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From Sensors to Supercomputers
Big Data Begins with Little Data
Eric Hennenhoefer
Linaro Connect 2016
VP Research
©ARM 20162
Introducing ARM Research
 About ARM Research
 3 – 7 years ahead of product teams
 From advanced development to blue sky
 Locations in Austin, Cambridge UK, San Jose, and Shanghai
 Objectives
 Build a pipeline to create and bring future technology into ARM products
 Create and maintain the technology roadmap
 Enable academia and research partnerships
©ARM 20163
Research Focus Areas
ArchitectureArchitecture
• 3D stacked memories
• Intent-based interfaces
Going Beyond
Evolutionary DRAM
• Reduce data
movement
Compute Near
Memory
• Drive
technology
• Ensure open
standards
NVM in the System
• Leading future
task group
Tracking and Driving
Memory Roadmaps
• TrustZone-M
• Improve code density
and performance
Embedded
Efficiency
• Super secret stuff
• Use transistors more
efficiently
• Accelerate key use cases
Next Gen
Arch
Security
• HW is the root of trust
• Make is easier to write
secure SW
• Novel use cases
New
Apps
Memory & InterconnectMemory & Interconnect
©ARM 20164
Research Focus Areas
Applied SiliconApplied Silicon
IoT Sensor Nodes
• Sub-threshold for 0.1x energy
• Energy optimized mixed-signal
• Extreme power gating
Integrating everything
• Voltage regulators
• Energy harvesters
• Sensor interfaces
Printed Electronics
• 1cent disposable MCUs
• Mapping the ecosystem
Disruptive technology
•Next Big Thing Memory
•What’s after MOS?
•3DIC technology
Predictive Technology Modeling
•Technology scaling entitlement
•Design-Technology Co-Optimization
•Next node device, patterning, ..
ARM layout on EUV. ASML ISSCC 2013.
Dependable Computing
•Detection, Correction, Security
•Robust power delivery
Future Si TechFuture Si Tech
©ARM 20165
Research Focus Areas
Design IntegrityDesign IntegrityLarge Scale SystemsLarge Scale Systems
• Improving system
efficiency for analytics
workloads
Data Intensive
High Performance
Computing
• Enable the firstARM
supercomputer
sideARMs
• Compute near memory,
network,and storage &
standardize systems
software interfaces
Formal
Methods
• Formal Coherency
Verification on
Cortex®-A
CPU μArch
Models
• Verifying implementations
against executable spec
Rain
• Deriving RTL checkers
fromArchitecture
specification
Deadlock
Dependency
Models
• Design-time deadlock
freedom for arbitrary
interconnect topologies
©ARM 20166
Research Focus Areas
Special ProjectsSpecial Projects
Machine
Learning
• Speech & image recog
• Neural networks
Graphics
Systems
• Full-system modeling
• System cache arch
Computer
Vision
• Emphasis on automotive
• Depth perception,
object and motion
tracking
Mobile
Systems
• Advanced workloads
• HW + SW system design
• Future devices
ARM motor
• Novel motor control
Low Power Radio
Technology
Roadmapping
Technical
Due Diligence
Emerging ApplicationsEmerging Applications
©ARM 20167
What Problem is IoT Solving?
Digital
World
Physical
World
IoT
©ARM 20168
The key is in the connections: Hardware and Software
Internet of Things
Little Data
Big Data
Web The Web
Things
Services
 Integrated sensors and computing
 Ultra low power systems
©ARM 20169
 Technically, the eyes, ears, nose, mouth and hands
 Sensors + compute + connectivity = IoT
Sensors are the heart of the IoT
Chris Wasden at 2014 MEC, via semiwiki
©ARM 201610
Sense of Touch: MEMS accelerometer, 3DIC
©ARM 201611
Feature shrinking: From cell-size to molecule-
size 23andMe
IMEC / Panasonic
©ARM 201612
Chip senses: Adding smell and taste
Adamant technologies, e.g.
http://www.its.caltech.edu/~ahmet/publications.html
Food quality, air quality, infectious disease monitoring….
©ARM 201613
Adding hearing and sight
 Imaging – thank you cell phone industry
 From the simple (is it daylight?)
 To the complex (driving on the highway)
 Hearing and sight are senses that could be drastically augmented compared to our own
physicsworld
nature.com crack sensor
©ARM 201614
Sensors Energy Harvesters will be the heart of the IoT
 Battery changing or re-charging is not “disappearing into the woodwork”
 Energy harvesters have low & very variable output power/voltage
 And slow rate of improvement: ~1%/year for solar
 Nano-Watt standby allows bottom-end energy storage
 Charging thin film battery or super-capacitor
 Minimizing peak power can reduce need for storage
 Smaller & cheaper device
 But not always available
Theoretical energy density (Source:S.Boisseau,G.Despesse,and B.A.Seddik,
“Electrostatic Conversion forVibration Energy Harvesting,” ArXiv e–prints, Oct. 2012.)
300uW @ 5K100uW @ 100Hz
Piezoelectric Thermoelectric
PV
3mW in direct sunlight
20uW under office lights
Sol-Chip
Microgen
Micropelt
©ARM 201615
 Run a Cortex®
-M0 for 10 cycles
 Write one bit of flash
 Write ~300 bits of DRAM or SRAM
 Send ~5 bits across LPDDR4
 Transmit 2 bits of UWB data
 Transmit 0.02 bits over Bluetooth LE
 Drive an electric car 100fm (@1MJ/km) ~0.05% of the distance across Si atom
Energy Efficiency: Things you can do with 100pJ
Energy costs to transmit, compute, and store data will define the shape of the IoT
VSLI Technology advancements will re-write the boundary conditions
Or 1,000,000x / sec with 100 uW
©ARM 201616
180nm Mich Micro Mote: 30 pJ / cycle
 Michigan Micro Mote
 Cortex®
-M3
 180nm, 8.75 mm3
 Vdd = 0.4V, Vt = 0.4V
 73 kHz/1 MHz operation
G. Chen et al., ISSCC, 2010.
Battery Processor Solar Cells
http://www.eecs.umich.edu/eecs/about/articles/2015/Worlds-
Smallest-Computer-Michigan-Micro-Mote.html
©ARM 201617
65nm M0+ : 11.7 pJ / cycle
ISSCC 2015
Heart Monitor Workload
2.3μW3.0μW
©ARM 201618
Big Science Starts With Little Data Too
Transfer antennas to DSP: 200 TB/sRun2: 25GB/s
©ARM 201619
Streaming Data is the Next Challenge
Big	Data	Graph	Streaming	
1	
Po int query
Global sl ice & dice ,
Data mi ning
Fast ingest
Fault tolera nce , co de tra nsp are ncy , flexi bility, data re si dence
Approved	for	Unlimited	Release:	SAND2016-1943	O	
Reality	
§ Sensors	produce	enormous	quan es	of	complex	
data	
§ Current	analysis	capabili es	fail	to	fully	exploit	this	
data	to	produce	ac onable	intelligence		
	
Challenge:	leverage	the	structure	of	geospa al	data	to	
iden fy	pa erns	of	life	
§ Automated	data	analysis	capabili es	that	enhance	
human	decision-making	
§ Scalable	analysis	over	disparate	temporal	and	
geospa al	scales	
§ Pa ern	analysis	of	complex	trajectories	
	
R&D	is	required	at	all	levels	of	the	so ware/
hardware	stack	to	automate	the	capture,	fusion,	and	
analy cs	of	geospa al	data	streaming	from	
heterogeneous	sensors.	
	
A	convergence	of	HPC	and	graph-analy cs	is	
necessary	to	provide	 me-sensi ve,	ac onable	
intelligence	
Geospa al	Graph	Analysis	
Approved	for	Unlimited	Release:	SAND2016-1943	O	
2
©ARM 201620
Even Basic Little Data can Produce a LOT of Big Data
Flavio Bonomi, 2013
©ARM 201621
Dimensions
(50cm)3
=
1/8m3
Weight
50kg
Power
2kVA
Specification
(8x) 64 Servers
(8x) 256 Cores
(8x) 128TB Storage
University of Cambridge Portable Cloud
‘Micro’ data centres will
dynamically adapt to support
storage, web and computation.
©ARM 201622
Connected Teddy Bears: What Could Wrong?
 Hackers love IoT
 If software hacks fail then
 They will come via UART…
 The Basics – plan to be hacked
 Harden the Device
 Secure boot, Secure kernel, …
 Perimeter security is insufficient
 Intrusion detection
 Deny foothold
 Revert to known state
 Secure over-the-air firmware updates
 Plan to be hacked …
©ARM 201623
Connected Teddy Bears: What Could Wrong?
©ARM 201624
CCCC AAAACCSS
AccelerationAcceleration
StorageStorage
ComputeCompute
AccelerationAcceleration
StorageStorage
ComputeCompute
Packet Flows Packet Flows
AccelerationAcceleration
StorageStorage
ComputeCompute
Packet Flows
Devices Edge Data CenterCoreAggregationAccess
 Applications run where the data is, independent of the network node
 Heterogeneous Compute is distributed into the network
 Networks and Compute resources are both managed
and configured using standard IT technologies
SS
AA
CCSS
CC
AA
CC
AA
SS
SS
AA
Scale-Down Power Consumption and Form FactorScale-Down Power Consumption and Form Factor
Scale-Up from Little Data to Big Data
Decrease LatencyDecrease Latency
The Journey From Little Data to Big Data
CC
©ARM 201625
Why is ARM interested in Supercomputing?
43831.0
41426.0
41214.0
41061.0
40848.0
40695.0
40483.0
40331.0
40118.0
39965.0
39753.0
39600.0
39387.0
39234.0
39022.0
38869.0
38657.0
38504.0
38292.0
38139.0
37926.0
37773.0
37561.0
37408.0
37196.0
37043.0
36831.0
36678.0
36465.0
36312.0
36100.0
35947.0
35735.0
35582.0
35370.0
35217.0
35004.0
34851.0
34639.0
34486.0
34274.0
34121.0
32143.0
31048.0
29952.0
27760.0
1.E+05
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
1.E+12
1.E+13
1.E+14
1.E+15
1.E+16
1.E+17
1.E+18
Supercomputing
iPad 2 == Cray 2*
* J. Dongarra & P. Luszczek HPEC 2012
Laptop 2014
©ARM 201626
High Performance Compute (HPC) – Why?
 Why ARM? - HPC community wants multivendor options
 Strategic requirement
 ARM ecosystem brings choice and a path to better optimized solutions
 Why Now? – Exascale is a compelling event
 Massive parallelism is requiring changes to software, this opens the door for a new ISA
 ARM HPC projects are active in multiple regions
 Why Linaro?
 HPC has a large open source component
 Some customers require multiple tools chains: proprietary + open source
©ARM 201627
 23% of HPC system usage is currently HPDA
 Machine learning
 Stochastic modeling / Monte Carlo – explore large problem spaces
 MapReduce/Hadoop, graph analytics, knowledge discovery
 Many fields benefit from real time results – finance
 Workloads are migrating to commercial compute servers
HPDA – High Performance Data Analysis
©ARM 201628
Deep Learning – HPC is the Future
“This is why around 2008 my group at Stanford
started advocating shifting deep learning to GPUs
(this was really controversial at that time;but now
everyone does it); and I'm now advocating shifting to
HPC (High Performance Computing/Supercomputing)
tactics for scaling up deep learning.Machine learning
should embrace HPC.These methods will make
researchers more efficient and help accelerate the
progress of our whole field”.
Andrew Ng - Quora Feb 3rd
2016
©ARM 201629
HPC Expectations: Platform Optimized Solutions
 Machine Learning on ARM example – 80% is about the Math(s)*
 1.0x ATLAS from repo is (single core)
 2.7x OpenBLAS from repo
 6.7x ATLAS self tuned (several hours setup)
 HPC expectations
 Easy to access precompiled and optimized packages
 Scientific packages: Compliers, MPI, math libs, profilers, schedules, pre-build python, …
 Ability to make power trade-offs
 Tuned for each silicon vendor and Linux distro
 Who will lead? OpenHPC? Linaro?
*Inference of AlexNet on Caffe with Batch-size 1, 8-core A57
©ARM 201630
ARM HPC Summary
 ARM HPC systems are coming, test beds are deployed
 Tool chains, apps, math libraries, are underway…
 Open source is a key component of HPC
 IoT is today and HPDA is a critical piece of the workloads of tomorrow
 From Sensors to Supercomputers: Big Data Begins with Little Data

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BKK16-100K2 ARM Research - Sensors to Supercomputers

  • 1. From Sensors to Supercomputers Big Data Begins with Little Data Eric Hennenhoefer Linaro Connect 2016 VP Research
  • 2. ©ARM 20162 Introducing ARM Research  About ARM Research  3 – 7 years ahead of product teams  From advanced development to blue sky  Locations in Austin, Cambridge UK, San Jose, and Shanghai  Objectives  Build a pipeline to create and bring future technology into ARM products  Create and maintain the technology roadmap  Enable academia and research partnerships
  • 3. ©ARM 20163 Research Focus Areas ArchitectureArchitecture • 3D stacked memories • Intent-based interfaces Going Beyond Evolutionary DRAM • Reduce data movement Compute Near Memory • Drive technology • Ensure open standards NVM in the System • Leading future task group Tracking and Driving Memory Roadmaps • TrustZone-M • Improve code density and performance Embedded Efficiency • Super secret stuff • Use transistors more efficiently • Accelerate key use cases Next Gen Arch Security • HW is the root of trust • Make is easier to write secure SW • Novel use cases New Apps Memory & InterconnectMemory & Interconnect
  • 4. ©ARM 20164 Research Focus Areas Applied SiliconApplied Silicon IoT Sensor Nodes • Sub-threshold for 0.1x energy • Energy optimized mixed-signal • Extreme power gating Integrating everything • Voltage regulators • Energy harvesters • Sensor interfaces Printed Electronics • 1cent disposable MCUs • Mapping the ecosystem Disruptive technology •Next Big Thing Memory •What’s after MOS? •3DIC technology Predictive Technology Modeling •Technology scaling entitlement •Design-Technology Co-Optimization •Next node device, patterning, .. ARM layout on EUV. ASML ISSCC 2013. Dependable Computing •Detection, Correction, Security •Robust power delivery Future Si TechFuture Si Tech
  • 5. ©ARM 20165 Research Focus Areas Design IntegrityDesign IntegrityLarge Scale SystemsLarge Scale Systems • Improving system efficiency for analytics workloads Data Intensive High Performance Computing • Enable the firstARM supercomputer sideARMs • Compute near memory, network,and storage & standardize systems software interfaces Formal Methods • Formal Coherency Verification on Cortex®-A CPU μArch Models • Verifying implementations against executable spec Rain • Deriving RTL checkers fromArchitecture specification Deadlock Dependency Models • Design-time deadlock freedom for arbitrary interconnect topologies
  • 6. ©ARM 20166 Research Focus Areas Special ProjectsSpecial Projects Machine Learning • Speech & image recog • Neural networks Graphics Systems • Full-system modeling • System cache arch Computer Vision • Emphasis on automotive • Depth perception, object and motion tracking Mobile Systems • Advanced workloads • HW + SW system design • Future devices ARM motor • Novel motor control Low Power Radio Technology Roadmapping Technical Due Diligence Emerging ApplicationsEmerging Applications
  • 7. ©ARM 20167 What Problem is IoT Solving? Digital World Physical World IoT
  • 8. ©ARM 20168 The key is in the connections: Hardware and Software Internet of Things Little Data Big Data Web The Web Things Services  Integrated sensors and computing  Ultra low power systems
  • 9. ©ARM 20169  Technically, the eyes, ears, nose, mouth and hands  Sensors + compute + connectivity = IoT Sensors are the heart of the IoT Chris Wasden at 2014 MEC, via semiwiki
  • 10. ©ARM 201610 Sense of Touch: MEMS accelerometer, 3DIC
  • 11. ©ARM 201611 Feature shrinking: From cell-size to molecule- size 23andMe IMEC / Panasonic
  • 12. ©ARM 201612 Chip senses: Adding smell and taste Adamant technologies, e.g. http://www.its.caltech.edu/~ahmet/publications.html Food quality, air quality, infectious disease monitoring….
  • 13. ©ARM 201613 Adding hearing and sight  Imaging – thank you cell phone industry  From the simple (is it daylight?)  To the complex (driving on the highway)  Hearing and sight are senses that could be drastically augmented compared to our own physicsworld nature.com crack sensor
  • 14. ©ARM 201614 Sensors Energy Harvesters will be the heart of the IoT  Battery changing or re-charging is not “disappearing into the woodwork”  Energy harvesters have low & very variable output power/voltage  And slow rate of improvement: ~1%/year for solar  Nano-Watt standby allows bottom-end energy storage  Charging thin film battery or super-capacitor  Minimizing peak power can reduce need for storage  Smaller & cheaper device  But not always available Theoretical energy density (Source:S.Boisseau,G.Despesse,and B.A.Seddik, “Electrostatic Conversion forVibration Energy Harvesting,” ArXiv e–prints, Oct. 2012.) 300uW @ 5K100uW @ 100Hz Piezoelectric Thermoelectric PV 3mW in direct sunlight 20uW under office lights Sol-Chip Microgen Micropelt
  • 15. ©ARM 201615  Run a Cortex® -M0 for 10 cycles  Write one bit of flash  Write ~300 bits of DRAM or SRAM  Send ~5 bits across LPDDR4  Transmit 2 bits of UWB data  Transmit 0.02 bits over Bluetooth LE  Drive an electric car 100fm (@1MJ/km) ~0.05% of the distance across Si atom Energy Efficiency: Things you can do with 100pJ Energy costs to transmit, compute, and store data will define the shape of the IoT VSLI Technology advancements will re-write the boundary conditions Or 1,000,000x / sec with 100 uW
  • 16. ©ARM 201616 180nm Mich Micro Mote: 30 pJ / cycle  Michigan Micro Mote  Cortex® -M3  180nm, 8.75 mm3  Vdd = 0.4V, Vt = 0.4V  73 kHz/1 MHz operation G. Chen et al., ISSCC, 2010. Battery Processor Solar Cells http://www.eecs.umich.edu/eecs/about/articles/2015/Worlds- Smallest-Computer-Michigan-Micro-Mote.html
  • 17. ©ARM 201617 65nm M0+ : 11.7 pJ / cycle ISSCC 2015 Heart Monitor Workload 2.3μW3.0μW
  • 18. ©ARM 201618 Big Science Starts With Little Data Too Transfer antennas to DSP: 200 TB/sRun2: 25GB/s
  • 19. ©ARM 201619 Streaming Data is the Next Challenge Big Data Graph Streaming 1 Po int query Global sl ice & dice , Data mi ning Fast ingest Fault tolera nce , co de tra nsp are ncy , flexi bility, data re si dence Approved for Unlimited Release: SAND2016-1943 O Reality § Sensors produce enormous quan es of complex data § Current analysis capabili es fail to fully exploit this data to produce ac onable intelligence Challenge: leverage the structure of geospa al data to iden fy pa erns of life § Automated data analysis capabili es that enhance human decision-making § Scalable analysis over disparate temporal and geospa al scales § Pa ern analysis of complex trajectories R&D is required at all levels of the so ware/ hardware stack to automate the capture, fusion, and analy cs of geospa al data streaming from heterogeneous sensors. A convergence of HPC and graph-analy cs is necessary to provide me-sensi ve, ac onable intelligence Geospa al Graph Analysis Approved for Unlimited Release: SAND2016-1943 O 2
  • 20. ©ARM 201620 Even Basic Little Data can Produce a LOT of Big Data Flavio Bonomi, 2013
  • 21. ©ARM 201621 Dimensions (50cm)3 = 1/8m3 Weight 50kg Power 2kVA Specification (8x) 64 Servers (8x) 256 Cores (8x) 128TB Storage University of Cambridge Portable Cloud ‘Micro’ data centres will dynamically adapt to support storage, web and computation.
  • 22. ©ARM 201622 Connected Teddy Bears: What Could Wrong?  Hackers love IoT  If software hacks fail then  They will come via UART…  The Basics – plan to be hacked  Harden the Device  Secure boot, Secure kernel, …  Perimeter security is insufficient  Intrusion detection  Deny foothold  Revert to known state  Secure over-the-air firmware updates  Plan to be hacked …
  • 23. ©ARM 201623 Connected Teddy Bears: What Could Wrong?
  • 24. ©ARM 201624 CCCC AAAACCSS AccelerationAcceleration StorageStorage ComputeCompute AccelerationAcceleration StorageStorage ComputeCompute Packet Flows Packet Flows AccelerationAcceleration StorageStorage ComputeCompute Packet Flows Devices Edge Data CenterCoreAggregationAccess  Applications run where the data is, independent of the network node  Heterogeneous Compute is distributed into the network  Networks and Compute resources are both managed and configured using standard IT technologies SS AA CCSS CC AA CC AA SS SS AA Scale-Down Power Consumption and Form FactorScale-Down Power Consumption and Form Factor Scale-Up from Little Data to Big Data Decrease LatencyDecrease Latency The Journey From Little Data to Big Data CC
  • 25. ©ARM 201625 Why is ARM interested in Supercomputing? 43831.0 41426.0 41214.0 41061.0 40848.0 40695.0 40483.0 40331.0 40118.0 39965.0 39753.0 39600.0 39387.0 39234.0 39022.0 38869.0 38657.0 38504.0 38292.0 38139.0 37926.0 37773.0 37561.0 37408.0 37196.0 37043.0 36831.0 36678.0 36465.0 36312.0 36100.0 35947.0 35735.0 35582.0 35370.0 35217.0 35004.0 34851.0 34639.0 34486.0 34274.0 34121.0 32143.0 31048.0 29952.0 27760.0 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 1.E+14 1.E+15 1.E+16 1.E+17 1.E+18 Supercomputing iPad 2 == Cray 2* * J. Dongarra & P. Luszczek HPEC 2012 Laptop 2014
  • 26. ©ARM 201626 High Performance Compute (HPC) – Why?  Why ARM? - HPC community wants multivendor options  Strategic requirement  ARM ecosystem brings choice and a path to better optimized solutions  Why Now? – Exascale is a compelling event  Massive parallelism is requiring changes to software, this opens the door for a new ISA  ARM HPC projects are active in multiple regions  Why Linaro?  HPC has a large open source component  Some customers require multiple tools chains: proprietary + open source
  • 27. ©ARM 201627  23% of HPC system usage is currently HPDA  Machine learning  Stochastic modeling / Monte Carlo – explore large problem spaces  MapReduce/Hadoop, graph analytics, knowledge discovery  Many fields benefit from real time results – finance  Workloads are migrating to commercial compute servers HPDA – High Performance Data Analysis
  • 28. ©ARM 201628 Deep Learning – HPC is the Future “This is why around 2008 my group at Stanford started advocating shifting deep learning to GPUs (this was really controversial at that time;but now everyone does it); and I'm now advocating shifting to HPC (High Performance Computing/Supercomputing) tactics for scaling up deep learning.Machine learning should embrace HPC.These methods will make researchers more efficient and help accelerate the progress of our whole field”. Andrew Ng - Quora Feb 3rd 2016
  • 29. ©ARM 201629 HPC Expectations: Platform Optimized Solutions  Machine Learning on ARM example – 80% is about the Math(s)*  1.0x ATLAS from repo is (single core)  2.7x OpenBLAS from repo  6.7x ATLAS self tuned (several hours setup)  HPC expectations  Easy to access precompiled and optimized packages  Scientific packages: Compliers, MPI, math libs, profilers, schedules, pre-build python, …  Ability to make power trade-offs  Tuned for each silicon vendor and Linux distro  Who will lead? OpenHPC? Linaro? *Inference of AlexNet on Caffe with Batch-size 1, 8-core A57
  • 30. ©ARM 201630 ARM HPC Summary  ARM HPC systems are coming, test beds are deployed  Tool chains, apps, math libraries, are underway…  Open source is a key component of HPC  IoT is today and HPDA is a critical piece of the workloads of tomorrow  From Sensors to Supercomputers: Big Data Begins with Little Data