This document provides an overview of Contrive Datum Insights and their research methodology for analyzing the global data capture hardware market. CDI utilizes secondary and primary research to collect and validate data. Their secondary research involves reviewing academic journals, reports, and databases. Their primary research consists of interviews with industry experts and companies across the supply chain. CDI then analyzes the data using statistical models and forecasts market trends and size from 2023 to 2030. The document also reviews key developments in the thermo compression bonder market and provides a regional outlook of the industry.
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Data Capture Hardware.pdf
1. Sample on Global Data Capture Hardware Market - Global Industry
Analysis, Size, Share, Growth Opportunities, Future Trends, Covid-19
Impact, SWOT Analysis, Competition and Forecasts 2022 to 2030
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Global Data Capture Hardware Market, 2023-2030
Research Methodology
Methodology/Research Approach
Our research methodology implements a mix of primary as well as secondary research. Our
projects are initiated with secondary research, where we refer to a variety of sources including
trade databases; government published documents, investor presentations, company annual
reports, white papers, and paid databases.
Research Programs/Design
Requirement
collection
Feasibility check of
client requirements
Draft of
deliverables
(iterative step)
Approval from
client
Projectinitiation
Secondary
research
Data collection Primary research
Data validation Data analysis
Cross verification
with panel of
experts
Projectdelivery to
the client
Post-delivery
support
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Global Data Capture Hardware Market, 2023-2030
Market Size Estimation
Post the initial data mining stage, we gather our findings and analyse them, Wearable Patch/ Data
Recordering out relevant insights. These are evaluated across teams and by our in-house
Medical. Along with data mining, we also initiate the primary research phase in which we interact
with companies operating within the market space.
To evaluate the wholeness of the market, we interact (via email or telephone) with players who
are responsible in adding value to the final product. Additionally, we interact with related industries
to understand the external factors that can drive/hamper a market. We also make it a point to
evaluate various economic parameters, which typically, have an impact on the purchasing choices
of individuals as well as companies.
Post these stages, data are cross-verified with the companies that operate in a market space. It
is important for us to study these companies in detail, to understand their existing performance
and future strategies which will define the market in the coming years.
All this data is collected and evaluated by our analysts. Post the preparation of the report and
data analysis, the findings are presented to our in-house experts who then eliminate
discrepancies (if any).
The key players in the industry and markets have been identified through extensive
secondary research.
The industry’s supply chain and market size, in terms of value, have been determined
through primary and secondary research processes.
All percentage shares, splits, and breakdowns have been determined using secondary
sources and verified through primary sources.
Data Source
Secondary Sources
In the secondary research process, various secondary sources, such as D&B Hoovers,
Bloomberg Business Week, and Factiva, have been referred to, for identifying and collecting
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Global Data Capture Hardware Market, 2023-2030
information for this study. Secondary sources included annual reports, press releases, and
investor presentations of companies; whitepapers, certified publications, and articles by
recognized authors; gold standard and silver standard websites; regulatory bodies; trade
directories; and databases.
List of secondary sources include but are not limited to:
Academic Journals
Census.gov
Bloomberg
Company Annual Report
Hoovers
Preliminary data mining
Raw market data is obtained and collated on a broad front. Data is continuously Wearable Patch/
Data Reordered to ensure that only validated and authenticated sources are considered. In
addition, data is also mined from a host of reports in our repository, as well as a number of reputed
paid databases. For comprehensive understanding of the market, it is essential to understand the
complete value chain and in order to facilitate this; we collect data from raw material suppliers,
distributors as well as buyers.
Technical issues and trends are obtained from surveys, technical symposia and trade journals.
Technical data is also gathered from intellectual property perspective, focusing on white space
and freedom of movement. Operation Industry Vertical dynamics with respect to drivers,
restraints, pricing trends is also gathered. As a result, the material developed contains a wide
range of original data that is then further cross-validated and authenticated with published
sources.
Primary Sources
This is the final step in estimating and forecasting for our reports. Exhaustive primary interviews
are conducted, on face to face as well as over the phone to validate our findings and assumptions
used to obtain them. Interviewees are approached from leading companies across the value chain
including suppliers, Component providers, domain experts and buyers so as to ensure a holistic
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Global Data Capture Hardware Market, 2023-2030
and unbiased picture of the market. These interviews are conducted across the globe, with
language barriers overcome with the aid of local staff and interpreters. Primary interviews not only
help in data validation, but also provide critical insights into the market, current business scenario
and future expectations and enhance the quality of our reports. All our estimates and forecast are
verified through exhaustive primary research with Key Operation Industry Vertical Participants
(KIPs) which typically include:
Market leading companies
Raw material suppliers
Operating System distributors
Buyers
The key objectives of primary research are as follows:
To validate our data in terms of accuracy and acceptability
To gain an insight in to the current market and future expectations
Some of the KIPs are mentioned as below:
Medtronic
Olympus
Otsuka Holdings Co., Ltd.
Etcetera
Others
Statistical model
Our market estimates and forecasts are derived through simulation models. A unique model is
created customized for each study. Gathered information for market dynamics, Component
landscape, Sensor Type development and pricing trends is fed into the model and analyzed
simultaneously. These factors are studied on a comparative basis, and their impact over the
forecast period is quantified with the help of correlation, regression and time series analysis.
Market forecasting is performed via a combination of economic tools, technological analysis, and
industry experience and domain expertise.
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Global Data Capture Hardware Market, 2023-2030
Econometric models are generally used for short-term forecasting, while technological market
models are used for long-term forecasting. These are based on an amalgamation of Component
landscape, regulatory frameworks, economic outlook and business principles. A bottom-up
approach to market estimation is preferred, with key regional markets analyzed as separate
entities and integration of data to obtain global estimates. This is critical for a deep understanding
of the industry as well as ensuring minimal errors. Some of the parameters considered for
forecasting include:
Market drivers and restrains, along with their current and expected impact
Raw material scenario and supply v/s price trends
Regulatory scenario and expected developments
Current capacity and expected capacity additions up to 2026
We assign weights to these parameters and quantify their market impact using weighted average
analysis, to derive an expected market growth rate.
Data Triangulation
Contrive Datum Insights also leverages three Industry Verticals of data triangulation approaches
as follows:
Data Triangulation Techniques
Source: Secondary Literature, Expert Interviews, and Contrive Datum Insights Analysis 2023
Data Source Triangulation
• Extracting data and validation
from multiple type of
secondary and primary
sources
Methodology Triangulation
• Combining various
methodologies to validate
data inputs
Theory Triangulation
• Applying different theories to
check credibility of data sets
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Global Data Capture Hardware Market, 2023-2030
Contrive Datum Insights data modeling tool is an in-house developed tool, which is based on the
fundamental Top Down and Bottom Up approach.
Bottom Up Approach
Source: Secondary Literature, Expert Interviews, and Contrive Datum Insights Analysis 2023
After arriving at the overall market size using the market size estimation processes as explained
above, the market was split into several segments and sub segments. To complete the overall
market engineering process and arrive at the exact statistics of each market segment and sub
segment, the data triangulation and market breakdown procedures were employed, wherever
applicable. The data was triangulated by studying several factors and trends from both the
demand and supply sides.
Global
Market
Value
Add up all Country Market Sizes
to Derive Regional Market Size
Market Size for a Country = Add up of Total
Company Revenues
Primary: Demand and Supply Side Experts
Secondary: Annual Reports, Presentations,
Press Release, Journals, Paid Databases,
and A2Z Market Research database
Primary: Demand & Supply Side Experts
Secondary: Annual Reports, Presentations,
Press Releases, Journals, Paid Databases,
and A2Z Market Research database
Bottom-upApproach (Segmental Analysis) Global Market
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Global Data Capture Hardware Market, 2023-2030
Top Down Approach
Source: Secondary Literature, Expert Interviews, and Contrive Datum Insights Analysis 2023
Report Objectives
To define, describe, and forecast the {Keyword} Market by segments, and region
To provide detailed information about the major factors (drivers, restraints, opportunities,
and challenges) influencing the growth of the market
To analyze the sub-segments with respect to individual growth trends, prospects, and
contributions to the total market
To analyze opportunities in the market for stakeholders and provide the competitive
landscape of the market
To forecast the revenues of the market segments with respect to the major regions, such
as North America, Europe, Asia Pacific (APAC), Middle East & Africa and South America.
To profile the key players and comprehensively analyze their recent developments and
positioning in {Keyword} market.
Global Market ($ Million)
Geographical Split
Percent Split for Type and
Application Segments for
Market
Country Split
Global Market Size Through Primaries(Demand and
Supply Side Experts)
Secondary: Annual Reports, Presentations, Press
Release, Journals, Paid Databases, and A2Z Market
Research
Primary: Demand and Supply Side Experts
Secondary: Annual Reports, Presentations, Press
Release, Journals, Paid Databases, and A2Z Market
Research database
Primary: Demand &and Supply Side Experts
Primary: Demand and Supply Side Experts
Secondary: Company Websites, Press Releases, and
News Articles
Top-Down Approach (SegmentalAnalysis) Global Market
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Global Data Capture Hardware Market, 2023-2030
To analyze competitive developments, such as mergers and acquisitions, new product
developments, and Research and Development (R&D) activities, in the market
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Market Overview
Market Synopsis
Thermo compression bonder, also known as diffusion bonding, pressure bonding, hot compression
welding, and solid welding, is a method for connecting wafers. Thermal compression machines use
pressure and vacuum to bond or fuse together semiconductor wafers. As the crystal lattice vibrates,
atoms approach one another. These atomic contacts hold together interfaces. Surface diffusion, particle
boundary diffusion, and bulk diffusion are the three common terms for diffusion processes. The concept
behind this technology is to employ a rapid temperature rise followed by a rapid temperature drop,
resulting in extremely precise processing at high speeds. These devices are also available in semi-
automatic and fully-automatic configurations. It provides the same functionality as wire bonding, but at
a much higher throughput because no human processes or specialized apparatus are required.
"The semiconductor industry will propel market expansion"
Increasing demand from a variety of end-user segments, such as semiconductor, flat panel display (FPD),
photovoltaic (PV) cell, and packaging substrate, is one of the main trend factors driving this expansion.
More and more semiconductor manufacturing processes are being outsourced, resulting in a rise in
demand for thermal compression. Increasing requirements for automation in manufacturing processes,
increasing popularity of automated equipment, and increasing government support for expansion of
production capacity are the main trends that are driving the market and serving as a catalyst for market
growth. Traditional producers are under greater pressure than ever before to adopt cutting-edge
technologies and restructure their operations and organizations as a result of rising demand and
competitive pressures. In addition, industry is a significant trend driving commodity sales.
Request Sample Copy of Report “Thermo Compression Bonder Market Insights, Size, Share,
Growth, Future Trends, Covid-19 Impact, SWOT Analysis, Top Key Players and Industry
Forecasts 2022 to 2030”, published by Contrive Datum Insights.
Key Developments
In June of 2019, ASE, TSMC, Leti/STMicroelectronics, and a few other companies described recent
advancements in advanced IC packaging, such as 3D, 2.5D, and fan-out technologies, which support high
bandwidth memory (HBM).
In 2019, Alter Technology UK invested in ball bonder apparatus to expand the capacity of wire bonding
operations. The IConn ProCu PLUS (automatic ball bonder) features an ultra-fine pitch of 40 microns for
copper wire diameters spanning from 15 to 30 microns, as well as bonding capabilities for gold wire with
a pitch of 35 microns and a diameter of 15 microns.
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In July 2021, Amkor Technology, Inc. supplied TSMC company with wire bond and flip chip packaging for
0.13-micron, low-k processes-based advanced devices.
In August 2021, QP Technologies installed a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939
heavy wire wedge bonder to provide fully automated assembly processing for RF and high-frequency
components, chip-on-board (COB), multichip modules (MCM), hybrids, optical, and automotive
electronics.
In 2021, Würth Elektronik GmbH & Co. The company's primary objective in the global electronic
semiconductor market is to consolidate its dominant market share and position.
In the report on the global wire bonding market, we discuss individual strategies, followed by profiles of
sputtering target suppliers. The 'Competition Landscape' section of the report has been included to
provide readers with a comprehensive view and company market share analysis of the major players
operating in the global wire bonding market.
Regional Outlook:
Geographically, the global Thermo Compression Bonder market has been divided into North America,
Europe, Asia-Pacific, Latin America, and the Middle East and Africa (MEA).
With a CAGR of 5.5% between 2022 and 2030, Asia-Pacific is expected to be the fastest-growing region.
This growth can be attributed to the increasing demand for thermo compression bonder in various
applications. China is anticipated to remain a significant market in the Asia-Pacific region as construction
activities increase due to its large manufacturing sector and rapid urbanization. In addition, India has
experienced substantial growth over the past few years, as well as the opposite influence of the
economic policies pursued by each government over the past few years.
Asia-Pacific grew at a 5.7% CAGR between 2008 and 2030, trailing Europe. This is predominantly
attributable to the account recovery witnessed in 2016/2017, following a severe economic downturn in
2008/09. And despite the fact that the European construction industry still confronts a number of
obstacles, such as Brexit, high unemployment, and stringent environmental regulations, it is expected to
expand at a moderate rate during the forecast period.
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Market Scope
On the basis of By Type, the market has been segmented as follows:
Automatic Thermo Compression Bonder
Manual Thermo Compression Bonder
On the basis of By Application, the market has been segmented as follows:
IDMs
OSAT
On the basis of Companies
ASMPT (AMICRA),
K&S,
Besi,
Shibaura,
SET,
Hanmi,
others.
On the basis of Geography
NORTH AMERICA
EUROPE
ASIA PACIFIC
MIDDLE EAST AFRICA
SOUTH AMERICA
About Us:
Contrive Datum Insights (CDI) is a global delivery partner of market intelligence and consulting
services to officials at various sectors such as investment, information technology,
telecommunication, consumer technology, and manufacturing markets. CDI assists investment
communities, business executives, and IT professionals to undertake statistics-based accurate
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Global Data Capture Hardware Market, 2023-2030
decisions on technology purchases and advance strong growth tactics to sustain market
competitiveness. Comprising of a team size of more than 100 analysts and cumulative market
experience of more than 200 years, Contrive Datum Insights guarantees the delivery of industry
knowledge combined with global and country-level expertise.
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Contact Us:
Anna B. | Head Of Sales
Contrive Datum Insights
Phone: +91 9834816757 | +1 2152974078
Email: anna@contrivedatuminsights.com
Website:
https://www.contrivedatuminsights.com
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