Transient thermal simulation with phase change of melting ice - Veselin Pavlov, ΙΜΙ
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The objective of the simulation is to calculate the time needed for melting of 0.5mm thick ice covering camera lens. Heating elements are 8 resistors each 82 Ohm in parallel configuration. Each one dissipates 0.133W power i.e. the total dissipated power is 1.064W..
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structures. The table below lists the required processing times and setup times at each of the
steps. There is unlimited spoce for buffer Inventory between these steps. Assume that the unit of
production is a wafer, from which individual chips are cut at a later stage. a. What is the process
capacity in units per hour with a batch size of 150 wafers? Note: Do not round intermediate
calculations. Round your answer to 2 decimal places. b. What is the utilization of depositing if
the batch size is 150 wafers? Note: Do not round intermediate calculations. Round your answer
to 2 decimal places..
Engineering Edge LR
- The document is an issue of Engineering Edge magazine from Mentor Graphics that features various articles on engineering projects and products.
- It includes a cover story from Yamaha Motor Company on evaluating motorcycle electronics using thermal testing tools, as well as articles on offshore oil/gas operations, LED lighting, automotive design, and other applications of simulation software.
- The issue announces new releases and enhancements to several Mentor Graphics thermal and fluid analysis software programs, including FloTHERM, FloEFD, and Flowmaster.
JCL Inc, is a major chip manufacturing firm that sells its products t.pdf
JCL Inc, is a major chip manufacturing firm that sells its products to computer manufacturers
like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc involves three basic
operations depositing. patterning, and etching - Depositing. Using chemical vapor deposition
(CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer
of solid material on the chip. - Patterning Photolithography projects a microscopic circuit pattern
on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic
film. It is repeated many times as each layer of the chip is built. - Eiching: Etching removes
selected material from the chip suiface to create the device structures. The table below lists the
required processing times and setup times at each of the steps. There is unlimited space for
buffer inventory between these steps. Assume that the unit of production is a wafer, from which
individual chips are cut at a later stage. Do not round intermediate calculations. Round your
answer to 2 decimal places a. What is the process capacity in units per hour with a batch size of
150 wafers? units per hour Do not round intermediate calculations. Round your answer to 2
decimal places b. What is the utilization of depositing if the batch size is 150 wafers?.
JCL Inc is a major chip manufacturing firm that sells its products t.pdf
JCL Inc: is a major chip manufacturing firm that sells its products to computer manufacturers
like Dell, Gateway, and others, In simplified terms, chip making at JCL Inc. involves three basic
operations: depositing, potterning, and etching: - Depositing: Using chemical vapor deposition
(CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer
of solid material on the chip. - Patterning: Photolithography projects a microscopic circuit pattern
on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic
film. It is repeated many times as each layor of the chip is built. - Etching: Etching removes
selected material from the chip surface to create the device structures. The table below lists the
required processing times and setup times at each of the steps. There is unlimited space for
buffer inventory between these steps. Assume that the unit of production is a wafer, from which
individual chips are cut at a later stage. Do not round intermediate calculations. Round your
answer to 2 decimal places. a. What is the process capacity in units per hour with a batch size of
50 wafers? units per hour Do not round intermediate calculations. Round your answer to 2
decimal places. b. What is the utilization of depositing if the batch size is 50 waters?.
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Simtec Hungary, the Certified Ansys Channel Partner in Hungary, organizes Ansys Technology Day in Budapest. In this free of charge event, you will have the opportunity to find out about the latest Ansys release updates, hear some fascinating Simtec customer stories and discover the latest simulation news, all while meeting our Simtec experts!
1st Ansys Technology Day in Athens, Agenda
Simtec S.A. the Elite Ansys Channel Partner in Greece, organizes the 1st Ansys Technology Day in Greece, at Demokritos.
Join us for an immersive experience at the 1st Ansys Technology Day hosted by Simtec at Demokritos!
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🌟 Exciting News for Engineers and Innovators in Greece!🌟
Simtec S.A. the Elite Ansys Channel Partner in Greece, organizes the 1st Ansys Technology Day in Greece, at Demokritos.
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学校原版美国波士顿大学毕业证学历学位证书原版一模一样
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本公司拥有海外各大学样板无数，能完美还原海外各大学 Bachelor Diploma degree, Master Degree Diploma
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#Abstract:
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- Gain actionable insights into AWS IAM policies and roles, using hands on approach.
#Prerequisites:
- Basic understanding of AWS services and architecture
- Familiarity with cloud security concepts
- Experience using the AWS Management Console or AWS CLI.
- For hands on lab create account on [killercoda.com](https://killercoda.com/cloudsecurity-scenario/)
# Scenario Covered:
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- Create S3 bucket.
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- Validate access.
- Exploiting IAM PassRole Misconfiguration
-Allows a user to pass a specific IAM role to an AWS service (ec2), typically used for service access delegation. Then exploit PassRole Misconfiguration granting unauthorized access to sensitive resources.
- Objective: Demonstrate how a PassRole misconfiguration can grant unauthorized access.
- Steps:
- Allow user to pass IAM role to EC2.
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- Access sensitive resources.
- Exploiting IAM AssumeRole Misconfiguration with Overly Permissive Role
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- Objective: Show how overly permissive IAM roles can lead to privilege escalation.
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- Allow user to assume the role.
- Perform administrative actions.
- Differentiation between PassRole vs AssumeRole
Try at [killercoda.com](https://killercoda.com/cloudsecurity-scenario/)
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The Python for beginners. This is an advance computer language.
The Python for beginners. This is an advance computer language.
Use PyCharm for remote debugging of WSL on a Windo cf5c162d672e4e58b4dde5d797...
Use PyCharm for remote debugging of WSL on a Windo cf5c162d672e4e58b4dde5d797...
Optimizing Gradle Builds - Gradle DPE Tour Berlin 2024
Optimizing Gradle Builds - Gradle DPE Tour Berlin 2024
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Software Engineering and Project Management - Introduction, Modeling Concepts...
Transient thermal simulation with phase change of melting ice - Veselin Pavlov, ΙΜΙ
- 1. 1 Transient thermal simulation with phase change of melting ice. Veselin Pavlov
- 2. 2 Guadalajara, Mexico . Philippines Laguna Cavite USANagoya Japan Singapore China Jiaxing Shenzhen (Liantang) Shenzhen (Kuichong) Chengdu Manufacturing Engineering California Tustin Třemošná Czech Republic Taguig Support only Hong Kong France Lyon Germany Munich Michigan (Detroit) Botevgrad Bulgaria Mexico Guadalajara IMI Global Footprint * Manufacturing space of 232,000 sq.m. with 13 factory sites in 6 countries
- 3. 3 D&D - Capabilities ConceptConcept DefinitionDefinition HardwareHardware DesignDesign SoftwareSoftware DesignDesign MechanicalMechanical Design -Design - MechatronicMechatronic LayoutLayout DesignDesign Verification/Verification/ ValidationValidation
- 4. 4 Subject Objective is to calculate the time needed for melting of 0.5mm thick ice covering camera lens Heating Elemets – 8 resistors each 0.133 W – 1.064 W in total Natural convection, -20° C initial temperature, -20°C ambient temperature
- 5. 5 Subject 3 significant thermal contacts PCB to lens holder glued with Delo-Dualbond AD345 adhesive Thread of lens holder and lens case filled with Delo-Dualbond AD345 Thread of aluminium lens casing and lens cap filled also with Delo-Dualbond AD345 Thermal behavior of these contacts is represented with experimentally estimated Thermal Contact Conductance Value - 0.008 W/mm2
- 6. 6 Enthalpy In order the phase change of the ice to be simulated, the enthalpy of ice/water was calculated Calculated enthalpy was assigned as material property to the ice body
- 7. 7 Enthalpy The distribution of enthalpy in the whole range [T0÷T1], is divided in e sub-ranges with the following characteristics: 1. [T0÷TS]: H = Cρ S (T T─ 0) 2. [TS÷TL]: H = HS + C* (T Tρ ─ S) 3. [TL÷T1]: H = HL + Cρ L (T T─ L) θ [oC] H [J/m3] CS= 2090 [J/kg-oC] -40 0.0000E+00 CL= 4184 [J/kg-o C] -30 2.0064E+07 ρ= 960 [kg/m3 ] -20 4.0128E+07 ΤS= -0.5 [o C] -10 6.0192E+07 ΤL= 0.5 [o C] -5 7.0224E+07 Τ0= -40 [o C] S -0.5 7.9253E+07 L= 334774 [J/kg] -0.25 1.6035E+08 C*= 337911 [J/kg-o C] 0 2.4145E+08 0.25 3.2255E+08 L 0.5 4.0365E+08 5 4.2172E+08 10 4.4181E+08 20 4.8197E+08 30 5.2214E+08 40 5.6230E+08
- 8. 8 Results Temperature at 0.001s (right) Temperature at 340s (left)
- 9. 9 Results
- 10. 10 Real test thermographic image Thermographic image at 0s (left) Thermographic image 300s (right)
- 11. 11 Results
- 12. 12 Questions???
- 13. 13 THANK YOU
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