When it comes to designing any type of radio frequency product, the footprint of the overall design may need to fit into a predefined package size. This often times causes the overall RF filter to be designed around these constraints. In this webinar we will review some of the electrical performance and mechanical size issues when designing an RF filter for your application. We will also discuss what techniques should be used and how they affect the overall performance of the product. For more information on our custom RF products solutions visit http://www.epectec.com/rf-products/

1. Manufacturing That Eliminates Risk & Improves Reliability
RF Filter Topology Constraints
Electrical Performance vs Mechanical Size
10.27.17

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Agenda
 Review Of Bandpass Filter Requirements
 Suspended Substrate Stripline (SSS) Technology Overview
 Lumped Element (LE) Technology Overview
 SSS Design Review
 LE Design Review
 SSS Effectiveness Summary
 LE Effectiveness Summary
 Q&A

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Band Pass Filter Specification Review

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Band Pass Filter Specification Goals
 Application
– Mission Critical System
– Vehicle mounted EW
 Mechanical
– 2.50“ L x .750“ W x .50“ H
– SMA (f) connectors
– Thru hole mounting
 Environmental
– Operating Temp -40C to 85C
– Storage Temp -55C to 100C
– Vibe 3 Axis Tracked Vehicle
 Production
– 100% Power test
– 100% ESS
– 100% RF Verification

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Band Pass Filter Specification Goals
 Electrical:
– Passband Insertion loss
• ( 2.5 – 6.0 ) GHz < 1.5 dB
– Rejection
• ( DC – 2.0 ) GHz > 50.0 dB
• ( 6.8 – 12.0 ) GHz > 50.0 dB
– Return Loss (VSWR)
• ( 2.5 – 6.0 ) GHz > 12.73 dB (1.60:1 VSWR)
– Power Handling
• (2.5-3.0) GHz 50W for duration of 5 seconds
• (4.5) GHz 80W for duration of 10 seconds
• (5.9) GHZ 80W for duration of 10 seconds

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Suspended Substrate Stripline
Technology Overview

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Suspended Substrate Stripline
 Distributed element design
 High Q-factor
 Design Flexibility
 Suitable for broadband applications
 Excellent temperature stability

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Lumped Element
Technology Overview

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Lumped Element
 Lumped element components
 Thermal characteristics
 Mechanical integrity
 Performance over temperature

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SSS Design Review

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SSS Design
 Electrical: Typology
– Cascaded highpass / lowpass sections
– Open circuit stub
– Short circuit stub
– Digital section

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SSS Design
 Electrical: Performance
– Passband Insertion Loss
• ( 2.5 – 6.0 ) GHz .40 to 1.0 dB
– Rejection
• ( DC – 2.0 ) GHz -65 dB
• ( 6.8 – 12.0 ) GHz > 58 dB
– Return Loss (VSWR)
• ( 2.5 – 6.0 ) GHz > 12.43 dB
(1.40:1 VSWR)

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SSS Design
 Mechanical: Chassis
– Compact design
– Interferences avoided
– Dimensionally critical stepped machining
– Mounting and alignment holes
– Plating

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SSS Design
 Mechanical: PCBA
– .005” thick Duroid substrate
• .001” F/B registration
• Ground via placement critical
– Silver plating
• Low loss
• Solderability
• Thermal management

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LE Design Review

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Lumped Element Design
 Electrical: Typology
– 9-pole
– Space constraints for more poles

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Lumped Element Design
 Electrical: Performance
– Upper rejection slope
– Insertion Loss, meets spec
– No parasites included

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Lumped Element Design
 Mechanical: Chassis
– RF shielding
– Mechanical shielding
– Increased size
– Plating

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Lumped Element Design
 Mechanical: PCBA
– .032” thick woven glass reinforced
hydrocarbon/ceramic substrate
• .010” F/B registration
• C1/C1 copper / durability
– Silver plating
• Lowest loss
• Solderability
– Installation

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Effectiveness Summary
 Suspended Substrate Stripline
– Design meets all requirements
• Mechanical footprint
• Rejection
• Loss
• RL (VSWR)
– Electrical stability over temperature
– Mechanically efficient
• Low component count for assembly
• High reliability and MTBF
• Low tuning effort
• High repeatability

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Effectiveness Summary
 Lumped Element
– Design exceeds electrical requirements
– Design exceeds mechanical footprint
– Less electrical stability over temperature
– High component count
• Complex assembly
• High tuning effort
• Less repeatable

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Our Products
Custom Battery Packs Flex & Rigid-Flex PCB’s High Reliability SMART HMIs
RF Product Solutions Cable Assemblies Printed Circuit Boards

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Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 SMART User Interfaces – Largo, FL
 Flex & Rigid Flex – Toronto, Canada
 RF Products – New Bedford, MA & Largo, FL
 Cable Assemblies – Largo, FL
 Printed Circuit Boards – New Bedford, MA & Shenzhen, China
 Our Engineering and Design teams are ready to help our
customers create world class and cost effective product
solutions.

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Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email

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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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