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Engagement Model and Overview
BSP design: Solution Highlights
and Hardware expertise
Board Support Package
Use Cases and Applications
-
Board Support PackageFACT SHEET |
đ đđ
We offer our Board Support Package (BSP) on a one-time
license fee model. This model makes our customers the
owner of the entire BSP source code along with the solution
IP rights.
This implies that the customer becomes entitled to re-use the
BSP solution across multiple projects.
A number of trusted and global automotive OEMs and Sup-
pliers have leveraged this business model for successful
integration of board support packages, with their several
vehicle production programs.
Embitel offers ready-to-deploy Board Support Package (BSP)
reference design solution. This BSP solution has been
designed for deployment across all major hardware plat-
forms, popularly used for various automotive applications.
In addition to BSP reference design solution, we also provide
custom board support package solution that is designed as
per your specific project requirements.
Following are some of the hardware platforms, for which our
team has project delivery experience:
1. Freescale( S12G128, MPC56XX)
2. Renesas ( RL 78, RH 850)
3. Fujitsu, Texas, Atmel, STMicroelectronics and Cypress
What’s inside our Board Support Package?
Our Board Support Package comprises the hardware
abstraction libraries and low-level drivers that are required
for efficient board bring-up.
The HALs and the drivers can be customized on the basis of
number of CAN, ADC and PWM Channels.
The following components are part of the complete Board
Support package:
Board Support Package contains Low
level device driver and HAL layer. It
is the essential to boot the system.
By this virtue, BSP finds its applica-
tion in almost every automotive ECU
software.
Following are some of the industry
applications of BSP:
• Seating Control ECU software
• Infotainment and Car Head-up
Display (HUD) Applications
• Advanced Driver Assistance
System (ADAS)
• Power Train ECUs
• Battery Management System in
Electric Vehicles and more.
Salient Features
• Low-level drivers such as CAN, SPI,
LIN, MCU, GPT and others are part
of the package.
• HAL (Hardware Abstraction Librar-
ies).
• HAL layer component supports
major 8/16/32 bit microcontroller
platforms.
• HAL layer can be customized on
the basis of target hardware plat-
form.
• Integration-level and module-level
testing and verification performed.
• MISRA-C Compliant Code
• Conformance test (with multiple
test-cases) for LIN and CAN bus
system.
• Compliant with both AUTOSAR
and non-AUTOSAR architecture
depending on customer require-
ments.
UDS Stack Integration, Testing and Support Services
Get in touch with Our Team
• Device driver development to allow OS
to communicate with the hardware com-
ponents
• Hardware Abstraction Layer develop-
ment for hardware initialization, memory
management and more
• Board Support Package customization
• Testing and Verification services includ-
ing unit, functional and integration testing
Board Support PackageFACT SHEET |
Aneesh Adkadkam
sales@embitel.com
BUSINESS UNIT HEAD
Automotive
Ratish Bhat
ratish.bhat@embitel.com
BUSINESS MANAGER
Automotive - North America
Kuldeep Singh
kuldeep.s@embitel.com
BUSINESS MANAGER
Automotive - Europe
• Safety module development including
RAM/ROM corruption test, CPU overload
test, program flow test etc.
• Fault code memory integration
• ECU state manager module development
and integration
• Support and Maintenance services at any
phase of vehicle testing, post BSP deploy-
ment
APPLICATION
LAYER APPLICATION SOFTWARE
APPLICATION INTERFACE LAYER
STATE MANAGER
UDS OBD II
KWP2000 J1939
DIAGNOSTIC STACK
FLASH
BOOTLOADER
SCHEDULER
FCM
RAM
INPUT
HANDLER
NVM
HANDLER
PWM
HANDLER
SYS.
TIME
LIN
IL
CAN
IL
OUTPUT
HANDLER
GPT
ADC
WDT LIN
SPI MCU
CAN
ICU
HANDLER
TAU DIO
NVM
(FLASH/DATA FLASH)
COM
CONTROL
STACK TEST
CORE
TEST
FLASH
TEST
IN/OUT
HANDLER
PROG.FLOW
TEST
APPLICATION
IL
SERVICES &
SAFETY LAYER
HAL LAYER
LOW LEVEL
DRIVERS

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Board Support Package Fact Sheet | Manual Guide

  • 1. Engagement Model and Overview BSP design: Solution Highlights and Hardware expertise Board Support Package Use Cases and Applications - Board Support PackageFACT SHEET | đ đđ We offer our Board Support Package (BSP) on a one-time license fee model. This model makes our customers the owner of the entire BSP source code along with the solution IP rights. This implies that the customer becomes entitled to re-use the BSP solution across multiple projects. A number of trusted and global automotive OEMs and Sup- pliers have leveraged this business model for successful integration of board support packages, with their several vehicle production programs. Embitel offers ready-to-deploy Board Support Package (BSP) reference design solution. This BSP solution has been designed for deployment across all major hardware plat- forms, popularly used for various automotive applications. In addition to BSP reference design solution, we also provide custom board support package solution that is designed as per your specific project requirements. Following are some of the hardware platforms, for which our team has project delivery experience: 1. Freescale( S12G128, MPC56XX) 2. Renesas ( RL 78, RH 850) 3. Fujitsu, Texas, Atmel, STMicroelectronics and Cypress What’s inside our Board Support Package? Our Board Support Package comprises the hardware abstraction libraries and low-level drivers that are required for efficient board bring-up. The HALs and the drivers can be customized on the basis of number of CAN, ADC and PWM Channels. The following components are part of the complete Board Support package: Board Support Package contains Low level device driver and HAL layer. It is the essential to boot the system. By this virtue, BSP finds its applica- tion in almost every automotive ECU software. Following are some of the industry applications of BSP: • Seating Control ECU software • Infotainment and Car Head-up Display (HUD) Applications • Advanced Driver Assistance System (ADAS) • Power Train ECUs • Battery Management System in Electric Vehicles and more. Salient Features • Low-level drivers such as CAN, SPI, LIN, MCU, GPT and others are part of the package. • HAL (Hardware Abstraction Librar- ies). • HAL layer component supports major 8/16/32 bit microcontroller platforms. • HAL layer can be customized on the basis of target hardware plat- form. • Integration-level and module-level testing and verification performed. • MISRA-C Compliant Code • Conformance test (with multiple test-cases) for LIN and CAN bus system. • Compliant with both AUTOSAR and non-AUTOSAR architecture depending on customer require- ments.
  • 2. UDS Stack Integration, Testing and Support Services Get in touch with Our Team • Device driver development to allow OS to communicate with the hardware com- ponents • Hardware Abstraction Layer develop- ment for hardware initialization, memory management and more • Board Support Package customization • Testing and Verification services includ- ing unit, functional and integration testing Board Support PackageFACT SHEET | Aneesh Adkadkam sales@embitel.com BUSINESS UNIT HEAD Automotive Ratish Bhat ratish.bhat@embitel.com BUSINESS MANAGER Automotive - North America Kuldeep Singh kuldeep.s@embitel.com BUSINESS MANAGER Automotive - Europe • Safety module development including RAM/ROM corruption test, CPU overload test, program flow test etc. • Fault code memory integration • ECU state manager module development and integration • Support and Maintenance services at any phase of vehicle testing, post BSP deploy- ment APPLICATION LAYER APPLICATION SOFTWARE APPLICATION INTERFACE LAYER STATE MANAGER UDS OBD II KWP2000 J1939 DIAGNOSTIC STACK FLASH BOOTLOADER SCHEDULER FCM RAM INPUT HANDLER NVM HANDLER PWM HANDLER SYS. TIME LIN IL CAN IL OUTPUT HANDLER GPT ADC WDT LIN SPI MCU CAN ICU HANDLER TAU DIO NVM (FLASH/DATA FLASH) COM CONTROL STACK TEST CORE TEST FLASH TEST IN/OUT HANDLER PROG.FLOW TEST APPLICATION IL SERVICES & SAFETY LAYER HAL LAYER LOW LEVEL DRIVERS