Thin Wafers, Temporary Bonding Equipment & Materials Market

1. © 2012
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Thin Wafers & Temporary Bonding Equipment & Materials
Market
Memories, Logic, Power Devices & Image Sensors markets will drive thin wafers market
and related handling technologies.
Infineon EVGroup Discera Sony PVA Tepla PlanOptik Matech
SAMPLE

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Why a thin wafers & temporary bonding equipment report?
•This report is an update on two former 2011 Yole reports « Thin Wafer Manufacturing, Equipment & Materials Markets” and “Thin Wafer Market & Applications”.
•Because some thin wafers, specially below 100μm thickness, will need a temporary bonding step, we decide to release this 2012 version bridging the gap between thin wafers and temporary bonding equipment.

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What is NEW/2011 report
•What is new:
–Updated thin wafers forecast 2011-2017
•By application
•By thickness
•By wafer size
–Updated players
–New chapter on Power MOSFETs
•Why thin wafers for power
•Players
•Roadmap
–New chapter on Photovoltaic
•Why thin wafers for PV
•Players
•Roadmap
–New chapter on temporary bonding:
•Players
•Technologies
•Applications
•Challenges
•Equipment forecast 2011-2017
–In units
–In US$
–By application
•Temporary chemistry forecast 2011-2017
•The report is now covering:
–MEMS
–CMOS Image Sensors (incl. BSI)
–Power Devices
–HBLEDs
–RF
–Memory & Logic
–Interposers and Advanced Packaging
–Photovoltaic
•Compared to 2011, we have identified an increasing use for thin wafers in different applications:
–Some MEMS devices are now using temporary bonding for Discear’s oscillators for example
–Power devices wafer are getting thinner with 300 mm wafers coming, requiring 300 mm temporary bonding tools.
–We now count power MOSFETs as devices requiring temporary bonding.
–CIS’ Back Side Illumination is still a big hit for ultra thin wafers (below 10μ thickness). SONY, SONY ERICSSON, SAMSUNG, APPLE are using BSI CMOS Imagers in their camphones.
–The Temporary Bonding equipment market is still small but 3D ICs will be a big push for this technology
–We have estimated what the ratio for thin wafers using temporary bonding will be. We estimate that 10% of the total thin wafers shipment would go through a temporary bonding step by 2017.

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From “standard” thickness to ultra-thin wafers
•The demand for ultra-thin wafers has increased in a wide range of applications such as stacked packages, portable communication devices, smart cards, cellular phones …
•This, in turn, requires new handling technologies. This report is dealing with all thin wafers applications with also a focus on thin wafers requiring temporary bonding step.
High interconnect density:
Aggressive TSV pitch & diameters
IC package devices: Reduced package size and thickness
Power dissipation, higher electrical performance
Technology limit for handling: special equipment and processes are required (e.g. temporary bonding to a support carrier)
Thin wafer drivers
100μ
10μ
1μ
500μ
Standard wafers
Thin wafers
Ultra-thin wafers
SCOPE OF THE REPORT
200μ

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Thin wafer applications covered in the
report
MEMS
CMOS Image
Sensors
Interposers
Source: Micron
3D Stacking of
memory, logic
Power Devices
HBLEDs
RF
Photovoltaic
THIN WAFERS

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Thinned Wafers vs. TOT Number of Shipped Wafers
•By 2017, we estimate the ratio of THIN wafers vs. TOTAL number of wafers (in 300 mm eq.) to be 74%.
•Compared to our 2011 forecasts, a larger growth in thin power devices and 3D stacking explain a larger increase than previously expected.
CAGR
11%
14%
2011
2012
2013
2014
2015
2016
2017
Est 2011 ratio for thin wafers
34%
38%
41%
47%
53%
58%
Est 2012 ratio for thin wafers
39%
43%
47%
53%
61%
69%
74%
0%
10%
20%
30%
40%
50%
60%
70%
80%
Ratio Thinned Wafers/TOT IC Wafers (300 mm eq.)
Thinned Wafers vs. TOTAL IC Wafers (300 mm eq.)
2011 vs. 2012 Forecast comparison

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2011 TOP Thin Wafer Processors (> 10kWSPY)

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Why special thin wafer handling technologies?
•New handling techniques for further wafer processing which must be performed on the backside of thin wafers (starting at 100μ thickness) are required such as temporary bonding/debonding technologies.
•Actually, ginding below 50μm of residual thickness results in a great challenge for thinning and handling of ultra thin wafers in both front-end and back-end processes. Indeed, in this thickness range, the Si device wafer becomes fragile and flexible.
•Today, temporary bonding technologies are numerous with no clear winning scenario coming out today.
–We have identified at least 6 different technologies for temporary wafer bonding with carriers.
–Each one of these approaches might have subtle differences in terms of chemistry, carriers…
–Along with these approaches came temporary bonding without carrier and reconstituted wafer for Fan Out WLP. So, the total number of approaches is more than 10 as of today

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Thin wafer handling solutions
Thin wafer handling
With carrier
Without carrier
Temporary bonding/debonding
Mobile Electro Static Wafer
Adhesive tape
Peripheral Ring
•Disco (TAIKO process)
•DoubleCheck
•Semitool (AMAT)
Carriers/Equipment
•FhG/ProTec
•ProTec/ProTec
Equipment & materials
•TOK
•3M
•Nitto denko
•Lintec
With intermediate layer
Without intermediate layer
Materials
•3M
•TOK
•Brewer Science
•Lintec
•Nitta Haas
•Nitto Denko
•Promerus
•Shin Etsu
•JSR
•Thin Materials AG
Equipment
•EVG
•SUSS MicroTEC
•TEL
•TOK
•3M
•AML

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Who should buy
•Foundries & chip manufacturers
•Get an overview of the large panel of accessible temporary wafer bonding technologies
•Spot the important temporary wafer bonding technologies in the future for your application
•Temporary wafer bonder manufacturers
•Identify and evaluate temporary bonding markets with market size, growth and key customers
•Analyze the threads and opportunities
•Monitor and benchmark your competitor’s advancements
•Chemical companies
•Identify and evaluate what the requirements for temporary bonding materials will be
•Analyze the threads and opportunities
•Financial & Strategic investors
•Understand the main market dynamics and main technological trends
•Get the list of the key players

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