This presentation summarizes the results of a recent study on the effectiveness of different materials to be used as heat shields during the PCB rework process. When localized components are sent into reflow using a focused heat source the neighboring devices need to be protected.
Protecting Neighboring Devices from Heat Damage During PCB Rework
1. Effective Shielding of Nearby
Components in PCB Rework
Bob Wettermann, MIT
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3. Heat SensitiveComponents
Aluminum and tantalum ceramiccapacitors,
crystals, oscillators, plastic-bodied
components suchasconnectors
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11. Material Thermal Conductivity(Watts/m K@330°C)
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Kapton TypeMT 0.37
304Stainless 18
Copper 379
Ceramic Fiber 0.14
Clay/Water Gel Unknown
12. Experimental Method
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Materials Used
Stainlesssteel 304
1650Venturetape-copperwithtape backing
Ceramicnon-wovenfiber
3milthickKapton™
“ColdShield”clay gel
19. Effective Shielding ofNearby
Components in PCB Rework
Bob Wettermann, MIT
bwet@solder.net
www.solder.net
Your BBEST choice in PCB Test/ Rework/Repair and Solder Training &Tools www.solder.net