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Photonic integrated circuits for data center interconnects

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Presented in Dublin at the ECOC International Symposium for Optical Interconnect in Data Centres, Annika Dochhan’s slide deck covers the latest developments in electro-photonic integrated circuits, silicon photonics and IC-TROSA.

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Photonic integrated circuits for data center interconnects

  1. 1. Annika Dochhan September, 2019 Photonic integrated circuits for data center interconnects
  2. 2. © 2019 ADVA Optical Networking. All rights reserved.22 Motivation – data center traffic growth Forecast 2014: Within data center 73.1% Data center to user 18.2% Data center to data center 8.7% Source: Cisco Global Cloud Index 2014 Forecast 2018: Within data center 73.4% Data center to user 14.3% Data center to data center 12.4% Source: Cisco Global Cloud Index 2016-2021 (2018) CAGR: 25% CAGR: 24.7%
  3. 3. © 2019 ADVA Optical Networking. All rights reserved.33 Motivation – data center traffic growth Data centers tend to be more distributed Enabling low-cost high-speed interconnects is still an important topic! Photonic integrated circuits fulfill these requirements! Forecast 2018: Within data center 71.5% Data center to user 14.9% Data center to data center 13.6% Source: Cisco Global Cloud Index 2016-2021 (2018) CAGR: 24.7%
  4. 4. © 2019 ADVA Optical Networking. All rights reserved.44 Overview Data center architecture Photonic integrated circuits Optical modules 1 2 3
  5. 5. 5 © 2019 ADVA Optical Networking. All rights reserved. Confidential. Data center architecture
  6. 6. © 2019 ADVA Optical Networking. All rights reserved.66 Data center architecture Tier 0 switches service a rack Tier 1 switches service a ”row“ (of racks) Tier 2 switches service a “co- location“ Tier 3 switches service a data center • Interface to long-haul network • Also interface to metro network Tier 0 Tier 0 Tier 0 … Tier 1 Tier 1 Tier 1… Tier 2 Tier 2 Tier 2… Tier 3 Tier 3 … Tier 1 Tier 2 Tier 3 Long-haul: 1000s of km Metro:<80km Copper cables Active optical cables ≤2km optics ≤2km optics Coherent optics IM/DD optics
  7. 7. © 2019 ADVA Optical Networking. All rights reserved.77 Data center architecture Tier 0 Tier 0 Tier 0 … Tier 1 Tier 1 Tier 1… Tier 2 Tier 2 Tier 2… Tier 3 Tier 3 … Tier 1 Tier 2 Tier 3 Long-haul: 1000s of km Metro:<80km Copper cables Active optical cables ≤2km optics ≤2km optics Coherent optics Complexity Volume Standardization Cost IM/DD optics
  8. 8. 8 © 2019 ADVA Optical Networking. All rights reserved. Confidential. Photonic integrated circuits
  9. 9. © 2019 ADVA Optical Networking. All rights reserved.99 Flavors of PICs Silicon InP SiN SiO Polymer LiNbO3 Waveguides ++ ++ +++ +++ + + Fiber coupling - + ++ ++ +++ + Modulators + ++ --- --- +++/--- +++ Pol. converters +++ + - - - - Light sources --- +++ --- --- --- --- Photo detectors ++ +++ - - - - Footprint +++ ++ - - -- --- Wafer size +++ -- + + - - Yield +++ + ++ ++ + - Hybrid integration ++ - + + + -- Packaging ++ - + + + -
  10. 10. © 2019 ADVA Optical Networking. All rights reserved.1010 Silicon photonics in DCI Tier 0 Tier 0 Tier 0 … Tier 1 Tier 1 Tier 1… Tier 2 Tier 2 Tier 2… Tier 3 Tier 3 … Tier 1 Tier 2 Tier 3 Long-haul: 1000s of km Metro:<80km Copper cables Active optical cables ≤2km optics ≤2km optics Coherent optics Products appeared here first Later here Slowly coming to the market now IM/DD optics
  11. 11. © 2019 ADVA Optical Networking. All rights reserved.1111 Coherent silicon photonic transceiver Polarization beam splitter MMI coupler Edge coupler Photo diodes Photo diodes Modulators Heaters Waveguide crossings 10mm x 5mm
  12. 12. © 2019 ADVA Optical Networking. All rights reserved.1212 with (Bi)CMOS electronics EPIC – electronic photonic integrated circuit Coherent silicon photonic transceiver Segmented driver Segmented driver Segmented driver Segmented driver TIAs TIAs DACs Digital interface (SPI) Control logic 10mm x 5mm
  13. 13. © 2019 ADVA Optical Networking. All rights reserved.1313 Early experiments Single MZM, direct detect BER vs OSNR 112 Gbit/s PAM4Bandwidth (MZM + driver)
  14. 14. © 2019 ADVA Optical Networking. All rights reserved.1414 Early experiments Single MZM, coherent 4 6 8 10 12 14 6 10 14 18 22 26 30 34 38 42 Q2-factor(dB) OSNR in 0.1 nm (dB) HD-FEC SD-FEC 64 GBaud DP-Bi-2ASK 128 Gbit/s DP-Bi-4ASK 256 Gbit/s DP-Bi-8ASK 384 Gbit/s Promising results for use of the modulator in a nested IQ structure for DP-64QAM! I Q Transmission over 120 km shown
  15. 15. © 2019 ADVA Optical Networking. All rights reserved.1515 with (Bi)CMOS electronics and active elements Best of both worlds: integration of III-V on silicon photonics Coherent silicon photonic transceiver Segmented Driver Segmented Driver Segmented Driver Segmented Driver TIAs TIAs DACs Digital interface (SPI) Control logic 10mm x 5mm Laser/LO SOA TIAs
  16. 16. 16 © 2019 ADVA Optical Networking. All rights reserved. Confidential. Optical modules
  17. 17. © 2019 ADVA Optical Networking. All rights reserved.1717 Higher bandwidth, lower power consumption, lower footprint. Optical interfaces
  18. 18. © 2019 ADVA Optical Networking. All rights reserved.1818 Integrated coherent transmit receive optical sub-assembly Coherent optical engine that enables small form-factor pluggables • QSFP-DD, OSFP, COBO, etc. Brings down cost through standard assembly processes • SMT, pick & place, … • But active optical alignment High RF performance through short traces • BGA mount Enabling interchangable short reach IM/DD and long reach coherent modules IC-TROSA
  19. 19. © 2019 ADVA Optical Networking. All rights reserved.1919 MASSTART: MASS manufacturing of TrAnsceiveRs for Terabit/s era  Glass interface based laser/PIC and fiber/PIC coupling approaches  Obtain spot size and pitch converters  Increase optical I/O density, automated assembly processes  3D packaging enabling backside connection of the high speed PIC to a Si carrier  New flip chip bonders with enhanced placement  Improvement in throughput  Wafer-level evaluation of assembled circuits with novel tools  Reduce characterization time Cost-efficient packaging processes are essential for PICs in mass production! Packaging of SiPh coherent transceiver
  20. 20. © 2019 ADVA Optical Networking. All rights reserved.2020 Conclusion Data centers tend to be more distributed  DCI is a growing market PICs are needed for every connection distance Silicon photonics are a good option  Monolithically integrated electronics (EPICs)  Hybrid integration with active materials Packaging is an important topic
  21. 21. Thank you IMPORTANT NOTICE The content of this presentation is strictly confidential. ADVA Optical Networking is the exclusive owner or licensee of the content, material, and information in this presentation. Any reproduction, publication or reprint, in whole or in part, is strictly prohibited. The information in this presentation may not be accurate, complete or up to date, and is provided without warranties or representations of any kind, either express or implied. ADVA Optical Networking shall not be responsible for and disclaims any liability for any loss or damages, including without limitation, direct, indirect, incidental, consequential and special damages, alleged to have been caused by or in connection with using and/or relying on the information contained in this presentation. Copyright © for the entire content of this presentation: ADVA Optical Networking. adochhan@advaoptical.com

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