Maxim Integrated MAX21000 3-Axis MEMS Gyroscope teardown reverse costing report by published Yole Developpement

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quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
June 2014 – Version 1 – Written by Romain Fraux

Maxim MAX21000 3-Axis MEMS Gyroscope
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8
– Maxim Integrated
– MAX21000 Characteristics
3. Physical Analysis 16
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package 19
– Package Views & Dimensions
– Package Pin Out
– Package Opening
– Wire Bonding Process
– Package Cross-Section
– ASIC Die 34
– View, Dimensions & Marking
– Delayering
– Main Blocks Identification
– Cross-Section
– Process Characteristics
– MEMS Die 45
– View, Dimensions & Marking
– Bond Pad Opening
– Cap Removed & Cap Details
– Sensing Area Details
– Cross-Section (Sensor, Cap & Sealing)
– Process Characteristics
– Consumer 3-Axis Gyro Comparison 77
– Comparison with STMicroelectronics, Bosch Sensortec
and InvenSense
4. Manufacturing Process Flow 82
– Global Overview
– ASIC Front-End Process
– ASIC Wafer Fabrication Unit
– MEMS Process Flow
– MEMS Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
5. Cost Analysis 100
– Main steps of economic analysis
– Yields Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test & Dicing
– ASIC Wafer & Die Cost
– MEMS Front-End Cost
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Front-End Cost per process steps
– MEMS Front-End: Equipment Cost per Family
– MEMS Front-End: Material Cost per Family
– MEMS Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test Cost
– MAX21000 Component Cost
– Consumer 3-Axis Gyro Cost Comparison
6. Estimated Price Analysis 130
– Manufacturer Financial Ratios
– Estimated Selling Price
Contact 135

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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Maxim MAX21000 3-Axis Gyroscope.
• The MAX21000 is an ultra-accurate, low power consumption MEMS gyroscope assembled in
industry’s smallest and thinnest 3.0 x 3.0 x 0.9mm LGA package. It is suitable for both user interface
(UI) and optical image stabilization (OIS) applications.
• The MEMS sensor is manufactured with the PSM-X2 process jointly developed by SensorDynamics
(acquired by Maxim in 2011) and the Fraunhofer Institute for Silicon Technology.
 This technology platform includes a proprietary surface micromachining process to build the
mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic
encapsulation of the gyro sensor.
• Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and
Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35%
reduction in silicon area for the MEMS die, enabling a significant cost advantage. Nevertheless,
Maxim uses a fabless model for this component reducing considerably this advantage.
• Another comparison with latest generation of InvenSense Gyro using also a fabless approach lets
appear that the silicon area reduction obtained by Maxim will not be sufficient to compete with
innovating processes like the one of InvenSense or mCube.

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Die Size Evolution of MEMS Gyroscopes
Source: Yole/S+C Inertial MEMS Manufacturing Trends 2014
• Upon components we
analyzed since 2010, the
MAX21000 currently offers
the smallest MEMS gyro
die area!
Gyroscope MEMS Die Size Evolution (3-axis)

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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

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Package Side View
• Package: LGA 16-pin
• Dimensions: 3.0 x 3.0 x 0.9mm
• Pin Pitch: 0.5mm
• Marking:
MXG3A
1329I
010FA
Package top view
Package back view
Orientation of Axes
(from datasheet)

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• The die marking includes the logo of Maxim Integrated and:
VI02B-0
2012 ©Ⓜ 92
ASIC Die Marking

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MEMS Sensor MEMS Cap

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Reverse costing analysis represents the best cost/price evaluation given the publically
available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to
a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
Please contact us:
Europe & USA Office
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email:
jourdan@yole.fr
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
Korea Office
• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810
- Fax: (82) 2 2010 8899 – Email: yang@yole.fr

Maxim Integrated MAX21000 3-Axis MEMS Gyroscope teardown reverse costing report by published Yole Developpement

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Maxim Integrated MAX21000 3-Axis MEMS Gyroscope teardown reverse costing report by published Yole Developpement