This is one slide set in a multi-part series on the BGA rework process. In this section, the BGA removal process is explained with the following basic characteristics. Click more on slides or visit www.solder.net to see more in detail.

1. 

Rework and Repair of PCBs
Solder/Assembly Training
 Rework/Repair Soldering
Tools
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2. BGA Rework
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I. Why Rework
II. Scopeof Material Covered
III. BGARework Process
A. Removal
B. SiteDressing
C. Placement
D. Reflow
E. Cleaning
F. Inspection
IV. Materials

3. BGA Rework-Why Rework?
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
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
Misplacedpart
PartUpgrade
Failed Part
Don’t know why?
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4. BGA Rework-A Primer
Reflow SCOPE
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• After part placement, the applied solder
must be reflowed to attach the BGA to
the PCB pads. After successfully
attaching the BGA to the PCB, the
perimeter row of solder joints should be
visually examined.
• Plastic packages attachment of new
parts using hot air as the reflow source

5. BGA Rework-A Primer
SCOPE
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Reference Documents
IPC-A-610
IPC-7095 IPC
7711/21 IPC J-STD-
020 IPC J-STD-033

6. BGA Rework-the process
Removal-ControlledHeat Source
Objective is to getthedeviceoffasquicklyas
possiblewithoutdamagingthedevice (mayneedto
reballanduseagain)orneighboringdevicesorthe
laminate
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7. BGA Rework-the process
Removal-locatingtherightlocation
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8. BGA Rework-the process
Removal-controlledheatsource-bottomside
preheat
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9. BGA Rework-the process
Removal-bakeoutif needtoreballorsalvagethe
component
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10. Removal-controlledheatsource-bottomside
preheat
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BGA Rework-the process

11. Removal-properboard holders
BGA Rework-the process
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12. Removal-controlledheatsource
Shield thesurroundingarea
BGA Rework-the process
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13. Removal-controlledheat source
Profile on, underneath and next to the
device
BGA Rework-the process
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14. Removal-controlledheat source
Typical Removal Profile-tin lead
BGA Rework-the process
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