From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.
Breaking the Kubernetes Kill Chain: Host Path Mount
PCB Capabilities
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PCB Capabilities
High-Tech Printed Circuit Board Manufacturer
April 2017
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America's Oldest, A History of Innovation
Privately held company, established in 1952.
Estimated 2017: Sales: US$50 Million
117 Employees Worldwide
(84 – North America, 30 – Asia, 3 – Europe)
Design and manufacture customized, build-to-print,
performance-critical products for all sectors of the
electronics industry.
Leading provider of custom battery packs, flex & rigid-flex PCBs, high reliability SMART
user interfaces, energy efficient fans & motors, cable assemblies, and printed circuit
boards.
Integrated supply chain management solutions to handle the complexity of today’s
global marketplace while making sure that every order is being manufactured at the
“right” factory.
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PCB Capabilities Summary
Printed circuit boards have been in
our blood since 1952.
Our PCB offering focuses on high mix –
medium/low volume customers who
require the highest level of technology
and service.
Our experience and dedicated technical
resources ensure that our customers
get quality product on time.
Full Range of Products
Standard Technology
Typical parameters that we manufacture every day using our well
established and documented processes and procedures.
01
Advanced Technology
Requires significant investment in engineering time in order to
provide the significant technical advantage of these attributes.
02
RF & Hybrid PCB’s
Experience in the design and manufacture of PCB’s for
analog, digital and mixed signal applications.
03
Heavy/EXTREME Copper
PCB’s up to 20 oz and EXTREME Copper to 200 oz.
04
HDI PCBS
Containing blind and buried via’s often with microvia’s of .006” or less.
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Standard PCB Capabilities
Up to 34 Layers
Laminate – FR-4 (All Tg & Td Ranges), Teflon, Ceramic, Polyimide
Finished Thickness Up to .478”
Minimum Dielectric Spacing = .003”
Via in Pad and Extreme Copper
Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold
Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG
Minimum Lines & Spaces =.003”
Blind & Buried Vias
Maximum Panel Size = 24” x 36”
Minimum Finished Hole Size = .005” +/- .003”
HDI (Types I, II, III, IV)
Maximum Hole Aspect Ratio = 25:1
Maximum Copper Weight = 6 oz. (UL Approved)
Laser Direct Imaging and Laser Drilling
Controlled Impedance +/- 10%
Conductive Filled Via’s and Back Drilled Vias
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Advanced Capabilities Full Etch Back
Z Axis Milling
Edge Plating
Micro BGA
Heat Sinks and Thermal Planes
LPI, Dry Film and Epoxy Soldermask
Selective Tin/Lead & Nickel Gold Plating
Up to 6 lamination cycles
Rogers Material in Stock
Mixed and Un-Balanced Copper Constructions
Cu & Aluminum Cores
Exposed Cavities and Air Gaps
Castellated Edges
Counter Sinks/Counter Bores
Standoff’s, Spacers & Pem Nuts Installed
Aluminum Clad Boards
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High Technology Capabilities
High tech PCB’s require careful attention to design parameters to
successfully yield reliable and robust boards and assemblies.
Micro Via’s using
Laser Drilling
Buried Via w/Via Fill
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RF, Hybrid & Advanced Technologies
Hybrid construction
typically involve a low
loss material such as
Nelco or Rogers
combined with another
core material like FR-4
Advanced Technologies like filled and plugged via’s require
investment in specialized equipment such as:
• Vacuum and controlled pressure plugging equipment
• Alkaline Permanganate Desmear
• Advance Planarization Equipment
• Laser/X-Ray Guided Registration for Secondary Drilling
FR-4 & Rogers Mixed
Copper Hybrid
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Heavy/EXTREME Copper PCB’s
Epec is the industry leader in building
Heavy Copper PCB’s up to 20 oz and
EXTREME Copper to 200 oz.
Maximum Number of Layers = 50
Laminate – FR-4 (All Tg Ranges), Teflon, Ceramic,
Polyimide
Finished Thickness = .020" - 1.500"
Hot Air Solder Leveling (HASL)
Immersion Gold (ENIG) & Immersion Silver
ITAR, Military and AS9100
Blind & Buried Vias
Minimum Holes Size - .008" +.005"/-.008"
Maximum Hole Aspect Ratio = 10:1
Maximum Copper Weight = 200 oz.
Controlled Impedance +/- 10%
Copper forms up to 1” thick can be embedded into the
PCB laminate
Heavy Copper Production Capabilities
Check out our web site for heavy copper production minimums
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HDI – High Density Interconnect PCB
HDI is a PCB with a higher wiring density per area, finer lines and space,
smaller vias and pads than conventional PCB’s.
HDI Boards contain blind and/or buried vias and often contain microvias of
.006 or less in diameter.
To produce HDI boards, investment in laser direct imaging, laser drilling
equipment, vacuum controlled pressure plugging equipment, alkaline
permanganate desmear, and advance Planarization equipment is a must.
HDI Production Capabilities
Microvias & Plated Over Via’s
Blind and Buried Via’s
Sequential Lamination
Via-In-Pad Technology
3/3 lines and spacing
Copper filled stacked microvia’s
Up to 18 Layers
Down to 2 mil dielectrics
Tight Impedance Control
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Equipment Investment
Laser Direct Imaging
– Tighter Impedance Control and No Film Growth due to heat expansion
– Layer to Layer Registration within .0004”
Precision DES (Develop-Etch-Strip)
– 2 micron variation over the panel
– 1 mil core capacity for HDI and rigid flex
Laser Drills
– 3:1 Aspect Ratio; .0014” hole with .004” Pad
In Process X-Ray and Automated AOI (Optical Inspection)
This equipment investments helps us get 97% yields on the most
demanding technology PCB’s.
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Certifications & Materials
CERTIFICATIONS
IPC-6012 Class II
IPC-6012 Class 3 (Military)
IPC-6012 Class 3 (Hi-Rel)
MIL-PRF-55110
MIL-PRF-31032/1
MIL-PRF-50884
MIL-PRF-31032/2
IPC-6013 (Flex, R-Flex)
IPC-6016 (HDI/Micro-Via)
IPC-6018 (RF)
NADCAP Certified
AS9100
IPC-1752 Materials Declaration
Capable
MATERIALS
Isola
370HR
Sheng Yi
ITEQ
Polyimide
Getek
Rogers
Taconic
Nelco
Arlon
Panasonic
Matsushita
DuPont
TaiFlex
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Design Centers & Technical Support
Battery Pack & Power Management – Denver, CO
SMART User Interfaces – Largo, FL
Fans & Motors – Wales, UK
Printed Circuit Boards – New Bedford, MA & Shenzhen, China
Flex & Rigid Flex – Toronto, Canada
Cable Assemblies – Largo, FL
Our Engineering and Design teams are ready to help our
customers create world class and cost effective product
solutions.
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Inventory Management
Customer requirements are always unique and customized, therefore our
inventory management system must accommodate for this type of
environment.
Our Solutions Include:
– Kanban
– Consignment
– JIT Programs
– Blanket Orders
– Customer Fulfillment
– Bonded Warehousing
– Kitting
– Safety Stock
– Other Flexible Solutions
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The Difference is Measureable
01
WORLD CLASS DESIGNS
With industry leading technical resources for all of our product groups, our design and engineering group
works with customers to help minimize unit production costs of finished products, reduce project risks,
and speed time to market.
02
QUICKER DELIVERY
Epec's technology infrastructure and people, including the Asian and US based operations,
manufacturing, quality and engineering teams, enable jobs to get started the same day the order is
received with no delays due to 24/7 coverage.
03
BETTER QUALITY
Epec ensures higher levels of quality through actual investment in all of our processes. Whether it is our
10+ people strong quality organization in Asia, equipping our tech centers with the latest tech gear, or our
A3 improvement auditing process, real investment is made to ensure quality.
04
FLEXIBILITY
Each of our manufacturing facilities have been selected for their best-in-class niche product, delivery
and technology solutions, ensuring our optimal facility is building every order.
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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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