Chong Leong Gan
4 SlideShares 19 Followers 30 Folgens
Personal Information
Unternehmen/Arbeitsplatz
Malaysia Malaysia
Beruf
PDE Director
Branche
Electronics / Computer Hardware
Info
Specialties: statistical softwares i.e JMP, Minitab, reliability prediction softwares i.e. ALTA, Weibull, FA tools i.e curve tracer, TDR, oscilloscopes, HAST board/lifeboards designs, reliability life calculation and field life extrapolations, package metallurgy, phase diagram interpretation, Microsoft Project software for reliability qualification, supplier quality auditing & AEC-Q100 automotive qualifications.
Tags
engineering semiconductor microelectronics electronics reliability materials model stress mathematics physics soldering bonding packaging
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Dokumente

(4)
Alle anzeigen

Book Review Article

Vor 8 Jahren • 186 Aufrufe

Evolutions of bonding wires used in semiconductor electronics perspective over 25 years

Vor 8 Jahren • 1215 Aufrufe

Book review

Vor 8 Jahren • 143 Aufrufe

Book review copper wire bonding

Vor 8 Jahren • 767 Aufrufe
Personal Information
Unternehmen/Arbeitsplatz
Malaysia Malaysia
Beruf
PDE Director
Branche
Electronics / Computer Hardware
Info
Specialties: statistical softwares i.e JMP, Minitab, reliability prediction softwares i.e. ALTA, Weibull, FA tools i.e curve tracer, TDR, oscilloscopes, HAST board/lifeboards designs, reliability life calculation and field life extrapolations, package metallurgy, phase diagram interpretation, Microsoft Project software for reliability qualification, supplier quality auditing & AEC-Q100 automotive qualifications.
Tags
engineering semiconductor microelectronics electronics reliability materials model stress mathematics physics soldering bonding packaging
Mehr anzeigen