This is a presentation showing the thermal analysis of a complex electronics cooling device. The

1. ElectroFlo® Complex Electronics Cooling Analysis

2. Why do I care that Electronics are Getting Hot? Electronics fail due to excess heat. For every 10 °C temperature increase there is a 50% reduction of operating life Overheating on the Xbox cost Microsoft an estimated $1.15 Billion

3. Introduction to ElectroFlo® Liquid Cooled Motor Controller Component Definition Joulean/Trace Heating Coldplate Modeling (Liquid Cooling) Results Contents

4. Why do Electronics Get Hot? Complexity Compactness CostFactors

6. Much lower cost than experimental investigation

7. Speed

8. Study many different scenarios and optimize your design

9. Completeness of Results

10. Results available for entire system; not just at sensor locations

11. No inaccessible locations

12. No inaccuracies as a result of probe interference

13. Modeling Difficult Conditions

14. Study worst case and other scenariosA Stitch in Time Saves Nine

16. Patented Automated Radiation Network

17. Automatically calculates heat from voltage calculation

18. Used globally with customers in US, South America, Europe and Asia

21. Internal natural convection (using CFD)

23. Cooling through Liquid Channels of ColdplateSample model of Motor Controller

24. Defining IGBTs and other Complex Components Geometry Definition Geometry can be created within ElectroFlo or read in from CAD Boundary Conditions (BCs) Thermal Resistance Planes are created to isolate different sections of component Using manufacture data (i.e. junction to case resistance), thermal links are created with a given resistance Functions and Tables can be used to accurately depict the power dissipation of the devices. Saving to Component Library Once the component has been created, the it can be saved to a database and then added to any model. BCs and Geometry will be automatically read in and linked to the component, but changes can be made like anything else in ElectroFlo

25. Component Definitions Switching Stack Due to complexity of components, simplified models of the IGBTs and Diodes are created using variable Power Dissipation values Define components in your terms

26. Electrical Calculation to Determine Power Dissipation within Traces and Leads Circuit Definition Geometry is defined like any other package, but materials have electrical properties as well as thermal properties Electrical Links can be added (with optional Heat Generation) Electrical Connection Regions are automatically determined Fixed/Variable Electrical Resistance planes can be added Voltage Calculation Voltage Field is incrementally determined as electrical resistance varies with temperature Voltage inputs (Current and Voltage) can vary with time Power Dissipation (Thermal Losses) From the voltage field, ElectroFlo calculates the power dissipation for the electrical circuit Determines local hot spots, within both traces and simple components

27. Electrical Calculation to Determine Power Dissipation within Traces and Leads Fuse Model All heat comes from Voltage Field calculation Fuse will “blow” if it reaches a set temperature User can look at transient case of what will happen in the time immediately following the blown fuse. Fuse Case Electrical Resistance Planes Temperature Results Aluminum Standoffs

28. Electrical Calculation to determine Power Dissipation within Traces and Leads Trace Heating All heat comes from Voltage Field calculation Shows local “Hot Spots” within layer Accurately capture transient effect Use Links to model vias without overloading your model Temperature Plot Power Dissipation Plot Don’t miss the Hot Spots

29. Heat Exchanger Model for Determining Cooling through Coldplate Channels Define Geometry Define the size and shape of the channel Create coolant path by either reading in file, or clicking on screen Pressure Calculation User can set fixed/variable flowrate Solver will calculate the flowrate based on the pump and pressure loss through the model Coolant through ElectroFlo model can be part of larger system Heat Transfer Heat is removed by the coolant path and the fluid temperature increases as it travels through the Coldplate Optimizing your Design User can quick change the coolant path, or channel properties with having to modify the rest of the model

30. Heat Exchanger Model for determining cooling through Coldplate Channels Coldplate Model Solved assuming fixed volumetric flowrate through channels By creating full system model, you can get very accurate transients and solve for thermal soak back issues The right tool for the job

32. Animation and Color plots for all variables

33. Watch streamlines developing

35. Introduction to ElectroFlo® A Stitch in Time Saves Nine Liquid Cooled Motor Controller Component Definition Define components in your terms Joulean/Trace Heating Don’t miss the Hot Spots Coldplate Modeling (Liquid Cooling) The right tool for the job Results Stop spending most of your time creating reports, automate it! Contents Revisited

36. Questions/Comments Join us next time when we see how this model fits into a rack system with three other liquid cooled electronics boxes Thank you Hamish Lewis hlewis@tesint.com