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TechShanghai2016 - 依靠DFM的可制造性分析软件解决PCB生产制造上的隐患
- 2. Agendag
Introduction to Zuken
Introduction to CR-8000
Overview and Demonstration of DFM Center
Summary and Next Steps
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.2
- 3. Zuken Corporate Profile
What We DoWhat We Do
ZUKENZUKEN
先进的电子产品的开发/设计/数据管理CAE 平台
针针对于:
PCB 系统的开发/设计/数据管理
IC 封装设计IC 封装设计
线束,流体,控制系统的开发/设计/数据管理
元器件库/设计数据的综合管理元器件库/设计数据的综合管理
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.3
- 4. Zuken Corporate Profile
SummarySummary
1976成立 1976
$231,500,427*
成立
2013营收
Yokohama, Japan
Munich Germany
总部
欧洲总部 Munich, Germany
Westford, Massachusetts
欧洲总部
北美总部
Tokyo Stock Exchange Level‐1
1 191
上市
员工数 1,191
Profitable, no debt
员工数
财务状况
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.44
* using the original currency and the average exchange rate for the period.
- 5. Engineering Organizationg g g
• 全球5大研发部门
R&D Headquarters: Yokohama, Japan
SI and EMC R&D:Paderborn, Germany
R&D and Support:Ulm Germany
Engineering
Resources
R&D and Support:Ulm, Germany
R&D:Bristol, United Kingdom
R&D:San Jose, California, USA
40%
• 专业R&D研发工程师
Worldwide staffing:325
平均资历:12 years
• 售后及服务工程师
R&D
Investment
25%
Worldwide staffing:400
平均资历:11 years
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.5
• 每年25%的研发投入
5
- 6. 研发，销售，售后网络
More Than 30 Offices WorldwideMore Than 30 Offices Worldwide
Zuken USA Inc.
North American
Headquarters
Zuken Inc.
Worldwide
Headquarters
Zuken GmbH
European
Headquarters
Zuken SOZO Center
Headquarters
Zuken GmbH
European Headquarters
Zuken Inc.
Worldwide Headquarters
Zuken USA Inc.
North American Headquarters
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.6
Munich, Germany Yokohama, Japan Westford, Massachusetts
- 7. Zuken’s Vision
Requirements Management to Design RealizationRequirements Management to Design Realization
Topology and
Functional Planning Circuit Engineering Panel Layout
Requirements
Functional Planning Circuit Engineering Panel Layout
q
Management
e-PLM Library and Design Data Management
Platform
Standardization
System Planning Circuit Engineering PCB and Package
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.77
System Planning Circuit Engineering PCB and Package
Layout
- 13. Zuken’s DFM 方案Zuken s DFM 方案
nualCheck
OK！
Assign
omponent
putCircuit
M
lacement
portOutline
Wiring
lderResist
ADM
ADM
ADM
ADM
Man
Co
Inp
P
Imp
W
Sol
ADMADM SystemSystemADMADM SystemSystem
加工设备要求的检查项目 布线和测试点要求的检查项目基板布局布线要求的检查项目 丝印、阻焊、锡膏
要求的检查项目
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.
- 14. DFM的意义DFM的意义
降低 本 提高产 竞争力• 降低成本、提高产品竞争力
• 优化生产过程，提高生产效率优化生产过程，提高生产效率
• 利于技术转移，加强公司协作
• 新产品开发及测试的基础
• 适合电子组装工艺新技术• 适合电子组装工艺新技术
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.
- 15. DFM Check rulesDFM Check rules
O• Board Outline and Hole
• Antenna Wiring
S N t Cl• Same Net Clearance
• Pad on Via
• Clearance between Non Plated Through Hole and Copper• Clearance between Non Plated Through Hole and Copper
Foil
• Line Neck Down
• Build-up Via
• Exposing Copper Foil
• Resist Opening Rule
• Resist Clearance
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.
- 19. 大面积净空区的处理大面积净空区的处理
在PCB板的天线净空区 往往没有任何走线以及铜箔 如果是这个区域超过5 *5 的大小 那么在• 在PCB板的天线净空区，往往没有任何走线以及铜箔，如果是这个区域超过5mm*5mm的大小，那么在
PCB制板过程中可能会有气泡产生，这个气泡在STM高温的时候会使板子内层鼓包或者其他隐患产生。
处理方法可以放置一些小方块的孤铜或者在板子上钻一些过孔。
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- 20. Introduction to CR-8000
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28
- 21. 最新一代最新 代
© ZukenZuken proprietary information, forwarding beyond the intended recipient(s) is not permitted.
Design Products ‐ not just PCBs
- 22. Zuken Solution
CR 8000 Multi board System level DesignCR-8000 Multi-board System-level Design
System Planner Design Gateway
DESIGNPLAN
完整的系统
级平台级平台
IMPLEMENTMANUFACTURE
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Design ForceDFM Center
- 23. DFM Center
通用性平台通用性平台
针对PCB板实施全面的可制造性分析，进而改善产品品质及设计效率
Rigid Board
(One Side/Both Sides)Rigid Board
(Multi Layer)
Ri id B d
HIC
SiPRigid Board
(Buildup)
SiP
FPC
(One Side/Both Sides)
Ceramic
Package
Data import
and check
Manufacturing
design
optimization
Tool Design Check
Output draws
for
each process g
OrganicFPC
(M lti L )
optimization
Organic
Package(Multi Layer) COF Rigid FPC
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- 24. DFM Center
高度客户化定制功能高度客户化定制功能
配备客户化定制功能，检查硬板、柔性板和高级封装设计
ACF 设计
Overcoat 设计
h i /fl ibilit
柔性板包括特殊板
(HIC, etc.)
硬板高级封装
Die 数据设计
Registry Guide design
Coverlay design
屏蔽设计
印刷电阻设计
hygroscopic/flexibility
Correction by Dry-film Elasticity
钻孔误差
线宽修正
刀具槽误差
加强板设计
印刷电阻设计
WB 盘设计
Metal Bridge design
Frame 设计
线宽修正
V Cut 误差
测试数据生成
丝印误差
阻抗匹配
Metal Bridge design
间距修正
Plated Lead/Tie Bar design
Chip-Up 功能
Silver Through design
高精度
Tolerance Correction in Each Area
外观检查设备数据生成
导体工具数据生成
Length Measurement
Drawing design
间距修正
Build-in 器件支持
Carbon design
g g
UL 标准支持
Measure for
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阻焊设计
单元设计
Measure for
Environmental problem
Lead-free support Halogen-free support
Warp support
32
- 25. Zuken Solution
DS 2 Library and Work in Progress Data ManagementDS-2 Library and Work-in-Progress Data Management
第三方PDM / PLM 系统
ZUKEN公司的管理平台可以无缝在线管理
PCB,封装,线束的整个设计制造流程PCB,封装,线束的整个设计制造流程
实时在线的物料管理 实时在线的BOM管理 实时在线的数据管理
实时在线的
元器件管理
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WIP
Workflow and Process Support
