SUSS MicroTec
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Unternehmen/Arbeitsplatz
Garching Germany
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www.suss.com
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SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding and is complemented by specialised add-ons such as photomasks, nanoimprint lithography tools and optical lenses.
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wafer bonding karl suss metal bonding hybrid bonding semiconductor 3d integration 3d bonding suss microtec bond metal bonding wafer bonder suss microtec karl semi
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