Example 2

1. SOLdering Alloys
in Reduced Gravity

2. Background
 Issues of soldering in reduced gravity
 Gas bubbles from PCB
 Previous experiments
 SoRGE
○ Found a problem with soldering in milli-gravity
 CLEAR
○ Finding a solution to the problem found in Sorge
 Applications
 Reparations of components in space
○ Long distance space journeys and space stations

3. Experiment proposal
 Our solution
 Non pressurized enviroment
○ Overpressure
 Gas flow
○ Internal flux of solder
 Need for a rocket
 Reduced gravity

4.  The experiment will melt and cool nine
samples
 Atmosphere
○ Reference sample
 Vaccum
 Gas flow
 Additional test done on ground
 Reference sample

5. How it all works
The inside
the outside

6. Electrical overview
Input Power
voltage Data
Power Batteries
distribution
Microprocessor Transistor
Components Experiment

7. Model overview
 3 main parts
 Soldering chambers
 Heat plate
 Cooling chamber
CAD cross section

8. The soldering chambers
 Design
 3 different chambers
 PCB
 Vacuum chamber
 Atmospheric chamber
 Vacuum chamber with gas flow

9. Heat element
 Design
 Easy to heat up
 Robust – Can handle vibrations
 Good heat conductivity
 Insulated from rest of experiment
 The heating process
 NiChrome wire

10. Cooling chamber
 Design
 High volume
 Liquid nitrogen
 Insulation
 Cork
 Valves
 Security valve

11. Flow
 Chamber with argon gas
 Gas flow starts with melting process
 Using liquid nitrogen in the cooling
chamber
 Gas flow starts when samples are
melted
 Enough gas to cool below melting
temperature

12. Data
 Mass
 The experiment
○ 5.4 kg
 Electrical components
○ 1 kg
 Gas container and valves
○ 1.6 kg
 Volume
 The experiment
○ 4.8 dm³

13. Current status
 Completed tasks
 Research
 Current tasks
 Design
 Calculations
 Future tasks
 Build experiment
 Obtain components
 Tests

14. Microcontroller and sensors –
How it all fits together

15. Components
 Microcontroller
 32bit ARM Cortex M3
○ 2*16 12bit-ADC-channels
 Sensors
 Temperature
○ KTY84-150
 Small size
 Large temperature range
 Pressure
○ XFHMC-001MPGR(H)
 Temperature compensated
 Large measuring range

16.  Batteries
 Saft batteries
 7.4V / 4A / 40Wh / 265g
 Wide temperature range
 Transistors
 High power MOSFET
 Fed through a MOSFET driver
 Valve
 Currently looking in to electronic valves

17. Analysis of samples
 CT scan
 University in Finland
 Comparing samples
 From same chamber
 Between chambers
 With reference samples
 Compile test data into a report
 Report will evaluate if methods are viable

18. Our outreach program
Project funding
and supporing professors

19. Funding sources
 Division of space technology, LTU
 Swedish institute of space
physics, Kiruna
 Swedish national board
 Sponsorship

20. Facilities
 Division of space technology, Kiruna
 Computer simulation tools
 Workshop
 Swedish institute of space
physics, Kiruna
 Tests and development
 Department of material
engineering, Luleå

21. Expert advice
 Department of space science, IRV, Kiruna
 Support from experts in the field of space
engineering
 Alf Wikström & Kjell Lundin
 Esrange, Kiruna
 Department of material engineering, Luleå
 University lecturer Esa Vuorinen, Material
science department, Luleå

22. Internet
solar-rexus.blogspot.com
 Website
 Facebook
 Blog
 Youtube
 Twitter

23. Media
 Publications in magazines
 Ny Teknik
 Populär astronomi
 Local newspapers
 Television/Radio

24. Presentations
 Seminars
 Spread intrest of space science
 Luleå university of technology
 Present project to new students
 Introduce Rexus/bexus
 High schools
 Inspire the younger audience

25. The SOLAR team
and estimated time plan

26. Organisation and key people
Team leader
Anders Svedevall
Hardware Electronics Software Outreach
group group group group
Adrian Lindqvist Martin Eriksson Björn Paulström
Johan Strandgren Anneli Prenta
Sara Widbom Elisabet Wejmo Johan Strandgren
Hamoon Shahbazi
Anneli Prenta

27. Time Plan
2011 2012 2013
Sep Oct Nov Dec Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Jan Feb Mar Apr May Jun
Research Phase
Outreach
Design Phase
Selection Workshop Presentation
Preliminary Design Reviews Δ
Build Phase Δ
Critical Design Reviews Δ
Integration Progress Reviews
Experiment Acceptance Reviews Δ
Integration Week
System Testing
Launch campaign Δ
Experiment Results

29. 32bit ARM Cortex M3
 Specifications
 72Mhz, 20Kb SRAM
 128Kb Flash memory
 Role
 Collecting and storing data
 Controlling temperature of heat plate
 Ongoing measurements of pressure and
temperature
 Initiates events based on a timeline

30. KTY84-150
 Specifications
 Resistance=f(temperature)
 Low operating current (2mA)
 Small size – 1.6x3.04mm
 Large temperature range
(-40 to +300 °C)
 Role
 Measure temperature at
each individual sample

31. XFHMC-001MPGR(H)
 Specifications
 Large measuring range -
0 to 1000KPa
 Low power (<10mA)
 Small size(14x7.6x10.15)
 Role
 Measuring pressure in
each of the sample chambers

32. Batteries – 2 VL 34570
 Specification
 7.4V / 4A / 40Wh / 265g
 Wide temperature range
 Lithium Ion cells
 Rechargeable
 Role
 Delivers power to the
heating element

33. Valve – AKVH 10
 Specifications
 PWM controlled
 Role
 Regulate the flow of argon gas through one
of the test chambers
 Activate

34. Transistor
 Specifications
 PWM controlled
 Role
 Regulating current through the heating
element, which controls temperature.