The case for non-destructive imaging New integrated circuit technologies and advanced heterogeneous integration call for innovative non-destructive and non-invasive imaging techniques. Semiconductors are everywhere and it is no longer possible to decapsulate an IC whilst keeping its functionality undamaged. The increasing trend towards More-than-Moore (MtM) approaches and the universalisation of sensor applications have brought the need to see what is going on inside fully encapsulated packaged devices. As fabrication process complexity increases, the possibility to perform in situ/in operando 3D/2D radiographic investigations of systems as manufactured remains a major challenge for the semiconductor industry.

1. Rafael Varela Della Giustina, Business Developer
of The Platform for Advanced Characterisation - Grenoble (PAC-G)
support pac-grenoble.eu | +33 (0)4 57 42 80 77
www.pac-grenoble.eu
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The case for non-destructive imaging
New integrated circuit technologies and advanced heterogeneous integration call for innovative non-destructive and
non-invasive imaging techniques. Semiconductors are everywhere and it is no longer possible to decapsulate an IC whilst
keeping its functionality undamaged. The increasing trend towards More-than-Moore (MtM) approaches and the
universalisation of sensor applications have brought the need to see what is going on inside fully encapsulated packaged
devices. As fabrication process complexity increases, the possibility to perform in situ/in operando 3D/2D radiographic
investigations of systems as manufactured remains a major challenge for the semiconductor industry.
What is going on inside your device?
Slice image acquired from a packaged chip
showing the interface between two dies.
We can observe copper pillars in white and
defects (voids) as black dots.
Non-destructive radiography
of a multilayer packaged device
on substrate with wire bonding.
We at the PAC-G are ready to help you
overcome your challenges!
Picture showing the reconstructed metal
interconnections inside a flip chip.
The Results
What you can expect
New synchrotron X-ray techniques at the ESRF offer
unique capabilities for non-destructive imaging
of advanced semiconductor devices. Using ESRF’s
facilities, fully packaged integrated circuits can be
visualised with spatial resolutions up to 150 nm in a
highly flexible characterisation environment. These
unique features enable 3D and 2D images of a device
during operation.
If higher resolution is needed, nano tomography is
also available for samples up to 400 µm. In this
configuration, world record 23 nm spatial resolution
can be achieved (with 10 nm pixel size) thanks to
advanced X-ray optics. Produsing high brilliance beam
focused down to the nanometre scale.
The Solution
Synchrotron X-ray Tomography:
for non-destructive imaging
Synchrotron X-Ray tomography is the only available
technique to visualise three-dimensionally
the interior structure of packaged devices
non-destructively.
The European Synchrotron (ESRF) offers a highly
coherent beam and a very high intensity source
yielding unmet spatial resolution and high penetration
depth. The unique ability to acquire images on very
short time-scales also allows for in situ and in
operando characterisation. This is crucial for,
for instance, the visualisation of a MEMs during
operation or for reliability investigations.
Synchrotron X-ray tomography also offers the
possibility for phase contrast imaging which can
provide much higher contrast information.
The Platform for Advanced Characterisation -
Grenoble (PAC-G) is the single entry point for
tomography services at ESRF in Grenoble.

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