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第5代
Intel® Core™ 處理器系列
*Other names and brands may be claimed as the property of others
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
2
Agenda
•低功耗Core 處理器進化史
•第5代Intel® Core™ 處理器介紹
•全新Intel® Core™ M處理器
•結論
2014
This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
啟動行動運算的旅程…
低功耗 Intel® Core™ 處理器的演進
Westmere
32nm
2010
2011
2012
2013 2014/15
Sandy Bridge
32nm
Ivy Bridge
22nm
Haswell
22nm
Broadwell
14nm
18mm 7.6mm
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
4
第5代 Intel Core 處理器
Intel® Core™ i7-5600U Processor with Intel® HD Graphics 5500 compared to 4th Generation Intel® Core™ i7-4600U
with Intel® HD Graphics 44001
第4代 Intel® Core™ 處理器
9億6千萬個 電晶體, 131mm2
第5代 Intel® Core™ 處理器
13億個 電晶體, 82mm2
電晶體更多35% 晶片尺寸更小 37%
3D 遊戲
Up to 22% BETTER
影像轉檔
Up to 50% FASTER
生產力
Up to 4% BETTER
電池續航力
Up to 1.5Hr LONGER
Source:Intel.Productivity:SYSmark2014.3DGraphics:3DMark*IceStormUnlimitedv1.2.VideoConversion:
Cyberlink*MediaEspresso*toconvertHDvideos.BatteryLifebasedon40WHrbatterycapacitywatchinglocal1080p
movie.SoftwareandworkloadsusedinperformancetestsmayhavebeenoptimizedforperformanceonlyonIntel
microprocessors.Performancetests,suchasSYSmarkandMobileMark,aremeasuredusingspecificcomputersystems,
components,software,operationsandfunctions.Anychangetoanyofthosefactorsmaycausetheresultstovary.You
shouldconsultotherinformationandperformanceteststoassistyouinfullyevaluatingyourcontemplatedpurchases,
includingtheperformanceofthatproductwhencombinedwithotherproducts.Formoreinformationgoto
http://www.intel.com/performance
1Configuration detail in Appendix A
處理器命名規則
1 Processor line names are not official processor names and should not be used in ANY end-customer communication. Use official brand names for all end-customer communication
2Thermal Design Power(TDP) definition represents a near-worst case workload and thermal conditions for a Notebook-first experience
3 Scenario Design Power(SDP) is an additional thermal reference point that is meant to represent workloads for specific usages
*Signifies CPU SDP only
處理器系列1 封裝
散熱設計功耗2
(TDP)
第5代 Intel®
Core™
處理器
(“Broadwell”)
H-處理器 系列1 BGA 47W, 37W
M-處理器 系列1 PGA 57W, 47W, 37W
U-處理器 系列1 BGA 28W, 15W
Y-處理器 系列1 BGA 11.5W
第5代後 無M處理器系列
Intel® Core™ M 處理
器
5
HD 5300
HD 5500/6000
Iris
6100
HD 5600 Iris Pro 6200
顯示晶片
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
6
耗電量更低 提升續航力
更長效的電池續航力.
40 Wh battery.
Realtek* external audio DSP used on HSW
Broadwell integrated audio DSP used on BDW
(Watts) Windows 8.1* 閒置狀態螢幕開啟 Windows 8.1* 本機端 HD 影片播放
從9.1小時提升至10.1小時  60 分鐘 從 7.2 小時提升至 8.7 小時  90 分鐘
Configuration detail in Appendix A.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,
operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products.
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
7
2006 2007 2008 2009 2010 2011 2012 2013
Source: *Intel estimates. 3DMark06
Intel® 顯示晶片效能的提升
2nd Gen
Intel®
Core™
3rd Gen
Intel®
Core™
4th Gen
Intel®
Core™
~100X*
提升!!!
80x
70x
60x
50x
40x
30x
20x
10x
Baseline
5th Gen
Intel®
Core™
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
8
Intel® 顯示晶片
遊戲
駕馭主流遊戲,與前一代有 22% 提升3
創作
創作編輯影片與前一代相比有高達
50% 提升4
HD影片播放
觀賞 1080p 或 UltraHD1 影片,與前一
代相比還多 1.5 小時的電池續航力2
Intel® HD 顯示晶片 5500 & 6000; Intel® Iris™ 顯示晶片 6100
DirectX 11.2, DirectX 12 Ready, OpenGL 4.3, OpenCL 2.0
4K UltraHD (3840x2160) 解析度,1 無線顯示技術††
增強型媒體編碼支援 VP8, VP9, and HEVC
Intel® Quick Sync Video, Intel® Clear Video HD 技術, Intel Wireless Display
Configuration detail in Appendix A. Footnote detail in Appendix B
革命性的新顯示架構
提升效能與更低耗電
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,
operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products.
†† Requires a graphics driver update coming in January 2015
Other brands and names may be claimed as the property of others.
專為2 in1裝置、輕薄型筆電設計
與Haswell U1相比
第5代 Intel® Core™ 處理
器
U系列
1 Performance and power estimates based on BDW Y top bin projections not measured data vs. HSW Y @ 4.5W. CPU
performance based on Spec fp, Graphics performance based on 3DMark Fire Strike . Battery life projection based on local video
playback.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.
Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,
operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information
and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products. For more information go to http://www.intel.com/performance
10% 效能提升
24% 顯示效能提升
20% 電池續航力提升(1.7 小時)
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
10
Processor
Number
Cores/
Threads
Base
Freq
(GHz)
Intel Turbo Boost Technology 2.0
Graphics
Graphics
Base /
Max
Freq
(MHz)
LPDDR3
Memory
Speed
Support
(MHz)
DDR3L
Memory
Speed
Support
(MHz)
L3Cache
TDP
cTDP
Down
Tj
(deg)
Intel
SIPP
Intel Technologies
Package
TypeMax Single
Core Turbo
(GHz)
Max Dual
Core Turbo
(GHz)
Max Quad
Core Turbo
(GHz)
Intel
vPro
Intel
TXT
Intel
VT-d
Intel
VT-x
AES-NI
Intel Core™ i7 Processors (U-Processor Line)
i7-5650U 2/4 2.2 3.2 3.1 N/A
Intel® HD
Graphics
6000
300/1000 1866 1600 4MB 15W 9.5W 105 2015 √ √ √ √ √ BGA
i7-5600U 2/4 2.6 3.2 3.1 N/A
Intel® HD
Graphics
5500
300/950 1600 1600 4MB 15W 7.5W 105 2015 √ √ √ √ √ BGA
i7-5550U 2/4 2.0 3.0 2.9 N/A
Intel® HD
Graphics
6000
300/1000 1866 1600 4MB 15W 9.5W 105 √ √ √ BGA
i7-5500U 2/4 2.4 3.0 2.9 N/A
Intel® HD
Graphics
5500
300/950 1600 1600 4MB 15W 7.5W 105 √ √ √ BGA
Intel Core™ i5 Processors (U-Processor Line)
i5-5350U 2/4 1.8 2.9 2.7 N/A
Intel® HD
Graphics
6000
300/1000 1866 1600 3MB 15W 9.5W 105 2015 √ √ √ √ √ BGA
i5-5300U 2/4 2.3 2.9 2.7 N/A
Intel® HD
Graphics
5500
300/900 1600 1600 3MB 15W 7.5W 105 2015 √ √ √ √ √ BGA
i5-5250U 2/4 1.6 2.7 2.5 N/A
Intel® HD
Graphics
6000
300/950 1866 1600 3MB 15W 9.5W 105 √ √ √ BGA
i5-5200U 2/4 2.2 2.7 2.5 N/A
Intel® HD
Graphics
5500
300/900 1600 1600 3MB 15W 7.5W 105 √ √ √ BGA
Complete CPU spec information can be
found at http://ark.intel.com
第5代Intel® Core™ 處理器系列 – 15W
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
11
Processor
Number
Cores/
Threads
Base
Freq
(GHz)
Intel Turbo Boost Technology
2.0
Graphics
Graphics
Base /
Max
Freq
(MHz)
LPDDR3
Memory
Speed
Support
(MHz)
DDR3L
Memory
Speed
Support
(MHz)
L3Cache
TDP
cTDP
Down
Tj
(deg)
Intel
SBA
Intel Technologies
Package
TypeMax Single
Core Turbo
(GHz)
Max Dual
Core Turbo
(GHz)
Max Quad
Core Turbo
(GHz)
Intel
vPro
Intel
TXT
Intel
VT-d
Intel
VT-x
AES-NI
Intel® Core™ i3 Processors (U-Processor Line)
i3-5010U 2/4 2.1 N/A N/A N/A
Intel® HD
Graphics
5500
300/900 1600 1600 3MB 15W 10W 105 √ √ √ BGA
i3-5005U 2/4 2.0 N/A N/A N/A
Intel® HD
Graphics
5500
300/850 1600 1600 3MB 15W 10W 105 √ √ √ BGA
Intel® Pentium® Processors (U-Processor Line)
3805U 2/2 1.9 N/A N/A N/A
Intel® HD
Graphics
100/800 1600 1600 2MB 15W 10W 105 √ √ BGA
Intel® Celeron® Processors (U-Processor Line)
3755U 2/2 1.7 N/A N/A N/A
Intel® HD
Graphics
100/800 1600 1600 2MB 15W 10W 105 √ √ BGA
3205U 2/2 1.5 N/A N/A N/A
Intel® HD
Graphics
100/800 1600 1600 2MB 15W 10W 105 √ √ BGA
第5代Intel® Core™ 處理器系列– 15W
Complete CPU spec information can be
found at http://ark.intel.com
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
12
Processor
Number
Cores/
Threads
Base
Freq
(GHz)
Intel Turbo Boost Technology
2.0
Graphics
Graphics
Base /
Max
Freq
(MHz)
LPDDR3
Memory
Speed
Support
(MHz)
DDR3L
Memory
Speed
Support
(MHz)
L3Cache
TDP
cTDP
Down
Tj
(deg)
Intel
SBA
Intel Technologies
Package
TypeMax Single
Core Turbo
(GHz)
Max Dual
Core Turbo
(GHz)
Max Quad
Core Turbo
(GHz)
Intel
vPro
Intel
TXT
Intel
VT-d
Intel
VT-x
AES-NI
Intel® Core™ i7 Processors (U-Processor Line)
i7-5557U 2/4 3.1 3.4 3.4 N/A
Intel®
Iris™
Graphics
6100
300/1100 1866 1600 4MB 28W 23W 105 √ √ √ √ BGA
Intel® Core™ i5 Processors (U-Processor Line)
i5-5287U 2/4 2.9 3.3 3.3 N/A
Intel®
Iris™
Graphics
6100
300/1100 1866 1600 3MB 28W 23W 105 √ √ √ √ BGA
i5-5257U 2/4 2.7 3.1 3.1 N/A
Intel®
Iris™
Graphics
6100
300/1050 1866 1600 3MB 28W 23W 105 √ √ √ √ BGA
Intel® Core™ i3 Processors (U-Processor Line)
i3-5157U 2/4 2.5 N/A N/A N/A
Intel®
Iris™
Graphics
6100
300/1000 1866 1600 3MB 28W 23W 105 √ √ √ √ BGA
Complete CPU spec information can be
found at http://ark.intel.com
第5代Intel® Core™ 處理器系列 – 28W
Intel Confidential 13
*Other names and brands may be claimed as the property of others
全新 Intel® Core™ M 處理器
平板特性 結合 筆電效能
高速且敏捷
與周邊產品相容
多種檔案格式支援
多工處理
互動式觸控
輕薄方便攜帶
長效電池續航力
即時反應隨時備戰
For more complete information about performance and benchmark results, visit Performance Test Disclosure
This Training Deck is for RSP Training under NDA Only. No Leave Behind.
Intel, Intel Inside and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
~Battery life may vary depending on hardware, software, system configuration and operating conditions.
Intel Confidential 14
Intel® Core™ M 處理器
打造無風扇散熱設計2 in 1
40 X 24 X 1.5mm
960 mm2
先進的 BGA封裝
體積輕薄
30 X 16.5 X 1.05mm
495 mm2
第4代Intel® Core™
處理器
Intel® Core™
M 處理器
功耗更低與更小的封裝面積造就
Intel® Core™ M 處理器更好的無風扇 2 in 1設計
18W
17W
11.5W
4.5W
2010 2012 2013 2014
散熱設計功耗
低功耗Intel® Core™ 處理器
無風扇的設計進化史
Intel Confidential 15
*Other names and brands may be claimed as the property of others
Intel Confidential 16
SYSMark Overall scores
16
Intel® Core™ M 5Y71Processor (up to 2.9GHz, 4T/2C, 4 MB cache, 4.5W TDP) 846
Intel® Core ™ i5-4200U(1.6 GHz base up to 2.6 GHz, 4T/2C, 3 MB cache, 15 TDP) 829
Intel® Core™ M 5Y10 Processor (up to 2.0GHz, 4T/2C, 4 MB cache, 4.5W TDP) 687
Intel® Core™ i3-4030U Processor (1.9 GHz, 4T/2C, 3 MB cache, 15W TDP) 686
Core i7-4610Y
Core i5-
4300Y
Core i3-4030Y
Core M-5Y71
Core M-5Y51
Core M-5Y31
4.5瓦
Intel Confidential 17
日常生活中 你/妳會用筆電做什麼?
17
刺激團戰
(1920x1080 30fps)
UHD4K影片
影音編輯
(Intel HD Graphics-
QSV)
賽車
(Medium-
30fps)
Intel Confidential 18
3DMARK
18
Core i5-4210U HD Graphics 4400 Core M-5Y71 HD Graphics 5300
Intel® Core™ M-5Y71
3DMARK 效能最高提升:19%
Intel Confidential 19
Cinebench R15
19
Core i5-4210U 高達 2.7GHz Core M-5Y71 高達 2.9GHz
Intel® Core™ M-5Y71
需要效能時 可以自動加速
Intel Confidential — Do Not Forward
影片-轉檔/遊戲
21
Intel® Core™ M處理器
開始支援4K解析度 60Hz
DP 1.2
HDMI 1.4
DP
eDP panel
2560x1600@60Hz
4096x2304@24Hz3
(1 eDP display supported)
HDMI
HDMI 2.0 (Not POR)4DP to
HDMI 2.0
轉換器
同上
Intel® Core™ M
2560x1600 @60Hz
3200x2000 @60Hz1
3840x2160 @60Hz2
2560x1600 @60Hz
3200x2000 @60Hz1
3840x2160 @60Hz2
3個管線同時支援
eDP 1.3
第4代只支援至30Hz
4K 60fps video 播放
22
30 vs 60 FPS
Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
24
Complete CPU spec information can be found in the EDS or in http://ark.intel.com
Intel® Core™ M 處理器系列
** 4W Config Down TDP
Processor
Number
Cores/
Threads
Base
Freq
(GHz)
Intel Turbo Boost Technology 2.0
Graphics
Graphics
Base / Max
Freq
(MHz)
LPDDR3
DDR3L
Memory
Speed
Support
(MHz)
LPDDR3L
DDR3L
Memory
Speed
Support
(MHz)
L3
Cache
TDP SDP
Intel Technologies
Max Single
Core Turbo
(GHz)
Max Dual
Core Turbo
(GHz)
Max Quad
Core Turbo
(GHz)
Intel
vPro
Intel
TXT
Intel
VT-d
Intel VT-x AES-NI
5Y71 2/4 1.20 2.90 2.90 N/A
Intel® HD
Graphics
5300
300 / 900 1600 1600 4MB 4.5W 3.5W     
5Y70 2/4 1.10 2.60 2.60 N/A
Intel® HD
Graphics
5300
100 / 850 1600 1600 4MB 4.5W NA     
5Y10a 2 / 4 0.80 2.00 2.00 N/A
Intel® HD
Graphics
5300
100/800 1600 1600 4MB 4.5W NA   
5Y10** 2 / 4 0.80 2.00 2.00 N/A
Intel® HD
Graphics
5300
100 / 800 1600 1600 4MB 4.5W NA   
ASUS* Transformer Book
T100 Chi
ASUS* Transformer
T300 Chi
ASUS* Zenbook
UX305
採用 Intel® 處理器系列 的 2 in 1 產品列表
This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.*Other names and brands may be claimed as the property of others.
Intel® Core™ M 處理器系列
高效快速的無風扇設計
適用於平板/ 2in1裝置
與Haswell Y1相比
高達
1 Performance and power estimates based on BDW Y top bin projections not measured data vs. HSW Y @ 4.5W. CPU
performance based on Spec fp, Graphics performance based on 3DMark Fire Strike . Battery life projection based on local video
playback.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.
Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,
operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information
and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products. For more information go to http://www.intel.com/performance
50% 效能提升
1.7X 顯示效能提升
20% 電池續航力提升(1.7 小時)
PC Client Group Intel Confidential
*Other names and brands may be claimed as the property of others
Material in this presentation is intended as product positioning and not approved end user messaging.
第5代 Intel Core 處理器
市場定位
極致輕薄
Intel® Core™ M 處理器
處理器
• 4.5W TDP
• 雙核心
• HD Graphics 5300
主流
U系列 處理器
效能
H系列 處理器
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and
performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance
1Intel Core M processor 5Y70 vs. 4th generation Intel® Core™ processor 4302Y with SPECfp_rate_base2006 and 3DMark Ice Storm
2Configuration: Intel Core M processor 5Y70, 35WHr , 1.6” panel, 19x10, SSD, 4GB memory, local video playback
3SYSmark and 3D Mark Vantage projections not measured; top bin to top bin; +/- 15% margin for error
處理器
• 15W TDP
• 雙核心
• HD Graphics
5500/6000
• 28W TDP
• 雙核心
• Iris Graphics
6100
處理器
• 37, 47W TDP
• 雙核心
• HD Graphics 5600
Iris Pro Graphics 6000
HQ: 四核心
總結產品定位 – 平板 , 2 in 1 , 筆電
This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel, Intel Inside, Intel Atom, Intel Celeron, Intel Pentium and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
~Battery life may vary depending on hardware, software, system configuration and operating conditions.
當效能表現最重要… 當行動力最重要…
Intel® RealSense™ 3D 攝影機應用
捕捉畫面/分享 身歷其境 &自然的互動寓教於樂
Intel Confidential - for use under NDA only
呈現真實的3D世界
Intel Confidential
All-in-One 筆記型電腦 翻轉式 2 in 1 分離式 2 in 1 平板電腦 Phablet 智慧型手機
前置鏡頭
後置鏡頭
Intel® RealSense™ 攝影機適用各種類型裝置
Intel® RealSense™ 3D Camera R200 (aka Double Spring 60fps)
Intel® RealSense™ 3D Camera F200 (aka Bell Cliffs 60fps)
Intel® RealSense™ Snapshot R100 (Photography) (aka Davis Reef)
Intel® RealSense™ F200 3D 攝影機
3D 2D
 成像技術: Coded Light; VGA 60fps
 適用平台 : 搭載第4與第 5代 Intel® Core 處理器之筆電, 2 in 1 與 All in Ones
 室內臉部掃描距離 0.2m – 1.0m
 OS: Windows* 8.1, Windows 10 (when available)
 外觀類型: 整合式模組
 1080p RGB, IR 紅外線投影機/攝影機
 規格 : 110x12.5x3.75mm
 功耗: 1.6W
* Other Names and Brands may be claimed as the property of
32
Intel® RealSense™ 技術 – 3D 攝影機應用
手部辨識以及手勢輸入
臉部追蹤
(可達78 個追蹤點)
人臉辨識
視訊會議
臉部偵測
多種辨識模式應用
* Other Names and Brands may be claimed as the property of
Thank you
33
Disclaimers
34
Intel® Core™ M Processors
"Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum,
tungsten, and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. We also use the term "conflict-free" in a broader sense to
refer to suppliers, supply chains, smelters, and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries.
1 Source: Intel: Based on local video playback, 35 WHr battery. System configurations in backup. Configurations: Intel® Core™ M-5Y70 processor (up to 2.60 GHz, 4T/2C, 4M cache), on Intel Reference
Platform, BIOS: v80.1, Graphics: Intel® HD Graphics (driver v. 15.36.3650). Memory: 4 GB (2 x 2 GB) dual channel LPDDR3-1600. SDD: Intel 160 GB, OS: Windows* 8.1 Update RTM. Intel® Core™ M-5Y10
processor (up to 2.00 GHz, 4T/2C, 4M cache) on Intel Reference Platform. BIOS: v80.1, Graphics: Intel® HD Graphics (driver v. 15.36.3650). Memory: 4 GB (2 x 2 GB) dual-channel LPDDR3-1600. SDD: Intel
160 GB, OS: Windows* 8.1 Update RTM. Intel® Core™ i5-520UM processor (formerly Arrandale) 1066/2C4T.SMT.On/2 x 256 KB/3 MB (Turbo -) Micron 8 GB (2 X 4 GB) DDR3 1333 (PC3-10700)399, Seagate
500 GB HDD*, N/A@ (8.15.10.2104), BIOS: Insyde v.1.11*, Intel v.9.3.0.1021. Prior generation: Intel® Core™ i5-4302Y processor (up to 2.30 GHz, 4T/2C, 3M cache) on Intel Reference Platform, 4.5W thermal
design power. BIOS: WTM 137*. Graphics: Intel® HD Graphics (driver v. 15.36.3650). Memory: 4 GB (2 x 2 GB) dual channel LPDDR3-1600. SDD: Intel 160 GB. OS: Windows* 8.1 Update RTM. System power
management policy: Balance. Wireless: On and connected. Battery size assumption: 35 WHr.
2 No computer system can provide absolute security. Requires an enabled Intel® processor, enabled chipset, firmware and/or software optimized to use the technologies. Consult your system manufacturer
and/or software vendor for more information.
3 Available on select Intel® processors. Requires an Intel® HT Technology-enabled system. Consult your system manufacturer. Performance will vary depending on the specific hardware and software used.
For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading.
4 Requires a select Intel® processor, Intel® software and BIOS update, and a Solid-State Drive (SSD) or hybrid drive. Depending on system configuration, your results may vary. Contact your system
manufacturer for more information.

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Asus x intel 行動裝置研討會0328

  • 2. *Other names and brands may be claimed as the property of others All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 2 Agenda •低功耗Core 處理器進化史 •第5代Intel® Core™ 處理器介紹 •全新Intel® Core™ M處理器 •結論
  • 3. 2014 This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. 啟動行動運算的旅程… 低功耗 Intel® Core™ 處理器的演進 Westmere 32nm 2010 2011 2012 2013 2014/15 Sandy Bridge 32nm Ivy Bridge 22nm Haswell 22nm Broadwell 14nm 18mm 7.6mm
  • 4. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 4 第5代 Intel Core 處理器 Intel® Core™ i7-5600U Processor with Intel® HD Graphics 5500 compared to 4th Generation Intel® Core™ i7-4600U with Intel® HD Graphics 44001 第4代 Intel® Core™ 處理器 9億6千萬個 電晶體, 131mm2 第5代 Intel® Core™ 處理器 13億個 電晶體, 82mm2 電晶體更多35% 晶片尺寸更小 37% 3D 遊戲 Up to 22% BETTER 影像轉檔 Up to 50% FASTER 生產力 Up to 4% BETTER 電池續航力 Up to 1.5Hr LONGER Source:Intel.Productivity:SYSmark2014.3DGraphics:3DMark*IceStormUnlimitedv1.2.VideoConversion: Cyberlink*MediaEspresso*toconvertHDvideos.BatteryLifebasedon40WHrbatterycapacitywatchinglocal1080p movie.SoftwareandworkloadsusedinperformancetestsmayhavebeenoptimizedforperformanceonlyonIntel microprocessors.Performancetests,suchasSYSmarkandMobileMark,aremeasuredusingspecificcomputersystems, components,software,operationsandfunctions.Anychangetoanyofthosefactorsmaycausetheresultstovary.You shouldconsultotherinformationandperformanceteststoassistyouinfullyevaluatingyourcontemplatedpurchases, includingtheperformanceofthatproductwhencombinedwithotherproducts.Formoreinformationgoto http://www.intel.com/performance 1Configuration detail in Appendix A
  • 5. 處理器命名規則 1 Processor line names are not official processor names and should not be used in ANY end-customer communication. Use official brand names for all end-customer communication 2Thermal Design Power(TDP) definition represents a near-worst case workload and thermal conditions for a Notebook-first experience 3 Scenario Design Power(SDP) is an additional thermal reference point that is meant to represent workloads for specific usages *Signifies CPU SDP only 處理器系列1 封裝 散熱設計功耗2 (TDP) 第5代 Intel® Core™ 處理器 (“Broadwell”) H-處理器 系列1 BGA 47W, 37W M-處理器 系列1 PGA 57W, 47W, 37W U-處理器 系列1 BGA 28W, 15W Y-處理器 系列1 BGA 11.5W 第5代後 無M處理器系列 Intel® Core™ M 處理 器 5 HD 5300 HD 5500/6000 Iris 6100 HD 5600 Iris Pro 6200 顯示晶片
  • 6. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 6 耗電量更低 提升續航力 更長效的電池續航力. 40 Wh battery. Realtek* external audio DSP used on HSW Broadwell integrated audio DSP used on BDW (Watts) Windows 8.1* 閒置狀態螢幕開啟 Windows 8.1* 本機端 HD 影片播放 從9.1小時提升至10.1小時  60 分鐘 從 7.2 小時提升至 8.7 小時  90 分鐘 Configuration detail in Appendix A. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
  • 7. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 7 2006 2007 2008 2009 2010 2011 2012 2013 Source: *Intel estimates. 3DMark06 Intel® 顯示晶片效能的提升 2nd Gen Intel® Core™ 3rd Gen Intel® Core™ 4th Gen Intel® Core™ ~100X* 提升!!! 80x 70x 60x 50x 40x 30x 20x 10x Baseline 5th Gen Intel® Core™
  • 8. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 8 Intel® 顯示晶片 遊戲 駕馭主流遊戲,與前一代有 22% 提升3 創作 創作編輯影片與前一代相比有高達 50% 提升4 HD影片播放 觀賞 1080p 或 UltraHD1 影片,與前一 代相比還多 1.5 小時的電池續航力2 Intel® HD 顯示晶片 5500 & 6000; Intel® Iris™ 顯示晶片 6100 DirectX 11.2, DirectX 12 Ready, OpenGL 4.3, OpenCL 2.0 4K UltraHD (3840x2160) 解析度,1 無線顯示技術†† 增強型媒體編碼支援 VP8, VP9, and HEVC Intel® Quick Sync Video, Intel® Clear Video HD 技術, Intel Wireless Display Configuration detail in Appendix A. Footnote detail in Appendix B 革命性的新顯示架構 提升效能與更低耗電 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. †† Requires a graphics driver update coming in January 2015
  • 9. Other brands and names may be claimed as the property of others. 專為2 in1裝置、輕薄型筆電設計 與Haswell U1相比 第5代 Intel® Core™ 處理 器 U系列 1 Performance and power estimates based on BDW Y top bin projections not measured data vs. HSW Y @ 4.5W. CPU performance based on Spec fp, Graphics performance based on 3DMark Fire Strike . Battery life projection based on local video playback. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 10% 效能提升 24% 顯示效能提升 20% 電池續航力提升(1.7 小時)
  • 10. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 10 Processor Number Cores/ Threads Base Freq (GHz) Intel Turbo Boost Technology 2.0 Graphics Graphics Base / Max Freq (MHz) LPDDR3 Memory Speed Support (MHz) DDR3L Memory Speed Support (MHz) L3Cache TDP cTDP Down Tj (deg) Intel SIPP Intel Technologies Package TypeMax Single Core Turbo (GHz) Max Dual Core Turbo (GHz) Max Quad Core Turbo (GHz) Intel vPro Intel TXT Intel VT-d Intel VT-x AES-NI Intel Core™ i7 Processors (U-Processor Line) i7-5650U 2/4 2.2 3.2 3.1 N/A Intel® HD Graphics 6000 300/1000 1866 1600 4MB 15W 9.5W 105 2015 √ √ √ √ √ BGA i7-5600U 2/4 2.6 3.2 3.1 N/A Intel® HD Graphics 5500 300/950 1600 1600 4MB 15W 7.5W 105 2015 √ √ √ √ √ BGA i7-5550U 2/4 2.0 3.0 2.9 N/A Intel® HD Graphics 6000 300/1000 1866 1600 4MB 15W 9.5W 105 √ √ √ BGA i7-5500U 2/4 2.4 3.0 2.9 N/A Intel® HD Graphics 5500 300/950 1600 1600 4MB 15W 7.5W 105 √ √ √ BGA Intel Core™ i5 Processors (U-Processor Line) i5-5350U 2/4 1.8 2.9 2.7 N/A Intel® HD Graphics 6000 300/1000 1866 1600 3MB 15W 9.5W 105 2015 √ √ √ √ √ BGA i5-5300U 2/4 2.3 2.9 2.7 N/A Intel® HD Graphics 5500 300/900 1600 1600 3MB 15W 7.5W 105 2015 √ √ √ √ √ BGA i5-5250U 2/4 1.6 2.7 2.5 N/A Intel® HD Graphics 6000 300/950 1866 1600 3MB 15W 9.5W 105 √ √ √ BGA i5-5200U 2/4 2.2 2.7 2.5 N/A Intel® HD Graphics 5500 300/900 1600 1600 3MB 15W 7.5W 105 √ √ √ BGA Complete CPU spec information can be found at http://ark.intel.com 第5代Intel® Core™ 處理器系列 – 15W
  • 11. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 11 Processor Number Cores/ Threads Base Freq (GHz) Intel Turbo Boost Technology 2.0 Graphics Graphics Base / Max Freq (MHz) LPDDR3 Memory Speed Support (MHz) DDR3L Memory Speed Support (MHz) L3Cache TDP cTDP Down Tj (deg) Intel SBA Intel Technologies Package TypeMax Single Core Turbo (GHz) Max Dual Core Turbo (GHz) Max Quad Core Turbo (GHz) Intel vPro Intel TXT Intel VT-d Intel VT-x AES-NI Intel® Core™ i3 Processors (U-Processor Line) i3-5010U 2/4 2.1 N/A N/A N/A Intel® HD Graphics 5500 300/900 1600 1600 3MB 15W 10W 105 √ √ √ BGA i3-5005U 2/4 2.0 N/A N/A N/A Intel® HD Graphics 5500 300/850 1600 1600 3MB 15W 10W 105 √ √ √ BGA Intel® Pentium® Processors (U-Processor Line) 3805U 2/2 1.9 N/A N/A N/A Intel® HD Graphics 100/800 1600 1600 2MB 15W 10W 105 √ √ BGA Intel® Celeron® Processors (U-Processor Line) 3755U 2/2 1.7 N/A N/A N/A Intel® HD Graphics 100/800 1600 1600 2MB 15W 10W 105 √ √ BGA 3205U 2/2 1.5 N/A N/A N/A Intel® HD Graphics 100/800 1600 1600 2MB 15W 10W 105 √ √ BGA 第5代Intel® Core™ 處理器系列– 15W Complete CPU spec information can be found at http://ark.intel.com
  • 12. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 12 Processor Number Cores/ Threads Base Freq (GHz) Intel Turbo Boost Technology 2.0 Graphics Graphics Base / Max Freq (MHz) LPDDR3 Memory Speed Support (MHz) DDR3L Memory Speed Support (MHz) L3Cache TDP cTDP Down Tj (deg) Intel SBA Intel Technologies Package TypeMax Single Core Turbo (GHz) Max Dual Core Turbo (GHz) Max Quad Core Turbo (GHz) Intel vPro Intel TXT Intel VT-d Intel VT-x AES-NI Intel® Core™ i7 Processors (U-Processor Line) i7-5557U 2/4 3.1 3.4 3.4 N/A Intel® Iris™ Graphics 6100 300/1100 1866 1600 4MB 28W 23W 105 √ √ √ √ BGA Intel® Core™ i5 Processors (U-Processor Line) i5-5287U 2/4 2.9 3.3 3.3 N/A Intel® Iris™ Graphics 6100 300/1100 1866 1600 3MB 28W 23W 105 √ √ √ √ BGA i5-5257U 2/4 2.7 3.1 3.1 N/A Intel® Iris™ Graphics 6100 300/1050 1866 1600 3MB 28W 23W 105 √ √ √ √ BGA Intel® Core™ i3 Processors (U-Processor Line) i3-5157U 2/4 2.5 N/A N/A N/A Intel® Iris™ Graphics 6100 300/1000 1866 1600 3MB 28W 23W 105 √ √ √ √ BGA Complete CPU spec information can be found at http://ark.intel.com 第5代Intel® Core™ 處理器系列 – 28W
  • 13. Intel Confidential 13 *Other names and brands may be claimed as the property of others 全新 Intel® Core™ M 處理器 平板特性 結合 筆電效能 高速且敏捷 與周邊產品相容 多種檔案格式支援 多工處理 互動式觸控 輕薄方便攜帶 長效電池續航力 即時反應隨時備戰 For more complete information about performance and benchmark results, visit Performance Test Disclosure This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel, Intel Inside and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. ~Battery life may vary depending on hardware, software, system configuration and operating conditions.
  • 14. Intel Confidential 14 Intel® Core™ M 處理器 打造無風扇散熱設計2 in 1 40 X 24 X 1.5mm 960 mm2 先進的 BGA封裝 體積輕薄 30 X 16.5 X 1.05mm 495 mm2 第4代Intel® Core™ 處理器 Intel® Core™ M 處理器 功耗更低與更小的封裝面積造就 Intel® Core™ M 處理器更好的無風扇 2 in 1設計 18W 17W 11.5W 4.5W 2010 2012 2013 2014 散熱設計功耗 低功耗Intel® Core™ 處理器 無風扇的設計進化史
  • 15. Intel Confidential 15 *Other names and brands may be claimed as the property of others
  • 16. Intel Confidential 16 SYSMark Overall scores 16 Intel® Core™ M 5Y71Processor (up to 2.9GHz, 4T/2C, 4 MB cache, 4.5W TDP) 846 Intel® Core ™ i5-4200U(1.6 GHz base up to 2.6 GHz, 4T/2C, 3 MB cache, 15 TDP) 829 Intel® Core™ M 5Y10 Processor (up to 2.0GHz, 4T/2C, 4 MB cache, 4.5W TDP) 687 Intel® Core™ i3-4030U Processor (1.9 GHz, 4T/2C, 3 MB cache, 15W TDP) 686 Core i7-4610Y Core i5- 4300Y Core i3-4030Y Core M-5Y71 Core M-5Y51 Core M-5Y31 4.5瓦
  • 17. Intel Confidential 17 日常生活中 你/妳會用筆電做什麼? 17 刺激團戰 (1920x1080 30fps) UHD4K影片 影音編輯 (Intel HD Graphics- QSV) 賽車 (Medium- 30fps)
  • 18. Intel Confidential 18 3DMARK 18 Core i5-4210U HD Graphics 4400 Core M-5Y71 HD Graphics 5300 Intel® Core™ M-5Y71 3DMARK 效能最高提升:19%
  • 19. Intel Confidential 19 Cinebench R15 19 Core i5-4210U 高達 2.7GHz Core M-5Y71 高達 2.9GHz Intel® Core™ M-5Y71 需要效能時 可以自動加速
  • 20. Intel Confidential — Do Not Forward 影片-轉檔/遊戲
  • 21. 21 Intel® Core™ M處理器 開始支援4K解析度 60Hz DP 1.2 HDMI 1.4 DP eDP panel 2560x1600@60Hz 4096x2304@24Hz3 (1 eDP display supported) HDMI HDMI 2.0 (Not POR)4DP to HDMI 2.0 轉換器 同上 Intel® Core™ M 2560x1600 @60Hz 3200x2000 @60Hz1 3840x2160 @60Hz2 2560x1600 @60Hz 3200x2000 @60Hz1 3840x2160 @60Hz2 3個管線同時支援 eDP 1.3 第4代只支援至30Hz
  • 22. 4K 60fps video 播放 22
  • 23. 30 vs 60 FPS
  • 24. Intel Confidential – UNDER EMBARGO UNTIL JANUARY 5, 2015 11:00 p.m. Taiwan Time All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 24 Complete CPU spec information can be found in the EDS or in http://ark.intel.com Intel® Core™ M 處理器系列 ** 4W Config Down TDP Processor Number Cores/ Threads Base Freq (GHz) Intel Turbo Boost Technology 2.0 Graphics Graphics Base / Max Freq (MHz) LPDDR3 DDR3L Memory Speed Support (MHz) LPDDR3L DDR3L Memory Speed Support (MHz) L3 Cache TDP SDP Intel Technologies Max Single Core Turbo (GHz) Max Dual Core Turbo (GHz) Max Quad Core Turbo (GHz) Intel vPro Intel TXT Intel VT-d Intel VT-x AES-NI 5Y71 2/4 1.20 2.90 2.90 N/A Intel® HD Graphics 5300 300 / 900 1600 1600 4MB 4.5W 3.5W      5Y70 2/4 1.10 2.60 2.60 N/A Intel® HD Graphics 5300 100 / 850 1600 1600 4MB 4.5W NA      5Y10a 2 / 4 0.80 2.00 2.00 N/A Intel® HD Graphics 5300 100/800 1600 1600 4MB 4.5W NA    5Y10** 2 / 4 0.80 2.00 2.00 N/A Intel® HD Graphics 5300 100 / 800 1600 1600 4MB 4.5W NA   
  • 25. ASUS* Transformer Book T100 Chi ASUS* Transformer T300 Chi ASUS* Zenbook UX305 採用 Intel® 處理器系列 的 2 in 1 產品列表 This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.*Other names and brands may be claimed as the property of others.
  • 26. Intel® Core™ M 處理器系列 高效快速的無風扇設計 適用於平板/ 2in1裝置 與Haswell Y1相比 高達 1 Performance and power estimates based on BDW Y top bin projections not measured data vs. HSW Y @ 4.5W. CPU performance based on Spec fp, Graphics performance based on 3DMark Fire Strike . Battery life projection based on local video playback. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 50% 效能提升 1.7X 顯示效能提升 20% 電池續航力提升(1.7 小時)
  • 27. PC Client Group Intel Confidential *Other names and brands may be claimed as the property of others Material in this presentation is intended as product positioning and not approved end user messaging. 第5代 Intel Core 處理器 市場定位 極致輕薄 Intel® Core™ M 處理器 處理器 • 4.5W TDP • 雙核心 • HD Graphics 5300 主流 U系列 處理器 效能 H系列 處理器 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance 1Intel Core M processor 5Y70 vs. 4th generation Intel® Core™ processor 4302Y with SPECfp_rate_base2006 and 3DMark Ice Storm 2Configuration: Intel Core M processor 5Y70, 35WHr , 1.6” panel, 19x10, SSD, 4GB memory, local video playback 3SYSmark and 3D Mark Vantage projections not measured; top bin to top bin; +/- 15% margin for error 處理器 • 15W TDP • 雙核心 • HD Graphics 5500/6000 • 28W TDP • 雙核心 • Iris Graphics 6100 處理器 • 37, 47W TDP • 雙核心 • HD Graphics 5600 Iris Pro Graphics 6000 HQ: 四核心
  • 28. 總結產品定位 – 平板 , 2 in 1 , 筆電 This Training Deck is for RSP Training under NDA Only. No Leave Behind. Intel, Intel Inside, Intel Atom, Intel Celeron, Intel Pentium and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. ~Battery life may vary depending on hardware, software, system configuration and operating conditions. 當效能表現最重要… 當行動力最重要…
  • 29. Intel® RealSense™ 3D 攝影機應用 捕捉畫面/分享 身歷其境 &自然的互動寓教於樂 Intel Confidential - for use under NDA only 呈現真實的3D世界
  • 30. Intel Confidential All-in-One 筆記型電腦 翻轉式 2 in 1 分離式 2 in 1 平板電腦 Phablet 智慧型手機 前置鏡頭 後置鏡頭 Intel® RealSense™ 攝影機適用各種類型裝置 Intel® RealSense™ 3D Camera R200 (aka Double Spring 60fps) Intel® RealSense™ 3D Camera F200 (aka Bell Cliffs 60fps) Intel® RealSense™ Snapshot R100 (Photography) (aka Davis Reef)
  • 31. Intel® RealSense™ F200 3D 攝影機 3D 2D  成像技術: Coded Light; VGA 60fps  適用平台 : 搭載第4與第 5代 Intel® Core 處理器之筆電, 2 in 1 與 All in Ones  室內臉部掃描距離 0.2m – 1.0m  OS: Windows* 8.1, Windows 10 (when available)  外觀類型: 整合式模組  1080p RGB, IR 紅外線投影機/攝影機  規格 : 110x12.5x3.75mm  功耗: 1.6W * Other Names and Brands may be claimed as the property of
  • 32. 32 Intel® RealSense™ 技術 – 3D 攝影機應用 手部辨識以及手勢輸入 臉部追蹤 (可達78 個追蹤點) 人臉辨識 視訊會議 臉部偵測 多種辨識模式應用 * Other Names and Brands may be claimed as the property of
  • 34. Disclaimers 34 Intel® Core™ M Processors "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten, and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. We also use the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters, and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. 1 Source: Intel: Based on local video playback, 35 WHr battery. System configurations in backup. Configurations: Intel® Core™ M-5Y70 processor (up to 2.60 GHz, 4T/2C, 4M cache), on Intel Reference Platform, BIOS: v80.1, Graphics: Intel® HD Graphics (driver v. 15.36.3650). Memory: 4 GB (2 x 2 GB) dual channel LPDDR3-1600. SDD: Intel 160 GB, OS: Windows* 8.1 Update RTM. Intel® Core™ M-5Y10 processor (up to 2.00 GHz, 4T/2C, 4M cache) on Intel Reference Platform. BIOS: v80.1, Graphics: Intel® HD Graphics (driver v. 15.36.3650). Memory: 4 GB (2 x 2 GB) dual-channel LPDDR3-1600. SDD: Intel 160 GB, OS: Windows* 8.1 Update RTM. Intel® Core™ i5-520UM processor (formerly Arrandale) 1066/2C4T.SMT.On/2 x 256 KB/3 MB (Turbo -) Micron 8 GB (2 X 4 GB) DDR3 1333 (PC3-10700)399, Seagate 500 GB HDD*, N/A@ (8.15.10.2104), BIOS: Insyde v.1.11*, Intel v.9.3.0.1021. Prior generation: Intel® Core™ i5-4302Y processor (up to 2.30 GHz, 4T/2C, 3M cache) on Intel Reference Platform, 4.5W thermal design power. BIOS: WTM 137*. Graphics: Intel® HD Graphics (driver v. 15.36.3650). Memory: 4 GB (2 x 2 GB) dual channel LPDDR3-1600. SDD: Intel 160 GB. OS: Windows* 8.1 Update RTM. System power management policy: Balance. Wireless: On and connected. Battery size assumption: 35 WHr. 2 No computer system can provide absolute security. Requires an enabled Intel® processor, enabled chipset, firmware and/or software optimized to use the technologies. Consult your system manufacturer and/or software vendor for more information. 3 Available on select Intel® processors. Requires an Intel® HT Technology-enabled system. Consult your system manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading. 4 Requires a select Intel® processor, Intel® software and BIOS update, and a Solid-State Drive (SSD) or hybrid drive. Depending on system configuration, your results may vary. Contact your system manufacturer for more information.

Hinweis der Redaktion

  1. 14吋以下 18mm 0.76cm
  2. This slide highlights the benefits of 14nm. Looking at the graphic on the left side of the slide, you can see that in going from the 22nm-based 4th Gen (Haswell) to our 14nm-based 5th Gen (Broadwell) Intel Core processor, we were able to pack in 35% more transistors while shrinking the die size by 37%. And on the right side, you can see the generational improvements in performance and battery life. Remember that 5th Gen does not represent a major architecture change (a tock), but rather a process technology change (a tick). So in some case, such as productivity workloads, you will see modest gains. Our testing does show a significant battery life gain of up to 1-1.5 hours across active and passive workloads. But the biggest improvement is in graphics and media, with gains of 22% and 50%, respectively, over the previous generation processor. That’s for the die shown here, with our Intel® HD Graphics 5500.
  3. With 4th gen Core, we delivered the largest battery life increase in Intel’s history. With 5th Gen Core, we have raised the bar yet again. 5th Gen Core based platforms have the ability to increase battery life across active workloads by up to 1.5 hours. Specifically, the processor SOC power is reduced by up to 25% on active workloads and up to 44% when idle. Another area where we have greatly reduced power is audio. Intel Smart Sound Technology reduces platform power by offloading audio processing from the host CPU.
  4. Intel has been investing in our processor graphics for years, and you can see how that investment has played out in terms of graphics performance. Starting with the 5th Gen Intel Core products, we’re seeing about a 100X increase in performance vs. the 2006 baseline At the same time, we have gone from a MSS% of 40% in 2006 to over 70 % in 2014, and we outperform 80% of current discrete cards in the market.
  5. So what does this improvement in graphics mean to the end user? Whether you’re playing the latest mainstream game, watching videos in Ultra HD 4K or simply sharing your latest gameplay and video creations with family, Intel HD and Iris graphics bring you an eye-popping visual experience. Videos come to life in Ultra HD, so users can enjoy amazing and vibrant multimedia experiences on Ultra HD displays, even over Wireless Display. You’ll also get enhanced new codec decode support for VP8, VP9, HEVC on 5th Generation Intel Core with Intel graphics. Mainstream games and apps will run effortlessly. With up to 22% better graphics performance than 4th Generation Core and support for the latest graphics APIs (DX 11.2, DX 12 Ready) your favorite PC game will play great on your notebook, Ultrabook, or 2-in-1. Seamlessly create, edit, and share your game play, video calls and creations without sacrificing system responsiveness. With Intel Quick Sync Video technology, you can accelerate most video capabilities allowing you to create and share in real-time and multi-task without interruption. The 5th Generation Intel Core processor also supports graphics programmability features (like OpenCL 2.0) for programmers to easily take advantage of our graphics compute capabilities. 5th Generation Intel Core with HD graphics 5500 provides great baseline level of graphics performance for entry level PC gaming video playback and light creation. No discrete card is required. In the same 15W design, the Intel HD Graphics 6000 product offers the best graphics performance possible in a 15W socket, with an estimated 20% higher graphics performance than the HD graphics 5500. If additional performance is needed for a more immersive gaming experience across a larger set of titles, Intel Iris graphics 6100 provides up to an estimated 50% better graphics performance boost over the baseline graphics offering. Experience discrete-level, premium gaming and media experience without the burden of a costly, power hungry discrete card. The lower platform TDP compared to platforms with discrete platforms means notebooks can be designed to be thinner, lighter, and more power efficient. Background The graphics for BDW U 2+2 are called HD Graphics 5500 The graphics for HSW Y 2+2 are called HD Graphics 4200
  6. The Intel® Core™ M processor was purpose built to deliver the optimal blend of mobility and performance – the BEST performance for the thinnest, fanless 2 in 1 devices. The chart on the left shows how Intel has reduced our thermal design power from 18W in 2010 to 11.5W in 2013 to 4.5W with the new Intel Core M processor. That’s a 4X reduction over 4 years and a 60% reduction year over year. But most importantly, this new processor puts us squarely in the fanless zone. At the same time, thanks in part to the die shrink enabled by our 14nm process technology, we have also reduced our package footprint by ~50%, and are seeing a ~25% reduction in board area. The combination of these two engineering achievements means that the Intel Core M processor can enable a new class thin fanless 2 in 1 devices.
  7. Broadwell Intel HD Graphics Display Support   On Broadwell, we've added 4K@60Hz availability for U and H processors. Resolutions in Green are improved over Haswell. There’s been a recent change, we’re now supporting a slightly higher resolution for Y processor 3200x2000@60Hz but an additional 100mW of cooling is required. This is what's committed today, but internally we're trying to push the boundaries of what's possible. You should be familiar with the rest…like HSW, we support 3 simultaneous displays over these protocols and connections.
  8. Well, The embedded 3D cameras will enable to make it pervasive and reduce cost. We believe we’ll repeat the WebCAM story. It started as discrete, but then cost was reduced and it was integrated. We plan To repeat it , but faster. And then people come with the question … Ok , there is a camera , but what is there for me? I’ll dedicate the rest of my presentation to answer this question.
  9. Well, The embedded 3D cameras will enable to make it pervasive and reduce cost. We believe we’ll repeat the WebCAM story. It started as discrete, but then cost was reduced and it was integrated. We plan To repeat it , but faster. And then people come with the question … Ok , there is a camera , but what is there for me? I’ll dedicate the rest of my presentation to answer this question.
  10. Imagine it. Scan it. Share it. Capture objects and people for sharing, editing and 3D printing Control without touching a thing using hands, fingers, head, facial movement and expressions Video chat reinvented. Change background and share content as if you were in the same room
  11. The new Intel WiDi version 5.1 is now available on Windows 7 and Windows 8.1, and it has been optimized for 5th Gen Core and Core M processors. The team has spent the last year laser focused on improving quality and the result is a great product that is easy to use, has fast connection times, and excellent video playback quality. In addition, there are some new features on WiDi 5.1 including Pro WiDi for business and a bundled WiDi Remote application to help you either clone or extend your display to your TV. There is also support for 4K UHD on 5th Gen Core processor based systems, though this will require a driver download that will be available in January. And lastly, there is a new WiDi adapter available from Actiontec in a small HDMI stick format, with a suggested retail price of US$39.99.