1. MOHAMMAD SHOWKAT ALI
Address:#38-87/2/2, Plot No:5,
Ambedkar Nagar Colony,Sainikpuri,
Malkajgiri, Hyderabad 500047(Telangana,India)
Email: showkat_83@yahoo.co.in/mohammadshowkatali83@gmail.com
CAREER OBJECTIVE
Seeking challenging positions in growth oriented Semiconductor organization.
CAREER SNAPSHOT
7.10 years’ of experience in the area of Semiconductor Industry . 4.10 years’ experience as PROCESS
A.E (Litho dept) in wafer fab manufacturing GLOBALFOUNDRIES Singapore and 3 years’ experience as
Process Engineer in Assembly Process and manufacturing operations in OSI Optoelectronics and Hands on
experience in process & Equipment monitoring troubleshooting after PM/CM and development (by using
SPC),with quality work. Ability to work independently as well as Part of a team, Self –Paced Learning Ability
to grasp new technologies and Decision making technically in work aspects.
ACADEMIC
 B TECH in Electronics and Communication Engineering from JNTU HYDERABAD INDIA
 Intermediate (MPC) with Aggregate 70.7 from IPE (Hyderabad).
 S.S.C with Aggregate 66 from Secondary Board of Hyderabad.
 Collage Project: Real Time Object Detection for an Unmanned Aerial Vehicle Using FPGA based Vision
Systems.
PROFESSIONAL HISTORY
Current employment:
Global Foundries Singapore JUL 2010 TO MAY 2015
PROCESS Associate Engineer(Litho)
Company Profile:
GLOBALFOUNDRIES offers a broad range of manufacturing capabilities, from the very leading edge of process
technology to more mature, cost-effective process nodes. The company operates several fabs, including both
300mm (12-inch) wafer and 200mm (8-inch) wafer production. In addition to leading process technologies of
45/40nm, 32nm, 28nm and a roadmap to 20nm and below.
Nature of job:
 Trouble-shoot process related issues and minimize the time lots are on hold , Monitor and improve on the
qualified process using SPC and other statistical tools
Hold lot(job scope)
• Disposition of OOC lots & trouble shoot the root cause for the issue in production line by using SPC and
statistical tools (Siview,Ingenio,Flatmap,FDC,Klarity,Archer)
• OOC lots (soor)hold due to measurement tools Overlay & CD and (fdch, hotspot and other system )
holds due to litho process tools.
• OOC lots hold due to Viper/Alter scan and the Alarmed wafers from litho processing tool are disposed
as per SOP
• Create/Optimize job files for metrology tools (Overlay tools) to run production lots. Do regular
housekeeping of production job files

2.  Preforming tool qualification after PM/CM and troubleshooting to achieve higher uptime without
compromising any quality related issue.
Inhibit(job scope)
• LITHO Tools(KRF/ARF/Immersion) Inhibit /down due to PM/CM/YDD high light /SOOR & Errors are
recovered by following standard process qualification procedure and engineering support
• Monitoring the tool through statistical tools (SPC,CIA GUI,FDCH,Siview) and Providing technical and
engineering support Equipment AEs and Engineers.
 Supporting the manufacturing for error free production and guiding them whenever required.
 Providing technical and engineering support for fine tuning processes for production And monitoring the
tool performance through various parameters.
 Identification and traceability of the product has been controlled and monitored through SPC , SiView and
FDCH.
Previous Employment:
OSI Optoelectronics pvt. Ltd MAY 2007 TO JUN
2010
PROCESS Engineer
Company Profile:
The company is an OSI Opto electronics Inc., USA. It is the largest manufacturers of standard and custom
Photo-detectors, Photo diodes and Optical Sensors in the United States. The company is a leader in the
design, engineering and production of Optoelectronic Components and Sub assemblies, offering extensive
research and state -of -art manufacturing capabilities
Department:
PROCESS / Engineering Department totally involved in Process Development, Equipment Monitoring and
qualifying New Devices.
Job Responsibility:
 Monitors closely manufacturing process to ensure strict enforcement and implementation of set
specifications to minimize lot rejection and defects.
 Programming (job file creating/optimization) of new devices for both TO Packages and Diode Arrays on
Auto Wire Bonding Machines.
 Set-up the machines according to required devices.
 Responsible for Maintenance and trouble shooting of wire bond machines.
 Process Monitor and improve by using SPC, New Product Assembly (proto type) and updating
Documents as per ISO standards.
Job Skills:
 Hands on Experience on Auto Wire Bonders.
 Directly in touch with manufacturing in upgrading productivity
 Generates related engineering documents to serve as temporary assembly reference by
manufacturing personnel.
 Collect Data, Analyze and Compile Reports on difficult process engineering experiments.
 Troubleshoot, perform Root Cause Analysis, and resolve process engineering issues.
Technical Purview:

3.  Maintenance and Troubleshooting of High precision Aluminum wedge bonders and Gold wire bonders.
 Wire bonding equipment related issues recovery and qualification is done to achieve higher uptime.
 ASM AB-530 – Auto Aluminum wire bonders.
 SHINKAWA UTC-100, K & S 1488 – Auto Gold wire bonders.
Trainings Attended:
OSI OPTOELECTRONICS PVT LTD.
Statistical Process Control (SPC) : January 10, 2008
Corrective and Preventive Action : April 12, 2008
Auto Wire Bonder ASM AB530 : December 4, 2008
Auto Wire Bonder SKW UTC-100 : December 22, 2008
Conversation and Email Etiquette : September 8, 2009
PERSONAL DETAILS
Name : Mohammad Showkat Ali
Date of Birth : 26th Jan 1984
Gender : Male
Nationality : Indian
Mother Tongue : Urdu
Marital Status : Married
Language Known : English, Hindi and Telugu.
Hobbies : Reading Books and Listening Music.
Fathers name : M. Subhani
Passport Number : Z3135308
DECLERATION
I hereby declare that the Above Mentioned Details are true According to the Best of my Knowledge.
PLACE: INDIA YOURS FAITHFULL
DATE : (MOHAMMAD SHOWKAT ALI)