Webinar Renesas - IoT é Segura? Com Renesas Synergy sim! E o SSP 1.5 tornou ainda mais fácil!

© 2018 Renesas Electronics Corporation. All rights reserved.
SYNERGY™
SSP V1.5 AND AE-
CLOUD2 UPDATE
IOT PLATFORM BUSINESS DIVISION
RENESAS ELECTRONICS

RENESAS PRODUCT PORTFOLIO
Page 2
Power
▪ Industrial & Automotive
▪ IGBT, diodes and
Intelligent Power Modules
Analog/Power/SOC
Devices
Analog
▪ Industrial & Automotive
▪ DC to DC, Fuel gauge,
charging, CMOS Image
Sensors, Optical Image
Stabilizer, SL BLDC Motor
SOC/ASIC
▪ Powertrain Control
▪ ASSP for USM, USB PD
and PLC
▪ Custom ASICs
▪ ASIC, broad IP portfolio in
40 nm, 28 nm, 16 nm
Microcontroller
Devices and Solutions
25000 DMIPS, Linux, Android
▪ Industrial Automotive 45 and 28 nm
▪ 10 MB SRAM/XIP or DDR Interface
47000 DMIPs, Multimedia, SoC
▪ Automotive, 28 nm
▪ Scalable solutions for Infotainment, Cluster
and ADAS
480 DMIPS, FPU, DSC
▪ Industrial, 40 nm
▪ 100 µA/MHz, 350 nA standby
1344 DMIPS, Real Time
▪ Automotive, 40 nm, 32-bit, 6 families
▪ 48-484 pins, 80-320 MHz, 256KB-8MB,
1-4 cores
44 DMIPS, True Low Power
▪ Industrial & Automotive, 130 nm, 16-bit
▪ 66 µA/MHz, 220 nA standby
Microcontroller
Platform
▪ Integrated Software, Development Tools,
MCUs, Solutions
▪ Industrial 130 nm and 40 nm

IOT PLATFORM FOR
EMBEDDED DESIGNERS
A complete and qualified platform that accelerates
embedded development, inspiring innovation and
enabling differentiation.
Accelerate
Development
Reduce Total Cost
of Ownership
Lower Barriers
to Entry
Page 3
Synergy Software
Synergy Software Package (SSP)
Verified
Software
Add-Ons (VSA)
Software APIs
ThreadX®
RTOS
Middleware
Application
Framework
Functional
Libraries
HAL Drivers
BSP
Specialties
…and more
Functions
Algorithms
Stacks
Synergy Microcontrollers
Synergy
Tools &
Kits
Synergy
Solutions
Synergy
Gallery

SYNERGY MCUS – FOUNDATION OF THE PLATFORM
WWW.RENESASSYNERGY.COM/MCUS
Page 4
▪ Four Scalable and Compatible MCU Series
High
Performance
Cortex-M4
240 MHz
3 - 4 MB Flash
640 KB SRAM
High
Integration
Cortex-M4
120 MHz
512 KB - 2 MB Flash
256 - 640 KB SRAM
High
Efficiency
Cortex-M4
48 MHz
256 KB - 1 MB Flash
32 - 192 KB SRAM
Ultra-Low
Power
Arm® Cortex®-M0+
32 MHz
64 – 256 KB Flash
16 - 32 KB SRAM

SSP V1.5

SSP V1.5.1 AVAILABLE NOW!
Page 6
▪ Fully qualified and tested
▪ S5D9 pillar board (AE-CLOUD2) supported with application projects
▪ S5D9 pillar board pack file
▪ Enterprise cloud (Amazon AWS, Google Cloud, Microsoft Azure)
▪ Private cloud (Medium One)

SSP V1.5.1 ENHANCEMENTS
Page 7
Feature Benefit
S5D3 support ▪ Software support for the latest S5D3 MCU group
▪ Target boards available for evaluation (YSTBS5D3E10)
Cryptography ▪ Additional crypto algorithm support via HAL and framework layers
▪ ECC and ECDSA support for P-224 and P-384 curves
▪ Code reduction through individual HAL module selection
Cellular ▪ NB-IoT support
▪ EGPRS fallback support
▪ Command mode / data mode switching after network connection
▪ Enhanced debugging capabilities
Touch panel framework ▪ Framework support for additional communication protocols (SPI,
UART, I2C, etc.)
▪ Support for callback and polling mechanisms

SSP V1.5.1 ENHANCEMENTS
Page 8
Feature Benefit
LevelX ▪ Flash wear leveling support
HTTP ▪ HTTPS client support (securely connect to a HTTPS server)
▪ HTTP v1.1 persistent connections (keep alive, single TCP
connection for multiple HTTP requests)
▪ Chunked data transfer encoding
NetX Secure ▪ TLS v1.1 support (SSP supports v1.0 – v1.2)
▪ Legacy support only; encourage customers to use v1.2!
▪ RSA4096 support (software implementation to support Microsoft
Azure cloud)
▪ MD5 support
USBX device HID class ▪ Support for multi-interface devices (e.g. keyboard and mouse)
DHCP improvements ▪ Support for option 60 (vendor class identifier) and option 61 (client
identifier)

© 2018 Renesas Electronics Corporation. All rights reserved. Page 9
Technology
▪ 40-nm high-performance process
▪ Operating temperature range:
-40°C up to 105°C
▪ GPIO pins: up to 71
▪ Package LQFP: 100, 64
▪ Package LGA: 100
▪ Package QFN: 64
TBD μA/MHz (Normal Mode)
TBD μA (Software Standby Mode)
TBD nA (VBATT for RTC)
M4
120 MHz
2.7 V-3.6 V
Arm®
Cortex®
Flash Density
Performance
Arm®
Cortex®
Arm®
Cortex®
Arm®
Cortex®
S5D3 MCU GROUP
AVAILABLE 3Q18

Technology
▪ 130-nm processes
▪ Operating temperature range:
-40°C to 105°C
▪ GPIO pins: Up to 49
▪ Package QFN: 40, 48
▪ Package LQFP: 32, 64
▪ Package BGA: 36
108* μA/MHz (Normal Mode)
56* μA/MHz (Sleep Mode)
500* nA (Software Standby Mode)
*preliminary
Flash Density
Performance
Arm®
Cortex®
Arm®
Cortex®
Arm®
Cortex®
M23
48 MHz
1.6 V-5.5 V
Arm®
Cortex®
S1JA MCU GROUP
AVAILABLE 3Q18

EXAMPLE S1JA APPLICATION - SENSOR
Page 11
3x Op amps
L
2x LP CMP
1x HS CMP
1x 12-bit DAC
2x 8-bit DAC
DAC
DAC
Sensors Configurable AFE
Safety, Security
and Encryption
Capacitive
Touch
RTC
Low
Power
Timers
SPI
IIC
SCI
Data Transfer
Controller
FlashSRAM
USB
FS
Timers 32-bit
Timers 16-bit
CPU
16-bit
SAR
ADC
Event
Lync Controller
GPIO
Packages: LQFP, QFN, LGA, CSP
Pins: 32, 36, 40, 48, 64
System Integration
Low Power
Communications
Key subsystems:
• Configurable AFE
• System Integration
• Safety / Encryption
• Low power
• Communications
• Capacitive Touch
MCU
Pressure
Smoke
Flow
Temperature
Infrared
Accelerometer
L
DAC
SD
ADC
HDAC
Temperature: -40C to 105C

NEW KITS
Page 12
▪ TB-S1JA v1.3 (YSTBS1JAE10)
▪ S1JA MCU (64-pin LQFP package)
▪ Common TB form factor
▪ TB-S5D3 v1.0 (YSTBS5D3E10)
• S5D3 MCU (100-pin LQFP package)
• Common TB form factor

APPLICATION PROJECTS - SECURITY
Page 13
▪ Secure data-at-rest
▪ Demonstrate use of flash access window (FAW) and MPU
▪ Create write-only and read-only memory
▪ Internal RAM and flash
▪ With and without secure boot manager (SBM) uses cases
▪ Device identity
▪ Demonstrate key generation using TSIP
▪ Demonstrate use of local CA to issue certificate
▪ Demonstrate secure key storage using MPU
▪ Secure boot manager v0.9
▪ Updated to SSP v1.5
▪ Updated to work with data-at-rest project
▪ Roll forward any SBM v.10 features that are completed

APPLICATION PROJECTS
Page 14
▪ Module and pack file creation
▪ Overall guidelines for module and pack file creation
▪ Standardize architectural elements, distribution, and versioning
▪ Wi-Fi module porting guides
▪ Wireless (Wi-Fi) porting guide (on-module and on-MCU)
▪ Three AP bundles updated for SSP v1.5
▪ Cellular AP (17 Sept)
▪ Adding Quectel BG96
▪ New cellular FW features
▪ Knowledge base article on BG96 configuration tips
▪ Low power module (LPM) v2 AP (26 Sept)
▪ Support for S5D5 and S3A3 devices
▪ New transitional modes
▪ Custom BSP creation application note (15 Oct)
▪ SSP versions v1.2.0 and higher
▪ SSP version v1.1.3 and older

SSP 1.5 MORE DETAILS

LEVELX
Includes:
▪ Block media driver
▪ Support for NOR Flash on QSPI
Benefits:
▪ As flash memory can only be erased and rewritten a finite number of times,
wear leveling maximizes the life of the flash by distributing the storage of
memory evenly over the entire flash
▪ Maximizing life of the flash maximizes the life of the device

CELLULAR FRAMEWORK DEBUGGING
▪ Implemented using a Multiline MACRO defined
in the cellular serial file
Includes:
▪ AT command being sent from modem
▪ Complete response received
▪ Response received from modem with timeout
Benefits:
▪ Faster and easier debugging of application
code using the cellular framework

HTTP 1.1
Includes:
▪ Support for Clients only
▪ Compliant with
▪ RFC1945 “Hypertext Transfer Protocol/1.0”
▪ RFC 2616 “Hypertext Transfer Protocol – HTTP/1.1”
▪ RFC 2581 “TCP Congestion Control”
▪ RFC 1122 “Requirements for Internet Hosts”
▪ Related RFCs
Benefits:
▪ Persistent connections
▪ Chunked transfers

HTTPS
Includes:
▪ Support for HTTPS Clients
▪ Compliant with RFC 2818
Benefits:
▪ HTTPS enabled clients can use HTTP authentication with the HTTPS Server.
▪ TLS is used to encrypt all HTTP traffic over TCP connection.

AE-CLOUD2

APPLICATION PROJECTS – CLOUD CONNECTIVITY
Page 21
▪ Synergy MQTT/TLS cloud connectivity solutions
▪ Utilizes the newly released AE-CLOUD2 connectivity kit
▪ Amazon AWS
▪ Google Cloud
▪ Microsoft Azure
▪ Medium One (private)
▪ Use Ethernet, Wi-Fi, or cellular
(Cat-M1, NB-IoT, EGPRS) for
data backhaul to the cloud

IDEAL CONNECTIVITY FOR IOT HAS…
Long Range
Go Anywhere
Low Cost Long Battery Life

HUGE GROWTH FORECASTED FOR LTE IOT MARKET
Page 23
Protocols using unlicensed
spectrum such as Sigfox,
LoRa, Ingenu, Telensa,
802.15.4, etc.
Protocols using licensed
spectrum for LTE IoT such
as NB-IoT and CAT-M1

AE-CLOUD2 KIT CONTENTS
Page 24
Wi-Fi PMOD Board 2x 1ft Micro USB Cable 1x 1ft Ethernet Cable
Renesas Synergy
S5D9 MCU Board
Cellular Arduino Shield Cellular Antenna GPS Antenna
MSRP $199
Part # YSAECLOUD2

RENESAS SYNERGY S5D9 MCU BOARD
Page 25
Grove (UART/I2C/ADC)
Grove (I2C)
Sensors
Realtek 10/100Mbps Ethernet PHY
USB (Power and Command
Line Interface)
PMOD Connector
JTAG Connector
USB
(Programming and Debug)
Renesas Digital
Ambient Light Sensor Synergy S5D9 MCU

S5D9 MCU BOARD KEY COMPONENTS
Page 26
Component Vendor Part Number
Renesas S5D9 32-bit Cortex M4F@120MHz MCU Renesas R7FS5D97E2A01CLK#AC0
Renesas S124 32-bit Cortex M0+@32MHz MCU (J-Link on-board) Renesas R7FS124773A01CFM#AA1
Serial NOR Flash Memory QSPI, 256Mbit ISSI IS25LP256D-JLLE
Single-port 10/100Mbps Ethernet PHY with auto MDIX Realtek RTL8201F-VB-CG
Integrated digital light sensor with interrupt Renesas ISL29035
Geomagnetic sensor Bosch BMM150
16-bit digital 3-axis accelerometer and 16-bit 3-axis gyroscope Bosch BMI160
Low power gas, pressure, temperature and humidity sensor Bosch BME680
Knowles high SNR, high AOP Analog SiSonic Microphone Knowles SPM0687LR5H-1
Renesas
Synergy S5D9 MCU
Renesas
Synergy S124 MCU
ISSI
QSPI Serial Nor Flash
Realtek
10/100M PHY
Renesas
Ambient Light Sensor
Bosch
Geomagnetic Sensor
Bosch
3-axis Acc3-axis Gyro
Bosch
Environmental Sensor
Knowles
Analog Microphone

CELLULAR ARDUINO SHIELD
BG96
Module
Cellular
Antenna
GPS
Antenna
SIM Card Slot
Micro SIM (3FF)
Status LEDs
8-pin
PCM Voice
Header
6-pin Analog
I/O Header

AE-CLOUD2 PRE-CONFIGURED CARRIERS
Page 28
Country Carrier NB-IoT CAT-M1 EGPRS
USA AT&T
UK Vodafone
Taiwan Far EasTone
Taiwan Taiwan Mobile
Singapore SingTel
India Vodafone
India Airtel India
Canada Bell
Japan KDDI

AE-CLOUD2 KIT CERTIFICATIONS
Page 29
United States European Union
Japan MIC
(Radio)
Japan MIC
(Telecom Terminal)
European Union European Union
R T

SYNERGY ENTERPRISE
CLOUD TOOLBOX DEMO
Page 30
Use Synergy MQTT & TLS to connect to cloud vendor of your choice1
Quickly compare connectivity with Cellular, Ethernet, and Wi-Fi using Synergy Frameworks2
Visualize sensor data in your own private web based Dashboard3
Use embedded and Dashboard code as a demo and quick way to get started4
▪ Software demo delivered as a binary
▪ Binary and quick start guide available on
https://cloud.renesassynergy.com/
▪ Customers looking for path to production
should use specific cloud solution
application projects
▪ Software executes on AE-CLOUD2 kit
Connect in
10 minutes!
AE-CLOUD2

GETTING STARTED WITH AE-CLOUD2 IN 3 EASY STEPS
Page 31
AE-CLOUD2 Kit
Buy the hardware for
$199
(PN YSAECLOUD2)
1
Synergy Software Package (SSP)
Download the free
SSP which provides
the RTOS,
networking, security,
and connectivity
software
2
Application
Project for
Amazon
Application
Project for
Google
Application
Project for
Microsoft
Quick Demo
using Cloud
Toolbox
Medium One
IoT
Prototyping
Sandbox
Select and download
from multiple cloud
provider example
projects
3

CLOUD PROVIDER OPTIONS
Cloud Toolbox Demo Cloud Application
Projects (Amazon,
Google, Microsoft)
Medium One IoT
Prototyping Sandbox
Which kits are supported? AE-CLOUD2
AE-CLOUD1
AE-CLOUD2
PK-S5D9
AE-CLOUD2
AE-CLOUD1
What is used to visualize
sensor data?
Renesas Dashboard User created visualization Medium One Dashboard
Who sets up the account
for the Cloud provider?
Renesas accounts User account User account
Suitable for production? Demo Only Yes Yes
Who pays for the Cloud
Account?
Renesas User Free

The user portal is prebuilt with common features needed by most dashboards for the end user
MEDIUM ONE PORTAL DASHBOARD
MAPS AND TRACKING CHARTS AND HISTORY SERVICE LOGS AND FILE UPLOADS
REAL-TIME CONTROLS ALERTS AND NOTIFICATIONS
… AND MUCH MORE

1. Get a Renesas Kit for Medium One
http://www.renesas.com/iotsandbox or
https://www.medium.one/renesaskits
MEDIUM ONE IOT PROTOTYPING SANDBOX FOR RENESAS KITS
2. Follow the online tutorial for AE-CLOUD2
http://renesas-blog.mediumone.com/
3. Go to the Medium One IoT Prototyping
Sandbox
Medium One login

SIM CARD OPTIONS
Page 35
▪ AT&T Marketplace
▪ Native support out-of-the-box through
the demo binary command line interface
▪ $2.00 for a SIM card, ~$4/month for 5MB
of data
▪ Digi-Key (RevX Systems MVNO)
▪ Multiple carriers supported
▪ AT&T currently tested, other carriers
being tested
▪ Purchase SIM cards directly from Digi-
Key
▪ ~$5.00 for a SIM card, ~$7.50 for
10MB of data

SIM CARD NOTES
Page 36
▪ Make sure you purchase a micro SIM card (Micro 3FF)
▪ There are many variants of SIM card sizes, so make sure to get
the micro version!
▪ SIM cards are tied to hardware, just like a cell phone
▪ ICCID: integrated circuit card identifier identifies the SIM card
▪ IMEI: international mobile equipment identify identifies the
cellular modem hardware
▪ Both the ICCID and IMEI are required to get cellular service
▪ Both are written in 4 point font on reflective surfaces
▪ Cell phone camera lights, magnifying glasses and LASIK are
recommended!

Webinar Renesas - IoT é Segura? Com Renesas Synergy sim! E o SSP 1.5 tornou ainda mais fácil!

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Webinar Renesas - IoT é Segura? Com Renesas Synergy sim! E o SSP 1.5 tornou ainda mais fácil!