Improvement group presentation slide for September 2010 progress report by Manufacturing Engineering(B) - Taiyo Yuden(Sarawak), Malaysia. Prepared by Abdul Qaiyum Alidin

1. Improvement Group
Process Development
Malaysia Sarawak, Taiyo Yuden
16th Fiscal Year, August - September
Monthly Presentation

2. Table of Content
 Development Summary  Air Press Machine
Noise Reduction
 Activity Progress
 Traverser
1. Activities on August
transparent cover for
 MS-24 Installation
Plating(2)
 Air Press Machine
 RO membrane
Auto Loader for replacement together
item 316 with aquamatic
 Air Press Machine valve & inverter
Noise Reduction panel installation
2. Activities on  Future activities and
September planning
 MS-24 Installation
 Plating 1 new line setup

3. 16 Fiscal Year, Aug-Sept
th
Development Summary
COMPLETED 16FY
PROCESS ON GOING IN PROGRESS PENDING
Aug-Sept
DATSUBAI - - - -
GAIDEN (M) 1 - - 1
GAIDEN (A) - - - -
SHOUSEI - - - 1
SAISANKA - - - -
PLATING (1) - 1 - 1
PLATING (2) - - - 2

4. Improvement Group
Process Development
Activity Progress

5. Gaiden(m) Development
Activity
 Air Press Machine Noise Reduction
Aug 10 Sept 10
Theme Activity PIC Status
WK 2
WK 3
WK 4
WK 2
WK 3
WK 4
WK 1
WK 1
Plan
Modification Improvement Group
Actual
Plan
Testing Improvement Group
Actual
Air Press Machine Noise Reduction
Plan
Monitoring & effectiveness Operation &
confirmation improvement Group
Actual
Plan
Waiting for report 1st appearance
Actual
Plan Done In progress Delay

6. Gaiden(m) Development
Activity
 Air Press Machine Noise Reduction
Figure 4
Machine adjustment and test results
Before After
Machine No. Result Item Name
Adjustment Adjustment
(during
(leadscrew) (leadscrew)
testing)
I-23(316) Upper 70mm 70/70 ↑ Line-A
Lower 64mm 70/60 ↑ E316BJ226KL
60/60 NG
65/60 ↓OK
I-21(316) Upper 60mm 60/65 ↓OK Line-A
Lower 70mm E316BJ226KL
R-9(316) Upper 65mm 65/60 ↓OK Line-A
Lower 67mm E316BJ226KL
P-8(316) Upper 63mm 63/60 ↓NG Line-A
Lower 68mm 63/63 ↓OK E316BJ226KL

7. Gaiden(m) Development
Activity
 Air Press Machine Noise Reduction
Chip Height Measurement Method using Laser Profile kit
Carrier plate
point number
1 2 3
4 5 6
Total of 9 area
points on carrier
plate are
7 8 9
measured
Remark: Average of 5 chips height value measured from each point for recording purpose

8. Gaiden(m) Development
Activity
 Air Press Machine Noise Reduction
Chip Height Laser Profile for item 316 Chip Height Laser Profile for item 212
Before Before
Chip modification modification
Chip
Height(μm) After After
Height(μm)
1.25 modification modification
1.55
1.2 1.5
1.15
1.45
1.1
1.4
1.05
1.35
1
1.3
0.95
1.25
0.9
1.2
one two three four five six seven eight nine Plate Point
one two three four five six seven eight nine Plate Point
A record of chip height or protrusion data pattern in graph

9. Gaiden(m) Development
Activity
 Air Press Machine Noise Reduction
Chip Height Laser Profile for item 316 Chip Height Laser Profile for item 212
Before Before
Chip modification modification
Chip
Height(μm) After After
Height(μm)
1.25 modification modification
1.55
1.2 1.5
1.15
1.45
1.1
1.4
1.05
1.35
1
1.3
0.95
1.25
0.9
1.2
one two three four five six seven eight nine Plate Point
one two three four five six seven eight nine Plate Point
A record of chip height or protrusion data pattern in graph

10. Gaiden(m) Development
Activity
 Air Press Machine Noise Reduction
Chip Height Laser Profile for item 316 Chip Height Laser Profile for item 212
Before Before
Chip modification modification
Chip
Height(μm) After After
Height(μm)
1.3 modification modification
1.55
1.25
1.5
1.2
1.45
1.15
1.4
1.1
1.05 1.35
1 1.3
0.95 1.25
0.9
1.2
one two three four five six seven eight nine Plate Point
one two three four five six seven eight nine Plate Point
A record of chip height or protrusion data pattern in graph

11. Shousei Development Activity
 MS-24 Installation
Aug 10 Sept 10
Theme Activity PIC Status
WK 2
WK 3
WK 4
WK 2
WK 3
WK 4
WK 1
WK 1
Plan
Testing(purging N2, wiring, piping) Improvement Group
Actual
Plan
MS-24 Monitoring(temperature profile) Improvement Group
Actual
Machine running for Plan
MSTY-Tech
production Actual
Plan Done In progress Delay

12. Shousei Development Activity
 MS-24 Installation
 New feature
 Blower 1 to blower 2 controller with relay
 Project issues
 Exhaust fan, blower & piping to roof resulting to unstable
internal pressure
 Off roof blower during maintenance
 Burnt sheath heater at zone no. 2 & no.3, cooling zone
 Replace sheath heater and covered holes using fiber
 Production alarm panel not properly maintain
 Tested and working

13. Plating(1) Development
Activity
 RO aquamatic valve & inverter panel installation
Sept10
Theme Activity PIC Status
WK 2
WK 3
WK 4
WK 1
Plan
Installation Improvement Group
Actual
Plan
RO aquamatic valve & inverter panel Monitoring Improvement Group
installation Actual
Plan
Effectiveness confirmation Improvement Group
Actual
 Remark:
11-Sep-10 RO Plant 1 Change Aquamatic Valve with new. (By KIASUI)
Plan Done In progress Delay

14. Plating(2) Development
Activity
 Traverser transparent cover installation
Aug 10 Sept 10
Theme Activity PIC Status
WK 2
WK 3
WK 4
WK 2
WK 3
WK 4
WK 1
WK 1
Plan
Proposal and discussion Improvement Group
Actual
Plan
Modification and installation Improvement Group
Actual
Transparent cover Plan
Downtime Monitoring Improvement Group
For easy inspection and monitoring Actual
Plan
Effectiveness confirmation Improvement Group
Actual
Operation & Plan
Implement all line
improvement group
Actual
Plan Done In progress Delay

15. Plating(2) Development
Activity
After modification
Before modification 170mm
260mm
Objective:
- Easy traverser chain inspection, maintenance and monitoring
- Reduce downtime during doing replacement part(Limit Switch) and they
do not need to open traverser cover

16. Plating(2) Development
Activity
 RO membrane replacement together with aquamatic valve &
inverter panel installation
Sept10
Theme Activity PIC Status
WK 2
WK 3
WK 4
WK 1
Plan
Installation Improvement Group
Actual
Plan
RO membrane replacement together with Monitoring Improvement Group
auqamatic valve & inverter panel installation Actual
Plan
Effectiveness confirmation Improvement Group
Actual
Plan Done In progress Delay

17. Plating(2) Development
Activity
RO Plant 3 membrance
9-Sep-10 RO Plant 3
replacement (By KIASUI)
RO Plant 3 Aquamatic Valve &
10-Sep-10 RO Plant 3 inverter panel installation (By
KIASUI)

18. Improvement Group
Process Development
Future Activity and Planning

19. 16 Fiscal Year th
Future Activity and Planning
 Web-based system for spare part purpose integration
with ME-B existing system(ex. Yokogawa Recorder)
 MW100 implementation to Shousei for monitoring
purpose
 Monitoring heater resistance & exhaust fan inverter
 Require further discussion & information
 Machine incoming & development process
 Plating(1) auto line – On progress.
 Datsubai – KIV implementation due to no further confirmation

20. 16 Fiscal Year th
Future Activity and Planning
 Web-based system planning
Sept 10 Oct 10
Theme Activity PIC Status
WK 2
WK 3
WK 4
WK 2
WK 3
WK 4
WK 1
WK 1
Outline project requirement Plan
Improvement Group
Prepare activity schedule Actual
Plan
Research on project requirement Improvement Group
Actual
Plan
Web-based system for spare part Web development Improvement Group
Actual
Plan
Testing Improvement Group Future Activity Progress
Actual
Plan
Proposal presentation Improvement group
Actual
Plan Done In progress Delay

21. Improvement Group
Process Development
Machine incoming & development process
CONTENT:
 Plating(1) auto line –Facilities planning progress
schedule, Plating 1 Auto line Set-up schedule(no
progress),progress picture(dismantle),new D.I plant
layout.
 Datsubai – Confirmed total of 8 machines out, 1st
batch expected 4 machines out on October and later
2nd batch another 4 machines out on November.

22. Plating1(RMW) Development Activity
.Facilities planning progress schedule
Sept-10 Oct-10 Nov-10
Activities P. I .C
w1
w2
w3
w4
w1
w2
w3
w4
w1
w2
w3
w4
Primary Works plan
（ Power Supplycompress air and
TAIKISHA
city water. ） actual No information
New R.O tank & D.I tank plan
TAIKISHA
piping. actual
plan
Installation new D.I plant TAIKISHA
actual
Manual line dismantle(Line D PRODUCTION/
plan
& E) ME
actual COMPLETE
Renovation of ceiling(install plan
new ceiling height and re-
TAIKISHA
install new lighting and M&E actual
system
plan actual Delay

23. Plating1(RMW) Development Activity
 Plating Auto line Set-up schedule.
Nov 10 Dec 10
Theme Activities
1 wk 2 wk
st nd
3 wk
rd
4 wk
th
1 wk 2 wk 3rd wk 4th wk
st nd
Plan
Machine Move In
Actual
Plan
Structure / Frame Setup
Actual
Plan
EpNi-Sn Auto Machine Setup Schedule Machine Setup
Actual
Plan
Barrel Sensor and Positioning Check
Actual
Plan
Test Run And Monitoring
Actual
Plan
Machine Move In
Actual
Plan
Structure / Frame Setup
Actual
Plan
StCu-EpCu Auto Machine Setup Schedule Machine Setup
Actual
Plan
Barrel Sensor and Positioning Check
Actual
Plan
Test Run And Monitoring
Actual
plan Actual Delay

24. Plating1(RMW) Development Activity
 Progress picture.
Dismanteling line progress Dispose part Dispose part

25. Plating (1) Development Activity
New D.I plant plating 1 layout
Plating manual line
New D.I plant area

26. Improvement Group
Process Development
Thank You.