Power SiC 2018: Materials, Devices and Applications 2018 Report by Yole Developpement

Power SiC 2018: Materials, Devices and Applications 2018 Report by Yole Developpement
From Technologies to Market July 2018 Power SiC 2018: Materials, Devices and Applications From Technologies to Market Sample
2 Biography and contact ABOUTTHE AUTHORS Dr. Hong LIN Dr. Hong Lin has worked atYole Développement as a Technology and Market Analyst since 2013, specializing in compound semiconductors and providing technical and economic analysis. Before joiningYole Développement, she worked as an R&D Engineer at Newstep Technologies, overseeing the development of cold cathodes made by plasma-enhanced chemical vapor deposition for nanotechnology-based visible and UV lamp applications. She holds a PhD in physics and chemistry of materials. Email: lin@yole.fr Dr. AnaVILLAMOR Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is involved in many custom studies and reports focused on emerging power electronics technologies, including device technology and reliability analysis. Previously Ana was involved in a high-added value collaboration related to of SJ Power MOSFETs, within the CNM research center for the leading power electronic company ON Semiconductor. During this partnership, and after two years as Silicon Development Engineer, she acquired relevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and coauthor of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in Micro and Nano electronics, both from UAB (SP). Email: villamor@yole.fr Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
3 TABLE OF CONTENTS • Executive Summary 9 • SiC Power Device market revenue • SiC Power Device bare die market revenue • SiC Power Device bare die market share • SiC Power Device overview • SiC diode market in 2017 • Projection of the SiC diode market by 2023 • SiC discrete transistor • Why use SiC in the main inverter? • Does SiC cross the chasm? (OBC market) • Does SiC cross the chasm? (Main inverter market) • Full SiC module • 2017 market share estimate for SiC power device manufacturers • Supplier development status • How fast can new wafer capacity be ready? • SiC substrate cost • Production capacity vs demand • • What could happen for the SiC power industry in 5 to 10 years? • Roadmap for SiC power industry drivers • News 37 • Report Comparison 42 • What’s new in the 2018 report? • Comparison withYole’s previous forecasts • What we got right and what we missed • Why use SiC for Power Electronics Applications? 50 • Power device technology life cycle • GaN vs SiC vs Si • Why use SiC power devices? • Power vs frequency in electronics • Power density enhancement from 1980-2020 • WBG market segmentation as a function of voltage range • SiC Device Market 57 • SiC Device Market Revenue • ElectrifiedVehicle Market 66 • EV/HEV market evolution Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
4 TABLE OF CONTENTS • Different types of electrified vehicles – definition • Power converters in EV/HEV - Si based solutions • Silicon power semiconductor market in EV/HEV: 2017VS 2023 • SiC devices add value to electrified vehicle applications • SiC devices add value to electrified vehicle applications • SiC advantages vs EV applications. • Why use SiC in the main inverter? (cost aspect) • Trends towards higher battery voltage • Why go to 800V battery pack voltage for electric vehicles? • SiC potential market in EV/HEV • Opinions about SiC penetration in EV/HEV (as of 2018) • Device manufacturer visions • • Opinions about SiC penetration in EV/HEV (As of 2018) • Reasons for OEMs • Electrified vehicle charging solutions • SiC in on-board chargers • Does SiC cross the chasm? (OBC market) • Does SiC cross the chasm? (Main inverter market) • WBG implementation in EV/HEV • Infineon’s roadmap for EV/HEV SiC products • SiC component evaluation by Toyota • Automotive-grade SiC power devices • Before mass adoption, what must SiC do? • SiC device market revenue in electrified vehicle applications • SiC device bare die market revenue in electrified vehicle applications • EV/HEV market – Conclusions • Electrified Charging Infrastructure 105 • Electrified vehicle charging solutions Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
5 TABLE OF CONTENTS • Charging infrastructure development • Geographical split of PHEV & BEV • Chinese EV/HEV market development versus government target • Charging infrastructure development • Worldwide newly installed DC charging infrastructures (units) • Increasing battery pack energy capacity per electric vehicle • Towards 800V battery pack for electric vehicles • Power charging voltage range • 350 kW ultra-high power charging points • SIC device market value in xEV charging infrastructure, in $M • SIC device bare die market value in xEV charging infrastructure applications • Photovoltaic Inverters 122 • PV inverters • SiC player positioning • Added value from SiC in residential applications • SiC in photovoltaic string inverters • SiC in central photovoltaic inverters • SiC in microinverters • SiC implementation as a function of PV classification • PV market provisions • SiC device market revenue in photovoltaic applications • SIC device chip market revenue in photovoltaic applications • SiC for solar power – Conclusions • PFC and Power Supply 140 • Power supply - industry trends • Power supply market segmentation Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
6 TABLE OF CONTENTS • Power supply unit standard • Replacing Si MOSFET with SiC • Developments in PFC topology • Replacing Si MOSFET with SiC • SiC penetration in PFC and power supply • SiC device market revenue in PFC for power supply applications • SiC device bare die Market revenue in PFC for power supply applications • Power supply – Conclusions • Uninterruptible Power Supplies 156 • UPS market - definition and architecture • SiC use in the UPS sector • SiC penetration in the UPS sector • Can SiC help save money for UPS applications? • WBG penetration in the UPS sector • SiC device market value in UPS applications • SiC device bare die market value in UPS applications • Motor Drive Market 166 • Motor drive application • Opportunities for SiC in motor drives • Challenges for SIC integration in motor drives • SiC implementation in motor drives • SiC device market value in motor drive applications • SiC device bare market value in motor drive applications • SiC for motor drive – Conclusions • Power Converters forWind Turbines 177 • Wind turbine market • Architecture • DFIGs vs. full converters • Power devices used in wind applications and SiC targets • Silicon power devices currently used in wind applications • SiC in medium voltage drives for wind power conversion Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
7 TABLE OF CONTENTS • SiC device market revenue in wind power applications • SiC device bare die market value in wind power applications • Are SiC devices ready for wind power? • Rail Traction Market 187 • Segmentation • Power devices in different train types • SiC implementation in rail traction • Hybrid SiC inverters for rail traction • On-track testing of SiC hybrid inverters • Full SiC inverters for rail traction • SiC for auxiliary power in trains • Focus on CRRC • ROLL2RAIL – Shift2RAIL • Is SiC ready? (Cost aspect) • SiC device market value in rail traction applications • SiC device bare die market value in rail traction applications • SiC for rail – Conclusions • • Other SiC Applications 207 • Battery Chargers • SiC for induction heating generators • Possible applications of SiC in aeronautics • SiC for military applications • SiC for space applications • SiC JFET for protection applications • Yole’s understanding of the status of SiC in other applications • SiC Device Market:Voltage Analysis 218 • SiC device market revenue • SiC power device bare die market revenue • SiC diode bare die market share split by voltage • SiC transistor bare die market share split by voltage • SiC bare die market share split by voltage • SiC power device bare die market share Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
8 TABLE OF CONTENTS • SiC power device overview • SiC diode market in 2017 • Projection of the SiC diode market by 2023 • SiC discrete transistor • Hybrid and full SiC module • SiC Power DeviceTechnology 234 • SiC power devices 236 • SiC MOSFET vs. Si device benchmark • SiC MOSFET:Trench vs planar • 200V SiC MOSFET technology evolution • SiC diode vs MOSFET technology process • Critical step processes • Packaging 245 • Discrete device packaging • Discrete device packaging-Case study • Commercially-available Intelligent Power Module examples • Full SiC module packaging • Development of junction temperature inside SiC power modules • Innovative packaging for SiC in R&D • Full SiC module • SiC device packaging-conclusions • Integration 268 • Integration of silicon vs SiC • Integration challenges • Gate driver • Capacitors for SiC devices • Capacitors for high temperature • Capacitors forWBG semiconductors • SiC power stacks • Innovative integration for SiC in R&D • SiC device integration-conclusions • SiC Device Reliability Status 279 • SiC reliability analysis • Reliability main concerns • Is reliability an issue for SiC? • SiC reliability analysis • SiC power reliability • SiC reliability • SiC Power Device Commercial Status 289 • SiC power device timeline Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
9 TABLE OF CONTENTS • SiC MOSFET technology developments • SiC power device overview • Discrete SiC MOSFETs • Known discrete SiC MOSFETs • Focus on high-voltage SiC Devices • SiC device roadmap • SiC power device commercial status – conclusions • SiC Power Device Industry Landscape 299 • Involvement origins of SiC power device manufacturers as of 2018 • Development of pure SiC power device manufacturers • SiC power industry business models as of 2018 • From prototype to mass production • 2017 market share estimate for SiC power device manufacturers • 2017 revenue estimate for SiC power device manufacturers • SiC power industry – conclusions • Focus on Cree/Wolfspeed • Focus on China • A special focus on China • China’s surge in SiC Wafer production capacity • Will Chinese SiC wafer players reshape the market? • Focus on China – conclusions • SiC Wafer and Epiwafer Market 314 • SiC wafer process • SiC growth technologies • Difficulty of SiC growth • Technology readiness for SiC production • SiC: From polytype to devices • SiC wafer supplier status • Map of SiC players, including R&D players • Development in SiC substrate size • 6” SiC wafer supply • Supplier development status • SiC materials producer status • SiC wafer development axes • SiC wafer capital investment Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
10 TABLE OF CONTENTS • How much investment is needed for 1 million 6’’ SiC wafers? • How fast can new wafer capacity be ready? • SiC substrate cost • SiC-based MOSFET wafer cost structure • Wafer cost impact • Production capacity vs demand • SiC n-type substrates - average price estimation • SiC n-type substrate market - volume projection, in units • SiC n-type substrate market size projection • SiC n-type substrate market value projection • Market share estimate for n-type SiC substrate players • 2017 revenue estimate for SiC wafer manufacturers • SiC epi-wafer manufacturing • SiC epi-house and epi-services • SiC epiwafers • Integration of SiC epi • SiC epiwafer market • • SiC wafer and epiwafer market- conclusions • IP 350 • SiC Schottky barrier diode (SBD) • SiC MOSFET • SiC power module/system • SiC wafer • Intellectual property - conclusions • SiC Power Industry Ecosystem 358 • SiC wafering • Power SiC industry Ecosystem • SiC backside thinning • SiC device processing • Power SiC industry ecosystem – conclusions • Open Discussion and Perspectives 383 • Primary drivers for using SiC in different applications • Lifecycle of the SiC transistor and diode market • SiC power industry - main challenges as of 2018 • SiC industry - Geographic analysis as of 2018 Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
11 TABLE OF CONTENTS • Power device price: Si vs SiC • SiC MOSFET vs Si IGBT • Market Penetration rate of 600V/650V SiC transistors • Si vs SiC vs GaN: 600V • Si vs SiC vs GaN: High voltage • Transistor market 2017 vs 2023 • SiC vs silicon power semiconductor market Share • SiC transistor vs IGBT and MOSFET market share • SiC transistor vs IGBT market share • SiC market share split by discrete vs module • Outlook over ten years • Key players and power electronics landscape • What could happen to the SiC power industry in 5 to 10 years? • Roadmap for SiC power industry drivers • General Conclusions 406 Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
12 WHAT IS IN THIS REPORT? • Why SiC-based materials are interesting options for power electronics applications. • Yole’s vision for SiC penetration in different applications: • xEVs • Charging infrastructure • PV • Power supplies • UPSs • Motor drives • Wind power • Rail applications • State-of-the-art SiC-based devices, modules, and power stacks and their commercial statuses. • SiC power device market projections through to 2023, including: • Bare die market split between transistors and diodes. • Device market split by application. • Device market split into discrete components and modules. • Analysis of SiC power device voltages. • Description of the SiC substrate and epiwafer market and market size projections through to 2023 • A description of the industrial SiC power landscape, from materials to systems. Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
13 COMPANIES CITED IN THIS REPORT ABB,Alstom,Ascatron,Aymont, Bombardier, Basic Semiconductor, Brückwell Technology, Caly Technology, Cree, CRRC, Danfoss, Delphi, DENSO, Dow Corning, Episil, Epiworld, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power Technology, Hestia Power, Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop Grumman, NXP, ON Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM, Sanrex, Schneider Electric, Semikron, Shindengen, SICC, Siemens, SMA, STMicroelectronics,Toshiba,Toyota, United Silicon Carbide,WeEn, X-Fab,Yaskawa, and more Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
14 LIST OF ABBREVIATIONS USED IN THIS REPORT AMB Active Metal Brazed A, Amp Ampere ASP Average Selling Price BEV Battery Electric Vehicle BJT Bipolar Junction Transistor BOM Bill Of Materials BPD Basal Plane Dislocation BTS Base Transceiver Station CAGR Compound Annual Growth Rate CCM Continuous Conduction Mode CTE Coefficient of Thermal Expansion CVD Chemical Vapor Deposition DC Direct Current DCB Direct Copper-Bonded DD Dislocation Density DFIG Double-Fed Induction Generator DMOS Diffused Metal Oxide Semiconductor EREV Extended Range Electric Vehicle EMC ElectroMagnetic Compatibility EMI ElectroMagnetic Interference xEV Electric Vehicle/Hybrid Electric Vehicle GaN Gallium Nitride FCV Fuel Cell Vehicle FET Field Effect Transistor GIT Gate Injection Transistor GTO Gate Turn-Off HEMT High Electron Mobility Transistor HEV Hybrid Electric Vehicle HVAC Heating, Ventilation and Air Conditioning HVDC High-Voltage Direct Current JBS Juction Barrier Schottky JFET Junction Field Effect Transistor IC Integrated Circuit IGBT Isolated Gate Bipolar Transistor IGCT Integrated Gate-Commutated Thyristor IPM Intelligent Power Module IH Induction Heating MESFET Metal-Semiconductor FET MISFET Metal-Insulator FET MOSFET Metal-Oxide-Semiconductor FET MOCVD Metal-Organic Chemical Vapor Deposition NEV Neighbourhood Electric Vehicle Ron/Rdson On-state Resistance LLC A power converter that is a variant of a series resonant converter, using two inductors (Lmagnetizing and Lresonant) and a capacitor (C). LV-HV Low Voltage to High Voltage OBC On-Board Charger OEM Original Equipment Manufacturer PEPDC Primary Electrical Power Distribution Center PCB Printed Circuit Board PCS Power Conversion System PCU Power Control Unit PFC Power Factor Correction PHEV Plug-in Hybrid Electric Vehicle POL Point-Of-Load PSU Power Supply Unit PV PhotoVoltaic PWM Pulse Width Modulation RF Radio Frequency SBD Schottky Barrier Diode SD Surface Defect Si Silicon SI Semi-insulating SiC Silicon Carbide SJMOSFET Super Junction MOSFET SMD Surface Mount Device SMPS Switching Mode Power Supply SSV Start-Stop Vehicle T° Temperature TAM Total Available Market T&D Electricity Transport and Distribution UPS Uninterruptible Power Supply VSC Voltage Source Converter WBG Wide Band Gap Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
15 YOLE METHODOLOGY:TOP-DOWN AND BOTTOM-UP APPROACHES To achieve market estimations, Yole uses two approaches: top down and bottom up. Top-down Bottom-up From systems to device market From substrate to device market System inverter device Wafer Wafer Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
16 Wafer Epiwafer Device Module Inverter End applications REPORT OBJECTIVES • Provide a clear understanding of the SiC power industry, covering markets from wafer to discrete/module (Units & M$). • Analysis the market drivers/bottlenecks of SiC power industry drivers by analysis the SiC adoption by different end applications and supply chain. • Understanding the technology status of SiC power device technology • Describe the industry playground Report focus Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
17 EXECUTIVE SUMMARY 2018 Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
18 SIC POWER DEVICE MARKET REVENUE Split by application The total SiC- based power device market is expected to grow steadily, reaching almost $1.4B in 2023. Including discrete diodes, discrete transistors, diode bare die in hybrid modules and full SiC modules. Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
19 SIC POWER DEVICE OVERVIEW * Danfoss: customer power module Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
20 DOES SIC CROSS THE CHASM? (MAIN INVERTER MARKET) As of 2018 understanding As shown earlier, main inverter presents the biggest opportunity for SiC.The adoption or not of SiC will be critical for the SiC power device market. We indeed heard about different projects, but we don’t have any concrete names behind these projects. 100% Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
21 SIC POWER RELIABILITY What will be changed? (1/2) Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
22 ROADMAP FOR SIC POWER INDUSTRY DRIVERS Yole’s interpretation as of 2018 2000 2010 2020 2030 Schematic illustration Unipolar: power conversion Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
23 NOTEWORTHY NEWS - 4/4 • Aug 2017, Nippon Steel & Sumitomo Metal Corporation (NSSMC) and Nippon Steel & Sumikin Materials Co., Ltd. decided to terminate SiC research and business development in 2018. NSSMC group decided to transfer relevant assets and technologies to Showa Denko K.K. (“Showa Denko”). • Aug 2017, Pallidus launched M-SiC silicon carbide source material and technology platform. • Sep 2017, Ascatron announced the availability of SiC components using its in-house technology. SBD and PiN diodes are available and MOSFETs are under development and will be available in 2018. • Oct 2017, Infineon released the sixth and latest generation of SiC diodes. • Oct 2017, Littelfuse launched its first series of SiC MOSFETs as the latest addition to its growing power semiconductor line. • Dec 2017, ROHM tested SiC power module in FORMULA E race cars. • Jan 2018, CRRCTimes Electric announced the success of the trial production of 6 inch SiC chip production line. • Jan 2018, Littelfuse completed the acquisition of IXYS. • Jan 2018, Disco developed DAL7440 KABRA laser saw for 8-inch SiC wafers. • Jan 2018, SDK to expand SiC epi capacity to 7000 wafers per month by September in 2018. • Jan 2018, CRRC completed 6’’ SiC production line. • Feb 2018, Cree signed $100M long-term deal to supply 150mm SiC wafers to Infineon. • Feb 2018, SILTECTRA validated twinned SiC wafer produced using COLD SPLIT laser-based wafer thinning technique. • March 2018, Bombardier tested SiC-equipped Mitrac TC1500 traction converter. • May 2018, Rohm announced plans for a new production building at the Apollo plant in Chikugo, Japan.The expanded production capacity is intended to meet the growing demand for SiC power devices.The construction is scheduled to begin in February 2019 and be completed by the end of 2020. Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
24 AUTOMOTIVE-GRADE SIC POWER DEVIC Example (Reverse engineering): Tesla - ST ST has developped 1-1 SiC MOSFET module for Tesla model 3. SiC MOSFET one in one module: • 2 dies of 650V, 100A Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
25 PV MARKET Geographic distribution • China is by far the biggest market of PV in 2017, presenting more than 50% of market share. • On I June 2018, China released a heavyweight solar PV policy (823) to rationalize capacity growth. • The policy, which comes as a shock to the industry, suspends approving new subsidised utility-scale PV power stations in 2018. • It also caps the scale of distributed projects at 10 GW. • In addition, all utility-scale projects are mandated to set power prices through competitive auctions. China is the biggest PV market in 2017. But the latest policy indicated a clear trend to reduce subvention for the PV market. Source: SolarPower Europe The announcement of the new policy in China has a strong impact on the PV market, the stock price of top PV inverter price has plunged. Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
26 Full SiC modules FULL SIC MODULE PACKAGING SOLUTIONS - SOME EXAMPLES There is a wide range of module packaging on the market for full SiC modules. Fuji: 1200V, 35A/50A/75A 1700V, 25A, 35A, 50A. 1200V, 120A, 13mΩ copper baseplate and aluminum nitride insulator. 1200V, 325A, 3.6mΩ: AlSiC baseplate and Si3N4 AMB insulator, enhancing ruggedness in thermal cycling. • 600V, 75A package from Mitsubishi, compatible with conventional products. • Incorporates SiC MOSFETs with current sensors and built-in drive circuit and protection functions. GeneSiC:1200V, 100A Panasonic and SanRex: 1200V/150A. Infineon: Easy1B with six-pack topology. Mass production in 2017. Rohm: Up to 120A, with 50% volume reduction than if IGBT were used Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
27 INTEGRATION SIVS SIC Increased efficiency and smaller size by replacing Silicon with SiC MOSFET 3-phase SiC-based boost converter prototype without copper bus bars and common mode chokes This can be parallelized to get a 9-phase SiC converter, resulting in 126 kW peak power 485 mm 226 mm 73 mm Source:Aachen University Case study Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
28 SIC POWER DEVICE TIMELINE SiC JFET 2016 First SiC MOSFET 2017 • First hybrid solution in production since 2006 by Infineon. • Once SiC MOSFETs were in production, several players started to release full SiC modules. Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
29 CREE’S TRANSFORMATION PATH (1/3) LED Lighting Power & RF 2015 2016 2017 2018 Materials Plan for LED Lighting Power & RF + Materials + Infineon RF Power Focus New Focus Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
30 SIC DIODE Time evolution of patent publications • SiC SCHOTTKY BARRIER DIODE (SBD) * A patent family is a set of patents filed in multiple countries to protect a single invention by a common inventor. A first application is made in one country – the priority country – and is then extended to other countries. Note: The patent search was performed in March 2018, thus the data corresponding to the year 2018 are not complete. At the time of the patent search, 12 patent families had been published in 2018. High number of JP 1st publication in 2013 like Fuji Electric (14 patent families) High number of JP 1st publication in 2003 and 2006 First wave first commeral introduction of SiC diode Second wave  SiC device market took off Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
31 SiC POWER INDUSTRY - MAIN CHALLENGES (AS OF 2018) From materials to system integration Material • High cost. • Limited wafer size. • Short supply at 6’’ Device • Less maturity compared to Si • Lower manufacturing yield. • Higher cost. • Long-term reliability. • Short circuit capability • What is the right packaging? System • How to integrate the active component e.g. for driving, EMI, topology choices. • What are the available choices for passive components and dielectric materials? • What are the right price? Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
32 SIC MOSFETVS SI IGBT Which is the R&D status as of 2018? Nowadays, companies still invest in R&D for IGBT. SiC MOSFET development timeline IGBT development timeline Gen 5 IGBT Decreased switching losses Vth inestabilities SBD integrated Enhanced short circuit characteristics Improved screening in production for dynamic tests Still investments in IGBT technology Switching transients *Non-exhaustive list Packaging Improving Power cycling All SiC players (device + module makers) Who? What? Who? What? As back-up solution for SiC MOSFETs SiC transistors will not be used in all IGBT applications as of 2018 IGBT market still grow. Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
33 RELATED REPORTS Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018
Following 2017’s trend, SiC transistors are clearly being adopted, penetrating smoothly into different applications. Yole Développement’s (Yole) forecast for the value of the SiC power semiconductor market is more than $1.5B by 2023 with a compound annual growth rate (CAGR) of 31% for 2017-2023. Today the market is still being driven by diodes used in power factor correction (PFC) and photovoltaic (PV) applications. However Yole expects that in five years from now the main SiC device market driver will be transistors, with an impressive 50% CAGR for 2017-2023. This adoption is partially thanks to the improvement of the transistor performance and reliability compared to the first generation of products, which gives confidence to customers for implementation. One of the topics that has been discussed in all Yole’s exchanges with industrial players is SiC adoption for automotive applications over the next 5-10 years. Its implementation rate differs depending on where SiC is being used. That could be in the main inverter, in the on-board- charger (OBC) or in the DC/DC converter. By 2018, more than 20 automotive companies are already using SiC Schottky barrier diodes (SBDs) or SiC MOSFET transistors for the OBC, which will lead to 44% CAGR through to 2023. Yole expects SiC adoption in the main inverter by some pioneers, with an inspiring 108% market CAGR for 2017-2023. This will be possible because nearly all carmakers have projects to implement SiC in the main inverter in coming years. In particular, Chinese automotive players are strongly considering the adoption of SiC. PV has also caught our attention during recent months. China claimed almost the half of the world’s installations in the last year. This segment could have therefore helped grow the SiC device market, but new governmental regulations mean Yole has lowered its expectation for the segment. System manufacturers are interested in implementing cost effective systems which are reliable, without taking into account if the power devices are silicon or SiC based. Therefore, even if it’s certified that SiC performs better than silicon, system manufacturers still get questions about long term reliability and the total cost of the SiC inverter. This report gives an overview of SiC power device markets, including electric and hybrid electric vehicles (EV/HEV), charging POWER SIC 2018: MATERIALS, DEVICES AND APPLICATIONS Market & Technology report - July 2018 AUTOMOTIVE IS DRIVING THE SIC POWER MARKET Automotive is putting SiC on the road. Is the supply chain ready? Do SiC technologies cross the chasm? As of 2018 understanding… WHAT’S NEW • Update of market size for discrete diodes, diodes in hybrid modules, discrete transistors and full SiC modules • Update of market size for the diode and transistor bare die market • Update of voltage analyses of SiC power devices: 650V, 1200V, 1700V and over 1700V • Update of player status • Discussion of SiC penetration in EV/HEV in detail • Discussion of SiC penetration in the PV market under the impact of new policy in China • Estimation of SiC wafer investment and analysis of short supply situation • SiC epiwafer market • A new chapter about the reliability discussion • A new chapter about the SiC materials and device IP landscape KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com • Yole’s deep understanding of SiC penetration in different applications including xEV, xEV charging infrastructure, PFC/power supply, PV, UPS, motor drives, wind and rail • State-of-the-art SiC-based devices, modules, and power stacks, including product charts for each • Description of the SiC power industrial landscape from materials to systems, and discussion of SiC power market dynamics • SiC power device market value projections to 2023, including bare die market with transistor/ diode split, device market split by application and device market with discrete/ module split • SiC power device voltage analysis • Market value and volume projections for the SiC wafer and epiwafer market through 2023 • SiC power industry roadmap (Yole Développement, July 2018) Marketadoption 100% More than 20 automotive companies use SBD and MOSFET in OBC. OBC: On board charger SBD: Schottky barrier diodes The Chasm The Early Market Tech Euthusiasts Visionaries Pragmatists Conservatives Skeptics The Mainstream Market *Non exhaustive list of companies
Automotive-grade SiC power device Example : Tesla STMicroelectronics* 2018 SiC wafer market : competitive landscape, including RD players (Yole Développement, July 2018) POWER SIC 2018: MATERIALS, DEVICES AND APPLICATIONS AUTOMOTIVE-GRADE SIC POWER DEVICE EXAMPLE : TESLA STMICROELECTRONICS* SIC ADOPTION IS ACCELERATING: IS THE SUPPLY CHAIN READY? A fast-evolving market is seeing plenty of activity from its participants, with several important events in 2017-2018. In February 2018, Cree announced a 180° turnaround in its strategy on its investor day, after the abortive sale of its Wolfspeed business to Infineon. The company decided to instead focus on Wolfspeed which, despite being Cree’s smallest business, is the market leader in both the SiC wafer and SiC power device markets as of 2017. This strategy pivot will allow Cree to invest more into its SiC activities, expanding wafer, epiwafer and device capacity and prepare for market growth. On the other side of the abortive acquisition, Infineon has also developed its SiC power business. The company signed a long term SiC wafer supply agreement with Cree and began to actively promote its CoolSiCTM MOSFETs at different power electronic tradeshows and conferences in 2018. Meanwhile, excitement surrounds Tesla’s adoption of SiC MOSFETs in its electric vehicles. This had been rumoured since 2016, but without detailed information about whether it would be in the OBC and/or main inverters. Confirmation came through reverse engineering, which shows that the Model 3 uses STMicroelectronics’ 1-in- 1 top lead frame module, containing two SiC MOSFETs. In 2018, Yole is confident that the market is going to grow. The question for the SiC device market today is how big it will be in five years, rather than whether the market will increase. Another question is whether the supply chain is ready to embrace the market acceleration? Wafer supply is one of the bottlenecks as of 2018. Analysts have to talk about the short SiC wafer supply situation, which has been in place since late 2016. Some expected the situation to be resolved in the second half of 2017. But we are in the middle of 2018 and the supply issue remains. Two main reasons account for the current situation. First, the transition from 4” to 6” wafers is much faster than suppliers expected. Second, the wafer demand increase is also faster than expected. Will the situation continue? Some say that it is temporary and quite normal and typically happens when shifting to larger wafer sizes. Others consider the situation to be critical. It’s a good problem for wafer suppliers as the supply constrained situation allows them to maintain high wafer prices. But they are also investing heavily to satisfy demand from numerous clients. Yole estimates that several hundred million US dollars will be invested in coming years. The leading SiC wafer suppliers, Cree-Wolfspeed, II-VI and Dow, are all investing to expand their capacity. At the epiwafer level, the market has struggled to take off several years, but the situation is evolving quickly. For example, Yole’s analysts have seen Showa Denko expand its capacity consecutively in 2015, 2016 and 2018 as the technology becomes more mature and the outsourcing ratio is increasing. Yole invites you to read its analysis about the short wafer supply situation and its impact, as well as forecasts for the wafer and epiwafer markets. infrastructure, PV, power supply, rail, motor drives and uninterruptible power supplies (UPS) and wind. It also has an overview on the current reliability status and comparison on the added cost of a SiC system compared to silicon IGBTs. (Yole Développement, July 2018) Newly identified in 2018 *Non exhaustive list of companies SiC MOSFET one in one module: • 2 dies of 650V, 100A * Extracted from System Plus Consulting report :Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics, June 2018 *Non exhaustive list of companies SiC MOSFET one in one module: • 2 dies of 650V, 100A * Extracted from System Plus Consulting report :Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics, June 2018
MARKET TECHNOLOGY REPORT A foundry model is clearly forming which facilitates fabless and fab-lite companies to launch SiC products and make the technology more accessible. But there was also short supply of foundry services in 2017. A new 6” wafer foundry, Clas-SiC Wafer Fab Limited (6”) was founded in 2017, with the entire SiC team from Raytheon, which has stopped its SiC activities. Taiwanese foundry Episil is also now active. This report provides an overview of the SiC power industry, covering the value chain from material to epitaxy to module. It also outlines Yole’s understanding of the market’s current dynamics and future evolution. Find more details about this report here: COMPANIES CITED IN THE REPORT (non exhaustive list) ABB, Alstom, Ascatron, Aymont, Bombardier, Basic Semiconductor, Brückwell Technology, Caly Technology, Clas-SiC wafer fab, Cree, CRRC, Danfoss, Delphi, DENSO, Dow Corning, Epiworld, Episil, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power Technology, Hestia Power, Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop Grumman, NXP, ON Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM, Sanrex, Schneider Electric, Semikron, Shindengen, SICC, Siemens, SMA, STMicroelectronics, Toshiba, Toyota, United Silicon Carbide, WeEn, Wolfspeed, X-Fab, Yaskawa, and more Executive summary 9 News37 Report comparison 42 Why use SiC for power electronics applications?50 Electrified vehicle market 66 Electrified charging infrastructure 105 Photovoltaic inverters 122 PFC and power supply 140 Uninterruptible power supplies 156 Motor drive market 166 Power converters for wind turbines 177 Rail traction market 187 Other SiC applications 207 SiC device market: voltage analysis 218 SiC power device technology 234 SiC power devices Packaging Integration SiC device reliability status 279 SiC power device commercial status 289 SiC power device industry landscape 299 SiC wafer and epiwafer market 314 IP350 SiC power industry ecosystem 358 Open discussion and perspectives 383 General conclusions 406 TABLE OF CONTENTS (complete content on i-Micronews.com) • Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends • Cree-Wolfspeed • Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics • UnitedSiC UJN1205K 1200V SiC JFET RELATED REPORTS Benefit from our Bundle Annual Subscription offers and access our analyses at the best available price and with great advantages AUTHORS Dr. Hong Lin works as a Technology and Market Analyst, Compound Semiconductors since 2013. She is specialized in compound semiconductors and provides technical and economic analysis. Before joining Yole Développement, she worked as RD engineer at Newstep Technologies. She was in charge of the development of cold cathodes by PECVD for visible and UV lamp applications based on nanotechnologies. She holds a Ph.D in Physics and Chemistry of materials. Dr. Ana Villamor serves as a Technology Market Analyst, Power Electronics Compound Semiconductors. She is involved in many custom studies and reports focused on emerging power electronics technologies at Yole Développement, including device technology and reliability analysis (MOSFET, IGBT, HEMT, etc). In addition, Ana is leading the quarterly power management market updates released in 2017. Previously Ana was involved in a high- added value collaboration related to SJ Power MOSFETs, within the CNM research center for the leading power electronic company ON Semiconductor. During this partnership and after two years as Silicon Development Engineer, she acquired a relevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in micro and nano electronics, both from Universitat Autonoma de Barcelona (SP). Find all our reports on www.i-micronews.com OBJECTIVES OF THE REPORT • Provide a clear understanding of the SiC power industry, covering markets from wafer to discrete and module level, with valuations in units and $M. • Analyze the market drivers and bottlenecks of the SiC power industry by studying SiC adoption by different end applications and supply chains. • Understand the status of SiC power device technology • Describe the industry landscape Dr. Hong Lin and Dr. Ana Villamor, all part of the Power Wireless division at Yole Développement co-authored the Power SiC 2018: Materials, Devices and Applications report:
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9©2018 | www.yole.fr | About Yole Développement o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover: o You are looking for: • An analysis of your product market • A review of your competitors evolution • An understanding of your manufacturing and production costs • An understanding of your industry technology roadmap and related IPs • A clear view on the evolution of the supply chain… Our reports are for you! The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the industry. o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount. REPORTS COLLECTION www.i-Micronews.com • MEMS Sensors • RF devices technologies • Imaging • Medical technologies (MedTech) • Photonics • Advanced packaging • Manufacturing • Advanced substrates • Power electronics • Batteries and energy management • Compound semiconductors • Solid state lighting • Displays • Software • Memory
10©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (1/4) MEMS SENSORS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of the MEMS Industry 2018 – Update − Silicon Photonics 2018 – Update − Consumer Biometrics: Hardware Software 2018 – Update − Inkjet Functional and Additive Manufacturing for Electronics 2018 − Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017 − Sensors and Sensing Modules for Smart Homes and Buildings 2017 − Acoustic MEMS and Audio Solutions 2017 − MEMS Sensors for Automotive Market Technology Trends 2017 − High End Inertial Sensors 2017 − Magnetic Sensor 2017 o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT – by System Plus Consulting − Piezo MEMS 2018 * o PATENT ANALYSES – by KnowMade − MEMS Microphone – Patent Landscape Analysis − Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product Mapping 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − MEMS Pressure Sensor 2018 – Market Technology Report − MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report − Gas Particles 2018 – Market Technology Report − Gas Particles Comparison 2018 – Structure, Process Cost Report − LiDARs for Automotive and Industrial Applications 2018 – Market Technology Report − LiDAR for Automotive 2018 – Patent Landscape Analysis − MEMS Packaging 2017 – Market Technology Report − MEMS Packaging Comparison 2017 – Structure, Process Cost Report RF DEVICES ANDTECHNOLOGIES o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Wireless technologies (Radar, V2X) for Automotive 2018 − RF Standards and Technologies for Connected Objects 2018 − RF Photonic Components Technologies for 5G Infrastructure 2018 o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System Plus Consulting − Automotive Radar Comparison 2018 o PATENT ANALYSES – by KnowMade − RF Acoustic Wave Filters 2017 – Patent Landscape Analysis o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market Technology Report – Update − RF Front-End Module Comparison 2018 – Structure, Process Cost Report − RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis − Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report – Update* − Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process Cost Report − RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market Technology Report – Update − RF GaN Comparison 2018* – Structure, Process Cost Report − RF GaN 2018 – Patent Landscape Analysis SOFTWARE o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Consumer Biometrics: Sensors Software 2018 – Update − Processing Hardware and Software for AI 2018 - Vol. 1 2 − From Image Processing to Deep Learning, Introduction to Hardware and Software Update : 2017 version still available / *To be confirmed
11©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (2/4) IMAGING OPTOELECTRONICS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of the Compact Camera Module and Wafer Level Optics − Industry 2018 – Update − 3D Imaging and Sensing 2018 – Update − Sensors for Robotic Vehicles 2018 − Machine Vision for Industry and Automation 2018 − Imagers and Detectors for Security and Smart Buildings 2018 − Uncooled Infrared Imagers 2017 o PATENT ANALYSES – by KnowMade − iPhone X Dot Projector – Patent-to-Product Mapping o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Status of the CMOS Image Sensor Industry 2018 – Market Technology Report - Update − CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report − CMOS Image Sensors Monitor 2018* – Quaterly Update** − Camera Module 2017 – Market Technology Report − Compact Camera Module Comparison 2018 – Structure, Process Cost Report − LiDARs for Automotive and Industrial Applications 2018 – Market Technology Report − LiDAR for Automotive 2018 – Patent Landscape Analysis ADVANCED PACKAGING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Advanced Packaging Industry 2018 – Update − Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends − 3D TSV and Monolithic Business Update 2018 – Update − Power Modules Packaging 2018 – Update − Discrete Power Packaging 2018 – Update* − Status of Panel Level Packaging 2018 − Trends in Automotive Packaging 2018 − Hardware and Software for AI 2018 - Vol. 1 2 − Thin-Film Integrated Passive Devices 2018 − Memory Packaging Market and Technology Report 2018 – Update* o PATENT ANALYSES – by KnowMade − Hybrid Bonding for 3D Stack – Patent Landscape Analysis o LINKED REPORTS– by Yole Développement and System Plus Consulting − Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report - Update* − Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process Cost Report − Fan-Out Packaging 2018 – Market Technology Report – Update* − Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report MANUFACTURING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Wafer Starts for More Than Moore Applications 2018 − Equipment for More than Moore: Technology Market Trends for Lithography Bonding/Debonding 2018 − Polymeric Materials for wafer-level Advanced Packaging 2018 − Laser Technologies for Semiconductor Manufacturing 2017 − Glass Substrate Manufacturing in the Semiconductor Field 2017 − Equipment and Materials for Fan-Out Packaging 2017 − Equipment and Materials for 3D TSV Applications 2017 o LINKED REPORTS – by Yole Développement and System Plus Consulting − Equipment for More than Moore: Technology Market Trends for Lithography Bonding/Debonding 2018 – Market Technology Report − Wafer Bonding Comparison 2018 – Structure, Process Cost Report Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (3/4) MEMORY o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Emerging Non Volatile Memory 2018 – Update − Memory Packaging Market and Technology Report 2018 – Update* o QUARTERLY UPDATE – by Yole Développement** − Memory Market Monitor 2018 (NAND DRAM) o MONTHLY UPDATE – by Yole Développement** − Memory Pricing Monitor 2018 (NAND DRAM) o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting − DRAM Technology Cost Review 2018 − NAND Memory Technology Cost Review 2018 o PATENT ANALYSES – by KnowMade − 3D Non-Volatile Memories – Patent Landscape COMPOUND SEMICONDUCTORS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Compound Semiconductor Industry 2018* − GaAs Materials, Devices and Applications 2018 − InP Materials, Devices and Applications 2018 − Bulk GaN Substrate Market 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Power SiC 2018: Materials, Devices, and Applications – Market Technology Report – Update − SiC Transistor Comparison 2018 – Structure, Process Cost Report − Power SiC 2018 – Patent Landscape Analysis − Power GaN 2018: Materials, Devices, and Applications – Market Technology Report – Update − GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report − Status of the GaN IP – Patent Watch 2018 Patent Activity 2017 − RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 – Market Technology Report – Update − RF GaN – Patent Landscape Analysis POWER ELECTRONICS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Power Electronics Industry 2018 – Update − Discrete Power Packaging 2018 – Update* − Power Electronics for Electric Vehicles 2018 – Update − Integrated Passive Devices (IPD) 2018 − Wireless Charging Market Expectations and Technology Trends 2018 − Thermal Management Technology and Market Perspectives in Power − Electronics and LEDs 2017 − Gate Driver 2017 − Power MOSFET 2017 − IGBT 2017 − Market Opportunities for Thermal Management Components in Smartphones 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Power Modules Packaging 2018 – Market Technology Report – Update − Automotive Power Module Packaging Comparison 2018 – Structure, Process Cost Report − Power ICs Market Monitor 2018 – Quaterly Update** − Power ICs Market Comparison 2018* – Structure, Process Cost Report BATTERY AND ENERGY MANAGEMENT o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 – Update o PATENT ANALYSES – by KnowMade − Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017 o LINKED REPORTS – by Yole Développement and KnowMade − Solid State Electrolyte Battery 2018 – Market Technology Report − Solid-State Batteries 2018 – Patent Landscape Analysis Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
13©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (4/4) SOLID STATE LIGHTING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update − Automotive Lighting 2018: Technology, Industry and Market Trends – Update − UV LEDs 2018: Technology, Industry and Market Trends – Update − LiFi: Technology, Industry and Market Trends − LED Lighting Module Technology, Industry and Market Trends 2017 − CSP LED Lighting Modules − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − Horticultural Lighting 2017 o LINKED REPORTS – by Yole Développement and System Plus Consulting − VCSELs 2018: Technology, Industry and Market Trends – Market Technology Report − VCSELs Comparison 2018 – Structure, Process Cost Report DISPLAYS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update − Displays and Optical Vision Systems for VR/AR/MR 2018 − MicroLED Displays 2018 – Market Technology Report – Update o PATENT ANALYSES – by KnowMade − MicroLED Display – Patent Landscape Analysis MEDTECH o MARKET AND TECHNOLOGY REPORT – by Yole Développement − BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical − Applications 2018 – Update − Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update − Neurotechnologies and Brain Computer Interface 2018 − CRISPR-Cas9 Technology: From Lab to Industries 2018 − Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018 − Inkjet Functional and Additive Manufacturing for Electronics 2018 − Liquid Biopsy: from Isolation to Downstream Applications 2018 − Chinese Microfluidics Industry 2018 − Scientific Cameras for the Life Sciences Analytical Instrumentation Laboratory Markets 2018* − Artificial Organ Technology and Market 2017 − Connected Medical Devices Market and Business Models 2017 − Status of the Microfluidics Industry 2017 − Organs-On-Chips 2017 − Solid-State Medical Imaging 2017 − Medical Robotics Market Technology Analysis 2017 o PATENT ANALYSES – by KnowMade − Microfluidic IC Cooling – Patent Landscape − Circulating Tumor Cell Isolation – Patent Landscape − OCT Medical Imaging – Patent Landscape − Pumps for Microfluidic Devices – Patent Landscape 2017 − Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017 − FLUIDIGM – Patent Portfolio Analysis 2017 − Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Organs-On-Chips 2017 – Market Technology Report − Organ-on-a-Chip – Patent Landscape Analysis Update : 2017 version still available / *To be confirmed
14©2018 | www.yole.fr | About Yole Développement OUR 2017 PUBLISHED REPORTS LIST (3/3) OUR PARTNERS’ REPORTS PATENT ANALYSES – by KnowMade − Wireless Charging Patent Landscape Analysis − RF Acoustic Wave Filters Patent Landscape Analysis − NMC Lithium-Ion Batteries Patent Landscape Analysis − Pumps for Microfluidic Devices Patent Landscape − III-N Patent Watch − FLUIDIGM Patent Portfolio Analysis − Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017 − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping − Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets − Microfluidic Technologies for Diagnostic Applications Patent Landscape TEARDOWN REVERSE COSTING – by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017 MORE INFORMATION o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com. o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide).
15©2018 | www.yole.fr | About Yole Développement MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.We will ensure you benefit from this. ONLINE ONSITE INPERSON @Micronews e-newsletter i-Micronews.com i-Micronewsjp.com FreeFullPDF.com Events Webcasts Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility.They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively – but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Targeted audience involvement equals clear, concise perception of your company’s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience.Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Benefit from the i-Micronews.com traffic generated by the 11,200+ monthly unique visitors, the 10,500+ weekly readers of @Micronew se-newsletter Several key events planned for 2018 on different topics to attract 120 attendees on average Gain new leads for your business from an average of 340 registrants per webcast Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager
16©2018 | www.yole.fr | About Yole Développement CONTACT INFORMATION o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS • North America: • Steve LaFerriere, Senior Sales Director forWestern US Canada Email: laferriere@yole.fr – + 1 310 600-8267 • Troy Blanchette, Senior Sales Director for Eastern US Canada Email: troy.blanchette@yole.fr – +1 704 859-0453 • Japan Rest of Asia: • Takashi Onozawa, General Manager,Asia Business Development (Korea, Singapore, India ROA) Email: onozawa@yole.fr - +81 34405-9204 • Miho Othake, Account Manager (Japan) Email: ohtake@yole.fr - +81 3 4405 9204 • Itsuyo Oshiba, Account Manager (Japan) Email: oshiba@yole.fr - +81-80-3577-3042 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • RoW: Jean-Christophe Eloy, CEO President,Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 o FINANCIAL SERVICES (in partnership withWoodside Capital Partners) • Jean-Christophe Eloy, CEO President Email: eloy@yole.fr - +33 4 72 83 01 80 • Ivan Donaldson,VP of Financial Market Development Email: ivan.donaldson@yole.fr - +1 208 850 3914 o GENERAL • Public Relations: leroy@yole.fr - +33 4 72 83 01 89 • Email: info@yole.fr - +33 4 72 83 01 80 Follow us on

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