Dia 20 - Manhã - Apresentação 3 More than Moore - Antonio Luis Pacheco Rotondaro - CTI

1. More Than Moore
Antonio L. P. Rotondaro
CTI Renato Archer

2. R&D Total Personnel
PhD
MS
BS
Tech
Centro de Tecnologia da Informação Renato Archer
Figures:
– Total area = 320.000 m2
– Built area= 14.000 m2
– Personnel = 600
2010 Budget:
– OGU: R$ 12M
– Projects: R$ 22M
– Total: R$ 34M

3. Microelectronics Software Applications
R&D Areas
HW and IC Design
Microsystems
Packaging
Qualification of
Electronic Products
Surface Interaction
and Displays
Software Quality
and Process
Improvement
Information
System Security
Software
Development
Robotics and
Computer Vision
Decision Support
Systems
3D Technologies
MISSION: Create, apply and disseminate knowledge in Information Technology, in
articulation with other social and economic agents, promoting innovations according to
society demands.

4. Final Commercial
Product
Digital, Analog and RF
0,18 µm Technology
1st batch from Foundry
Engineering Phase
Test on Protoboard
Backend & Final Tests
Geometrical Description
Functional blocs
Symbolic language descriptionSimulation
Design House

5. Main Tools:
Mask Fabrication Wet bench
Mask aligner MJB3
Magnetron sputtering Balzers BAS 450
Optical profilemeter Zygo
Pattern Generator Heidelberg DWL66
Clean rooms:
400 m2, Class 1000 & 100 w. tunnel class 10
Microfabrication and Microsystems
Infrastructure

6. Optical
Microscope
SEM w.
EDX/WDS
Teradyne MicroFlex
tester
Wafer prober –
Micromanipulator 6400
Logic analyzer-
HP16500B
FIB/SEM dual beam (@UNICAMP)
Characterization and Failure Analysis
Focused-Ion-Beam Scanning Electron Microscope

7. Burn-in
Climatic chamber
– Vötsch 7033
Sample
preparation
Thermal cycling
chamber Vötsch
7012
Reliability and Certification Lab

8. IC Packaging Group
Prototypes;
Components 01005;
Printer, Pick&Place, Reflow;
Project
Failure
Analysis
Multi Chip
Modules (MCM)
SMTAsembly
PCB, Hybrid Circuits,
Multi-Chip-Modules;
Chip-on-board (COB);
Wire Bonding of Au or Al;
Custom Capsules;
X-Ray & Ersascope;
BGA & µBGA reballing;
Wire-bonding;
Alumina or Silicon substrates;
3 Metal Levels;
Embedded Components:
Resistors, Capacitors e Inductors;

9. Available IC Packaging Technologies
Technologies
 Bump Deposition
 Stud Bump
 Wire Bonding
 Flip Chip
 Wafer Thinning
 Stacked Dies  IR Sensors
 RFID
 MEMS &
BioMEMS
 Memories
Aplications

10. IC Packaging Techniques
Wire Bonding
BGA assembly
Chip-on-board Assembly

11. Customized Capsules and Connectors
Technologies
 Hermetic Sealing
 Metal/Ceramic Joint
 IR Sensors
 RFID
 MEMS & BioMEMS
 Memories
Aplications

12. Organic Electronics
Flexible Solar Cells
Bulk-heterojuction
Solar CellsPET ITO PEDOT P3MET/
CdSe QD
Al/Ag

13. Nanomaterials
Nanostructures Fabricated by Sputtering
Applications:
Electrodes; Sensors; Memories; Surface Functionalization

14. [1] R. R. Tummala,
MOORE'S LAW MEETS ITS
MATCH, IEEE Spectrum, p.
44, June 2006.
IC Packaging: More-than-Moore
14

15. DSL CO Linecards
1996
1st Gen
Single Channel
1998
2nd Gen
Dual Ch
1999
3rd Gen
Dual Ch
2000
4th Gen
Quad Ch
2001
5th Gen
Octal Ch
2002
6th Gen
Octal Ch
IC Packaging: SOC – Saving Space
15

16. AR5
BOM
Manufacturing
Process
Technology
2000
5 chips
740 discretes
u CMOS
u Analog
u Flash
u SDRAM
2005 – AR5
3 chips
415 discretes
u CMOS
u Analog
u Flash
u SDRAM
1 chip
<50 discretes
u CMOS
u Analog
u Flash
u SDRAM
Memory
Comms
Processor
Digital
PHY
Analog
Codec
Line
Driver
Line
Receiver
740
Discretes
Memory
Comms
Processor
Digital
PHY
415
Discretes
AFE
Memory
<50
Discretes
Single-Chip
DSL Modem
IC Packaging: SOC Integration
16

17. IC Packaging: 3D SoP
[1] R. R. Tummala, MOORE'S LAW MEETS ITS MATCH, IEEE Spectrum, p. 44, June 2006.
17

18. IC Packaging: Mobile Requirements
18
• Decreasing Thickness
• Decreasing Weight
• Increasing Functionality
• Increasing Complexity
• Increasing I/O ports

19. 1971 – First Microprocessor 4004
2.3x103 transistors, 108Khz, 10μm,
pMOS, 12V, 0.3W, 4 Bits, 16DIP
2006 – Dual-Core Intel
Itanium “Montecito”
1.7x109 transistors, 2GHz,
65nm, CMOS, 1.2V, 130W,
64 Bits, 775 Flipchip MCM
IC Packaging: MCM Evolution
19

20. IC Packaging: 3D Packaging
• Achieves Packaging Efficiency greater than 1.0
20 J.U. Knickerbocker et al., ECTC2012, pg.1068 (2012)

21. 5 years Goal: Chip Embedding
Technologies
 Multi Chip Module (MCM)
 Flip Chip
 Through Silicon Vias (TSV)

22. Conclusions
• Packaging integration
– RFID IC
– Antenna
– Energy Harvesting
– Battery
– Sensors
• Flexible substrate
– Organic Electronics

23. Antonio L. Pacheco Rotondaro
Head IC Packaging Division
antonio.rotondaro@cti.gov.br
Tel.: +55 19 3746-6195 - Fax: +55 19 3746-6028
www.cti.gov.br