2. STARS Microelectronics(Thailand) Public Company Limited
Profile
• Established in 1996 and became a public company in 2004
• Registered Capital : USD 23 Millions or Baht 736 Millions
• Revenue : - 2006 : USD 240 Million
- 2007 : USD 350 Million
- 2008 : USD 430 Million
• Total Employees : 2,700 persons ( > 100 engineers )
• Production Facilities : 2 Factories in same location.
• Electronics Manufacturing Service :
- Microelectronics Module Assembly
( PCBA, Test and Box Build Assembly)
- IC Packaging & Captive Line Assembly
“ Five STARS Customer Satisfier ”
CONFIDENTIAL
3. STARS Microelectronics(Thailand) Public Company Limited
Plant 1
Commencement : December 1997
Location : Bang Pa-In Industrial
Estate, Ayutthaya
Land Area : 4 Rai (6400 SQM)
Plant Space : 3,500 SQM
Investment Cost : Baht 617.7
million Annual Capacity : 32 million units
Clean Room Class : 10K and 100K
Equipment : Baht 525.3
million
Temp Control : 23 ± 5 Degree C.
Plant : Baht 92.4 million
: 55 ± 10 %
Relative Humidity
Main Business : (1) Microelectronic
Assembly
(2) Captive Line
Assembly
Tax Incentives : BOI and EPZ
Privilege
( Free Trade Zone )
“ Five STARS Customer Satisfier ”
CONFIDENTIAL
4. STARS Microelectronics(Thailand) Public Company Limited
Plant 2
Plant Facility
Commencement : January 2005
Location : Bang Pa-In Industrial
Estate, Ayutthaya
Land Area : 13 Rai ( 20,800 SQM)
Plant Space : 22,000 SQM
Annual Capacity : 150 million units
Clean Room Class : 1K, 10K and 100K
Temp Control : 23 ± 5 Degree C.
Relative Humidity : 55 ± 10 %
Main Business :
(1) PCB Assembly
(2) IC Packaging Assembly and Test
(3) Captive Line Assembly
Tax Incentives : BOI and EPZ Privilege
( Free Trade Zone )
“ Five STARS Customer Satisfier ”
CONFIDENTIAL
9. Special High-End Packages:
Open Cavity MEMS Packages
SiP
SiP
Dual die Pressure Package
Dual die Pressure Package
QFN Pressure Package
QFN Pressure Package
CONFIDENTIAL
10. Special High End Packages: Multi-Die
8L SOIC:
DIE ATTACHED WIRE BONDED X-RAY AFTER MOLDED
Status : Production
8L TDFN 2x3:
Status : Done with Engineering lot
CONFIDENTIAL
13. IC Package Features
♦O
♦ P P TI
♦ GREEN LEAD PACKAGES
♦ R ROV MIZ
♦ LEAD-FREE COMPLIANT EL EN ED
IA P
BL EQU ACK
♦ MSL LEVEL-1@260˚C PERFORMANCE E P IP A
AC ME GE
NT DE
KA
GE & P S I G
MA RO N
TE CES
GREEN MOLDING
GREEN MOLDING RI
AL SES
COMPOUND
COMPOUND
S
MATTE TIN
MATTE TIN
LEADFINISH Ni/Pd/Au PPF
LEADFINISH Ni/Pd/Au PPF
LEADFRAME
LEADFRAME
HIGH
HIGH
PERFORMANCE
PERFORMANCE
EPOXY
EPOXY
Ni/Pd/Au PPF
Ni/Pd/Au PPF
GREEN MOLDING
GREEN MOLDING
LEADFRAME
LEADFRAME
COMPOUND
COMPOUND
“ Five STARS Customer Satisfier ”
CONFIDENTIAL
14. TDFN Packages
TDFN 8L TDFN 12L
TDFN 8L TDFN 12L TDFN 16L TDFN 16L
2x2x0.75, 2.5x1.35x0.75,
1.7x1.35x0.75, 3x1.35x0.75, 3.3x1.35x0.75, 4x1.6x0.75 EEP,
0.5 mm Pitch 0.4 mm Pitch
0.4 mm Pitch 0.5 mm Pitch 0.4 mm Pitch 0.5 mm Pitch
TDFN 8L
2x3x0.75,
0.5 mm Pitch
CONFIDENTIAL
“ Five STARS Customer Satisfier ”
15. UDFN Packages
UDFN 8L
UDFN 8L UDFN 12L UDFN 12L UDFN 12L UDFN 16L UDFN 16L
2x2x0.5,
1.7x1.35x0.5, 2.5x1.35x0.5, 3x1.35x0.5 EEP, 3x1.35x0.5, 3.3x1.35x0.5, 4x1.6x0.5 EEP,
0.5 mm Pitch
0.4 mm Pitch 0.4 mm Pitch 0.5 mm Pitch 0.5 mm Pitch 0.4 mm Pitch 0.5 mm Pitch
CONFIDENTIAL
“ Five STARS Customer Satisfier ”
17. STARS Microelectronics(Thailand) Public Company Limited
Microelectronics Assembly: Interconnect Technology
Current State of
the Art
Technology
Current High
T
Volume
Technology
“ Five STARS Customer Satisfier ”
CONFIDENTIAL