ICT Proposers' Day 2019 Side Event, Visit 1

Welcome to Visit 1:
Microelectronics and Printed Intelligence Pilot
and Demonstration Facilities
Host: Tauno Vähä-Heikkilä, VTT
#ICTpropday
#vttbeyondtheobvious
20/09/2019 VTT – beyond the obvious

Micronova Centre for Micro and Nanotechnology
Himadri Majumdar, VTT
Printocent Pilot Manufacturing for Printed Intelligence
Jukka Hast, VTT
OtaNano
Jukka Pekola, Aalto University
Silicon Photonics
Timo Aalto, VTT
Antennas and RF Technologies
Pekka Rantakari, VTT
Visit of the Micronova Facility
Agenda

MICRONOVA
Centre for Micro and
Nanotechnology
Himadri Majumdar
#ICTpropday
#VTTbeyondtheobvius
20/09/2019 VTT – beyond the obvious 3

20/09/2019
Owned by
Ministry of
Economic
Affairs and
Employment
VTT – beyond the obvious
Established in
1942
268M€
Net turnover and
other operating
income (VTT
Group 2018)
2,049
Total of personnel
(VTT Group
31.12.2018)
44%
From the net
turnover abroad
(VTT Group
2018)
31%
Doctorates and
Licentiates
(VTT Group
2018)
VTT is one of the leading research, development and
innovation organizations in Europe. We help our customers
and society to grow and renew through applied research. The
business sector and the entire society get the best benefit
from VTT when we solve challenges that require world-class
know-how together and translate them into business
opportunities.
Our vision
A brighter future is created through science-based
innovations.
Our mission
Customers and society grow and renew through
applied research.
Strategy
Impact through scientific and technological excellence.
4

VTT is a key actor
in the Finnish
innovation ecosystem
• Innovation partner to companies
• Finland’s biggest single actor in
EU’s framework programmes
• Participates in ca. 30 national
technology programmes (Business
Finland, Academy of Finland)
• Strategic partnerships with main
universities
• Participates in two Academy of
Finland Centers of Excellence and
in four Flagship Programme
5

VTT is one of the most appreciated and
active Horizon 2020 programme
participants.
VTT has won EUR 134 million in research
funding from the H2020 programme in
2014 to 2018. This represents 17% of the
funding won by the Finnish participants.
European Research Ranking:
VTT ranked 4th
in Horizon 2020

VTT’s research projects
COMMERCIAL
PROJECTS
Impact:
• Building competitiveness for VTT’s
customers through world-class research
and innovation services
JOINTLY FUNDED
PROJECTS
Impact:
• More efficient technology transfer
• Foundation for new innovations and
political decision-making
SELF-FINANCED
PROJECTS
Impact:
• Developing VTT’s own competitiveness
and acquiring knowledge and expertise
to meet future customer needs
1
2
3

VTT’s R&D
infrastructure
– an essential
part of the
national
research
infrastructure
Bioruukki Biotechnology and food
research piloting environment
ROVIR
A pilot-scale research environment
for fibre processes
Centre for Nuclear SafetyEngine and vehicle laboratory
Micronova VTT MIKES MetrologyPrintoCent

Micronova is the largest R&D cleanroom in Nordics
for fabrication of silicon based microstructures
A national research infrastructure in the
field of microelectronics and
nanotechnology
• VTT, Aalto University and companies
• Both academic and applied research
• Pilot and small scale production
Cleanroom environment enables versatile
innovation projects

20+ PRIVATE COMPANIES USING MICRONOVA FACILITIES
CONTRACT MANUFACTURING
SERVICES
BASIC RESEARCH
AND EDUCATION
PRIVATE CONTRACT RESEARCH
WITH COMPANIES
APPLIED RESEARCHPUBLIC AND JOINT-FUNDED RESEARCH
Micronova – A central hub for the Finnish
electronics industry ecosystem
18 M€ portfolio
MICRONOVA

VTT – beyond the obvious 11
Micronova Facilities
Main Cleanroom Characteristics
Total Area 2 600 m2
Cleanroom Classification ISO 4…ISO 6
Temperature 21 C  0,5 C
Relative humidity 45 %  5
Labs with built-in Cleanroom
 Micro-packaging lab - dicing saws, wire
bonding
 SubTech lab - Ion implantation, CMP,
backgrinder, wafer bonder

Existing Technology Platforms
Silicon
Photonics
Hyperspectral
Components
MEMS
Technologies
Quantum
Devices
Silicon
Detectors
Silicon Photonics
solutions based on a
novel, low-loss thick SOI
platform.
Optical MEMS-based
& Piezo Fabry-Perot
filters for spectroscopy
applications
Surface MEMS, SOI
MEMS and Piezo-MEMS
CSOI processing
capabilities.
Superconducting and
tunnel-junction
devices
Pixel detectors for
medical and high energy
physics applications.
Developed within research projects over multiple years, platforms listed are mature enough
for VTT Memsfab to offer manufacturing services

13
Equipment and Process Overview
Lithography
i-line stepper, 5:1, 0.35 µm CD
Contact/proximity aligners
Electron-beam writing
Nanoimprinting (step&stamp)
Etching
Polysilicon/nitride
Oxide; thin film and Advanced Oxide Etching
Metals; Al, Mo, Ti-W, Nb (TCP)
Deep silicon etching; production and R&D
Anhydrous HF vapour
Ion trimming
Wet etching, various; critical-point drying
Deposition
Six sputtering tools
LPCVD of nitride, poly, and oxide (TEOS, LTO)
PECVD; nitride and oxide
ALD: aluminium oxide, titanium oxide
Parylene
Ion implantation
Medium-current; n- or p-type doping of silicon
Plating, spin-coating
Cu (via or wiring), Ni, Sn-Ag, Sn-Pb, In-Sn, Au
Polyimide, BCB
3D integration
CMP of Si/oxide or copper
Direct wafer bonding
Grinding
Spin-etching
Thin-wafer handling
Ion trimming
Backend
Dicing, flip-chip and wire bonding

PrintoCent pilot
manufacturing for
printed intelligence
Prof. Dr. Jukka Hast
Research Manager
Sensing and Integration
jukka.hast@vtt.fi
+358 40 587 0069
20.9.2019 VTT – beyond the obvious 15

Contents
 What is Printed Intelligence?
 Research today at VTT
 Position
 Infra
 Some research highlights
 PrintoCent Industry Cluster
 Spin-offs

What is Printed intelligence?
Printed intelligence are components and systems which:
 extend the functions of printed matter beyond traditional
visually interpreted text and graphics
 perform actions as a part of functional products or wider
information systems
Printed intelligence is combined multidisciplinary know-how of
 Electronics, photonics, biotechnology, nanotechnology,
chemistry, printing, hybrid integration and process automation
Key application areas are:
 Structural electronics and photonics
 Stretchable and wearable electronics
 Diagnostics and biosensors
 …

Research teams (100+ people in Oulu & Espoo):
 Flexible electronics integration (Oulu)
 Concept creation for smart surroundings, large-area surfaces and wearables
 Hybrid integration R&D & PrintoCent Pilot Factory
 Printed electronic processing (Oulu)
 Printed optoelectronics (OPV, OLED, OPD)
 Nano- and microstructure replication (hot embossing and nano-imprinting)
 Flexible sensors and devices (Espoo)
 Printed sensors and indicators including paper-based diagnostics
 Sensor read-out electronics (transistors, memories, circuits)
 Biosensors (Oulu/Espoo)
 Assay platforms with printed functionality
 Diagnostic systems (assay platform and reader devices)
 Tailored antibodies for diagnostics and analytical purposes
Printed Intelligence research at VTT
Scale up large area R2R printing process from lab to pilot fab•
•Oulu
Espoo
Polar circle
1h flight

Strong player in EC R/D-landscape (FP6 => H2020)
Impact in European framework programs:
• Over 40 research project done/on-going (11 VTT coordinated projects)
• Total project volume over 350 M€
Networking and CSA projects: FP7-PRODI, FP7-PolyNEt, FP7-PolyMAP, FP7-OPERA,FP7-FlexNEt, FP7-COLAE

Flexible and Printed Electronics
VTT’s competitive edge to demonstrate functional systems is enabled by:
 Multidisciplinary research teams
 Unique roll-to-roll research infrastructure
 About 20 years experience – research started at end of 1990’s
 Strong international networking with academia and industry
Materials Components Systems
Material tailoring
VTT’s competences cover whole production chain
Component manufacturing System integration

World leading roll-to-roll pilot manufacturing facilities
PICO printing machine ROKO printing machine
MAXI printing machine
TESLA2 testing unit
ELAS ps-laser processing unit
DELTA converting unit
with CO2 laser
ENKELI R2R injection moulding
machine
EVO assembly and bonding unit
LAKO assembly and bonding machine

Some research highlights
R2R printed Organic PV modules:
150 meters foil tested, yield 100%, Area 100 cm2, PCEAVE
1.8%, PCEMAX 2.1% (with P3HT_PCBM)
Printed oxide TFTs on low-T plastic:

R2R processing of PDMS biosensors:
Nature Reviews Materials (2017), 2, 17016
Hou et al
Nature (2014), 507, 181 Sackmann et al

R2R processing of sweat analysis patches:

Elevator user interface in media wall (GEN2):
UI media panel (2.6m x 1.3m) implementation
including:
 Manufactured using R2R printing and hybrid
assembly techniques including functional testing
 Backlighting video and display element
implemented with data bus controllable RGB LEDs
(5050 LEDs)
 Proximity sensing with transparent capacitive touch
sensors and Haptic feedback element
In GEN3 phase whole elevator cabin demonstrator with
total wall area of 18 m2 is targeted equipped with pop-
up user interfaces.

R2R manufacturing of cancer diagnostic photonic biosensors:

PrintoCent Industrial Cluster
2019-2021
2016-2018
2013-2015
www.printocent.com
27.-30.1.2020, Oulu, Finland

Deep tech Spin-offs from R/D work
See through near to eye display to smart glasses
www.dispelix.com
Listed on 60 most promising spin-offs list:
Produces holographic-like, light scattering effects for plastic-
based and fibre-based film materials with its’ state-of-the art
surface modification technology - www.iscent.fi
EARTO Innovation Award 2018
Injection molded structural electronics (IMSE)
solutions seamlessly integrate printed circuitry
and electronic components within 3D injection
molded plastics.
www.tactotek.com
+several other spin-offs and start-ups employing +300 people in Finland

Aalto University
Large scale research and teaching
infrastructures
Jukka Pekola
18 September 2019

Aalto large scale RIs
• Supported by over 10 M€
annually from University
budget
• Provide support to the core
research at Aalto University
• Open for external partners
• Professionally managed
• Operate under Aalto’s
common management
principles:
 Defined management and
ownership
 Transparent budgeting, costs
and invoicing
 Open access
 Clear plan of development
 Annual evaluation

• Aalto IceTank
 Multipurpose basin suited for testing ships
and other maritime structures in ice
conditions
• Aalto Neuroimaging
 Open-Access Infrastructure for Human
Functional Neuroimaging
• Aalto Studios
 The media center of the future
• Bioeconomy
 Research Infrastructure for sustainable
biomass refining
• i3
 Industry Innovation Infrastructure
Aalto large scale RIs
• Metsähovi radio-observatory
 The only astronomical radio observatory in
Finland
• OtaNano
 Nanoscience and technology and quantum
technologies
• RawMatTERS
 Design, synthesis and characterization of a
variety of inorganic materials
• Science-IT
 Resources in data analytics and
computational research

National
OPEN ACCESS
research infrastructure
www.otanano.fi

• Aalto-VTT joint research
infrastructure
• Established 2013 (current form)
• On National RI Roadmap since
2009
• Currently serves 9 Finnish
universities and 30+ companies
• Since 2013: > 500 000 h of use
> 100 theses
> 1000 rev. articles
~ 100 pat. / appl.
8 M€
annual budget
500
FEATURES
users annually
• 90 research groups
• 30 companies

FOCUS AREAS
• Nanostructured
materials
• Nanoelectronics and
quantum technology
• Micro- and
nanophotonics
• MEMS/NEMS, printed
electronics

4 700
m2 of lab space
24/7
available tools
• 2600 m2 cleanroom,
ISO 4–ISO 6
• Vibration free facilities for
nanomicroscopy
• Ultra-low-noise
measurement techniques at
cryogenic temperatures
• Over 200 major instruments
installed
FACILITIES

QUANTUM TEHCHNOLOGIES
Computers &
Transistors
Light emitting
diodes (leds)
Photodetectors &
photodiodes
Lasers
Scanning tunnelling
microscopes
GPS &
Atomic clocks
MRI and MEG
scanners
Solar panels
1st
revolution 2nd
revolution

Faster method to
read quantum
memory –
speeding up
getting data from
a quantum
computer.
QUANTUM HIGHLIGHTS
Quantum control
of high speed
energy
transfers –
paving the way
towards
quantum
simulation and
computing
applications.
Realization of a
miniature heat
valve –
a major step
towards
quantum
refrigerators and
heat engines.
New confirmation
of exotic
arrangements in
graphene –
novel approach
for topologically
protected
quantum
information
processing.
Fabrication and
properties of a
new nanowire
structures –
applications in
photonics and
quantum
technologies.

More information:
www.otanano.fi

Silicon
Photonics
Timo Aalto
Research Team Leader
VTT
#ICTpropday
#VTTbeyondtheobvious

Photonics integration – Why?
 Discrete components don’t scale up well into complicated systems
20/09/2019 VTT – beyond the obvious Ludwig-Maximilians-University – Munich
https://www.quantum-munich.de/media/nice-photos
41

Benefits of photonic integrated circuits
 Smaller size
 Smaller weight
 Smaller power consumption
 Smaller cost (in volume manufacturing)
 Better optical performance
• Lower coupling losses
• Higher bandwidth

Example applications for Si photonics
 Data/signal transfer
• Data centers
• Fiber networks
• Wireless networks
• Harsh environments
• Quantum key distribution
 Data/signal processing
• Analog-digital conversions
• Optical logic & memory
• Microwave photonics
• Optical computing
• Quantum computing
• Neural networks and AI
 Sensors & imaging
• Gas analysis
• Environmental and
biosensors
• Medical imaging
• LIDARs
"Low-error and broadband microwave frequency
measurement in a silicon chip", Optica 2, pp. 751-756, 2015

Many open access Si photonics platforms
Si310-PH
Si substrate
WaveGuide
SiO2
Si
FiberCoupler
PSV
ISIPP50G
IHP SG25H4_EPIC
Passive + heaters IHP SG25_PIC
Passive + heaters
Actives
Passives
+ Heaters
+ Implanted PIN
+ Flip-chip
310 nm SOI220 nm SOI 3 µm SOI220 nm SOI 220-500 nm SOI
Photonic BiCMOS
Customized actives &
Passives with EBL
220/340 nm SOI
220/300 nm SOI220 nm SOI 220 nm SOI 220 nm SOI
3 µm SOI
44
Specialty of VTT: 3 µm thick silicon-on-insulator (SOI) waveguides

Illustration of the 3 µm SOI platform
3 µm thick SOI layer
Buried oxide
layer
Silicon substrate
Oxide cladding layer
Up-reflecting
TIR mirror
and anti-
reflection
layer
Single-mode rib waveguide
Multi-mode strip waveguide
Total internal reflection (TIR) mirror
Rib-strip converter
Spot-size converter
Euler bend

Micron-size SOI waveguides have ultra-wide
wavelength range for both TE & TM
220 nm SOI
(strip)
TE
TM
3 µm SOI
(SM rib)
3 µm SOI
(strip)
12 µm SOI
(strip)
Standard
single-mode fiber
1.2
µm
1.5
µm
1.8
µm
2.1
µm
2.4
µm
2.7
µm
3.0
µm
3.3
µm
3.6
µm
3.9
µm
4.2
µm
TE
TM
TE
TM
Norm of the E field plotted
as a function of wavelength
(material absorption and
dispersion ignored)
Core

Small bends and mirrors for dense PICs
Euler bends for
negligible loss
and small footprint
(<0.01 dB,
Reff = 10-50 µm)
Total internal
reflection mirrors
for negligible footprint
and small loss
(0.1-0.3 dB, Reff = 1.5 µm)
5 µm

Wavelength (de)multiplexers and filters
With strip (+rib) waveguides:
 Arrayed waveguide gratings (AWGs)
 Echelle gratings
 Asymmetric Mach-Zehnder interferometers
 Ring resonators and ring-loaded AMZIs
Ring-loaded AMZI
48
1530 1540 1550 1560
- 40
- 30
- 20
- 10
0
Wavelength (nm)
Transmission(dB)
CH1
CH2
CH3
CH4
CH5
Echelle with 1 mm2 footprint
and down to 0.9 dB loss (TE)1x10 AWG with loss ~1.6 dB
and cross-talk -35 dB (TE)

Ring-loaded AMZI
49
Ring-loaded AMZI for flat-top interleaving

With rib waveguides:
 Directional couplers and lattice filters
Ring-loaded AMZI
1310 nm 1490 nm

Ge photodetectors up to 40 GHz
 Vertical Ge PDs for high sensitivity
 Side-wall implanted horizontal Ge PDs
for fast operation
 Bandwidth limited by the width of the Ge
waveguide n-well
on Si
n-well
on Si
p-well
on Ge
Vertical PIN Ge PD
3 µm SOI
waveguide
n-well p-well
Horizontal PIN
Ge PD

Seeking for the holy grail in silicon photonics:
Monolithically integrated optical circulator
 Faraday rotation in 3 µm SOI has already
been demonstrated
 Further work is needed to improve
bandwidth & isolation, and to develop
polarization splitters and rotators
Dirk Jalas et al.,
"Faraday rotation in
silicon waveguides",
Proc. IEEE 14th Int.
Conf. Group IV
Photonics (GFP’17),
pp. 141-142, 2017
52
PBSPBS
45° FR
45° FR
45° reciprocal
rotators
IN
M
M
OUT

Next step: Local spot-size conversions
for ultra-fast components
3 µm thick waveguide
(low-loss, zero-birefringence)
Thin a-Si waveguide
pulling light to the surface
Evanescently coupled III-V
devices (lasers, SOAs, EAMs)
Fast (monolithic)
detectors and modulators
 Amorphous silicon “escalator” pulling light
into a thin a-Si waveguide
 High-speed modulators and photodetectors
can be coupled to the thin waveguide
SIDEVIEWTOPVIEW
SOI a-Si
BOX
SiO2
53
TE
TM
l = 1260nm
Fabricated a-Si waveguide on Si

Finnish Si photonics ecosystem
 National RAPSI project 2018-2020 for
"Ramping up silicon photonics business in Finland"
 VTT and Tampere University jointly develop hybrid & monolithic
integration of III-V chips on SOI wafers
 Integrated InP/GaAs-on-SOI to be offered in MPW runs
 Industrial RAPSI partners develop new manufacturing methods
for SiPh and their own SiPh products
https://www.vttresearch.com/media/news
/turning-silicon-photonics-into-a-new-
competitive-asset-for-the-electronics-industry
H. Tuorila et al., Appl. Phys. Lett.
113, 041104 (2018)

VTT’s services in silicon photonics
Consultation & feasibility studies
VTT can help you to understand SiPh
and to see what silicon photonics can
do for you and your business.
Multi-project wafer runs
Low-cost prototyping using VTT’s
process design kit (PDK) and mature
process modules. VTT delivers SiPh
chips with your layout.
Design support
VTT can provide all or part of the
design and simulation work that is
needed to convert your conceptual
idea into a product.
Dedicated process runs
VTT can provide full SiPh wafers,
customized wafer processes and
process development to come up
with an optimized solution for you.
Assembly, packaging and testing
VTT can help you to convert optical
chips into functional modules and
systems, and to test those on
wafer/chip/module/system level.
Contract manufacturing
After successful prototyping at VTT,
small and medium volume production
is available via VTT Memsfab Ltd. in
the same fab.
Looking for an EU project partner? Contact silicon.photonics@vtt.fi

CONCLUSIONS
Micron-size silicon waveguides already offer
• Low losses in small footprint
• Polarization independent, ultra-broadband operation
• Monolithic & hybrid integration of active components
…and in the future they are aimed to also offer
• Isolators & circulators on chip
• Fast monolithic modulators
• Even lower losses to support microwave photonics,
optical computing and other new applications
• Scalability from R&D and small volumes (<1M chips)
to very large volume manufacturing (>>1M chips)

Acknowledgments
 VTT: Matteo Cherchi, Mikko Harjanne, Fei Sun, Tapani
Vehmas, Srivathsa Bhat, Markku Kapulainen, Giovanni
Delrosso, Päivi Heimala, Ari Hokkanen, Tomi Hassinen,
Lauri Lehtimäki, Mikko Karppinen, Jyrki Ollila, Noora
Heinilehto etc.
 Tampere university: Mircea Guina, Jukka Viheriälä
 Hamburg University of Technology:
• Dirk Jalas, Nabeel Hakemi, Alexander Petrov,
Manfred Eich
 Vertilas Gmbh: Christian Neumeyr
 PASSION, RAPSI, OPEC: All project members
RAPSI
OPEC

Thank you!
@VTTFinland
#VTTbeyondtheobvious
silicon.photonics@vtt.fi
www.vtt.fi/siliconphotonics

Antennas and RF
technologies
Pekka Rantakari

Antennas and RF technology
• Hardware and technology
development for RF applications
from sub 6 GHz to THz
frequencies
Research focus
• Part of MilliLab, Millimetre
Wave Laboratory of Finland
(est. 1995)
Several decades of
experience on mm-
waves
• Millimetre wave imaging radars
(24,35 & 60 GHz)
• Millimetre and sub-mm wave
radiometer development
• Active antennas for 5G and
beyond wireless systems (sub
6GHz, E-band, D-band)
• 5G satellite integration - payloads
for mm-wave communications
• Evaluation and space
qualification of RF components,
material characterization
• LTCC manufacturing (e.g. ceramic
antennas and AiP modules)
Current R&D topics and
activities
• Anechoic chambers
for antenna testing
• Labs and
cleanrooms for
manufacturing and
on-wafer testing
Research
facilities
R&D services from
design to
manufacturing,
prototyping and
testing

Why?
 Digitalization, robotization and rise
of autonomous systems
 We are living a Digital World and
number of connected devices and
amount of data is increasing faster
and faster every year
 New digital services need high
capacity networks that are available
anytime and anywhere
 Autonomous systems (e.g. self-
driving cars and ships) and robots
need reliable sensor systems and
low-latency connectivity

 16-channel beam forming BiCMOS SiGe MMICs
• Active phased array antennas for E-band (71-76 GHz)
• 8-bit digital control for phase and amplitude
 4 mm × 4 mm MMIC includes:
• 16 times LNA + VM + BA + DAC
• 16-to-1 power combining/dividing network
• solder bumps for flip-chip packaging
E-band 5G development – Beam forming MMIC
65
4×4 receiver MMIC 4×4 transmitter MMIC
Research Highlights
One MMIC feeds 16 antenna elements

66
E-band active phased array antennas
Simulated beam steering of 64-element array
φ= 0 deg. φ= 90 deg.
64-el array in CST
16-element array Electronic scanning range +/-30 degrees
Research Highlights
https://www.luxturrim5g.com/

 ESA ARTES Advanced Technology Programme project
 Study W-band for future satellite communication links
 Why W-band (75-110 GHz)?
• Wide available bandwidth
• small antenna size for high gain
• low interference from ground
• rapid RF electronics development
 Purpose is to collect propagation data at W-band from LEO to
ground to create atmospheric channel propagation models
 Reaktor Space Lab satellite platform is used in 3U
configuration
 VTT is responsible for the RF payload including antennas
• Radio beacon for Q/V- and W-bands
 Planned launch in 2020
W-band communication test mission – W-CUBE
67
artes.esa.int/projects/w-cube
Photos: Reaktor Space Lab.
Research Highlights

 State-of-the-art 60 GHz 3D imaging system,
based on VTT’s in-house designed radar
MMICs
 Fully scalable radar chips with FMCW and
modulation capabilities
 Supports frequency MIMO operation
Modular 60 GHz 3D imaging system
4-ch Tx and Rx
MMICs based on
the IHP’s SG13S
SiGe technology
Research Highlights

 Surroundings sensing/imaging
• Visually impaired persons, robotics &
autonomous systems
 Presence detection
• Counting and tracking objects
 Wellbeing (Radar + AI & ML)
• Vital sign monitoring (RR, HR, HRV)
• Sleep quality
• Stress recovery
Radar use-cases
Research Highlights
69

Summary
We are living in a Digital
World and number of
connected devices and
amount of data is
increasing faster and
faster every year
Autonomous systems (e.g. self-
driving cars and ships) and robots
need reliable sensor systems
and low-latency connectivity
VTT is developing antennas
and RF solutions
for future wireless
communications systems
as well as for robotics, autonomous
systems, public safety and wellbeing
applications
We collaborate world wide
with top universities, research
organisations and companies
70

Pekka Rantakari
pekka.rantakari@vtt.fi
+358 40 7215 148
@VTTFinland
@your_account
www.vtt.fi

ICT Proposers' Day 2019 Side Event, Visit 1

Empfohlen

Empfohlen

Weitere ähnliche Inhalte

Was ist angesagt?

Was ist angesagt? (20)

Ähnlich wie ICT Proposers' Day 2019 Side Event, Visit 1

Ähnlich wie ICT Proposers' Day 2019 Side Event, Visit 1 (20)

Mehr von VTT Technical Research Centre of Finland Ltd

Mehr von VTT Technical Research Centre of Finland Ltd (20)

Kürzlich hochgeladen

Kürzlich hochgeladen (20)

ICT Proposers' Day 2019 Side Event, Visit 1