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Seminar FABRICATION FACILITY IN INDIA AND OUTSIDE  Subash John CGB0911005 VSD528  M. Sc. [Engg.] in VLSI System Design Module Title: Full Custom Physical Design Module Leader:  Mr. Chandramohan P.
Contents ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Semiconductor manufacturing in India ,[object Object],[object Object],[object Object],[object Object]
Global semiconductor market ,[object Object],[object Object],[object Object],[object Object],Fig. 1 Global market share
Types of chip manufacturers ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Fabs in India ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Fabs in India (1/2) ,[object Object],[object Object],[object Object],[object Object]
Fabs in India (2/2) ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Fig.2 SITAR ASIC
Comparison of Fabs in India  Table 1. Comparison of Top 3 Fabs in India Fab Name SCL SITAR BEL Location Chandigarh Bangalore & Hyderabad Bangalore Technology node 0.8u 0.5u 1u Clean room Class 10 Class 10 Class 100 Wafers/year 44000 20000 24000 Wafer size 6″(150mm) 6″ 4″(100mm) Products Data Converters, Clock Drivers, LVDS Transmitter and Receiver Digital Frequency Synthesizer, Content Addressable Memory, DSPs Industrial ICs, Consumer ICs, Digital ICs
Fab city  ,[object Object],[object Object],[object Object],[object Object],Fig. 3 Fab ecosystem
Fabs outside India ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Fig. 4 Wafer diameters
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
[object Object],[object Object],[object Object],[object Object],[object Object]
Comparison of Fabs from around the world Table 2. Comparison of top 5 Fabs outside India Fab name TSMC Intel UMC Global foundries SMIC Founded 1987 1994 1980 2009 2000 Location Hsinchu, Taiwan (12) Santa Clara, California (16) Hsinchu, Taiwan (10) Milpitas, California (8) Shanghai, China (8) Technology node (nm) 22/28/45/55/65/90/130 14/22/32/45/65/90/130/180 28/40/65/90/130/150/180/250 600nm to 40nm 350nm to 40nm Wafer size (inches) 4/6/8/12 6/8/12 6/8/12 6/8/12 6/8/12 Wafers/year 13.2 Million 8.6 Million 2Million 1.5Million 900K
Fab Rankings Table 3. Revenues for Fabs for the year 2010 Fig 5. World’s top semiconductor consumers 2010 Ranking Company 2010 Revenues YOY change (%) 1 TSMC US$ 13.3B 48 2 UMC US$ 3.9B 41 3 Global Foundries US$ 3.5B 219 4 SMIC US$ 1.5B 45 5 Tower Jazz US$ 510M 70 6 VISC US$ 508M 33 7 Dongbu US$ 495M 25 8 IBM US$ 430M 28 9 Magna Chip US$ 420M 60 10 Samsung US$ 400M 38
Fab nodes Fig 6. Technology nodes Table 4. Top 25 Semicon suppliers
Future Scope ,[object Object],[object Object],[object Object],[object Object]
References [1]   Ken Liu (2011), TSMC Retains Lead on 2010 Foundry Ratings  [online] available at < http://news.cens.com/cens/html/en/news/news_inner_35197.html> Retrieved on 20 Nov 2011 [2] Peter Clarke (2011), Chipmakers 2011 capabilities ranked [online] <http://electronics-eetimes.com/en/chipmakers-201-capabilities ranked.html?cmp_id=7&news_id=222905562#>  Retrieved on 20 Nov 2011 [3] Department of Information Technology, Government of India (2011), Study on semiconductor design, embedded software and services industry. Bangalore: India Semiconductor Association
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Fabrication units in India and outside

  • 1. Seminar FABRICATION FACILITY IN INDIA AND OUTSIDE Subash John CGB0911005 VSD528 M. Sc. [Engg.] in VLSI System Design Module Title: Full Custom Physical Design Module Leader: Mr. Chandramohan P.
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  • 9. Comparison of Fabs in India Table 1. Comparison of Top 3 Fabs in India Fab Name SCL SITAR BEL Location Chandigarh Bangalore & Hyderabad Bangalore Technology node 0.8u 0.5u 1u Clean room Class 10 Class 10 Class 100 Wafers/year 44000 20000 24000 Wafer size 6″(150mm) 6″ 4″(100mm) Products Data Converters, Clock Drivers, LVDS Transmitter and Receiver Digital Frequency Synthesizer, Content Addressable Memory, DSPs Industrial ICs, Consumer ICs, Digital ICs
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  • 15. Comparison of Fabs from around the world Table 2. Comparison of top 5 Fabs outside India Fab name TSMC Intel UMC Global foundries SMIC Founded 1987 1994 1980 2009 2000 Location Hsinchu, Taiwan (12) Santa Clara, California (16) Hsinchu, Taiwan (10) Milpitas, California (8) Shanghai, China (8) Technology node (nm) 22/28/45/55/65/90/130 14/22/32/45/65/90/130/180 28/40/65/90/130/150/180/250 600nm to 40nm 350nm to 40nm Wafer size (inches) 4/6/8/12 6/8/12 6/8/12 6/8/12 6/8/12 Wafers/year 13.2 Million 8.6 Million 2Million 1.5Million 900K
  • 16. Fab Rankings Table 3. Revenues for Fabs for the year 2010 Fig 5. World’s top semiconductor consumers 2010 Ranking Company 2010 Revenues YOY change (%) 1 TSMC US$ 13.3B 48 2 UMC US$ 3.9B 41 3 Global Foundries US$ 3.5B 219 4 SMIC US$ 1.5B 45 5 Tower Jazz US$ 510M 70 6 VISC US$ 508M 33 7 Dongbu US$ 495M 25 8 IBM US$ 430M 28 9 Magna Chip US$ 420M 60 10 Samsung US$ 400M 38
  • 17. Fab nodes Fig 6. Technology nodes Table 4. Top 25 Semicon suppliers
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  • 19. References [1] Ken Liu (2011), TSMC Retains Lead on 2010 Foundry Ratings [online] available at < http://news.cens.com/cens/html/en/news/news_inner_35197.html> Retrieved on 20 Nov 2011 [2] Peter Clarke (2011), Chipmakers 2011 capabilities ranked [online] <http://electronics-eetimes.com/en/chipmakers-201-capabilities ranked.html?cmp_id=7&news_id=222905562#> Retrieved on 20 Nov 2011 [3] Department of Information Technology, Government of India (2011), Study on semiconductor design, embedded software and services industry. Bangalore: India Semiconductor Association

Hinweis der Redaktion

  1. A  fabless  (fabrication-less)  semiconductor company  specializes in the design and sale of hardware devices and semiconductor chips while outsourcing the fabrication or &amp;quot;fab&amp;quot; of the devices to a specialized manufacturer called a semiconductor foundry.
  2. APAC – AsiaPACific…With many of these products being manufactured in Asia, along with growing consumption electronics in these countries, explains why sales to this region are so large. The Asia-Pacific region surpassed the Americas to become the world’s largest region for semiconductor sales in 2001, and since then, its lead has increased every year.
  3. An integrated device manufacturer (IDM) is a semiconductor company which designs, manufactures, and sells integrated circuit (IC) products. Cypress Semiconductor, Fujitsu, Hitachi, IBM, IDT, Intel, LSI Corporation, Matsushita, Mitsubishi, Freescale, NEC, Philips, NXP, Samsung, STMicroelectronics, Infineon, Sony, National Semiconductor, Texas Instruments, and Toshiba. Vertical integrated captive producers manufacture for in-house use. Vertical integrated captive-merchant producers manufacture semiconductors partly for their own use and partly for sale. Merchant producers are companies making semiconductors only for sale. A fabless semiconductor company specializes in the design and sale of hardware devices implemented on semiconductor chips but do not manufacture them. Nvidia Today most major IDMs including Freescale, Infineon, Texas Instruments and Cypress Semiconductor have adopted the practice of outsourcing chip manufacturing as a significant manufacturing strategy. Foundries manufacture semiconductors to customer specifications but do not design them UMC (United Microelectronics Corporation) which was founded as Taiwan&apos;s first semiconductor company in 1980 Taiwan Semiconductor Manufacturing Company (TSMC)
  4. MESFET – Metal Semiconductor FETs.
  5. HITEC city - H yderabad  I nformation  T echnology  E ngineering  C onsultancy City.. ATMP (Assembly Test Mark Plant). Fab city houses close 15 companies with an expected investment of $7Billion. This project will be realized over a number of years in three phases: Phase 1 : (07/08) investment of US$1 billion; the assembly and testing phase. Estimated employment: 2000 jobs. Phase 2 : (08/10) investment of US$2 billion; the construction of the actual chip manufacturing facility and leading to the production of semiconductor chips. Estimated employment: 1000 jobs. Phase 3 : (10/15-17) establishment of advanced semi-conductor plant.  Estimated employment: 5000 jobs.
  6. Chairman and CEO of TSMC: Dr Morris Chang
  7. INTEL - Int egrated  El ectronics Corporation Paul Otellini (President &amp; CEO of INTEL)
  8. Divestiture - The partial or full disposal of an investment or asset through sale, exchange, closure or bankruptcy. Ajith Manocha – CEO of Global Foundries…Bachalors from Delhi university and Masters from Kansas State university.
  9. YOY – Year Over Year
  10. All four of these companies (TSMC, GlobalFoundries, Samsung, Intel) are expected to outperform all other foundries in 2011, wielding the technology, capacity, and money to keep their leadership positions.