From FeRAM to Integrated Passive Devices (IPDs): will MEMS applications be the driver for future growth of thin film PZT? The most promising effect of thin film PZT for future aplications would certainly be its piezoelectric effect In September 2013, EPSON has announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: First, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology! Second, more inkjet head players will soon follow. Thin film piezoelectric materials are gaining increasingly more importance within the MEMS industry. Although semiconductor manufacturing companies are historically reluctant to introduce such exotic materials into their production lines, every major MEMS foundry nowadays is working on the implementation and qualification of piezoelectric thin film in their MEMS manufacturing processes. Lead zirconium titanate or PZT (Pb[ZrxTi1-x]O3 with 0≤x≤1)) is a very interesting ferroelectric material. Depending on its composition, it has the advantage of combining 3 different material properties: high dielectric constant, pyroelectric effect and piezoelectric effect. Its high dielectric constant property is still extensively being used with the integration of thin film PZT in Integrated Passives Devices (IPDs) and to a lesser extent in Ferroelectric memories (FeRAM). These have been the 2 leading applications for thin film PZT for many years. NXP Semiconductors and STMicroelectronics dominate this IPD market. The pyroelectric effect of PZT is today being used by Pyreos for thin film PZT based uncooled Infrared detectors, although this thin film PZT based technology remains quite marginal in this field. The most promising effect of PZT for future applications would certainly be its piezoelectric effect. Companies like Wavelens and PoLight are extensively working on the introduction of their autofocus based products to the market using thin film PZT technology. This profusion of new MEMS applications using thin film PZT technology is just beginning. The roadmap for high volume production is still to be built The main difficulty for thin film PZT technology is the integration of this exotic material into a robust and reproducible process flow. There are major technological challenges associated with thin film PZT integration into a product : Deposition Etching Process monitoring Test Reliability These are complex topics and although many R&D efforts have been made so far by labs, equipment and material suppliers, and device manufacturers, some work remains to be done to achieve robust products for high volume production. More information on that report at http://www.i-micronews.com/reports/Thin-Film-PZT-Semiconductor-Trends-Update/1/404/

1. Thin film PZT for
Semiconductor
Application trends &Technology update (FeRAM, IPDs and MEMS)
© 2013

2. Table of contents (1/2)
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Glossary
Motivations and objectives of the report
Who should be interested in this report ?
Companies cited in this report
Definitions, limitations and methodology
Executive summary
– Key facts & trends
– 2013-2018 market forecast in wafers (6’’ eq)
– 2013-2018 market forecast by deposition
techniques in wafers (6’’ eq)
– Key thin film PZT market players
– Main R&D Labs active in thin film PZT
• Focus on Ferroelectric definitions and effect
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Ferroelectric definition
Piezoelectric and ferroelectric materials definition
Piezoelectric effect definition
PZT characteristics
• Lattice properties
• Piezoelectric and Dielectric properties
• Figures of merit, coefficients
– Piezoelectric technologies : thin film, bulk or gauge
– PZT applications domains
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• Thin film PZT applications
– FeRAM
• Technology and Market description
• Players
• Research
– Integrated Passives Devices (IPDs)
• Comparison between thin film/thick film IPD
technology
• Trends for thin film Ferroelectric IPDs
– MEMS
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Inkjet heads
Inertial MEMS (acceleros, gyros)
Uncooled IR detectors
Autofocus
RF-MEMS
Ultrasound sensors & transducers
Energy harvesting – energy scavengers
Micromirrors

3. Table of contents (2/2)
• Market analysis for thin film PZT applications
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Thin film PZT applications
Thin film Ferroelectric functions & materials
Players roadmap – expected year for market entry
2013-2018 market forecast in wafers (6’’ eq)
2013-2018 market forecast in units
2013-2018 market forecast in US$
2013-2018 market forecast by deposition techniques
in wafers (6’’ eq)
• Thin film PZT market players
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Key industrial market players per application
Thin film PZT thickness per application
Key industrial market players positioning
MEMS Foundries positioning
• Thin film piezoelectric deposition techniques &
materials
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© 2013•
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Processes
Equipment manufacturers examples
CSD techniques
Focus on Sol-Gel process
Thin film PZT deposition techniques comparison
Thin film Ferroelectric functions & materials
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• Thin film PZT manufacturing challenges :
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Which technology for which application ?
Advantages & drawbacks
Material challenges
Lifetime – reliability
Regulations related to Lead
• R&D European projects on thin film PZT
– PiezoVolume
– Lab4MEMS
– EPAMO
• Other Piezoelectric materials
• General Conclusions

4. Motivations and objectives of the report
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We have decided to make a technology and market report on thin film PZT
applications for the following reasons:
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Thin film PZT is used for FeRAM and IPDs
Growing interest for thin film PZT observed in the industry, due to its very promising
piezoelectric properties
EPSON has released its 2nd generation Ink Jet head based on thin film PZT technology this
year, proving the maturity of thin film PZT technology and thus opening the path to new
MEMS products shortly
The objectives of the reports are :
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Provide an overview of thin film PZT applications
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Provide market data and forecasts on thin film PZT applications
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Production forecast 2013-2018 in number of wafers (6’’ eq)
Production forecast 2013-2018 by deposition techniques in number of wafers (6’’ eq)
Players roadmap, expected year for market entry
Analyze the deposition techniques (Sputtering, Sol-Gel) trends
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© 2013•
Description of the key thin film PZT applications
Who are the current and future industrial thin film PZT users in each application
Global deposition techniques and materials trends
Deposition techniques used in each application and for each manufacturer
Manufacturing challenges related to each deposition technique
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5. PZT : application domains
PZT
EFFECTS
High K
Piezoelectric
Strain
gauge
Bulk ceramic
&
Thick film
TECHNOLOGIES
Thin
film
Thin
film
Sensors &
Actuators
IPDs
Thin
film
Ink jet heads
FeRAM (+ hysteresis effect)
HDD actuators
…
- Autofocus
- Energy harvesting
- Micromirrors
- MEMS speakers
- Drones
- Microphones
- MEMS speakers
- Inertiel MEMS (gyros,…)
- Ultrasound sensors & transducers
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Bulk
ceramic
APPLICATIONS
- Ink jet heads
- Deformable Mirrors for adaptive optics
Pressure
sensors
…
Pyroelectric
IR
detectors
IR detectors
Thin film PZT applications

6. Year of introduction of thin film PZT devices
MEMS
FeRAM
IPDs
FeRAM
…
Timeline
1980
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6
…
2010
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2015
2020

7. Key thin film PZT market players
Fabless & Devices manufacturers
Equipment and materials
R&D labs and IP provider
Foundries
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8. Key Thin film PZT Market players
FeRAM
IPDs
MEMS
Fabless
& IDMs
Others detailed in the report…
Foundries
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9. Main R&D Labs Active in thin film PZT
IPDs
MEMS
Others
(FeRAM, optical,
Photovoltaic..)
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10. Thin film PZT Deposition Techniques
Equipment & Material manufacturer examples
Sol-Gel
Sputtering
Europe
North America
Asia
Primaxx CSD - LSMCD
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Ulvac PVD

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Thin Films

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