We are professional PCB design & fabrication in Taiwan and India. We manufacture high precision, high density, and high reliability PCB up to complex multi-layered boards. We PARTNER with our customers and suppliers to provide a total test/design solution.

1. ZEN VOCE CORPORATION
PCB Products & Services
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2. 1. Product Line-up &
General Capability
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3. Product Line Up
PCB (Printed Circuit Board)
We define the PCB design and production considerations.
This includes the signal type, calibration capability, speed, resolution, and
interconnect configuration for power supply, I/O channels, and control
signals. These considerations and requirements are factored into
fabrication decisions including the selection of a dielectric material, the
various metals that will be deposited, and optimum layer stack up.
High Frequency Multi-Layered PCB
- Customized High Technology products , High Frequency & Impedance Controlled Product
- Required short delivery (One Device – Multi designer System)
- Massive product library & Experienced in major test systems / Interfaces
▶ We design and plan products considering the degree of noise and produce High Multi
site Probe Card PCB through High Multi Layer technology.
PCB Specification & Core Technology
- CAD/CAM Design Tool & PCB Software
- Design & Manufacturing capability of Multi Layered PCB (up to 52 layers)
- Signal matching technology for high frequency
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4. Test Load Board & Probecard PCB
Offer full range of PCB design services,
Digital
Analog
Mixed signal
Memory boards
Multi-layer PCB
Provide design & fabrication solution on probe
card PCB, load board and PRVX motherboards.
Provide full turn-key solution with component
assembly solution according to customer’s
request.
Very competitive pricing with fast delivery time.
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5. PCB Design Capability
High Technology PCB
- Multi Layer (More than 52Layer)
- High Frequency (Mobile Base Band)
- High Speed Interface (USB2.0 , S-ATA)
- Controlled Impedance PCB (50Ω±5Ω, Custom Spec :±10% , Special Spec :±5%)
Design CAD TOOLS
- Mentor Graphics, Power PCB(PADS)
- Accel (P-CAD)
- Cadence, Allegro, Orcad Capture
- CAM350
- Auto CAD
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6. Product Line Up
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7. Product Line Up
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8. PCB For Probe Card
2-2. PCB For Probe Card
DRAM ø440 WFBI ø440 DRAM ø305
Layers : 14 – 52
Materials : FR-4, FR-5, Polymide, PPE, BT
Thickness : 3.2T - 7.0T
Impedance matching : 50 ± 5ohm
Memory (DRAM & FLASH & WFBI) , Non Memory
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9. Motherboards
3. Mother Board (PRVX)
We designs and manufactures a diversified product of line of
motherboards. Motherboards used in conjunction with probe card
analyzing equipment are a critical and necessary component to
measure probe card correlation and performance prior to production
wafer testing.
Configuration
- Motherboard PCB
- Pogo Mold & Pin
- Upper Base & Down Base
- Other Tools
Product Item (PRVX III)
- Teradyne Catalyst
- Teradyne Flex
- Teradyne Tiger
- Yokogawa ST6730
- Advantest T6372
- Advantest T6673
- HP 93000
- Fostes SF3000
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10. PCB Specification
제품명 Layer Thickness Impedance Material 비고
Probe Card 2~52 3.2 ~7.0 50Ω±5Ω FR-4 Memory
Customer Spec : ±10% Polyimide DD I
(Special Spec : ±5%) PPE Logic
BT Mixed
Rogers
Load Board 2~48 2~6.35 50Ω±5Ω FR-4 Logic
Customer Spec : ±10% Polyimide Mixed
(Special Spec : ±5%) PPE
BT
Rogers
Mother Board (PRVX) 6~26 4.8 FR-4 580x725.5
470 x 730 x 75
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11. Specifications
ITEM Standard Special
Material Board Material FR4,FR408,N4000-13 Getek, Polyimide, Ceramic
Structure Flatness/Warpage ±5 mil/in ±2 mils/in
Layers Max. 24 Layers Max. 52 Layers
B/d Thickness Tol. +/- 10% +/- 5%
Hole Drilled Hole Size Min. Finish 6milsψ Min. Finish 4milsψ
Aspect Ratio 10 32
Trace Width 3mils 2mils(Internal),
3mils (external)
Line Spacing 3mils 2mils(Internal),
Design Rule 3mils (external)
Annular Ring 2.5mils 1.5mils
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12. PCB Material Applications in different Temperature
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13. Our Major Performance
PROBE CARD PCB
Item Para Layer Remark
Memory 16~256 16~52 T5365,T5371,T5375,T5377,AL6050,FOS8000
DDI 1~12 10~48 T6700,T6371,T6372,ST6730 and etc.
CIS 1~32 10~32 J750,IP750,MAGNUM
LOGIC 1~4 4~24 T3324,T6682,ITS9000,VERSA and etc.
MIXED 1~4 4~30 FLEX,HP93K,SHAPPHIR,FUSION and etc.
LOAD Board
Item Tester Remark
R/F Catalyst, U-Flex Mobile Bandwidth
High Speed Tiger, Fusion USB2.0, S-ATA
LOGIC T3324,T6682
MIXED CATALYST,FLEX,HP93K, SHAPPHIR ADC,DAC
PRVX Mother Board
Item Tester Remark
Mother Board PRVXⅡ, PRVXⅢ HP93K,T5375,ST6730 and etc.
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14. Platform Supported (LCD & Memory)
• Universal Probe Card
<For LCD Driver>
TS6700-B Type
T7315-A Type
T7315-B Type (No GND)
T6371 (ND-1)
ST6730
<For Memory >
T5335P-8DUTs-Horizon
T5335P-8DUTs-Vertical
T5335P-4DUTs
T5335P-1DUT-T10514
T5363
V3300-8DUTs
V3300-4DUTs
V3300-4DUTs-Diagonal
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15. Platform Supported (Mixed signal/RF)
Universal Probe Card Load Board
<For Logic > HP93000
HP83000 Tiger
HP93000 Uflex
DUO 9” IFLEX
KALOS Chroma 3600
J750 SC312
Catalyst HP83000
Tiger V7100
J750
SC312
Catalyst
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16. Platform Supported (Mixed signal/RF)
Customized PCB
All Teradyne platform
All HP/Verigy platform
All Credence platform
All LTX platform
PRVX Mother Board
HP93K
J750
Catalyst
Tiger
Uflex
KALOS
DUO6”
DUO9”
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17. Product Line-up
▣ PROBE CARD & TEST B/D LIBRARY ▣ PRVX II & III M/B LIBRARY
TERADYNE ADVANTEST MOSAID VERSA CATALYST ITS9000
J750 T3324 V2000
MS3400 V3000 T5371 J750
J937 T5365
V3300
T5335 MS4155 T5377 FLEX
J994
T5371 MS4205 ASIA
J995 AL6050 SAPPHIRE
T5581 A7160
J996 T5377 HP A7162 FOS7000 T6372
J997 T6371 A7163
HP 83K HF3000 T6371
Catalyst T6372 A7164
HP 93K
FLEX SF3000 HP93K
CREDENCE HP 4062 LTX System
A565
T3326 HP94K
QUARTET Delta 50
A580 HP 4071
KALOS Delta trillium VALSTAR KALOS
HP 4072
YOKOGAWA SC312
VLCT TS6700
SC212 SCHLUMBERGER
TS6700 EAGLE
ITS9000 ST6730
DUO ETS364
TS6730
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18. PCB Manufacture Capability
Description Korean Fab. Japanese Fab. American Fab.
GETEK, Nelco, Roger's, Polymide, Cyanate
FR4, Polymide, Nelco, Roger's ,BT, Polymide,
Material FR-5, Polymide, Megtoron6, etc.. Ester, ARLON, Hybrid Construction
etc..
Combinations
Pannel Size 770 x 580 mm 500 x 720 mm 660 x 890 mm
Layer (6.35mm) 60 lyrs 58 lyrs 60 lyrs
Min Copper weights 1/2 oz (18 micron) 1/2 oz (18 micron) 1/4 oz (9 michron)
6.35T: ∮0.3 6.35T: ∮0.3 6.35T: ∮0.25
6.2T:∮0.3 6.2T:∮0.25 6.2T:∮0.20
4.8T: ∮0.25 4.8T: ∮0.25 4.8T: ∮0.15
Mechanical spec. Min. Drill hole diameter
3.2T: ∮0.20 3.2T: ∮0.20 3.2T: ∮0.15
2.0T:∮0.20 2.0T:∮0.20 2.0T:∮0.10
1.6T: ∮0.15 1.6T: ∮0.15 1.6T: ∮0.10
Normal: NI 4㎛, AU 0.05㎛ Normal: Ni 3㎛, AU0.05㎛ Normal: Ni 5.08㎛, AU0.076㎛
Plating thickness
Max: NI 8㎛, AU 0.09㎛ Max: NI 7㎛ , AU 3㎛ Max: NI 7.62㎛, AU 1.27㎛
Min pitch 0.9 mm pitch 0.8 mm pitch 0.8 mm pitch
T 6.35mm (P/C) Min. Pad size 0.50 mm 0.45 mm 0.45 mm
Clearance 0.20 mm 0.20 mm 0.20 mm
Min pitch 0.6 mm pitch 0.5 mm pitch(developing 0.4pitch) 0.4 mm pitch
T 4.8mm (L/B) Min. Pad size 0.3 mm 0.30 mm 0.20 mm
Clearance 0.15 mm 0.1 mm 0.1 mm
Quick turn delivery Hiper Via Low DK speciall material
Advance
Laser Via for pine pitch, Excelent plating High Thickness of plating
Low layer product / stable quality Fine pitch BI Board Low DK Load board
Application
Probe Card / Load Board High performance probe card High performance Load Board
Lead time 7 days 2 weeks 2~3 weeks
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19. MLC Design / Manufacture Capability
Property LTCC HTCC
Dielectric Constant 5.1±0.2 8.8±0.2
Fired Density 3.10 g/cm3 3.54 g/cm3
Flexural Strength 203 Mpa 435 Mpa
200℃ 2.56 9.23
Thermal
Dielectric Ceramic Material
Conductivity
400℃ 2.41 9.62
RT~200℃ 6.245×10-6/℃ 7.527×10-6/℃
Thermal
Expansion RT~400℃ 6.237×10-6/℃ 7.592×10-6/℃
Coefficient
RT~500℃ 6.308×10-6/℃ 7.462×10-6/℃
Conductor Ag Ag W W
Metal Contents 85±1% 90±1% 85±1% 90±1%
Conductor Metal Firing Temp. 850~900℃ 850~900℃ 1,500~1550℃ 1,500~1550℃
Signal Line Signal Line
Usage Inner GND Via Filling Inner GND Via Filling
Power Plane Power Plane
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20. 2. Software
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21. EDA Simulation Tools
Enough Engineering of EDA Tool Expertise Background
Allegro PCB SI
Allegro PCB PI
Allegro Package SI
Hyper-lynx
Paksi-E and Tm
PowerGrid
Hspice
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22. Library
Advantest Schlumberger Teradyne Credence Yokokawa Mosaid Verigy Versa Nextest TI
T5335 ITS9000 J973 SC212 TS6700 MS3440 HP83000 V1000 M1 VLCT 8"
T5365 ITS9000EX J993 SC312 TS6700A MS3480 HP93000 V2000 M2 VLCT12"
T5371 DX2000 J994 Kalos TS6700B MS3485 HP94000 V3300 Maveric RASP
T5375 DX2001 J995 KalosII TS6700C MS40xx HP95000 V4400 All series SPREAD
T5377 DX2200 J996 KalosXW AL6050 V5400
T5377(250mm) DX3000 J997 VV AL6060
T5363 J971 Duo Catalyst
T5581 Tiger Quartet
T5591 J750 Octet
T5592 IP750 Sapphire
T5595 Catalyst
T6371 Flex Series
T6372
T7315
T5771
T5575
LM4
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23. Library
Teradyne J750-1024 / 512
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24. 3. Equipment
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25. Equipment
<1> TDR System <2> Digital Dial Gauges
Brand : Tektronix Brand : Sylvac
Model : TDS8000 Model : S229
Function : Impedance Check Spec : 12.5 mm – 0.001 / 0.5” – 0.00005
Function : Flatness/Thickness Check
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26. Equipment
<3> 2 Dimensions Coordinate Measuring Machine
Brand : ChienWei
Model : PJG-600 DV
Function : Dimension/Mechanical Hole Check
<4> Flying Probe
Brand : MicroCraft
Model : ELX6146
Function :
Leakage/Open/Short Test
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27. 4. Special Capabilities
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28. RF Capability
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29. RF Test Capability
Actual Tester Environment
Verigy, Teradyne,Credence,etc..
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30. Design Signal Integrity (SI) Capability
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31. Design SI Simulation
Load Board Design – Micro strip Implementation – Single ended
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32. Design SI Capability
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33. Design SI Capability
• Rise time becoming more rapid (bandwidth increasing)
– Reflection and Ringing
– Crosstalk
– SSN
– Skew
– Jitter
– Loss & ISI
• Lower power-supply voltage and High current
– Power supply droop and ground bounce
– Adequate power plane decoupling is the key
– Power delivery impedance is frequency dependent
– Common-mode radiated noise (EMI)
EMI
SUSCEPTIBILITY THERMAL NOISE
RADIATION
N
T IO ATTENUATION
L EC
GROUND BOUNCE R EF CROSSTALK
INTERCONNECT DELAY
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34. Signal Integrity Analysis Flow
Schematic Pre-layout Driver Models
Analysis
Constraint Driven
Layout
Post Layout
Analysis
Meet No
Spec.
Yes
Fabrication
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35. Pre Layout Analysis
• Define Specification & Verification
• Schematic & Topology Optimization
• Stack-Up & Floor Planning
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36. Pre Layout Analysis
• Reflection and Ringing Analysis
• Propagation delay variations (skew)
• Crosstalk Analysis
• Single-ended I/O supply noise (SSN)
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37. Power Layout Analysis
• Power supply droop and ground bounce
• De-coupling Capacitors Estimation
• Common-mode radiated noise (EMI)
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38. RF Capability
Teradyne Catalyst
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39. RF Capability
Integraflex
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40. 5. Process Flow
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41. Artwork Flow
Getting Design Info. Part Placement PCB FAB
Verify Design Info. PCB Art-Work PCB
Inspection
Design
Registration of Library Verification Assemble of
Plot (.DXF) Parts
Sch. (Net_list)
CAM OUT Delivery
Import
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42. Working Procedure
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43. Load Board Design Request
•Tester Channel Mapping
•Tester Data
•Tester Mechanic Drawing
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44. Load Board Design Request
• Schematic Critical Line SPEC Socket Drawing
• IC Datasheet IBIS(IC/Component)
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45. 7. Quality
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46. Quality Policy
Our goal is to provide the highest quality our item
available anywhere. We guarantee the customer's satisfaction.
Prompt delivery is our objective of production. Our experienced
engineers guarantee the quality and schedule production. So that
you can catch up on challenging market.
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47. Quality Assurance
• by SMD system.
• TDR , L R C Check in House ( Not depend on third party )
• Repair Service in Local
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48. Quality Assurance
* All signal ( Leakage / Short ) being guaranteed by QA system for Probe card PCB
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49. Outgoing QC Inspection System
• External Check
• Dimension
• Thickness
• Flatness
• Bending
• Open/Short Test
• Leakage Test
• TDR for Impedance Test
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50. Quality Assurance
•All signal ( TDR / Impedance ) being guaranteed
by QA system for all product
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51. 7. Contacts
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52. Contact us
Zen Voce Manufacturing Pte Ltd
5004 Ang Mo Kio Avenue 5 #04-06
TECHplace II Singapore 569872
Tel: 65 6319 9991
Fax: 65 6319 9997
www.zenvoce.com
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53. Thank You
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