I-Byte Technology July 2021

IT Shades
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I-Bytes
Technology
July Edition 2021
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Table of Contents
1. Financial, M & A Updates....................................................................................................................................1
2. Solution Updates...................................................................................................................................................5
3. Rewards and Recognition Updates...................................................................................................................17
4. Customer Success Updates................................................................................................................................23
5. Partnership Ecosystem Updates........................................................................................................................24
6. Environmental & Social Updates......................................................................................................................44

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Financial, M & A
Updates Technology Industry

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Financial, M&A Updates
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Agilent Technologies Inc. (USA) Resolution Bioscience Investigated Acquired
Resistance to KRAS G12C Inhibition
Agilent Technologies Inc. announced the publication of a study carried out
in partnership with Resolution Bioscience (a part of Agilent) and
Dana-Farber Cancer Institute. The paper was published in the New England
Journal of Medicine on June 24 and is titled "Acquired Resistance to KRAS
G12C Inhibition in Cancer." It demonstrates the clinical utility of liquid
biopsy techniques to detect resistance to targeted therapies, including
inhibitors of KRAS, one of the most commonly mutated oncogenes in
cancer. KRAS G12C inhibitors, such as adagrasib, have shown promising
efficacy in clinical trials, however, mechanisms of acquired resistance are
not yet fully understood. Leveraging cell-free DNA analysis, this study was
conducted to investigate mutations that arise that may confer resistance to
patients treated with KRAS inhibitors, including adagrasib and to better
understand the process of acquired resistance and to identify new strategies
to combat acquired resistance.
Executive Commentary
“While results from these early clinical trials are encouraging, the
cancer usually becomes resistant to these drugs,” said MD, Ph.D, the
co-first author of the paper with Shengwu Liu, Ph.D., also of
Dana-Farber. “The mechanisms of resistance – the genomic and other
changes that occur that allow the cancer to begin growing again – are
largely unknown. This study sought to identify them.”
Description
1

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NVIDIA (USA) to Acquire DeepMap, Enhancing Mapping Solutions for the AV
Industry
NVIDIA has agreed to acquire DeepMap, a startup dedicated to
building high-definition maps for autonomous vehicles to
navigate the world safely. Maps that are accurate to within a few
meters are good enough when providing turn-by-turn directions
for humans. AVs, however, require much greater precision. They
must operate with centimeter-level precision for accurate
localization, the ability of an AV to locate itself in the world.
Proper localization also requires constantly updated maps. These
maps must also reflect current road conditions, such as a work
zone or a lane closure. These maps need to efficiently scale across
AV fleets, with fast processing and minimal data storage. Finally,
they must be able to function worldwide.
“NVIDIA is an amazing, world-changing company that shares
our vision to accelerate safe autonomy,” said co-founder and
CEO of DeepMap. “Joining forces with NVIDIA will allow
our technology to scale more quickly and benefit more people
sooner. We look forward to continuing our journey as part of
the NVIDIA team.”
Description
2

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Texas Instruments Incorporated (TI) (USA) to acquire Micron 300-mm semiconductor
factory, extending TI's cost advantage and greater control of supply chain
Texas Instruments Incorporated (TI) announced it signed an
agreement to acquire Micron Technology’s 300-mm
semiconductor factory in Lehi, Utah, for $900 million. The Lehi
fab will be TI’s fourth 300-mm fab, joining DMOS6, RFAB1 and
soon-to-be-completed RFAB2 in TI’s wafer fab manufacturing
operations. In addition to its value as a 300-mm fab, the
acquisition is a strategic move, as Lehi will start with 65-nm and
45-nm production for TI’s analog and embedded processing
products and be able to go beyond those nodes as required.
"This investment continues to strengthen our competitive
advantage in manufacturing and technology and is part of our
long-term capacity planning," said TI’s chairman president and
CEO.
Description
3

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Xilinx (USA) Acquires Silexica to Broaden its Developer Base
Xilinx, Inc. the leader in adaptive computing announced that it has acquired
Silexica, a privately-held provider of C/C++ programming and analysis
tools. Silexica’s SLX FPGA tool suite empowers developers with an
unparalleled development experience building applications on FPGAs and
Adaptive SoCs. This technology will become integrated with the Xilinx
Vitis™ unified software platform to substantially reduce the learning curve
for software developers building sophisticated applications on Xilinx
technology. Leveraging standard high-level synthesis tools from Xilinx, the
SLX FPGA tool suite tackles non-synthesizable and non-hardware aware
C/C++ code, detects application parallelism, inserts pragmas, and
determines optimal software and hardware partitioning. This enables
designing at a higher level of abstraction, orders of magnitude faster
simulation, and a better result through high-level optimizations and design
space exploration.
“Software programmability is imperative to our long-term goal to
accelerate the path from software to application-optimized hardware
systems,” says executive vice president and general manager Data
Center Group, Xilinx. “Silexica’s technology complements our existing
Vitis solution and roadmap and will accelerate our ability to attract a
wider range of developers seeking to leverage our heterogeneous
computing architectures.”
Description
4

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Solutions Updates
Technology Industry

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Solution Updates
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Apple (USA) launches at Apple Creative Studios to provide opportunities
to young creative
5
Solution Description
Apple announced at Apple Creative Studios, a global initiative that will provide career-building mentorship, professional industry
skills training, creative resources, and access to Apple’s full product lineup of iPhone, iPad, and Mac to underrepresented
communities across the globe. Creative Studios will launch first in Los Angeles and Beijing, followed by Bangkok, London, Chicago,
and Washington, D.C. later this year. In each city, Apple will work hand-in-hand with nonprofit community organisations to connect
youth with mentors and established artists. At Apple Creative Studios programming will hone creative passion in areas such as music,
film, photography, and art and design, and will be available to young people who face barriers to meaningful artistic education.
Across eight to 12 weeks of programming, mentors — in collaboration with Apple and community partners — will take participants
through a curriculum of hands-on sessions, insider industry knowledge, and provide ongoing feedback on participants’ creative
projects. Alongside developing creative skills, our mentors and community partners will nurture participants’ self-expression and
encourage them to spark social change within their own communities. At the end of programming, Apple will host a celebration and
showcase of participants’ final works in their local Apple Store location or within the community.

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Solution Updates
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Apple (USA) introduces new developer tools and technologies to create
even better apps
6
Apple unveiled new tools and technologies designed to help developers create more engaging app experiences and make it even
easier to build high-quality apps. Xcode Cloud brings together the multiple tasks and tools required to build, test, and deliver apps
using powerful cloud services, enabling individual developers and teams to be more productive and provide great apps to their users.
With In-App Events and Custom Product Pages, the App Store now provides all-new ways for developers to promote their apps and
connect with users. Swift takes a massive leap forward with concurrency support built into the language, and augmented reality (AR)
technologies make it easier than ever to build immersive content in apps or on the web. Xcode Cloud is a new continuous integration
and delivery cloud service designed specifically for Apple developers. Built into Xcode 13, Xcode Cloud offers a fast and simple way
for developers and teams of all sizes to build, test, and deliver high-quality apps even more efficiently. Xcode Cloud can
automatically build apps in the cloud to free up developers’ Macs for other tasks. Parallel testing in the cloud means developers can
test on a simulated version of every current Apple device, then easily deploy a build of the app for internal testing, or deliver to
external beta testers through TestFlight for instant feedback.

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Solution Updates
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Apple (USA) previews new iPad productivity features with iPadOS 15
7
Apple previewed iPadOS 15, with new features that take advantage of the unique capabilities of iPad, helping users be more productive and taking
the versatility of iPad even further. iPadOS 15 introduces a multitasking experience that is even more intuitive, making features like Split View
and Slide Over easier to discover, easier to use, and more powerful. A note goes systemwide with Quick Note, and offers new ways to collaborate
and organise whether typing or writing with Apple Pencil. New widget layouts for the Home Screen and App Library offer simple ways to
personalise the iPad experience and organize apps. Translate delivers new features for translating text and conversations, and users can now build
apps for iPhone and iPad, on iPad, with Swift Playgrounds. iPadOS 15 also includes new privacy controls in Siri, Mail, and more places across the
system to further protect user information. iPadOS 15 makes working with multiple apps easier than ever. A new multitasking menu appears at the
top of apps, letting users go into Split View or Slide Over with just a tap. Users now have quick access to the Home Screen when using Split View,
making it easier to get to the right app. using the new shelf, they can also multitask with apps that have multiple windows like Safari and Pages,
as well as quickly preview emails. The experience with an external keyboard allows users to get more done with all-new keyboard shortcuts and
a redesign of the menu bar. Users can quickly set up and switch between Split View and Slide Over with new shortcuts for multitasking right from
the keyboard.

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Solution Updates
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Arrow Electronics (USA) Provides Fully Managed Service for Citrix ADC
and Microsoft 365 Cloud Backup
8
Global technology provider Arrow Electronics announced the launch of a fully managed service to help customers meet the challenges presented
by the delivery and back-up of applications. Recognizing the growing challenges organizations face and the responsibilities they have to protect
their data in the many applications used on a daily basis, Arrow will initially deliver Citrix ADC (application delivery controller) and Microsoft
365 cloud back-up as fully managed services to aid optimal app compliance, upgrade, configuration and back-up. Microsoft 365 cloud back-up
will be available via ArrowSphere, Arrow`s global multi-tier cloud platform. Citrix Application Delivery Controller (ADC) is a comprehensive
application delivery and load balancing solution, allowing businesses to deliver a great user experience anywhere on any device. The number of
options to choose from and ways to deploy Citrix ADC can be complex and without the right technical support, some customers are not using it to
its maximum potential. Arrow has developed a Citrix ADC managed service to help customers meet the challenges presented and get the most out
of their Citrix ADC solution. With the ability to install a secure virtual appliance into a customer’s environment providing a fully managed Citrix
ADC, new applications can be quickly onboarded as required and vulnerabilities can be proactively monitored, making preventative changes
automatically and alerting to issues. In the same way, cloud backup for Microsoft 365 will provide a fully managed back-up-as-a-service solution
to provide peace of mind that data is protected.

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Solution Updates
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KLA (USA) Launches New Portfolio of Automotive Products to Improve
Chip Yield and Reliability
9
KLA Corporation announced the launch of four new products for automotive chip manufacturing: the 8935 high productivity patterned wafer inspection
system, the C205 broadband plasma patterned wafer inspection system, the Surfscan® SP A2/A3 unpatterned wafer inspection systems and I-PAT®
inline defect part average testing screening solution. The automotive industry is focused on innovations in electrification, connectivity, advanced driver
assistance and autonomous driving. This means vehicles require more electronics, which drives the demand for semiconductor chips. With chips at the
core of vehicle operations and safety applications, reliability is critical and automotive chips must meet strict quality standards. The three new
inspectors form a complementary defect discovery, monitoring and control solution for larger design node chip manufacturing in the automotive
industry. The Surfscan SP A2/A3 unpatterned wafer inspectors incorporate DUV optics and advanced algorithms to produce the sensitivity and speed
required to identify and eliminate process defects that can cause automotive chip reliability issues and to ensure process tools are operating at peak
performance. For R&D and production ramp, the C205 patterned wafer inspector utilizes broadband illumination and NanoPoint™ technology for high
sensitivity discovery of critical defects, helping speed optimization of new processes and devices. During high volume manufacturing, the 8935
patterned wafer inspector employs new optical technologies and the DefectWise® AI solution to capture a wide variety of critical defects at a low
nuisance rate for fast and accurate identification of process excursions that can affect final chip quality.

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Solution Updates
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Lenovo (Hong Kong) Launches New Mobile Workstations with Innovative
Solutions to Enhance User Experience and Maximize Productivity
10
Lenovo’s recent Future of Work and Digital Transformation study found that 70 percent of global employees surveyed reported higher
job satisfaction and that 56 percent felt more productive at home. To deliver a smarter way forward as many companies explore a hybrid
working environment that balances the continuation of remote working with a return to the office post-pandemic, Lenovo™ introduces
the next generation of its ThinkPad™ P1, ThinkPad P15 and ThinkPad P17 mobile workstations. Each boasts the latest 11th generation
Intel® Core™ and Xeon™ mobile CPUs, the latest NVIDIA® GPU architecture up to the NVIDIA RTX A5000 GPU, and added support
for PCIe Gen 4 SSDs. These new mobile workstations deliver the performance and power professional users need to maximize
productivity. As is true with the entire Lenovo workstation portfolio, the ThinkPad P1, P15 and P17 are all ISV certified and tested at the
highest level to pass MIL-spec standards1 – allowing users to take their productivity to the next level with reliable devices they can trust.
Beyond the new trio of mobile workstations, Lenovo delivers a complete solution for today’s modern working environment and makes it
easier than ever to work from anywhere. This includes the introduction of the new ThinkVision™ P34w-20 monitor for a
professional-level display and the ThinkPad Thunderbolt™ 4 Workstation Dock to conveniently power the full experience.

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Solution Updates
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Sierra Wireless Launches Advanced Multi-Network 5G Router Powered by
ON Semiconductor (USA) Wi-Fi 6 Solution Chinese Korean
11
ON Semiconductor driving energy-efficient innovations announced that Sierra Wireless a world-leading IoT solutions provider has selected
QCS-AX Wi-Fi 6 chipsets to power the Wi-Fi functionality of its market-leading XR Series of multi-network 5G routers. The supercharged X90
and XR80 routers are designed to deliver high performance and seamless connectivity across 5G cellular, Wi-Fi and Ethernet networks for mission
and business-critical applications. Embedded with the QCS-AX Wi-Fi 6 chipsets from ON Semiconductor, the XR Series delivers best-in-class
flexibility and reliability among 5G and Wi-Fi radios while intelligently connecting to the best-performing network at the right time. With up to
2.4Gbps speed in a single band, the QCS-AX can be configured for dual band concurrent operation to provide optimized performance along with
simultaneous access point and station capability. The public safety, transit and utility applications rely on real-time communications, including
video streaming, video offload and other data-intensive use cases, to ensure safety and responsiveness. Having uninterrupted and reliable
connection is crucial as users in the field and at the station must make timely decisions based on the information received in critical situations. The
mobile router can be used for mobility applications or primary, temporary, or backup fixed wireless connectivity, from connecting medical devices
in emergency vehicles, to providing continuous and scheduled telematic backup or business-critical connectivity. Security is a serious concern for
all data transmission.

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NVIDIA (USA) Announces Instant AI Infrastructure for Enterprises
12
NVIDIA unveiled NVIDIA AI LaunchPad a comprehensive program delivered through hybrid-cloud providers that gives enterprises
immediate access to NVIDIA-powered infrastructure and software to streamline the entire AI lifecycle. Digital infrastructure leader Equinix
will be the first in the AI LaunchPad program, providing NVIDIA-powered hybrid-cloud solutions globally on Platform Equinix®. The
Equinix infrastructure deploys in minutes, allowing enterprises to access an entire spectrum of NVIDIA resources that support virtually every
aspect of AI, from data center training and inference to full-scale deployment at the edge. With AI LaunchPad, Equinix customers can develop
advanced AI on NVIDIA DGX™ SuperPODs managed by NVIDIA Base Command™ Platform, an AI development hub. Enterprises will
also be able to use Base Command Platform on NVIDIA-Certified Systems™ from leading manufacturers including Dell Technologies and
Lenovo. Built on the NVIDIA EGX™ platform, these industry-standard servers are ideal for running the NVIDIAAI Enterprise software suite
on VMware vSphere to deploy an AI-ready enterprise platform that scales AI on hybrid clouds. Additionally, customers can securely deploy
and manage AI applications across distributed edge infrastructure at Equinix with the NVIDIA Fleet Command™ managed cloud service —
which entered general availability— connected to NVIDIA-Certified Systems.

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NVIDIA (USA) and Global Partners Launch New HGX A100 Systems to
Accelerate Industrial AI and HPC
13
NVIDIA announced it is turbocharging the NVIDIA HGX™ AI supercomputing platform with new technologies that fuse AI with high
performance computing, making supercomputing more useful to a growing number of industries. To accelerate the new era of industrial AI and
HPC, NVIDIA has added three key technologies to its HGX platform: the NVIDIA® A100 80GB PCIe GPU, NVIDIA NDR 400G InfiniBand
networking, and NVIDIA Magnum IO™ GPUDirect™ Storage software. Together, they provide the extreme performance to enable industrial
HPC innovation. Atos, Dell Technologies, Hewlett Packard Enterprise (HPE), Lenovo, Microsoft Azure and NetApp are among dozens of partners
using the NVIDIA HGX platform for next-generation systems and solutions. The HGX platform is being used by high-tech industrial pioneer
General Electric, applying HPC innovation to computational fluid dynamics simulations that guide design innovation in large gas turbines and jet
engines. The HGX platform has achieved order-of-magnitude acceleration for breakthrough CFD methods in GE’s GENESIS code, which
employs Large Eddy Simulations to study the effects of turbulent flows inside turbines that are composed of hundreds of individual blades and
require uniquely complex geometry. NVIDIA A100 Tensor Core GPUs deliver unprecedented HPC acceleration to solve complex AI, data
analytics, model training and simulation challenges relevant to industrial HPC. A100 80GB PCIe GPUs increase GPU memory bandwidth 25
percent compared with the A100 40GB, to 2TB/s, and provide 80GB of HBM2e high-bandwidth memory.

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Qualcomm (USA) Upgrades its Premium Tier with Snapdragon 888 Plus
5G Mobile Platform
14
Qualcomm Technologies, Inc. announced the new Snapdragon® 888 Plus 5G Mobile Platform, follow-on to the
flagship Snapdragon 888. These two platforms power more than 130 designs announced or in development.
Snapdragon 888 Plus fuels flagship experiences with intelligent entertainment, including AI-enhanced gameplay,
streaming, photography, and more – backed by boosted performance, unrivaled speed, and premium connectivity. The
platform is armed with the full arsenal of Snapdragon Elite Gaming™ features to harness the power of ultra-smooth
responsiveness, color-rich HDR graphics, and mobile-first desktop-level. Compared to its predecessor, Snapdragon
888 Plus offers an increased Qualcomm® Kryo™ 680 CPU Prime core clock speed at up to 3.0 GHz* and the 6th
generation Qualcomm® AI Engine with up to 32 TOPS AI performance, which is more than 20% improvement.

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Rennes’s (Japan) Launches LTE CAT-M1 Module for Massive IoT Based
On Carrier-Proven Monarch Technology from Sequans
15
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, introduced the RYZ014A, Renesas’ first cellular IoT module
supporting the LTE Cat-M1 specification. This technology allows devices to directly connect to the internet without the need for a gateway by relying
on the existing communication infrastructure owned by mobile network operators. This makes it economical to connect each device, which is especially
beneficial when installing larger networks that require a low cost per unit. The pre-tested, pre-certified RYZ014A enables customers to quickly and
cost-effectively implement wireless IoT applications across the globe. The RYZ014A module solves customers’ design and certification issues
compared to building a wireless IoT solution from scratch. This includes RF regulatory certification, PTCRB/GCF certification and carrier certification
for the customer’s network operator of choice. The module is built on proven technology both from a hardware and software perspective and is
delivered fully tested and calibrated. It has been certified with all major radio frequency regulations in the world as well as with leading network
operators in North America, APAC and Europe. Cellular IoT is one of the pillars of Renesas’ connectivity strategy that also includes Bluetooth® Low
Energy, Ultra-wide band and Wi-SUN among others. Renesas is teaming up with Sequans Communications a leading developer and provider of 5G and
4G chips and modules for IoT, on the RYZ014A modules. Sequans offers the Monarch LTE CAT-M1 hardware and software technology used in the
module, and has extensive experience implementing wireless IoT worldwide.

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Magic Information Launches Turnkey Solution for Smart Locks Using
Technology from STMicroelectronics (Switzerland)
16
Magic Information China’s leading Artificial Intelligence of Things (AIoT) fingerprint-recognition technology provider has
launched a smart-lock reference design based on AIoT fingerprint recognition running on an STMicroelectronics STM32WB55*
Bluetooth® LE (BLE) microcontroller (MCU) that manufacturers can integrate into their designs to make Smart Locks. This
reference design leverages the dual-core (Arm® Cortex® M0+ and M4) advantages of the STM32WB55, designed with high
interoperability between the hosting MCU, fingerprint recognition, as well as Bluetooth LE 5.2. The Magic Information
fingerprint-recognition algorithm runs on the high-performance STM32WB55 MCU that also enables recognition and unlocks
the device in as fast as 0.3 seconds, while ensuring ultra-low power consumption. For the best user experience and cost
competitiveness, a variety of fingerprint sensors, sizes (including 80×64, 112×88, 176×64, and 160×160), and packaging methods
are currently available. The turnkey solution has been qualified with mass productions. At the same time, a very much improved
efficiency in product building/development can be expected, which can shorten the time-to-market within 20 weekdays.

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R & R Updates
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Agilent Technologies Inc. (USA) Announces Winners of HPLC for Potency
Testing Competition
17
Agilent Technologies Inc. announced the Agilent HPLC Testing for Potency Competition winners. The contest was established to promote awareness
of Agilent solutions and its commitment to support cannabis processors, cultivators, and commercial testing labs in the testing of cannabis and hemp.
The three grand prize winners each receive one-year free use of an Agilent 1260 Infinity II LC System for potency testing, as well as an Agilent potency
kit and standards. Six runners-up will receive a 50% discount on the future purchase of an Agilent HPLC for Potency system. The grand prize winners
are:
• Category: Cultivator.
• Category: Processor.
• Category: Testing Lab.
HPLC systems with ultraviolet (UV) detectors are the most commonly used equipment for potency testing in commercial cannabis and hemp
laboratories. The chromatography separates the mixture of cannabinoids in a sample, and then the amount of each cannabinoid is determined by shining
UV light on the separated compounds. Each cannabinoid absorbs UV light differently depending on its concentration. Measuring how much UV light
is absorbed determines the quantity of each cannabinoid within the sample.
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Konka Group (China) wins two awards at the 12th Tigers Awards
18
The 15th China Digital Business Communication Forum and the 12th Tigers Award Presentation Ceremony with the theme of "Connecting to the
Future" was held at the Shanghai Baohua Marriott Hotel. With the case of "Future Core Vision-Konka 2020 Chongqing Micro LED Industry Innovation
Forum Marketing Communication", Konka Group has achieved innovative breakthroughs in digital marketing and won two outstanding awards in the
marketing case category-integrated marketing category and marketing case category-home appliance category excellence award. The Tiger Roar Award
is a national award that represents the highest level in the field of digital commercial communication under the guidance of the China Commercial
Advertising Association. It is committed to creating a large-scale competition in the field of digital commercial communication that integrates authority,
forward-looking and innovation. The Tigers Awards received a total of 3,500 case entries this year. Under the premise that the number of reported
companies and the number of case works have both increased this year, the Tigers Award also has higher requirements for the evaluation criteria of case
works, and finally 27.5% of the works Finalist. Being able to stand out among many entries is a high affirmation of Konka Group's continuous
enhancement of technological innovation capabilities and brand building achievements. This dissemination integrates a variety of creative content
forms and channels, and integrates core technology and trend style creativity to achieve the same frequency resonance between the brand, young users,
and popular culture.
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Konka Group (China) Refrigerator wins three awards at 2021 China
Refrigerator Industry Summit Forum
19
China Refrigerator Industry Summit Forum, under the guidance of China Household Electrical Appliances Association and hosted by the State Grid
Corporation of China, was held in Beijing with the theme of "Freshly Cultivated Ways and Prosperous". Many companies in the industry made their
debut. Konka Refrigerator was awarded the "2021 China Refrigerator Industry Ecological Original Fresh Leading Brand" for its outstanding brand
influence and preservation technology, and its 15-day ecological original fresh refrigerator BCD-590WD5EBVP won the "2021 China Refrigerator
Industry Outstanding Fresh Keeping Brand". "Strong High-end Product" Award; BCD-448WEGT4SP, a sterile clean fresh refrigerator, won the "2021
China Refrigerator Industry Outstanding Channel Performance Product" award. With the continuous evolution of consumer demand, users are paying
more and more attention to healthy diet and fresh ingredients. How to use excellent products and advanced technology to solve the needs of users is the
top priority of the technological development of the refrigerator industry. Konka refrigerators always adhere to the consumer demand as the center, and
technological innovation continues to satisfy users' ultimate pursuit of high-quality life experience. Facing the new market situation and new consumer
demand, accelerating product innovation and structural upgrading has become an important strategy for refrigerator companies in recent years. Among
them, high-end refrigerators with large-capacity and health functions as their selling points have received significant attention and become a bright spot
in the market.
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LONGi (China) earns top awards in PVEL’s PV Module Reliability
Scorecard and RETC’s PV Module Index Report
20
LONGi Solar has received awards for outstanding PV solar module performance from two independent testing labs, demonstrating consistent
quality of LONGi’s cutting-edge technology. PV Evolution Labs the leading independent test lab for the downstream solar industry, awarded
LONGi “2021 Top Performer” status in its PV Module Reliability Scorecard for the fifth consecutive year, since 2017 when LONGi began selling
modules in the U.S. The U.S. Renewable Energy Testing Center a leading engineering service and certification testing provider for PV and
renewable energy, named LONGi a “2021 High Achiever” in its PV Module Index Report for the third consecutive year. PVEL’s PV Module
Reliability Scorecard provides the industry with vital knowledge about long-term reliability and performance data. The Product Qualification
Program tests included in the 2021 publication are Thermal Cycling 600 cycles, Damp Heat 2000 hours, Mechanical Stress Sequence
(SML+DML+TC50+HF10), Potential-Induced Degradation (PID) 192 hours, LID+LETID and PAN Performance. LONGi was the only tier one
module manufacturer to receive Top Performer status in all six testing categories. RETC’s PV Module Index Report provides an overview of
relevant tests carried out by RETC, covering reliability, performance and quality indicators. The report includes CEC, PAN file and LID testing
data, as well as Thresher Test Performance Matrix and an overall results matrix. LONGi’s results received a boost from last year and it was the
only module manufacturer to receive top marks in all categories.
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TE Connectivity (Switzerland) Named Among Forbes Best Workplaces
for New Graduates
21
TE Connectivity, a global leader in connectivity and sensors has been named by Forbes magazine as one of the Best
Employers for New Graduates in the United States. The Forbes ranking was determined through a survey of 20,000
Americans with fewer than 10 years of experience working for businesses with at least 1,000 employees. Respondents
were asked to rate their companies on a variety of criteria, including workplace safety, compensation, opportunities for
advancement, diversity and inclusion initiatives and company image. TE's presence on the list doesn't come as a
surprise to the members of TEYP, an employee resource group for young professionals that boasts a network of more
than 2,300 people around the world. TE has committed to building a pipeline of new talent through internships, as well
as its rotational program, which offers new graduates exposure to a variety of careers and industries within the
company along with the support of experienced mentors.
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Analog Devices (USA) Recognized by General Motors as Winner of
Coveted Overdrive Award
22
Analog Devices, Inc. was recognized as a GM Overdrive Award winner in General Motors’ 29th annual Supplier of the Year
awards. Analog Devices was one of only 26 companies to be selected as an Overdrive winner in 2020. First presented in 2012,
GM’s Overdrive Award is a distinction reserved for suppliers who display outstanding achievement within GM’s Global
Purchasing and Supply Chain organization’s key focus areas, including sustainable value streams, total enterprise cost and
profitability, safety, launch excellence, accelerating innovation and nurturing relationships. As part of the annual awards, GM also
recognized 122 companies as a Supplier of the Year for consistently exceeding GM’s expectations, providing customers with
innovative technologies and among the highest quality in the automotive industry. The recognition is for supplier performance in
the 2020 calendar year. The 2020 Supplier of the Year and Overdrive Award winners were selected by a global team of GM
purchasing, engineering, quality, and manufacturing and logistics leaders. Winners were chosen based on performance criteria in
Product Purchasing, Global Purchasing and Manufacturing Services, Customer Care and Aftersales, and Logistics.
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Google Selects 3rd Gen AMD (USA) EPYC™ Processors to Launch First
Tau VM Instance
23
AMD and Google Cloud announced T2D; the first instance in the new family of Tau Virtual Machines (VMs) powered by 3rd Gen AMD
EPYC™ processors. According to Google Cloud, the T2D instance offers 56% higher absolute performance and more than 40% higher
price performance for scale-out workloads1. The Tau VM family provides customers with a leading combination of performance, price,
and easy integration. The T2D instances, using the leadership performance of 3rd Gen AMD EPYC processors, excels at workloads
including web servers, containerized microservices, data logging-processing, large scale Java® applications and more. The
industry-leading2 3rd Gen AMD EPYC processors allow Google Cloud customers to seamlessly integrate workloads with their existing
x86 ecosystems, enabling applications and frameworks to work with the T2D instances. The new instances are offered in eight different
predefined VM shapes, with up to 60 vCPUs per VM, and up to 4GB of memory per vCPU, making this technology ideal for scale-out
workloads. AMD EPYC processors power numerous instances at Google Cloud that support workloads including compute optimized,
general purpose, high-performance and confidential computing. These instances are used by well-known cloud-native companies,
spanning multiple industries, providing high-performance cloud instances for their workloads.
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AMD (USA) and Mercedes-AMG Petronas Esports Team Partner to Power
High-Octane Gameplay for a Competitive Edge
24
AMD and the Mercedes-AMG Petronas Esports Team, the esports arm of the Mercedes-AMG Petronas Formula One Team, announced a new
partnership to empower the team with championship-level computing technologies and performance for competitive virtual racing. Through the
partnership, AMD has equipped the Mercedes-AMG Petronas Esports Team with the powerful combination of AMD Radeon™ RX 6900 XT Graphics
Cards, built upon the groundbreaking AMD RDNA™ 2 gaming architecture, best-in-class AMD Ryzen™ 7 5800X Desktop Processors1, powered by
the fastest cores for PC gamers with “Zen 3” core architecture2, and advanced Radeon™ Software to enable the highest framerates and
ultra-low-latency gameplay. Optimized for esports gaming, AMD hardware and software technologies will provide the Mercedes-AMG Petronas
Esports Team drivers with ultra-fast click to response times, the smoothest driving experience, and an unmatched competitive edge for virtual racing.
With AMD at the heart of the team’s gaming rigs, AMD Smart Access Memory, AMD Radeon Anti-Lag, AMD FidelityFX Contrast Adaptive
Sharpening (CAS), and Ryzen technologies further optimize competitive esports gaming by maximizing performance and delivering an incredibly
smooth and responsive gaming experience. AMD will also contribute gaming systems to a new Mercedes-AMG Petronas Esports Training Facility,
expected to be launched later in 2021, in Brackley, UK. This world-class esports training facility will provide state-of-the-art AMD-powered gaming
equipment to help esports athletes elevate their game to new levels and support the next generation of up-and-coming esports drivers.
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Analog Devices (USA) and Keysight Collaborate to Speed Development of
O-RAN Solutions
25
Analog Devices, Inc. and Keysight Technologies, Inc. announced a collaboration that accelerates network interoperability and compliance
testing for Open RAN radio units (O-RUs). The companies are collaborating to create a robust test bench to verify the interoperability of a
new O-RU that includes ADI’s low-PHY baseband, software defined transceiver, power, and clock integrated with an Intel© FPGA. Applying
Keysight’s Open RAN emulation, signal generation and signal analysis capabilities to a wide range of use cases improves the testing process,
reducing complexity and testing time. Open RAN technology is expected to account for more than 10 percent of the overall radio access
network market by 2025, according to the Dell-Oro Group. The ADI and Keysight collaboration addresses commercial opportunities in this
industry that is transitioning towards open, disaggregated and virtualized RAN (vRAN) architectures. An Open RAN infrastructure, based on
O-RAN ALLIANCE open interfaces, enables mobile operators to create a robust multi-vendor network environment designed to streamline
the delivery of advanced 5G services for enterprises in manufacturing, financing, transportation, logistics and healthcare. Performance
validation of O-RUs and interoperability testing between network elements from the edge of the RAN to the 5G core (5GC) allows mobile
operators to effectively deploy O-RAN in multi-vendor 5G networks.
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ASML (Netherlands) partners with Jheronimus Academy of Data Science
26
ASML and Jheronimus Academy of Data Science (JADS), based in’s-Hertogenbosch, the Netherlands, have joined forces
to collaborate in the field of data science. This collaboration brings together academic knowledge, world-class research,
international talent and challenging industrial applications. The partnership will initially focus on thesis assignments from
JADS students at ASML and a case study within JADS’ Data Entrepreneurship in Action (DEIA) program. Data science
is increasingly important for the semiconductor industry as a whole and for ASML technology in particular. ASML’s Big
Data Analytics Innovation Lab, which collects and analyzes large volumes of corporate and machine data, initiated the
partnership with JADS. The collaboration will kick off with a JADS student who will start their thesis assignment at
ASML in September. But there are already plenty of ideas for further collaboration, such as developing tailored
professional education programs, participating in career events and supporting startups.
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ASML (Netherlands) and Muziekgebouw Eindhoven launch Spotlight
27
ASML and Muziekgebouw Eindhoven believe the stage is for everyone. The partners are pleased to announce the launch of Spotlight.
Spotlight invites people from the Brainport region in the Netherlands to take to the stage and claim their moment in the spotlight.
Participants can sign up to ‘Feel like an artist’ where they will have the full artist experience – from being invited backstage to a
private green room, to performing on the Muziekgebouw stage with full light and sound production. Participants can also invite their
family and friends to watch them perform. And to make sure the experience is truly unforgettable; performances can be made
available as a recording for the participant to keep. Participants can also sign up for an ‘Unforgettable class’, where anyone can apply
to receive a lesson as a group or individual from a top performer, right on the stage where the magic happens. Whatever the interest,
from trombone to rap, the Unforgettable class offers something for everyone. Spotlight is open to anyone in the Brainport region, but
places are strictly limited and based on the availability of the Muziekgebouw. People who register their interest will be contacted by
the Spotlight team, and those selected to participate will receive further information in due course.
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Hikvision (China) announces Hik-ProConnect integration with Sentinel Software
28
Hikvision, an IoT solution provider with video as its core competency, announced its collaboration with Monitor Computer Systems,
Ltd. to integrate its Hik-ProConnect framework with Sentinel Software. The combination provides a convenient way for alarm
receiving centers (ARCs) and systems integrators to install and operate Hikvision security devices in Sentinel systems. With the
integration, ARCs and systems integrators can easily connect, view and control Hikvision cameras, NVRs and alarm panels in
Sentinel via the cloud-based Hik-ProConnect. Multiple functions, such as live view, playback, and event notifications can be directly
managed in Sentinel as well. The integration instantly provides a broad support for all Hik-Connect-compatible products in Sentinel,
and ARCs and systems integrators can be confident about compatibility with both current and future Hikvision products in Sentinel.
Building on the secure architecture of the Hik-ProConnect and Hik-Connect, ARCs and systems integrators will avoid cumbersome
network setup, such as complex configuration or creating VPN tunnels; they will also avoid exposing customer networks to
unnecessary security risks, as the video and data traffic is initiated from the inside.
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Foxconn (Taiwan) and Gogoro Announce Strategic Partnership to Accelerate
Expansion of Gogoro’s Battery Swapping System and Smartscooters
29
Foxconn®, the world’s largest electronics manufacturer, and Gogoro®, a technology leader that is accelerating the shift to sustainable urban mobility, announced
they had signed a Memorandum of Understanding (MOU) to form a strategic technology and manufacturing partnership. Together, the companies will accelerate
Gogoro’s global expansion by utilizing Foxconn’s world-leading manufacturing capabilities to introduce new levels of manufacturing capabilities and scale for
Gogoro battery swapping technologies and Smartscooters. The announcement follows Gogoro’s recent market announcements in India and China and growing
interest for its battery swapping ecosystem around the world. Foxconn and Gogoro will begin collaborating on multiple projects including smart batteries, vehicle
engineering and manufacturing. By integrating Foxconn’s strong manufacturing, global capabilities and top quality, Gogoro will focus on its own product design,
technology development, and marketing and branding, expanded distribution and customer service channels. Key to Foxconn’s vision for the future, is its 3+3
strategic initiative that focuses on three emerging industries and three major core technologies that include investments in electric vehicles, digital health, and
robotics industries as well artificial intelligence, semiconductors and next-generation communication technologies, forming its key “3+3” (industry and
technology) strategy. With this announcement, Foxconn is expanding beyond four wheels to include Gogoro’s two-wheel Smartscooter vehicles as well as its
battery swapping technologies. In the electric cars industry, Foxconn is assertively promoting the MIH Alliance by teaming up over 1,600 software and hardware
partners. Foxconn also uses the global layout in ICT (Information and Communication Technology) to integrate the advantage of manufacturing ability and
quickness to become the major partner for international automobile brands.
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Infineon (Germany) and pmdtechnologies partner with ArcSoft for under-display
Time-of-Flight turnkey solution
30
The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on
quality or performance. Infineon Technologies AG together with its Time-of-Flight (ToF) partner pmdtechnologies and the leading vision-based imaging
specialist ArcSoft is developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones. It will provide reliable
high-quality infrared images and 3D data for security-related applications like face authentication and mobile payment. The market for ToF solutions in
smartphones is estimated to reach above 600 million sensor units in 2025 with a CAGR of around 32 percent from 2021 onward*. The new under-display
solution will be available in the third quarter of 2021 and will be introduced during the MWC 2021 conference from June 28 to July 1. The combination of
high-end semiconductor technology, ToF expertise, and high-end algorithms of the three companies, will enable an easy design-in, turnkey solution for
OEMs to offer its customers their favorite user facing applications in a modern smartphone design with a notch-less display. User facing ToF cameras are
mostly used for face authentication and for photo enhancements. Infineon and pmdtechnologies are providing the most advanced and secure 3D ToF sensor
solution for facial ID on several smartphone models. The latest facial ID solution, which will incorporate ArcSoft’s under-display camera package, allows
overcoming display effects while reaching highest performance for secure face ID and image quality. The grey value and depth data quality of under-display
images are as good as those obtained with traditional over-display concepts for critical applications like secure face ID.
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Murata (Japan) and Cooler Master announce partnership to jointly develop 200 μ
m vapor chamber, the world’s thinnest heat dissipator for electronic devices
31
Murata Manufacturing Co., Ltd. and Cooler Master Co., Ltd. have jointly developed a 200 μm vapor chamber, the world’s thinnest heat dissipator for electronic
devices. This is the first product to result from the joint development partnership between Murata, which brings expertise in designing compact electronic
components, and Cooler Master, a leader in heat dissipators for electronic devices. Both companies are committed to strengthening their partnership moving
forward as they work to create new products that solve heat-related problems affecting next-generation devices. As electronic devices achieve higher performance
and more advanced functionality, the amount of heat generated per device is increasing, making efficient heat dispersion and dissipation, as well as cooling, a key
issue. In addition, the limited available space inside the product case of high-density designs means that conventional heat dispersion components such as graphite
sheets and heat pipes cannot provide sufficient heat dissipation. This has created a need for vapor chambers, which can disperse heat over a large surface area and
dissipate heat effectively in spite of limited space. The space available for heat dissipators is particularly limited in mobile products with advanced functionality,
such as 5G smartphones and AR and VR devices, as they utilize high-performance ICs and face constant demand for reduced weight. Using Murata’s technology
and expertise in electronic components, mainly for communication applications, the new product was designed to be the world’s thinnest vapor chamber at only
200 μm thick. It can be mounted in very small interior spaces yet provides efficient dispersion and dissipation of heat from components such as ICs, thereby
improving the operating stability of compact electronic devices. The 200 μm vapor chamber will be manufactured at Cooler Master’s factory, benefiting from their
extensive expertise in producing heat dissipators for a variety of electronic devices, and will be widely marketed as a product bearing the Cooler Master brand.
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NVIDIA (USA) and Google Cloud to Create Industry’s First AI-on-5G Lab to
Speed Development of AI Everywhere
32
NVIDIA announced that it is partnering with Google Cloud to establish the industry’s first AI-on-5G Innovation Lab, enabling network
infrastructure players and AI software partners to develop, test and adopt solutions that will help accelerate the creation of smart cities, smart
factories and other advanced 5G and AI applications. The lab will provide enterprises with access to Google Cloud’s Anthos platform and
NVIDIA accelerated computing hardware and software platforms that let them harness data and AI to drive business performance, improve
operational efficiency and optimize safety and reliability. The companies will begin development in the second half of the year. NVIDIA
announced in April it is teaming with Google Cloud, Fujitsu, Mavenir, Radisys and Wind River to develop solutions for NVIDIA’s AI-on-5G
platform. Google Cloud is extending the Anthos application platform to the network edge, allowing telecommunications service providers and
enterprises to rapidly deliver new services and applications at the 5G edge. Anthos supports NVIDIA GPU-accelerated servers, enabling a
consistent deployment and operational experience across deployments, while reducing expensive overhead and improving developer
productivity. The platform also protects applications and software supply chains and provides an outcome-focused approach to managing
policies for applications across environments — a critical feature for network operators and enterprises delivering AI on 5G.
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NVIDIA (USA) Partners Unveil New Servers Featuring NVIDIA BlueField
DPUs
33
Several of the world’s top server manufacturers at COMPUTEX 2021 announced new systems powered by NVIDIA BlueField-2 data processing
units. While systems with NVIDIA GPUs are already available now with the option of adding BlueField-2 DPUs, many applications and customer
use cases may not require a GPU but can still benefit from a DPU. The new servers from ASUS, Dell Technologies, GIGABYTE, QCT and
Supermicro are ideal for enterprises seeking the additional performance, security and manageability that NVIDIA BlueField-2 DPUs offer. Servers
that primarily run software-defined networking (for example, a stateful load balancer or distributed firewall), software-defined storage or
traditional enterprise applications will all benefit from the DPU’s ability to accelerate, offload and isolate infrastructure workloads for networking,
security and storage. Systems running VMware vSphere, Windows or hyperconverged infrastructure solutions also benefit from including a DPU,
whether running AI and machine learning applications, graphics-intensive workloads or traditional business applications. NVIDIA BlueField
DPUs shift infrastructure tasks from the CPU to the DPU, making more server CPU cores available to run applications, which increases server and
data center efficiency. The DPU places a “computer in front of the computer” for each server; delivering separate, secure infrastructure
provisioning that is isolated from the server’s application domain. This allows agentless workload isolation, security isolation, storage
virtualization, remote management and telemetry on both virtualized and bare-metal servers.
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NXP (Netherlands) and Jio Platforms Collaborate to Enable Expanded 5G
Use Cases in India
34
NXP Semiconductors N.V. and Jio Platforms Ltd. (JPL) a subsidiary of RIL announced a collaboration to implement a 5G NR O-RAN small cell
solution that incorporates NXP’s Layerscape® family of multicore processors. The combined solution will power new RAN networks that will
deliver high performance, enabling a wide range of 5G use cases for broadband access as well as Industry 4.0 and IoT applications, including
tele-medicine, tele-education, augmented/virtual reality, drone-based agricultural monitoring and more. Jio Platforms Ltd. (JPL) is a leading
technology company that delivers innovative 4G and 5G solutions and is the holding company of Jio, the largest mobile network operator in India
and the third largest mobile network operator in the world. The company consistently leverages innovative technology solutions to serve its vast
customer base and is moving rapidly to address 5G opportunities in India. JPL has leveraged the high performance and flexibility of NXP’s
Layerscape processors in its new 5G NR solutions. The combination enables a powerful offering that has successfully tested at 100 MHz channel
bandwidth in 3.5 GHz spectrum with peak data rates of 1 Gbps+. This translates to increased performance for a wide range of segments, enabling
innovative applications in smart cities; smart homes, health and education, and significantly enhanced user experience in data download rates for
all mobile users. As a result, JPL’s 5G NR radio solutions are well suited for next generation RAN networks, providing increased indoor and
outdoor performance and enabling a wide range of 5G use cases.
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Qualcomm (USA) and Capgemini Announce Plan to Collaborate to Boost 5G
Private Network Implementations for Industries
35
Qualcomm Technologies, Inc., a global leader in 5G, wireless communications and computer and Capgemini, have announced their plan
to collaborate to unlock the benefits of 5G private networks to support their clients’ digital transformation towards Intelligent Industry.
This collaboration is intended to give clients access to an off-the-shelf private network system which is fully tested and validated.
Working with Qualcomm Technologies, Capgemini is expected to provide quicker, easier access to the benefits of private networks in
industrial and enterprise settings, including for the digital enterprise, smart warehouses, and industrial IoT. This collaboration foresees
Capgemini in the role of systems integrator, utilizing Qualcomm Technologies’ 5G Private network system to enable clients’ business
transformation and expand the benefits of 5G. Capgemini expects to support clients with their enterprise systems, edge compute
capabilities, use cases, cloud and data/AI, interface with management systems and other bespoke elements to create end-to-end solutions
that leverage powerful and efficient 5G private networks at scale. This collaboration between the two organizations builds further on an
already successful working relationship. It is intended to provide organizations with increased end to end carrier grade interoperability in
a wireless 5G industry ecosystem environment of connected devices, connected equipment and 5G Private Network infrastructure.
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Jacobs, Peachtree Corners, and Qualcomm (USA) Collaborate to Deploy Cellular
Vehicle-to-Everything Technology in Georgia Smart City
36
Jacobs, Peachtree Corners and Qualcomm Technologies, Inc. announced joint efforts to deploy end-to-end smart solutions in one of the nation’s first
smart city environments powered by real-world connected vehicle technology and infrastructure. As a part of the working relationship, Qualcomm
Technologies serves as ecosystem enabler by providing technology solutions, while Jacobs manages the installation commission project delivery. The
program aims to demonstrate the continued momentum of smart cities and spaces, with Peachtree Corners serving as a model for other municipalities
as they look to deploy smart solutions and programs. Peachtree Corners is home to one of the nation’s most advanced smart city ecosystems, with smart
connected technologies actively being developed and deployed in real-world conditions. Its Curiosity Lab is home to technology developers and
companies enabling the future, while smart connected solutions are being deployed across the community, bringing the region to the forefront in the
development of next-generation, Internet of Things (IoT) technologies. Jacobs, Peachtree Corners and Qualcomm Technologies are working together
to deploy the company’s technology solutions, focusing initially on roadside infrastructure, traffic management and road safety, with the
implementation of Cellular Vehicle-to-Everything (C-V2X) technology. As a part of the program, the city will work with Commsignia to feature
roadside units (RSUs) equipped with Qualcomm Technologies’ C-V2X solution. Utility vehicles equipped with Qualcomm Technologies’ C-V2X
solutions will also be utilized to demonstrate vehicle-to-infrastructure (V2I) direct communications.
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STMicroelectronics (Switzerland) and Feig Electronic Collaborate on Contactless
Product Personalization for Fast, Flexible, Cost-Efficient Logistics
37
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, and Feig Electronic, a leading
RFID-reader and antenna specialist, have combined their RFID know-how in a time-saving logistics solution that can help cut numerous costs and
enhance flexibility for vendors of high-tech products such as smart industrial, consumer, and medical devices. Together the Companies have created a
production-ready contactless system capable of personalizing palletized items containing ST’s ST25DV NFC dynamic tags in just a few seconds,
eliminating the need to power-up or even remove the products from their packaging. With this system, end users can eliminate the costs associated with
inline programming and leverage contactless NFC technology to enjoy efficient, economical, and flexible stock-management and logistics. A typical
application configures setup parameters such as manufacturer ID, serial number, and default language in new products before they are shipped.
Historically a laborious and time-consuming process that requires connecting each unit to a programmer, basic setting up can now take place at any
convenient point in the supply chain using this new contactless solution. The innovative solution extends the readable range for contactless NFC
interactions beyond the typical distance of only a few centimeters, to create a 1m x 1m x 1m readable space. By connecting the Feig ID LR2500
long-range reader/writer to two pairs of long-range antennas positioned on either side of the reading area, the Feig system can simultaneously program
batches of products containing the ST25DV dynamic NFC tags placed in the reading area.
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STMicroelectronics (Switzerland) Collaborates with Eyeris on Integration of
Global-Shutter Sensor Solution for Automotive In-Cabin Monitoring
38
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, announced scooperation
with Eyeris, a world leader in vision-based Artificial Intelligence (AI) software and in-cabin sensor fusion technologies. The collaboration focuses
on extending ST’s Global-Shutter sensor to in-cabin sensing applications with Eyeris’ advanced portfolio of Deep Neural Networks for a
comprehensive visuospatial understanding of the entire vehicle interior. This advanced perception supports safety and convenience features
including Driver Monitoring Systems (DMS), Occupant Monitoring Systems (OMS), child presence detection, object recognition, gesture control,
and activity prediction. ST’s 2.3 Megapixel VG5761 Global-Shutter sensor features high linear dynamic range of up to 98 dB for sharp, crisp
images. The sensor can capture images inside a vehicle under all lighting and environmental conditions. Combined with Eyeris’ in-cabin sensing
technology, the sensor can be used for Eyeris’DMS with accurate eye-gaze tracking, especially from non-frontal camera locations such as rearview
mirror, overhead console, and center stack areas. In parallel, the sensor also enables Eyeris’ OMS with accurate tracking of body key-points,
height, width, size, posture, movements, and orientation. Furthermore, the ST sensor enables Eyeris for accurate child presence detection, and
recognition of common vehicle interior objects under the widest range of lighting conditions. The technological integration from ST and Eyeris
delivers substantial in-cabin safety, comfort, and convenience benefits for all occupants.
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Orange, Sierra Wireless, LACROIX, and STMicroelectronics (Switzerland) join forces and launch
IoT Continuum to scale up and accelerate the digital transformation of industrial markets
39
Orange, Sierra Wireless, LACROIX, and STMicroelectronics announced the creation of the IoT Continuum – a partnership that aims to simplify and accelerate the mass
deployment of IoT in Europe and beyond. By bringing together for the first time expertise across the entire IoT industry (Connectivity, Hardware, Software, Design and
Manufacturing) under one roof, partners of the IoT Continuum will support international businesses to accelerate the deployment and industrialization of Massive IoT
over LTE (including Cat M and Cat 1) and 5G. A three-step process (“start, prove, deploy and scale”) has been put in place by the partners to support businesses’ IoT
projects on cellular networks, from ideation to industrialization, without having to liaise with multiple players on the market. IoT Continuum offers a combination of
leading industry players who will improve project risk management for businesses. Customers will be able to join the process at any stage, according to their needs. As
part of these processes, the partners will:
• Provide any business and their vertical of choice a set of components and solutions validated on the Orange network, and the necessary industrial tools to deploy
wide-scale IoT services on cellular networks
• Reduce the complexity, development time and cost for businesses to realize IoT use cases by providing already pre-integrated building blocks including hardware and
software (STMicroelectronics, Sierra Wireless), connectivity and IoT Services (Orange), design and manufacturing (LACROIX)
This will also enable new business models to accelerate the digital transformation of international industries and unleash the potential of IoT technology in areas of
critical growth, including Smart Buildings, Automotive, Health, Smart Cities and Smart Industries.
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STMicroelectronics (Switzerland) and Politecnico di Milano Announce Agreement
on Research Center for Advanced Sensors
40
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, and Politecnico di Milano, a
scientific-technological university, which trains engineers, architects and industrial designers, announced a five-year collaboration agreement in the presence of
Italy’s Minister of Economic Development Giancarlo Giorgetti. At the heart of the agreement is the establishment of a joint research center on advanced materials
for sensors (STEAM), leveraging the long-standing collaboration between ST and Politecnico. The joint research center has been created to give professors,
researchers, and PhDs a unique opportunity in Italy, namely all the means to conceive, design and develop MEMS technology and to create new MEMS products.
The agreement will allow the Politecnico di Milano to become even more attractive for talented academics, offering multiple doctoral scholarships and positions
for professors and researchers in four areas of common interest and in the related materials sector. The expansion of the existing collaboration will allow the further
development of the center of excellence dedicated to cutting-edge sensors in Lombardy. ST is a world leader in MEMS and advanced sensors, with over 15 billion
MEMS sold to date. The core of its global MEMS R&D operations is in Lombardy, close to Milan. The agreement will also contribute to fuel ST’s research and
development roadmap in advanced sensors, MEMS and analog as the teams investigate, develop an understanding of, and develop technologies and skills to future
business needs in areas including advanced MEMS, motion control, power electronics, and galvanic isolation. The agreement also provides for an infrastructure
upgrade for the Politecnico di Milano, starting with the construction of a state-of-the-art 200mm pilot line in addition to the current 150mm line of the PoliFab
clean room. Dedicated to the development of new MEMS technologies, the new pilot line will be used to support research projects, training, and thesis elaboration.
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STMicroelectronics (Switzerland) and Metalenz Partner to Transform Optical
Sensing for Consumer, Automotive, and Industrial Applications
41
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, and Metalenz Inc.,
the pioneer in meta-surface design and commercialization, announced a co-development and license agreement that will see ST develop
manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and
automotive applications. Metalenz is a spin-out of the group of Federico Capasso at Harvard University, where the technology was
invented. This breakthrough technology is expected to be ready for mass production by the end of this year. Metalenz’s multifunctional
meta-surface optics enable new forms of sensing for the next generation of smartphones and other consumer devices, as well as healthcare
and automotive applications. For example a camera built around this new flat-lens technology can collect more light for brighter images
and produce images of the same or better quality than traditional refractive lenses while consuming less power and taking up less space.
ST will integrate Metalenz’s meta-surface optics technology into ST’s existing diffractive optics manufacturing process at its 300mm
wafer fab in Crolles, France, leveraging ST’s position at the forefront of the fast-growing Near-Infrared (NIR) optical sensing market. ST
leads the market for time-of-flight (ToF) proximity and distance sensors with over 1 billion devices shipped to customers.
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China Mobile and ZTE (China) complete first VC-OTN upgrade and
cross-vendor interoperability
42
ZTE Corporation a major international provider of telecommunications, enterprise and consumer technology solutions for the mobile
internet, together with the Zhejiang Branch of China Mobile, has completed the upgrade of the Virtual Container-Optical Transport
Network (VC-OTN) in China Mobile's existing networks in Wenzhou and Taizhou of Zhejiang province, China. Also, they have achieved
the cross-vendor interoperability of enterprise services, accelerating the construction of all-optical networks and intelligent MAN of
China Mobile in Zhejiang. This is the first time for China Mobile to implement the upgrade and the cross-vendor and cross-regional
VC-OTN. In the VC-OTN upgrade solution of China Mobile, ZTE interconnects its devices with those from other mainstream Chinese
vendors to verify the VC functions and test the interoperability based on the OTN platform. The VC-OTN upgrade and deployment in the
entire Zhejiang province, including the two cities of Wenzhou and Taizhou, enables efficient delivery of enterprise services. ZTE's CPE
OTN box devices, featuring small size, low power consumption, flexible installation, and automatic service provisioning, are deployed
on demand at the end access node in the existing networks to provide flexible service access of different rates.
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Toshiba (Singapore) and Japan Semiconductor Demonstrate Simultaneous Optimization of ESD
Tolerance and Power Efficiency for High Voltage LDMOS for Automotive Analog ICs
43
Toshiba Electronic Devices & Storage Corporation and Japan Semiconductor Corporation have together demonstrated a method for improving at
the same time both the reliability and the performance of high voltage Laterally Double Diffused MOS (LDMOS), core components of analog ICs
used in a wide range of automotive applications, such as motor control drivers. As the electrification of vehicles progresses, including wider
deployment of advanced driver assistance systems (ADAS), Toshiba and Japan Semiconductor will be able to offer improved LDMOS cell design
based on desired voltages. Details of the achievement were reported at the IEEE-sponsored International Symposium on Power Semiconductor
Devices and ICs 2021 (ISPSD 2021), held online. There has been a trade-off in LDMOS design between reliability and performance. It is known
that tolerance of electrostatic discharge (ESD), as measured using the human body model (HBM), is improved by increasing the backgate ratio to
suppress lateral parasitic bipolar action*2, which degrades HBM tolerance. However, increasing the backgate ratio also increases on-resistance,
which degrades performance. Until now, LDMOS designers have had to balance HBM tolerance against higher on-resistance. Toshiba and Japan
Semiconductor evaluated HBM tolerance in LDMOS and found no increase at above 80V, even if the backgate ratio was increased. In a 2D TCAD
simulation, they found that this is due to the appearance of vertical parasitic bipolar action alongside lateral parasitic bipolar action, a phenomenon
that will give designers greater freedom when setting parameters for HBM and the backgate ratio.
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Environment & Social Updates
Technology Industry

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NEC (Japan) India commits INR 10 crores towards COVID-19 relief initiatives
44
Manifesting its purpose to 'Orchestrate a brighter world', NEC Corporation India a wholly-owned subsidiary of NEC Corporation, has stepped up
efforts towards COVID-19 relief initiatives in India. The organization is channeling INR 10 crores to support employee well-being and community
welfare in the fight against the pandemic. Guided by the ‘NEC Way’, NEC has always placed high priority on social values such as safety, security,
fairness, and efficiency to promote a more sustainable world. The initiatives reaffirm the brand’s promise to enable a better future for all. The NEC
India COVID Task Force is supporting employees and their families across India by providing real-time details about hospitals, ICU beds, plasma
donors, and access to medication and 24/7 online medical consultation. NEC India is also providing timely updates of patients, procurement/
circulation of oxygen concentrators and five days of wellness leave for its employees. To further protect employees, the organization is providing
an enhanced medical insurance policy - one of the best in the industry - that covers COVID-19. In addition, the company has pledged to undertake
CSR initiatives to aid COVID relief efforts in the country. This includes donation of oxygen generating plants in rural hospitals; contribution of
100 oxygen concentrators to the needy; sponsoring ICU beds in rural hospitals, and efforts to start crematorium to handle the unexpected COVID
pressure. NEC is committed to support other local communities and augment medical infrastructure in different states.
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Nanya Technology (Taiwan) Donates Rapid COVID-19 Test Kits and Prevention
Kits to Support Frontline Medical Crews
45
Nanya Technology announces the donation of 3,200 COVID screening rapid test kits and 2,000 prevention kits with antibacterial spray and face shield
to the New Taipei City Government to support frontline medical crews. The company has long invested in social engagement as an active participant
in giving back to society. To support the New Taipei City Government’s efforts on fighting pandemics, Nanya would donate 3,200 COVID screening
kits and 2,000 protection kits, which contains antibacterial spray and face shield to support the frontline medical crews. We hope to create a positive
influence and contribute to our efforts to the epidemic prevention for Taiwan. Maintaining a safe and healthy workplace is the top priority of the
company. To address the concerns on the COVID-19 pandemic, Nanya has strengthened its preventative measures since the outbreak. Nanya has
implemented staggering work shifts, office partition, and WFH alternatives. All employee travel and on-site visiting are restricted. Internal and external
communications are carried out through On-line Video or Voice meetings, with minimum attendees in conference rooms. All personnel entering
company premises are required to submit body temperature measurements and essential COVID prevention questionnaires. Cooperating with Chang
Gung Memorial Hospital medical crews, the company has set up a rapid COVID screening station within company premise. As of June 25th, 2,637
employees have been tested and no infection found. We will further serve for 1,200 subcontractors and 800 employees from neighboring companies.
We will continue to serve our employees and partners for rapid screening on demand to provide a safer and healthier working environment.
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