Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reverse costing report published by Yole Developpement

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
March 2016 – Version 1 – Written by Stéphane ELISABETH

Qorvo TQF-6405
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Observations
– Reverse Costing Methodology
2. Company Profile 9
– Qorvo
– Qorvo Filter & Duplexer
– Mobile Data Front-End Module Details
3. Physical Analysis 14
– Synthesis of the Physical Analysis
– Apple iPhone 6s Plus Disassembly 16
– iPhone Opening
– Die Removal
– Packaging 19
– View, Dimensions & Marking
– Package Opening
– Filter Die Function
– FEM Cross-Section
– Power Amplifier Die 30
– PA Cross-Section
– SPDT Die 34
– SPDT Die Cross-Section
– SMR-BAW Filter Die 39
– Filter Die Main Block ID
– SMR-BAW Filter Overview
– SMR-BAW Filter Cavity & Copper Pillar Cross-Section
– SMR-BAW Filter Cavity & Copper Pillar Details
– SMR-BAW Die Cross-Section
– Process Characteristics
4. Manufacturing Process Flow 52
– Component Process Flow
– Component Fabrication Unit
– MEMS SMR-BAW Filter Process Flow
– MEMS SMR-BAW Filter Wafer Fabrication Unit
– MEMS Filter : SMR-BAW Process Flow
– MEMS Filter : Cavity & Copper Pillar Process Flow
– Component Packaging
5. Cost Analysis 65
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– MEMS Wafer Front-End Cost
– MEMS Front-End Cost
– MEMS Wafer Cost
– MEMS Die Cost
6. Estimated Price Analysis 77
– Manufacturer Financial Ratios
– TQF6405 Estimated Selling Price
7. BAW Filter Comparison 81
Contact 86

Qorvo TQF-6405
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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Qorvo TQF-6405.
• Qorvo TQF-6405 is a front-end module LTE band device aimed at use in Apple IPhone 6S Plus.
• The TQF-6405 features power amplifier and filtering in different LTE band manufactured with Triquint
proprietary solid mounted resonators (SMR) process and Cu-flip™ technology.
• The analysis is focused in SMR BAW filter.
• Cu-Flip™ is an advanced flip-chip technology that uses copper "bumps" to replace wire bonds.
Triquint use the Cu-Flip™ technique to package custom-design integrated circuits with other
components into compact modules.
• Based on complete physical analysis of the TQF-6405 component, this report provides the
manufacturing cost of the BAW filter die. It will be compared to the Avago AFEM-8030.
• The AFEM-8030 have been found also in the Apple IPhone 6S Plus. The analysis of the AFEM-8030 is
available in a separate report.

Qorvo TQF-6405
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Main Board (Top Side)
LTE FEM area
• The front-end module from Qorvo is located on the
main board. Two other front-end module working on
different band are close to it: SKY77812 from Skyworks
for Low band LTE Tx/Rx, and Avago AFEM-8030 for Mid
band LTE Tx/Rx.

Qorvo TQF-6405
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• Package Type : 40-pin QFN
• Dimensions : 4.806 x 6.695 x 0.9 mm (32.18 mm² x 0.9 mm)
• Pin Pitch : 0.5 mm
• Marking : TQF6405
1527 CHIN
AR5155 Package Top view
Package Bottom view
Package Side view

Qorvo TQF-6405
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Qorvo TQF-6405
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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the
manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
o Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole Développement
Email: levenez@yole.fr
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Email: katano@yole.fr
– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
o Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
– Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
– Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
o General: Email: info@yole.fr

Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reverse costing report published by Yole Developpement

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Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reverse costing report published by Yole Developpement