The Evolution Of An Electronic Material

The Evolution of a Ceramic Materials System for Chip Packaging Dave Kellerman April 27, 2006

Acknowledgements ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Materials System Requirements ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Low Dielectric Constant (K, Er) Low Loss (tan delta, dissipation factor)

Dielectric Properties of Ceramic Substrates and Dielectrics ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Candidate Substrate Technologies for Low K ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Thick Film Technology ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Approach Hollow Microspheres (K=1+) Standard Thick Film dielectric (K=8) Composite Thick Film Dielectric (K=4)

Porous Materials ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

New Thick Film Dielectric Formulation ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Particle Size Distribution ,[object Object],[object Object],[object Object],[object Object]

Microsphere Electrical Measurement ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Dielectric Properties of Microspheres over Frequency

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Microsphere Materials Analysis ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Final Microsphere Attributes ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Electrical Insulation Properties of the Low K Thick Film Dielectric ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

High Current Carrying Capability ,[object Object],[object Object],[object Object]

Thick Film on Low Temperature Cofired Ceramic

High Dimensional Stability, Power Dissipation, Thermal Conduction

Dimensional Stability ,[object Object],[object Object],[object Object]

Thick Film on Alumina ,[object Object]

Thick Film on Cofired Ceramic on Molded Aluminum Nitride: Patent 5,158,912

Microwave Characterization and Applications

Microwave Characterization, T Resonator ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Microwave Characterization: Stripline ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Application: Re-Design Single Layer Thin Film Microwave Circuit ,[object Object],[object Object],[object Object]

Device Development Steps ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Thick Film Design Signal Layer Signal Layer Ground Plane Ground Plane Ground Plane Vias ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Materials Issues ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Redesigned Thick Film Lincoln Labs Circuit First Layer Second Layer (EMCA/Ferro)

Buried Resistor Performance On alumina, under Low K On Low K, under Low K

Electrical Performance ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Bottom Lines ,[object Object],[object Object]

The Evolution Of An Electronic Material

Empfohlen

Empfohlen

Weitere ähnliche Inhalte

Was ist angesagt?

Was ist angesagt? (19)

Andere mochten auch

Andere mochten auch (7)

Ähnlich wie The Evolution Of An Electronic Material

Ähnlich wie The Evolution Of An Electronic Material (20)

Kürzlich hochgeladen

Kürzlich hochgeladen (20)

The Evolution Of An Electronic Material