This is a segment of a larger presentation covering some of the technical aspects of the x3850 X5.

1. x3850 X5 overview
1

2. x3850 X5 Technical Presentation
Michelle Gottschalk Ralph M. Begun
WW Product Manager System Development Lead
mgottsc@us.ibm.com begun@us.ibm.com
March 30, 2009

3. IBM System x3850 X5
Flagship System x platform for leadership scalable performance
and capacity
Versatile 4-socket, 4U rack-optimized scalable enterprise server provides a
flexible platform for maximum utilization, reliability and performance of
compute- and memory-intensive workloads.
Maximize Memory
– 64 threads and 1TB capacity for 3.3x database and 3.6x the
virtualization performance over industry 2-socket x86 (Intel
Xeon 5500 Series) systems
– MAX5 memory expansion for 50% more virtual machines and
leadership database performance
System Specifications
Minimize Cost
– Lower cost, high performance configurations reaching desired  4x Intel Xeon 7500-series CPUs
memory capacity using less expensive DIMMs  64 DDR3 DIMMs, up to 96 with MAX5
 6 open PCIe slots (+ 2 additional)
– eXFlash 480k internal IOPs for 40x local database performance
 Up to 8x 2.5” HDDs or 16x 1.8” SSDs
and $1.3M savings in equal IOPs storage
 RAID 0/1 Std, Optional RAID 5/6
 2x 1GB Ethernet LOM
Simplify Deployment  2x 10GB Ethernet SFP+ Virtual Fabric / FCoEE
– Pre-defined database and virtualization workload optimized  Scalable to 8S, 128 DIMM
systems for faster deployment and faster time to value  Internal USB for embedded hypervisor
 IMM, uEFI & IBM Systems Director
3

4. x3850 X5 and x3950 X5 Models
x3850 X5 – Four Socket Scalable Server
IBM System x high end four-socket server with Intel 7500 Series processors, IMM,
RAID 0,1, dualGigE, Emulex 10GigE, 2x1975W power supplies x3850 X5
x3850 X5
7145-1RY 2x E7520 4 Core 1.86GHz18MB x4.8 95W (S4S), 4x4GB
7145-2RY 2x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 4x4GB
7145-3RY 2x E7540 6 Core 2.0GHzT,18MB x6.4 105W (S8S), 4x4GB
7145-4RY 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB
7145-5RY 2x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S), 4x4GB
2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB
7145-E4Y x3850 X5 w/ MAX5
x3850 X5 – Memory Expanded Four Socket Scalable Server
IBM System x high end four-socket scalable server with MAX5, IMM, RAID 0,1,
dualGigE, Emulex 10GigE, 1x4QPI cable kit, 2x1975W power supplies
x3850 X5
.
7145-2SY 4x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 8x4GB + eX5 MAX5, 2x2GB
7145-4SY 4x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB
7145-5SY 4x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB
MAX5
Workload Optimized Models
Richly-configured models optimized for virtualization environments or database workloads
x3950 X5 Virtualization Optimized Models
4x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W. 64x4GB, +eX5 MAX5, 32x4GB, VMWare
7145-4DX
ESXi Hypervisor USB key
x3850 X5 Database Optimized Models
2x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 4QPI, 8x4GB, 2x1975W, IMM, 1 x Intruder
7145-5DY
backplane, dual GigE, Emulex 10GigE
7145-4FY 4 x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W, 32x4GB, 16x1.8” 200GB SSD,RAID 5,6
7145-5GY 4 x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 130W, 32x4GB, 16x1.8”200GB SSD,RAID 5,6
4

5. Intel Xeon chipset
5

6. Intel Boxboro-EX 4S design
• Connectivity
– Fully-connected (4 Intel® QuickPath
MB
MB
MB
interconnects per socket)
MB
Xeon Xeon
MB
MB
– 6.4, 5.86, or 4.8 GT/s on all links
MB
MB
– Socket-LS
– With 2 IOHs: 82 PCIe lanes (72 Gen2
MB
MB
Boxboro lanes + 4 Gen1 lanes on unused
MB
Xeon Xeon
MB
MB
ESI port + 6 Gen1 ICH10 lanes)
MB
MB
MB
• Memory Intel® QuickPath
interconnects
– CPU-integrated memory controller
– Registered DDR3-1066 DIMMs running at Boxboro Boxboro
speeds of 800, 978 or 1066 MHz via on-
board memory buffer X4
– 64 DIMM support (4:1 DIMM to buffer ESI
ratio)
ICH
X4 PCIe Gen1
x8 x8 x8 x8 x4 x8 x8 x8 x8 x4
10*
• Technologies & Enabling
2x4 2x4 x16 x16
– Intel® Intelligent Power Node Manager
2x4 2x4
– Virtualization: VT-x, VT-d, & VT-c
– Security: TPM 1.2, Measured Boot, UEFI
– RAS features
6
6

7. Intel Boxboro-EX 2S Platform
• Modified Boxboro-EX ingredients to offer a new
high-memory 2S platform
• Xeon 2S will only be validated with up to 2 IOHs Validated Configuration
• Xeon 2S SKUs cannot scale natively (w/ QPI)
beyond 2skts
• Xeon 2S SKUs can scale beyond 2skts with a node Xeon Xeon
controller
• Comparison w/ Boxboro-EX & Tylersburg-EP: Intel® QuickPath
interconnects
Boxboro Boxboro
X4
ESI
Boxboro-EX 2S Tylersburg-EP
ICH
X4 PCIe Gen1
(2 IOH) (2 IOH) x8 x8 x8 x8 x4 x8 x8 x8 x8 x4
10*
2x4 2x4 2x2 x16 x16 2x2
# of cores per CPU Up to 8 Up to 4
2x4 2x4
QuickPath 4^ 2
Interconnect
# of DIMMs 32 18
PCIe lanes 72+10 72+6
7
7

8. Xeon® 7500/6500 Platform Memory 2 DDR3
4 SMI
• 4 Socket platform capability 64 DIMMs
M
RDIM
M
RDIM
SMB
M
RDIM
M
RDIM
– Up to 16 DDR3 DIMMs per socket via up to four
Scalable Memory Buffers
– Support for up to 16GB DDR3 DIMMs
– 1TB with 16GB DIMMS Xeon
7500/6500
• Memory types supported:
– 1066MHz DDR3
– Registered (RDIMM)
– Single-rank (SR), dual-rank (DR), quad-rank (QR) Up to 16 DIIMS
• Actual system memory speed depends on specific
processor capabilities. (see NHM-EX SKU stack for
max SMI link speeds per SKU):
– 6.4GT/s SMI link speed capable of running memory speeds up to 1066Mhz
– 5.86GT/s SMI link speed capable of running memory speeds up to 978Mhz**
– 4.8GT/s SMI link speed capable of running memory speeds up to 800Mhz
^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer
^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer
8** Memory speed sett by UEFI ; All channels in a system will run at the fastest common frequency
8

9. x3850 X5 system specifics
9

10. x3850 X5 front view
(2x) 1975W Rear Access Hot 10Gb Ethernet Adapter
Swap, Redundant P/S
(8x) Memory Cards – 7x - PCIe Gen2 Slots
8 1066MHxDDR3 DIMMs per card
(4x) Intel Xeon EX CPU’s
RAID Card
(2x) 120mm
Hot Swap Fans
2x 60mm Hot Swap Fans
DVD Drive (8x) Gen2 2.5” Drives
Dual USB Light Path Diagnostics
10

11. System Images - Interior
SAS Backplanes + HDD Cage
Slot 1 M5015 RAID
PCIe x16
Slot 2
PCIe x4
Slot 3
PCIe x8 Boxborro 2
Slot 4 PCIe x8 HS Fan Pack
Slot 5 PCIe x8
Slot 6 PCIe x8 Boxborro1 Mem Card 8
Slot 7 PCIe x8 CPU4
Mem Card 7
System
Mem Card 6
Recovery
PS1 Jumpers CPU3
Mem Card 5
USB
Mem Card 4
CPU2
Mem Card 3
PS2 Mem Card 2
CPU1
Mem Card 1
11

12. New x3850 X5 memory card
Specifications :
64 DDR3 DIMMs
32 buses @ 1066M
2 DIMMs per bus
SMI - 16 buses
Each @ 6.4GT/s
(2B Rd/1B Wr)
PC3-10600R LP DIMMs
1GB, x8, 1R, 1Gb
2GB, x8, 2R, 1Gb
4GB, x8, 4R, 1Gb
8GB, x8, 4R, 2Gb
16GB, x4, 4R, 2Gb
12

13. System Images – Chassis View
Rear Access HS PSUs
- lift up on handle then pull out
Front Access 120mm fans QPI Scalability Ports / Cables
Rear I/O Shutttle
13

14. System Images – CPU and Memory
CPU and Heatsink installation
Memory Cards
14

15. System Images - Options
M1015 RAID card and
Installation bracket
8 HDD SAS Backplane
15

16. x3850 X5 DIMM Population Rules
Memory Card 1
General Memory Population Rules DIMM 8 DIMM 6
• DIMM’s must be installed in matching pairs
DIMM 1 DIMM 3 Channel 1
• Each memory card requires at least 2 Channel 0
Channel 0 Channel 1 DIMM 7 DIMM 5
DIMM’s
DIMM 2 DIMM 4
Memory Buffer 2
Memory Population Best Practices Memory Buffer 1
• Populate 1 DIMM / Memory Buffer on each
CPU
SMI Lane 2
SMI lane 1st
SMI Lane 1 MC1
• Populate 1 DIMM / Memory Buffer across all
cards before moving to populate the next
channel on the Memory Buffer
• Populate DIMMs furthest away from SMI Lane 4 MC2
Memory Buffer 1st (ie – 1, 8, 3, 6) before SMI Lane 3
populating 2nd DIMM in channel
• Memory DIMMs should be plugged in order Memory Buffer 1
of DIMM size Memory Buffer 2
• Plug largest DIMMs first, followed by next DIMM 2 DIMM 4
largest size Channel 0 Channel 1 DIMM 7 DIMM 5
• Each CPU & memory card should have DIMM 1 DIMM 3 Channel 0 Channel 1
identical amounts of RAM
DIMM 8 DIMM 6
Memory Card 2
Optimally expandable memory config is 2 memory cards / CPU, 4 DIMMs / memory card, equal amounts of memory / card
16
16 16

17. x3850 X5 PCIe Slot Population
Card # PCIe Slot #
1 1
2 5
3 3
4 6
5 4
6 7
7 2
Plug one PCIe card / Boxboro before moving to next set of slots
17
17 17

18. x3850X5 Supported Internal ServRAID
adapters
ServRAID M1015 ServRAID M5015
Features and Functions Features and Functions
• Two x4 internal SAS / SATA ports • Two x4 internal SAS / SATA ports
• RAID Levels 0, 1, 10 • X8 PCI e Gen 2 host interface
• LSI SAS2008 RAID on Chip (ROC) • RAID Levels 0, 1, 5, 10, 50 (6, 60
• Low-profile PCIe ½ Length card Optional)
• X8 PCIe Gen 2 host interface • 800MHz 72-bit ECC DDR2 SDRAM
Memory (512 MB)
• LSI SAS2108 6Gb/s RAID on Chip
• Low-profile PCIe ½ Length card
• Encryption Services
• Instant Secure Erase
• Local Key Management
Bertram: • MegaRAID Management Suite
• MegaRAID Storage Manager
optional for x3850 X5, std on x3690 • MegaCLI (command-line interface)
• WebBIOS
• Intelligent Battery Backup Unit
Multiple RAID Adapters to meet Multiple Performance Requirements
18
18 18

19. x3850 X5 – Hardware; Speeds and Feeds
Processors Networking
 4 Socket Intel Xeon 7500 series  Broadcom BCM5709C
 (4) QPI Ports/Processor • Dual 1Gb connection
 (4) SMI Ports/Processor • x4 PCIe Gen2 Connection
 Emulex 10Gb dual port custom
Memory • IBM Specific Adapter Option
 (8) Memory Cards, 2 per CPU • Installs in PCIe Slot 7, x8 PCIe Gen2
 (16) Intel Memory Buffers total • V-NIC Capable
• SMI Connected
 DDR3 DIMMs PCIe Slots
 (64) Total DIMM Slots  Slot 1 PCIE Gen2 x16 Full Length
 1066 MHz DDR3 speed  Slot 2 PCIE Gen2 x4 Full Length (x8 mech)
• Processor QPI Speed Dependant  Slot 3 PCIE Gen2 x8 Full Length
 2, 4, 8 and 16GB Support  Slot 4 PCIE Gen2 x8 Full Length
• Installed In Matched Pairs  Slot 5 PCIE Gen2 x8 Half Length
 Memory Sparing and Mirroring Support  Slot 6 PCIE Gen2 x8 Half Length
• Installed in Matched Quads  Slot 7 PCIE Gen2 x8 Half Length (10GbE)
All slots 5Gb/s, full height
Chipset
 (2) Intel Boxboro IOH (QPI-to-PCIe Bridge)
• (36) PCIe Gen2 Lanes
• (2) QPI Ports
• (4) ESI Lanes To ICH10
 Intel ICH10 Southbridge
• (8) USB 2.0 Ports
• 3Gb/s SATA DVD Connection
19
19

20. x3850 X5 – Hardware; Speeds and Feeds Cont.
2.5” Storage IMM
Up To (8) 2.5” HDD Bays  Common IMM Across Rack Portfolio
• Support For SAS / SATA and SSD • x3550M2
 SAS Drives • x3650M2
• 146GB / 10K / 6Gbps • x3750 X5
• 300GB / 10K / 6Gbps • x3850 X5
• 73GB / 15K / 6Gbps • x3950 X5
• 146GB / 15K / 6Gbps  300MHz, 32-bit MIPS Processor
 SATA Drive  Matrox G200 Video Core
• 500GB / 7200rpm  128MB Dedicated DDR2 Memory
 SSD Drive  Avocent Based Digital Video Compression
• 50GB  Dedicated 10/100Mb Ethernet
 Configured with one or two 4-Drive backplanes  9-Pin Serial Port
 128-bit AES Hardware Encryption Engine
UEFI BIOS  IPMI v2.0
 Next-generation replacement for BIOS-based firmware which provides Fan Speed Control
a richer management experience  Serial Over LAN
 Removes limit on number of adapter cards—important in virtualized  Active Energy Manager/xSEC
environments  LightPath
 Ability to remotely configure machines completely via command
scripts with Advance Settings Utility
20
20

21. System Population Guidelines
Processors
 Base Systems contain 2 CPU
 8-socket QPI scaling is supported with 4+4 CPU, all matching
Memory
 Each CPU needs at least one memory card
 Each memory card needs at least 2 DIMMs
 DIMMs must be installed in matching pairs
 Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on each
memory card, equal amounts of memory per card.
 If memory mirrored, then DIMM’s must match in sets of 4
 MAX5 memory expansion works best with DIMMs in sets of 4
 MAX5 memory expansion works best with a ratio of 2/1 memory in host/expander
Drives
 Base systems contain backplane for 4 drives
 Maximum of 8 SFF SAS drives
I/O Adapters
 Alternate adapter population between IOH chipset devices; alternate between slots (1-4)
and (5-7)
21

22. Trademarks
Trademarks
The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. For a complete list of IBM Trademarks, see
www.ibm.com/legal/copytrade.shtml: AS/400, DBE, e-business logo, ESCO, eServer, FICON, IBM, IBM Logo, iSeries, MVS, OS/390, pSeries, RS/6000, S/30, VM/ESA, VSE/ESA, WebSphere, xSeries, z/OS,
zSeries, z/VM
The following are trademarks or registered trademarks of other companies
Lotus, Notes, and Domino are trademarks or registered trademarks of Lotus Development Corporation
Java and all Java-related trademarks and logos are trademarks of Sun Microsystems, Inc., in the United States and other countries
LINUX is a registered trademark of Linux Torvalds
UNIX is a registered trademark of The Open Group in the United States and other countries.
Microsoft, Windows and Windows NT are registered trademarks of Microsoft Corporation.
SET and Secure Electronic Transaction are trademarks owned by SET Secure Electronic Transaction LLC.
Intel is a registered trademark of Intel Corporation
* All other products may be trademarks or registered trademarks of their respective companies.
NOTES:
Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will
experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed.
Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual
environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.
This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change
without notice. Consult your local IBM business contact for information on the product or services available in your area.
All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance,
compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.
Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography.
References in this document to IBM products or services do not imply that IBM intends to make them available in every country.
Any proposed use of claims in this presentation outside of the United States must be reviewed by local IBM country counsel prior to such use.
The information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication.
IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.
Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not
part of the materials for this IBM product and use of those Web sites is at your own risk.
22
22