Wafer starts for More than Moore applications 2018 Report by Yole Developpement

Wafer Starts
for More than
Moore Market
trends
-
Sample
2018
From Technologies to Markets
Sample
March 2018

2
ABOUTTHE MAIN AUTHOR
AmandinePIZZAGALLI,Market &TechnologyAnalyst,Equipmentand Materials Manufacturing
Amandine Pizzagalli oversees the equipment and materials fields for the Advanced Packaging and Manufacturing team at Yole
Développement. She graduated as an engineer in Electronics, specializing in semiconductors and nanoelectronic technologies.
Prior toYole,Amandine worked forAir Liquide,with an emphasis on CVD andALD processes for semiconductor applications.
Contact:pizzagalli@yole.fr
Wafer Starts for More than Moore | Sample | www.yole.fr | ©2018
Biography and contact

3
THROUGH STRONG COLLABORATION WITH…
Dr. Ana VILLAMOR,
Market & Technology Analyst,
Power Electronics
Dr. Hong LIN,
Compound Semiconductors
& Power Electronics
Cédric MALAQUIN,
RF Devices & Technologies
Dr. Eric MOUNIER,
Senior Analyst,
MEMS Devices & Technologies
Dr. Guillaume GIRARDIN,
Director,
Photonics, Sensing and Display
Pierre CAMBOU,
Activity Leader,
Imaging & Sensors
Dr. Alexis DEBRAY,
Imaging
Dr. Pierric GUEGUEN,
Business Unit Manager,
Power Electronics, Compound
Semiconductor, Energy
& Battery Management
Zhen ZONG,
Compound Semiconductors
& Power Electronics
Claire TROADEC,
Director,
Power & Wireless

4
COMPANIES CITED IN THE REPORT
Alpha & Omega Semiconductor,Austriamicrosystems (AMS),Broadcom/Avago,Canon,Cavendish
Kinetics,GaN systems, Fairchild Semiconductor,Fuji Electric,Infineon,Ixys,Qualcomm/TDK Epcos,
Qorvo,Microsemi,Microchip,Mitsubishi,Murata,NXP,Omnivision,On Semiconductor,Panasonic,
Renesas,Samsung,Sony,Skyworks,ST Microelectronics, Texas Instrument,Toshiba,Vishay …
(non-exhaustive list)

5
OBJECTIVES OF THE REPORT
• This report is the first to present the entire wafer starts market for More than Moore devices
• The objectives of the report are to
• Assess the wafers market for MEMS & Sensors,CMOS Image Sensors,Power devices,RF devices applications
• Offer market metrics at wafer market level for the entire More than Moore (MtM) industry (2017 - 2023)
• Evaluate market developmentsin terms of market size (volume,value), substrate sizes/formats, and by MtM device
• Discuss the competitive landscape and identify key players in technology development and manufacturing
• Furnish an overview of who is doing what,and the specificities of each market
• Technology process,specification and value chain
• Identify the key drivers that will shape the future MtM market
• Provide a clear overview in terms of wafer shipments, and identify business opportunities in the MtM industry
 An update of this initial report, Wafer Starts for More than Moore Applications, will be released in June with
additional More than Moore applications and components such as photonics, VCSEL,and 2.5D interposer platform
applications
• The report does not cover the following applications
• ROE/DOE µoptics applications
• LED applications
• Flat panel display and panel applications,OLEDs
• Photonics devices,VSCEL
• PV applications

REPORT METHODOLOGY
Technology analysismethodology Information collection

8
TABLE OF CONTENT
Wafer Starts for More than Moore
• Introduction,Definitions& Methodology 6
• Objectives of the report
• Who Should be Interested in this Report?
• Companies Cited in this Report
• Definitions, Limitations & Methodology
• Glossary
• Executive Summary 18
• More than Moore devices technologies overview 32
• Scope of the applications covered
• 2017 – 2023 Wafer demand and shipment Market Forecast (in
wspy)__________________________________________________43
• Breakdown by Wafer Size (4 vs 6 vs 8 vs 12 inch)
• Breakdown by MtM application in 8 inch equivalent
• Breakdown by Semiconductor substrate material
• MEMS & Sensors devices market forecast________________71
• Volume shipments for each MEMS device
• Wafer shipments by wafer size
• CMOS Image Sensors devicesmarket forecast__________81
• in wafer eq. with attached growth rates
• Volume shipments for each CIS device and technology
• Wafer shipments by wafer size and substrate type
• RF devices market forecast___________________________110
• Power devices market forecast_______________________144
• Volume shipments for each power device and technology
• Conclusions________________________________________170
• Appendix Wafer Starts for More than Moore | Sample | www.yole.fr | ©2018

9
An update of this initial report,
Wafer Starts for More than Moore
Applications,will be released in June
with additional More than Moore
applications and components such as:
• Number of wafer starts (units) forecast for the green tick marked are covered in this report
• Red cross stands for applicationsand devices which are not covered in the report
SCOPE OFTHE REPORT
This report
provides an
extensive
review of
wafer market
forecast for
MtM
semiconductor
applications
MEMS& Sensors
Imaging
CMOS image
sensors
Wafer Substrate
RF devices
Photonics &
VCSEL devices
Power
2.5D
interposer
Considered as a technology platform not an
application
Other sensors
like
Fingerprint
sensor
Ambient Light
Sensors

10
SEVEN MEGATRENDS TO BOOST SEMICONDUCTOR INDUSTRY
Smart Automotive &
Electrification
5G HPC / Hyperscale Data Center
AI/ML
AR/VR Mobile
Voice processing

11Wafer Starts for More than Moore | Sample | www.yole.fr | ©2018
0
10 000 000
20 000 000
30 000 000
40 000 000
50 000 000
60 000 000
70 000 000
2017 2018 2019 2020 2021 2022 2023
Wafercountsin8inchequivalent Overall wafer demandfrom 2017 to 2023
Breakdownby More than Moore application(in 8 inch eq)
Power
MEMS & Sensors
CIS
RF
Voice Processing
Mobile
Mobile
Automotive
Automotive:
Electrical vehiclesMobile
Automotive AR/VR
OVERALL WAFER SUBSTRATE OVERALL MARKET SIZE (IN 8 INCH WSPY)
Automotive
Automotive:
Electrical vehicles

12
WAFER SIZEVS APPLICATION/DEVICE COVERED
MtM Device
MEMS & Sensors CIS RF devices Power
Wafer-based
12 inch
8 inch
6 inch
4 inch
3 inch
Substrate size
In development/evaluationIn production

13
OVERALLWAFER MARKET FORECAST FOR MORETHAN MOORE APPLICATIONS
Breakdown byWafer size
6” is now the
dominant size
representing 33%
of total wafer
consumption in
2017.However,
the 8” wafer
demand will then
surpass the 6”
demand driven by
MEMS & Sensors,
Power as well as
RF devices
applications
8’’
12’’
6’’
5’’
4’’
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2017 2018 2019 2020 2021 2022 2023
%surfaceprocessed
Wafer demand for More than Moore devices
Breakdown by wafer size
6’’
5’’
4’’
<4’’ (2’’ & 3’’)
8’’
12’’
(including MEMS & Sensors,CIS, Power,RF devices)

14
MtM Device
MEMS & Sensors CIS RF devices Power
Wafer-
based
12 inch
8 inch
6 inch
4 inch
3 inch
SUBSTRATE TYPE USED BY MORE THAN MOORE WAFER SIZE
Substrate size
Silicon
SiGe
Glass:
SOI
Ceramic
GaN/SiC
SiC
GaAs

15
2017WAFERVOLUME – BREAKDOWN BY SUBSTRATE TYPE
MtM wafer volume - split by substrate type
Silicon substrate is
the main substrate
technology in
2017,with more
than 80% market
share.Although,
alternative
substrate will gain
market share,the
Silicon substrate
will remain the
dominant
semiconductor
material for MtM
applications
Silicon
Ceramic

16Wafer Starts for More than Moore | Sample | www.yole.fr | ©2018
MORE SLIDES EXTRACTS

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Wafer demand (including MEMS & sensors, CIS,
and power, along with RF devices) for More than
Moore (MtM) reached almost 45 million 8-inch
eq wafers in 2017. Wafer demand is expected to
reach more than 66 million 8-inch eq wafers by
2023, with an almost 10% CAGR2017 - 2023
.
Numerous megatrend market drivers will
contribute to MtM devices’ growth : 5G (wireless
infrastructure & mobile), mobile (including
additional functionalities), voice processing,
smart automotive, and Augmented Reality/Virtual
Reality (AR/VR), artificial intelligence.
Driven by the increasing deployment of renewable
energy sources (principally solar energy inverters)
and industrial motor drives, as well as the growing
electric and hybrid vehicles (EV/HEVs) automotive
industry, power devices’ wafer market size will grow
at an almost 13% CAGR2017 - 2023
. In 2017, it accounted
for more than 60% of overall MtM wafer starts and it
will continue dominating the MtM industry.
5G, a hot topic today, will likely be a huge part
of the MtM evolution, bringing any service to any
user anywhere, but also requiring new antennas,
along with filtering functionality. These stringent
requirements will lead to increasing demand for
RF components like RF filters, power amplifiers
(PAs), and low-noise amplifiers (LNAs) to ensure
access to tomorrow’s radio network.
Meanwhile, the demand for advanced mobile
applications that integrate more functionalities will
require aggregating more and more devices such
as fingerprint sensors, ambient light sensors, 3D
sensing, microphones, and inertial MEMS devices.
This will, in the near future, contribute to strong
wafer growth in the MEMS & sensors wafer market.
Additionally, smart automobiles have reached a
new level of complexity requiring the development
and integration of new sensors. As such, we
expect smart automobiles to drive consistent
growth of CIS and sensor wafer production
over the next five years, fueled by the expanding
integration of high-value sensing modules like
radar, imaging, and lidar. Although automotive
will be mainly supported by these growth areas,
classical MEMS & sensors such as MEMS pressure
sensors and inertial MEMS will still continue
growing at a reasonable rate, supporting the
standard automotive world.
This report provides a detailed analysis of the wafer
market forecast by MtM segment application, along
with a comprehensive overview of the market segments
driving MtM devices.
WAFER STARTS
FOR MORE THAN MOORE APPLICATIONS
Market & Technology report - March 2018
MEGATREND MARKETS ARE AT THE HEART OF MORE THAN MOORE’S
WAFER VOLUME EVOLUTION
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow
at an almost 10% CAGR from 2017 to 2023.
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• This report is the first to present
the entire wafer starts market for
More than Moore devices
• 2017 - 2023 overall wafer forecasts
(in units) for More than Moore
markets, including MEMS
sensors, CMOS image sensors,
RF devices, and power devices
(discretes and modules)
• 2017 - 2023 wafer market metrics
in wspy: breakdown by More than
Moore application segment
• Detailed analysis and wafer
forecast for each More than Moore
application segment, plus wafer
market metrics by component type
• 2017 - 2023 wafer market metrics
in wspy: split by wafer size and, by
semiconductor substrate material -
silicon vs. non silicon-based
• Wafer starts analysis by More than
Moore application segment and
split by wafer size
• Overview and positioning of key
players, by More than Moore
device and by substrate type
2
(in million)
Wafercountsin8inchequivalent(inmillion)
10
20
30
0
40
50
60
70
2017 2018 2019 2020 2021 2022 2023
PowerMEMS SensorsRF CIS
Voice Processing
Mobile
Mobile
Automotive
Automotive:
Electrical vehiclesMobile
Automotive AR/VR
Automotive
Automotive:
Electrical vehicles
(Yole Développement, March 2018)
Overall wafer demand from 2017 to 2023
Breakdown by More than Moore device (in 8 inch eq)
WHAT ABOUT THE REPORT?
An update of this report will
be released in June 2018 with
additional More than Moore
applications and components
analysis such as:
• photonics
• VCSEL
• Sensors like fingerprint sensors,
ambient light sensors...
• 2.5D interposer platform applications
Customers of this report will
automatically receive the June update.

WAFER STARTS FOR MORE THAN MOORE APPLICATIONS - VOLUME 1
DESPITE SILICON’S DOMINANCE IN THE SEMICONDUCTOR AREA, ALTERNATIVE
SUBSTRATES ARE DISRUPTING THE MORE THAN MOORE MARKET
Regarding semiconductor material, although silicon is
by far the most dominant (with more than 80% market
share), alternative non-silicon-based substrates
like SiGe, GaAs, GaN, and SiC are increasing their
importance within the MtM industry. Choosing
the right substrate technology will strongly depend
on the technical performance associated with the
megatrends’s requirements, as well as the cost.
In the case of high-temperature applications, SiC
will stay the preferred choice while GaN is better
adapted for low-power DC/DC and AC/DC
converters. Moreover, SiC transistors are particularly
advantageous for high-voltage and high-rating
applications, and thus are considered as a technology
choice for some MOSFET and diode products.
GaN could possibly reach high-voltage values, but
would require bulk GaN as the substrate, which is
currently impossible. However, due to their power
efficiency and broadband capability, both GaN-on-
SiC and GaN-on-Si are very good candidates for RF
power devices, especially for macro base stations.
Meanwhile, silicon cannot compete in high-frequency-
range RF applications due to its limitations in terms of
insertion loss and dielectric constant.
Looking ahead, glass is an appealing choice for low-
power consumers like RF IPD, and high-frequency
applications requiring low dielectric loss and low
insertion loss. However, glass exhibits bad heat
conductivity and thus is not compatible with solid-
state RF components like PAs/LNAs and RF switches.
GaAs is not optimized for high-power applications like
macro base stations. However, thanks to its maturity,
its satisfying out-power, and its good linearity, GaAs
is being used for PA devices. Furthermore, GaAs is
especially advantageous for small-cell implementation
for both sub-6Ghz and the first mmWave small cells
(28GHz - 39GHz range). Meanwhile, SiGe, ceramic,
and SOI are the dominant technologies for LNAs, RF
BAW (Bulk Acoustic Wave) filters, and RF switches,
respectively.
In terms of wafer size, the MtM wafer market -
including MEMS sensors, CIS, and power (MOSFETs,
IGBTS, thyristors, and diodes (excluding Power ICs)),
along with RF devices - is dominated by the 6-inch
wafer format, followed by the 8-inch size, which is
mostly supported by power device applications.
However, though 6-inch will continue increasing in the
next few years, its share will decrease compared to
8-inch. Indeed, we expect 8-inch wafer diameter to
progress significantly and surpass the 6-inch wafer size
by 2023. This transition will be driven first by power
and MEMS sensor applications, where the vast
majority will convert their components from 6-inch
to 8-inch over the next five years due to increasing
volume production.
Nevertheless, 12-inch will represent the fastest
growth from 2017 - 2023, with a 15% CAGR. We
expect 12-inch wafer demand to grow from 3.3 million
units in 2017 to 7.5 million in 2023, mainly fueled by
Backside Illumination CMOS Image Sensors (BSI CIS)
(3D stacked BSI, 3D hybrid BSI). On the other side,
4-inch wafer diameter is in large demand today for
MtM applications driven by RF SAW (Surface Acoustic
Wave) filter products. However, 4-inch’s adoption will
decrease due to the transition from 4-inch to 6-inch
for these applications.
We still see some MtM products manufactured in wafer
sizes below 4-inch, i.e. 3-inch and 2-inch wafer formats.
However, these represent a very small volume, and we
expect such sizes to die out (aside from small volumes still
used for producing MEMS, power, and RF SAW devices).
This report offers a comprehensive overview of wafer
starts market data, split by wafer size for MtM devices
and including the following fields: MEMS sensors, CIS,
RF devices, and power devices. This report also furnishes
a more in-depth analysis of the wafer starts split, with a
separate forecast by type of component for each MtM
device covered.
Substrate type used by More than Moore wafer size
More than Moore Device
PowerMEMS Sensors CIS RF devices
Wafer-based
12 inch
8 inch
6 inch
4 inch
3 inch
Substrate size
Silicon
SiGe
Glass
:
SOI
Ceramic
GaN/SiC
SiC
GaAs
Wafer demand for More than Moore devices
Breakdown by wafer size - including MEMS Sensors, CIS, Power, RF devices
%surfaceprocessed
100%
75%
50%
25%
0%
2017 2018 2019 2020 2021 2022 2023
8’’
12’’
6’’
5’’
4’’4’’ (2’’ 3’’)
6-INCH AND 8-INCH ARE FORECAST TO REPRESENT MORE THAN 60% OF
MORE THAN MOORE WAFERS’ TOTAL WAFER CONSUMPTION

Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Alpha Omega Semiconductor, Austriamicrosystems (AMS), Broadcom/Avago, Canon, Cavendish
Kinetics, GaN Systems, Fairchild Semiconductor, Fuji Electric, Infineon, Ixys, Qualcomm/TDK Epcos,
Qorvo, Microsemi, Microchip, Mitsubishi, Murata, NXP, Omnivision, On Semiconductor, Panasonic,
Renesas, Samsung, Sony, Skyworks, STMicroelectronics, Texas Instruments, Toshiba, Vishay, and more
AUTHOR
Amandine Pizzagalli is a Technology
Market Analyst at Yole Développement
(Yole). Amandine is part of the development
oftheAdvancedPackagingSemiconductor
Manufacturing Business Unit of Yole with
the production of reports and custom
consulting projects. She is in charge of
comprehensive analyses focused on
semiconductor equipment, materials and
manufacturing processes.
Previously, Amandine worked as Process
engineer on CVD and ALD processes for
semiconductor applications at Air Liquide.
Amandine was based in Japan during one
year to manage these projects.
Amandine is graduated in Electronics
from CPE Lyon (France), with a technical
expertise in Semiconductor Nano-
Electronics and has a master focused on
Semiconductor Manufacturing Technology,
from KTH Royal Institute of Technology
(Sweden).
She has spoken in numerous international
conferences and has authored or co-
authored more than 10 papers.

Introduction, definitions methodology 6
Report objectives
Who should be interested in this report?
Companies cited in this report
Definitions, limitations methodology
Glossary
Executive summary 18
More than Moore devices technologies
overview 32
Scope of the applications covered
2017 - 2023 wafer demand and shipment market
forecast (in wspy) 43
Breakdown by wafer size (4 vs. 6 vs. 8 vs. 12-inch)
Breakdown by MtM application in 8-inch equivalent
Breakdown by semiconductor substrate material
MEMS sensors - Device market forecast 71
Volume shipments for each MEMS device
Wafer shipments by wafer size
CMOS image sensors - Device market forecast 81
In wafer eq. with attached growth rates
Volume shipments for each CIS device and technology
Wafer shipments, by wafer size and substrate type
RF devices - Market forecast 110
Power devices - Market forecast 144
Volume shipments for each power device and
technology
Conclusions 170
TABLE OF CONTENTS (complete content on i-Micronews.com)
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OBJECTIVES OF THE REPORT
• Assess the wafer market for MEMS sensors, CMOS image sensors, RF devices, and power
devices applications
• Offer market metrics at wafer market level for the entire More than Moore (MtM) industry
(2017 - 2023)
• Evaluate market developments in terms of market size (volume, value), substrate sizes/formats,
and by MtM device
• Discuss the competitive landscape and identify key players in technology development and
manufacturing
• Furnish an overview of who is doing what, and the specificities of each market
• Technology process, specification, and value chain
• Identify the key drivers that will shape the future MtM market
• Provide a clear overview in terms of wafer shipments, and identify business opportunities in the
MtM industry
• Status of the MEMS Industry 2017
• Status of the CMOS Image Sensor Industry 2017
• Power MOSFET 2017: Market and Technology
Trends
• IGBT Market and Technology Trends 2017
• Status of the Power Electronics Industry 2017
• Power SiC 2017: Materials, Devices, Modules,
and Applications
• Bulk GaN Substrate Market 2017
• RF GaN Market: Applications, Players,
Technology, and Substrates 2018-2023
• RF Front End Modules and Components for
Cellphones 2017
Find all our reports on www.i-micronews.com
Similarly, although InP substrate is considered as
a promising solution from a performance point
of view to enter the small cell market towards
higher mm wave frequencies in a range of
60GHz - 70GHz, the technology’s accessibility
in terms of volume and players might still be
limited. However, GaAs and InP are attractive
solutions for photonics applications, while GaN
could be an enabler for 5G infrastructure with
increasing frequencies and high data rates, where
power efficiency remains crucial. In this respect,
numerous non-silicon-based semiconductor
substrates could in the long-term make serious
inroads in the MtM market.
This report offers a comprehensive overview of the
semiconductor substrates used in MtM applications,
as well as technology trends and a wafer market
forecast by application and component type.
Moreover, a detailed analysis of the wafer forecast
(split by wafer size and substrate type) has been
calculated for the 2017 - 2023 timeframe.

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Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software

OUR 2018 REPORTS COLLECTION (1/3)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
− Sensors for AR/VR 2018
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− Gas Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – byYole Développement
− RF Front End Module and Connectivity for Cellphones 2018 – Update
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2018 - Update
− RF GaN 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018
− RF Photonic Technologies for 5G Infrastructure 2018
− RF Front-End Modules in Smartphones
− RF GaN *
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module Industry 2018 - Update
− 3D Imaging and Sensing 2018 - Update
− Imaging for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
− CMOS Image Sensors
− Compact Camera Modules
− LiDAR – Patent Landscape Analysis
− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
Update : 2017 version still available / *To be confirmed

ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates
Like PCB Trends
− Fan-Out Packaging 2018 – Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 – Update
− MEMS Packaging and Testing 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI: Integration Challenges 2018
− Integrated Passive Devices (IPD) 2018
− RF Front-End SiP
− Fan-Out Packaging *
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
− Manufacturing Wafer Starts for More than Moore 2018
− Equipment for More than Moore: Technology Market Trends for Lithography
Bonding/Debonding 2018
− Equipment for More than Moore: Technology Market Trends for Thin Film
Deposition Etching 2018
− Wafer Bonding Technology Overview 2018
MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Memory Market 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement
− Memory Pricing 2018 (NAND DRAM)
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – byYole Développement
− Status of Compound Semiconductor Industry 2018 *
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN 2018 – Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Power SiC Devices
− Power GaN Devices
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Landscape Analysis

POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update
− EV/HEV Market Expectations and Technology Trends - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
− Power ICs Market 2018 – Update
− Power ICs Market 2018 *
− Power Modules *
BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry Update with Focus on Manufacturing 2018 *
− Battery Pack Technology and Business Opportunities 2018 - Update
− Solid-State Batteries – Patent Landscape Analysis
SOLID STATE LIGHTING
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− Lasers 2018
− Light Shaping Technologies 2018
− LiFi 2018
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
Update *
− Displays for AR / VR / MR 2018
− Non Display Applications of MicroLEDs 2018 *
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− Status of the BioMEMS Industry 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update
− Neuro-Technologies for Healthcare and Consumer Applications 2018
− CRISPR Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS (1/3)
MEMS SENSORS
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING PHOTONICS
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES ANDTECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
− Embedded Software in Vision Systems
MEDTECH
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology Market Analysis 2017

OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
SOLID STATE LIGHTING
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Management ICs Market 2017
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
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CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US Canada
Email: laferriere@yole.fr – +1 31 06 008 267
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• Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US Canada
Email: laferriere@yole.fr – +1 31 06 008 267
• Troy Blanchette, Senior Sales Director for Eastern US Canada
Email: troy.blanchette@yole.fr – +1 704 859 0453
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
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