Silver Filled Epoxy for Bonding & Die Attach Applications

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Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.

Technologie

for
Bonding &
Die Attach
Applications
ABOUT THE MATERIAL
One Part Epoxy
EP3HTS-TC
THERMAL CONDUCTIVITY
110-118 BTU•in/(ft²•hr•°F)
[16-17 W/(m•K)]
NOT PREMIXED AND FROZEN
NASA LOW OUTGASSING
VERY LONG OPEN TIME
AT ROOM TEMPERATURE
PERFORMANCE
PROPERTIES
HARDNESS, 75°F
60-70 Shore D
COEFFICIENT OF THERMAL
EXPANSION, 75°F
20-23 x 10-6
in/in/°C
VOLUME RESISTIVITY, 75°F
<1x10-6
ohm-cm
VISCOSITY, 75°F
Thixotropic paste
SERVICE TEMPERATURE
-80°F to +400°F
[-62°C to +204°C]
APPLICATION
AND CURING
THIXOTROPIC INDEX, 75°F
10
CURE SCHEDULE
15-20 minutes at 300°F
DIE SHEAR STRENGTH, 75°F
(2 X 2 MM [80 X 80 MIL])
9-12 kg-f
154 Hobart Street, Hackensack, NJ 07601 USA
+1.201.343.8983 • main@masterbond.com
www.masterbond.com

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Silver Filled Epoxy for Bonding & Die Attach Applications

1. for Bonding & Die Attach Applications ABOUT THE MATERIAL One Part Epoxy EP3HTS-TC THERMAL CONDUCTIVITY 110-118 BTU•in/(ft²•hr•°F) [16-17 W/(m•K)] NOT PREMIXED AND FROZEN NASA LOW OUTGASSING VERY LONG OPEN TIME AT ROOM TEMPERATURE PERFORMANCE PROPERTIES HARDNESS, 75°F 60-70 Shore D COEFFICIENT OF THERMAL EXPANSION, 75°F 20-23 x 10-6 in/in/°C VOLUME RESISTIVITY, 75°F <1x10-6 ohm-cm VISCOSITY, 75°F Thixotropic paste SERVICE TEMPERATURE -80°F to +400°F [-62°C to +204°C] APPLICATION AND CURING THIXOTROPIC INDEX, 75°F 10 CURE SCHEDULE 15-20 minutes at 300°F DIE SHEAR STRENGTH, 75°F (2 X 2 MM [80 X 80 MIL]) 9-12 kg-f 154 Hobart Street, Hackensack, NJ 07601 USA +1.201.343.8983 • main@masterbond.com www.masterbond.com

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