This document discusses flexible electronics and OLED displays. It begins with an introduction to advances in thin-film materials and flexible electronics. It then covers the basic OLED structure, materials used including substrates and backplane electronics, and technologies for flexible displays. The document discusses fabrication methods like batch and roll-to-roll processing. It outlines applications in areas like healthcare, automotive, and displays. Advantages of flexible electronics are listed as well as limitations that need to be addressed.
2. OUTLINE
Introduction
Basic OLED Structure
Materials for flexible electronics
Technologies involved in processing
Technologies for Flexible Displays
Degree of flexibility
Applications
Advantages and Limitations
Conclusion
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3. INTRODUCTION
Ever evolving advances in thin-film
materials and devices have fueled many of
the developments in the field of flexible
electronics.
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5. Materials for Flexible Electronics
A generic large-area electronic structure is
composed of :
Substrate
Back-plane
Front-plane
Encapsulation
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6. Substrates
Flexible substrates that are to serve as drop-in
replacements for plate glass substrates must meet
many requirements:
Optical properties
Surface roughness
Thermal and thermo-mechanical properties
Chemical properties
Mechanical properties
Electrical and magnetic properties
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7. Backplane electronics
Backplanes provide or collect power and signal to or
from front-planes. Backplanes may be passive or
active.
Silicon Thin-Film Transistors
Organic Thin-Film Transistors
Materials for Interconnects and Contacts
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9. Front plane technologies
Front plane carry the specific optoelectronic
application.
Liquid Crystal Displays
Electro-phoretic Displays
Organic Light-Emitting Displays
Sensors
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10. TECHNOLOGIES AND INTEGRATION
PROCESSES
Any manufacturable device has four essential
characteristics:
Superior and pre-specified performance, with
reproducibility, uniformity, and reliability
High yield to acceptable tolerance
Simulations exist for both reverse engineering during
development and right-first-time design
Proven adequate in-service lifetime.
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12. FABRICATION TECHNOLOGY FOR FLEXIBLE
ELECTRONICS
Fabrication on sheets by Batch Processing..
On a rigid carrier, facing up and loose;
In a tensioning frame, facing up or down;
In a frame, facing down and loose
Fabrication On Web by roll-to-roll Processing
Additive Printing
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13. Batch and roll to roll fabrication
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15. Degree of flexibility
Flexibility can mean many different properties to
manufacturers and users.
Degree of flexibility is given by ε = d/2r.
Bendable or rollable
Permanently shaped
Elastically stretchable
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19. Other applications
Automotive Industries
Displays and Human- machine interaction
Energy management and mobile devices
Wireless systems
Electronics Embedded in the living environment
Electronics for hostile environment etc..,
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21. ADVANTAGES AND LIMITATIONS
Advantages:
Size and weight
Self luminous
Low cost & easy fabrication
Increased circuitry density
Bounadaries of design and packaging
Shape or to flex during its use
Wide Viewing Angle
Limitations:
Lifetime
Manufacturing
Water
Battery
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22. CONCLUSION
Based on the current socio-economic trends, we
outlined some of the most likely technological future
needs and discussed the potential exploits of thin-film
flexible electronics in various market sectors.
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