. Evaporative deposition
Electron beam vapor deposition
Pulsed laser deposition
Sputter deposition
Ion induced deposition
Cathode Arc Deposition
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

8. Evaporative deposition
 Resistive heating method is used.
 deposition is performed at high
temperature & low vacuum
 Vacuum decreases the content
of Contamination
 Voltage & current is manually
controlled.
 Material is kept in boats.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

9. Resistive heating unit
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

10. Electron beam is generated
by tungsten filament.
Material is placed in
Graphite or tungsten crucible
Deposition mechanism is same
 deposition is carried out
under high vacuum.
Deposition is controlled, and
Uniform
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

11. MUHAMMAD ALI ASGHAR
VC&ML NINVAST

12. Pulsed laser deposition
 High power laser is used for deposition.
 Argon or neon is used for inert atmosphere.
 High vacuum is formed
 laser is focused by lens, target decides the position of
the deposition .
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

13. Sputter deposition
 Sputtering works on the bases of momentum principle,
formed by the collision of the atoms and molecules.
 Plasma glow, ion accelerator or radioactive emitting is
used to evaporate material.
 argon gas is used for inert atmosphere.
 Types of sputtering
 Chemical and etching sputtering
 Electronic sputtering
 Potential sputtering
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

14.  In this process ions are deposited
on the substrates.
 This process is used for IC
fabrication, micro circuit printing
nano printing or pattering . &
lithography.
 It will be discussed in detail with
nano pattering.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

15. PVD advantages & Disadvantages
 Environment friendly then  Cooling systems are required.
paint & electroplating.
 Mostly high temperature and
 more than one PVD
vacuum control needs skill &
technique can be used for
experience.
coating.
 PVD coated materials has no
 Usually topcoats are not
chemical interaction with the
required.
surface that
 Good strength and
durability.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

16. MUHAMMAD ALI ASGHAR
VC&ML NINVAST

17. MUHAMMAD ALI ASGHAR
VC&ML NINVAST