1. The document discusses Custom Interconnect Ltd (CIL), an electronics manufacturing company that specializes in power electronics and has expanded its capabilities for GaN and SiC devices. 2. CIL has been successful in projects like GaNSiC that developed new silver sintering techniques for attaching GaN and SiC dies. 3. CIL continues to work with customers on non-funded power electronics projects and has two new funded projects starting in early 2022.

1. Engage With… CUSTOM INTERCONNECT
18 November 2021
CIL IS HERE TO HELP YOU DEVELOP PEMD PRODUCTS,
BUT WE REALLY CONCENTRATE ON MANUFACTURE
John Boston (Managing Director)
CUSTOM INTERCONNECT LTD
www.cil-uk.co.uk

2. 1. HISTORY AND BUILD UP TO POWER DEVICES
2. PROJECT APC15@FutureBEV
3. PROJECT GaNSiC
4. NORMAL POWER BUSINESS
5. OTHER FUNDED PROJECTS
6. LESSONS LEARNED
EVERYTHING IS UNDER NDA
CUSTOM INTERCONNECT LTD

3. * CIL FORMED IN 1986 ALL BASED IN ANDOVER, HAMPSHIRE
* CIL HOUSE – 22,000sq ft OFFICES & PCBA PRODUCTION + CLEANROOMS
* RENNIE GATE – 10,000sq ft BOX OR FULL PRODUCT BUILD + CLEANROOMS
* “UNIT C”- 34,000sq ft OPENS Q3 2022, HOUSES MICRO-ELECTRONICS & POWER
* REVENUES ARE 50% PCBA, 40% DIE/WIREBOND & 10% BOX BUILD
* 139 STAFF TOTAL, 45 INDIRECTS AND 94 DIRECTS – 7 ENGINEERING VACANCIES
* 9 BUYERS CONTROLLING 1000 SUPPLIERS AND 35,000 COMPONENT ITEMS
* STATE OF THE ART MRP / MIS SYSTEM
* QUALITY APPROVALS ISO 9001:2015
ISO 13485:2016 (MEDICAL EQUIPMENT)
AS9100 Rev D (AEROSPACE)
Cyber Essentials
ISO14001 BEING ASSESSESED NOW
IATF16949 IN PLANNING
PEOPLE & SYSTEMS

4. * 30,000 – 40,000 ASSEMBLIES PRODUCED EACH MONTH – VOLUMES ARE INCREASING
* PRODUCTION BATCH SIZES FROM 1off – 120,000off/month
* >20 NPI’s/PROTOTYPES IN THE CIL SYSTEM AT ALL TIMES
* CIL’s RAPID SERVICE OFFERS 1-3 DAY PROTOTYPE ASSEMBLY SERVICE
* 6 SMT LINES ONE OF WHICH HAS NITROGEN (N2) REFLOW
* TEST CAPABILITY INCLUDING 3D AOI / FPT / X-Ray / CSAM / FUNCTIONAL TEST
* AUTO ALUMINIUM & GOLD WEDGE, GOLD BALL & HEAVY GAUGE ALUMINIUM WIRE BONDING
* 3 AUTOMATIC DIE BONDERS + EUTECTIC DIE BONDING
* THICK FILM HYBRID PRINTING ON ALUMINA & ALUMINIUM NITRIDE
* SOLIDWORKS 3D CAD STATIONS x 4
* ”SILICON EXPERT” COMPONENT SOFTWARE – BOM SCRUB, EOL, RoHS, COO, ALT
* ”NET COMPONENTS” COMPONENT SOFTWARE – WHO HAS STOCK GLOBALLY
Equipment and Processes

5. The CIL Facility

6. Main Assembly Area
Selective Soldering Laser De-panel Aluminium Wire bond
Surface Mount SMT Lines x 6
Nitrogen Storage
The CIL Facility

7. X-Ray & CT Scan
3D AOI x 2
TAKAYA APT1400F FPT x 2
BGA & CSP underfill
Wire pull &
component shear test
Functional Test
The CIL Facility

8. High Temperature 150 & 175DegC
Oil drill bit electronics
• 150 & 175 DegC Operating
• Polyimide PCB
• All IC’s 8 pins or greater are
“Double dipped”
• IPC3 Soldering standards
• All large components
“staked” to PCB to withstand
20G’s in 3 axis for 4 years
• 100% Conformal coated

9. PA MODULE ASSEMBLY & RADAR

10. Matchbox size
1100 components
600 0201’s
400 0402’s
66 IC’s
7000 solder joints
MINIATURISATION DIE / WIREBONDING OR SMT

11. Micro-Packaging

12. PCB MATERIALS PROCESSED
• FR4 ALL THICKNESSES
• FR4 Hi TEMPERATURE
• FR4 HEAVY COPPER TO 6oz, 8oz, 10oz,12oz IN PRODUCTION, 32oz BEING PROTO’D
• NELCO & ISOLA FOR RF CIRCUITS
• ROGER’s FOR RF CIRCUITS
• TACONIC FOR RF CIRCUITS
• ROGER’s/THICK COPPER FOR RF/uW POWER AMPLIFIERS
• RT / DUROID / RO4350B FOR uW CIRCUITS TO 70 GHz
• POLYIMIDE FOR HIGH TEMPERATURE CIRCUITS 150/175 Deg C
• ARLON 35N FOR VERY HIGH TEMPERATURE CIRCUITS >220 Deg C
• NON – MAGNETIC POLYIMIDE
• POLYIMIDE & POLYESTER FLEXI’s
• FR4 & POLYIMIDE FLEX RIGID’s
• CERAMIC – ALUMINA, ALUMINIUM NITRIDE, SILICON NITRIDE, DBC & AMB
• ALUMINIUM / ALUMINIUM CLAD / IMS PCB’s
• COPPER & COPPER CLAD PCB’s UP TO 100mm THICK
• BRASS & BRASS CLAD PCB’s
• TUNGSTEN COPPER MACHINED HOUSINGS
• STEEL / TITANIUM / MAGNESIUM

13. IN 2015 WE STARTED SEEING THE FIRST DEMANDS FOR
POWER ELECTRONICS, BOTH AT PCBA AND DIE/WIRE
BOND STAGE
CUSTOM INTERCONNECT LTD

14. MODULE ASSEMBLY
IGBT / SiC / GaN PACKAGED & BARE DIE DEVICES

15. IN LATE 2019 (JUST BEFORE COVID)
CIL GETS INVOLVED IN
PROJECT APC15@FutureBEV
PROJECT GaNSiC
CUSTOM INTERCONNECT LTD

16. APC15@FutureBEV
BMW
CIL
Lyra Electronics Ltd
Compound Semiconductor Applications
Catapult (CSAC)
University of Warwick
£30.5M project
£6.2M is CIL budget
42 months duration
CIL manufacturing partner
Accelerated Technologies for Future
Battery Electric Vehicles (@FutureBEV)
will ensure competitive powertrains in
function and costs and enable UK
technology transformation to zero
emission mobility.

17. * ASSCON VP6000 VACUUM ASSISTED VAPOUR PHASE (Installed Aug 2020)
* KEYENCE VHX-7000 DIGITAL MICROSCOPE (Installed Oct 2020)
* K&S AUTOMATIC HEAVY GAUGE ALUMINIUM WEDGE BONDER (Installed Jan 2021)
* NORDSON GEN7 SCANNING ACOUSTIC MICROSCOPE (C-SAM) (Installed Jan 2021)
* DATACON 2200EVO AUTO DIE BONDER FOR GaN/SiC POWER AMPS (Installed Feb 2021)
* BOSCHMAN SILVER SINTER FOR SiC & GaN POWER MODULE BUILD (Installed Feb 2021)
* DEK NeoHORIZON 03iX SOLDER PRINTERS x 1 (Installed Aug 2021)
* VITRONICS 10 ZONE CONVECTION REFLOW OVEN (Installed Aug 2021)
* NORDSON ASYMTEK S2-920 AUTO JETTING FLUID DISPENSE SYSTEM (Installed Oct 2021)
* MYCRONIC MY300DX SMT PLACEMENT MACHINE (Planned Dec 2021)
* BOSCHMAN UNISTAR AUTO PLASTIC OVERMOULD (Planned Mar 2022)
* DISCO WAFER DICING SAW (Planned Sep 2022)
* LASER MARKING MACHINE (Planned Mar 2022)
* DAGE PROSPECTOR MATERIAL / DEVICE TESTER (Planned Dec 2021)
* AUTOMATIC PLASTIC RESIN FILL (Planned Jan 2022)
* DE-ENCAPSULTION MACHINE (Planned Jan 2022)
* AUTOMATIC ULTRASONIC WELDER (Planned Feb 2022)
* AUTOMATIC HEAT STAKING CAPABILITY (Planned Feb 2022)
Equipment and Processes

18. The CIL Facility
Auto Die placement Silver Sinter Vacuum assisted Vapour phase
Scanning Acoustic
Microscope
X2,500 Digital
Microscope
Auto Heavy
Aluminium
wire/ribbon bonder
Auto Gold wire/ribbon
bonder

19. PLANNED EQUIPMENT AT CIL FOR GaN & SiC PACKAGING
BOSCHMANN AUTO UNISTAR
PLASTIC OVERMOULD
HESSE AUTO ULTRASONIC
LEADFRAME WELDER
DAGE PROSPECTOR
MATERIALS TESTER
DISCO DAD3361
DICING SAW
SCHEUGENPFLUG
LP804 VDU EPOXY FILL MACHINE
• PLASTIC OVERMOULD CAPABILITY DUE MARCH 2022
• EPOXY FILL CAPABILITY DUE JAN 2022
• DEVICE DICING CAPABILTY DUE SEPT 2022
• LEADFRAME / BUSBAR WELDING TO POWER DEVICE DUE FEB 2022
• DAGE MATERIALS TESTER DUE DEC 2021

20. X-RAY/CT SCAN/CSAM/4K INSPECTION & ANALYSIS
CSAM Surface scan CSAM
die surface visible, large void
CT SCAN
4K Digital 3D X-RAY

21. PROJECT PARTNERS
* CUSTOM INTERCONNECT LTD (CIL)
* COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT (CSAC)
OVERVIEW
* “The ability to replace printed High Pressure & Pressureless Silver Sinter die attach paste technologies with
“Direct Dispensed” methods for both GaN and SiC die attach and get the same mechanical, electrical and
thermal properties.”
* The moment you place the first SMT, GaN or SiC devices and then sinter, all remaining processes do not have a
flat surface and therefore subsequent printed methods of sinter deposition are not possible.
* Modern SiC based power modules will have up to four separate Silver sinter process operations in their build up
and you can only print once.
* This method can be used for discrete devices, module build and final attachment.
CSAC – Substrate & circuit design/layout, thermal & electrical testing / screening
CIL – Sinter print/”dispense”, die attach, Sintering,
wirebonding (2 types) X-Ray, CT-Scan, CSAM,
zero contact laser measurement
PROJECT GaNSiC (76169)

22. EQUIPMENT USED AT CIL FOR GaNSiC
DAGE QUADRA5
X-RAY / CT SCAN
4K ULTRA HI-DEF
DIGITAL MICROSCOPE
ASM EAGLE60
AUTO Au
Ball Bonder
ASYMTEK
AUTO DISPENSE
SYSTEM
LASER MARKER
DIE SHEAR &
WIREBOND
PULL TESTER
DATACON 2200EVO
AUTO DIE BONDER
Boschman Sinterstar
Innovate F-XL
K&S Asterion
Automatic Heavy Gauge
wire bonder
NORDSON GEN7
Scanning Acoustic
Microscope
(CSAM)

23. EQUIPMENT USED AT CSAC FOR GaNSiC
Power tester for SiC thermal
Characterisation
Semiconductor analyser and wafer prober test setup
for electrical Characterisation
Thermal Simulation using
ANSYS
Thermal
testing

24. Pressureless Silver Sinter dispense GaN
3D measurement 3D Measurement
Colour adjusted
True 3D measurement of
wet sinter paste
Die co-planarity
Measurement
FAIL!!

25. GaN OF GaNSiC

26. SiC OF GaNSiC

27. NORMAL POWER/PEMD BUSINESS
* CIL IS CURRENTLY ENGAGED WITH MULTIPLE CUSTOMERS ON NON-FUNDED PROJECTS
ACROSS THE ENTIRE PEMD COMMUNITY.
THEY ALL UTILISE WBG DEVICES SUCH AS GaN / SiC DEVICES BOTH BARE DIE AND
PACKAGED AND USE ALL OF THE TECHNIQUES DEMONSTRATED
* GaNSiC TECHNOLOGY HAS ALSO BEEN DEPLOYED ON HIGH POWER LED PRODUCTS
* GaNSiC TECHNOLOGY HAS ALSO BEEN DEPLOYED ON 195degC DOWNHOLE PRODUCTS
OTHER FUNDED PROJECTS
* CIL CURRENTLY HAS TWO FURTHER FUNDED PROJECTS DUE TO
COMMENCE IN JAN/FEB 2022, AND THESE WILL BE ANNOUNCED IN THE NEAR FUTURE
CUSTOM INTERCONNECT LTD

28. 1. GaNSiC IS A COMPLETE SUCCESS
2. WE CAN NOW “DISPENSE” PRESSURELESS SILVER SINTER ONTO GaN DEVICES
3. WE CAN NOW “DISPENSE” HIGH PRESSURE AND LOW PRESSURE SILVER SINTER ONTO SiC DEVICES
4. YOU CANNOT GENERALLY SINTER Si DEVICES, NO BACK METALLISATION
5. YOU CANNOT CORRECTLY ASSEMBLE POWER SMT PCBA’s WITHOUT VACUUM REFLOW
6. YOU CANNOT CORRECTLY INSPECT POWER SMT PCBA’s WITHOUT X-RAY (VOIDING)
7. YOU CANNOT CORRECTLY INSPECT SiC/GaN DEVICES WITHOUT CSAM (COPPER TOO THICK)
8. EVEN WHEN YOU ARE ABSOLUTELY SURE, STILL GET THEM SECTIONED
9. NEARLY ALL FUTURE SiC DIE WILL HAVE BONDABLE / SOLDERABLE / SINTERABLE TOP LEVEL SOURCE
CONTACT PADS
10. THERMAL SHOCK IS GOING TO BE ONE OF THE BIGGEST PROBLEMS TO SOLVE
11. WATCH OUT FOR CONDUCTIVE ANODIC FILIMENTS (CAF) !!! FR4 PCB’s AND DC VOLTAGES
LESSONS LEARNED

29. THANK YOU
John Boston - Managing Director
CUSTOM INTERCONNECT LTD
Email sales@cil-uk.co.uk
Phone 01264 321321
www.cil-uk.co.uk