Emerging Non-Volatile Memory 2020 report by Yole Développement

From Technologies to Markets
© 2020
From Technologies to Markets
Emerging Non-
Volatile Memory
2020
Market and Technology
Report 2020
SAMPLE

2
Emerging NVM Market Forecast (2019-2025) 181
MRAM Market Forecast – in units, $M, Gb and 12’’ eq. wafers 195
PCM Market Forecast – in units, $M, Gb and 12’’ eq. wafers 202
RRAM Market Forecast – in units, $M, Gb and 12’’ eq. wafers 216
MRAMTechnology, Roadmaps and Players
Technology description, time to market, key players, key products, main trends
223
PCMTechnology, Roadmaps and Players
248
RRAMTechnology, Roadmaps and Players
271
Other Emerging NVMTechnologies (NRAM, FeFETs) 294
China Memory Landscape 302
Summary and Conclusions 314
Noteworthy News 2018-2019
Players’ announcements, technical demonstrations, and highlights from IEDM ‘19
323
Mergers & Acquisitions, Partnerships and Funding 336
How should you use our data? 345
Yole’s Presentation 346
Scope, Objectives and Methodologies 13
Three Slides Summary 23
Executive Summary 27
Context - Overview of the Memory Business 56
Stand-Alone Memory – NAND, DRAM, NOR, (NV)SRAM 61
Embedded Memory – eFlash, eDRAM, SRAM 78
Memory Market Players 88
Overview Emerging Non-Volatile Memory 104
Emerging Non-Volatile Memory Applications 118
Fast/Reliable Memory for Industry, Defense, etc. (NVRAM) 125
Code/Data Storage (NOR-like) 130
Persistent Memory (NVDIMM) 134
Low-Latency Storage (SCM Drive) 141
Embedded NVM for Analog ICs (EEPROM/eFlash-like) 146
Embedded NVM for MCU, SoC,ASIC, etc. (Slow-SRAM/eFlash-like) 150
Embedded Cache Memory for CPU/APU (SRAM/eDRAM-like) 164
Embedded NVM for AI (In-Memory Computing) 174
TABLE OF CONTENTS
Emerging Non-Volatile Memory 2020 | Sample | www.yole.fr | ©2020

33
ABOUT THE AUTHORS
Biographies & contacts
Simone Bertolazzi,PhD
Simone is a Technology & Market analyst at Yole Développement (Yole) working within the Semiconductor & Software division. He is member of
Yole’s memory team and contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and
fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging
semiconducting materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals (>3,000 citations)
and was awarded the prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique
Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics.
Simone earned a double M.A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Contact: bertolazzi@yole.fr
Emilie Jolivet
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages
the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships
with semiconductor leaders and the development of market research and strategy consulting activities. With previous collaborations at Freescale
and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software &
computing. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated
with an MBA from IAE (Lyon, France).
Contact: jolivet@yole.fr

44
4DS,Adesto,Aeroflex,Antaïos,Apple,Applied Materials,ARM,Avalanche, Buffalo, Canon Anelva, CEA Leti,
ChangXin MemoryTechnologies, Cisco, Crocus Nanoelectronics, Crossbar, Cypress, Dell, eBay, EMC, Evaderis,
Everspin, Facebook, Ferroelectric Memory Company, Fujitsu, Fusion IO, GigaDevice, GlobalFoundries, Google, H-
Grace, Hikstor, HLMC, Honeywell, HP, HProbe, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel,
ITRI, Jiangsu Advanced MemoryTechnology, Kioxia, Lenovo, Macronix, Maxim, Materion, Mediatek, Microchip,
Micron, Mythic, Nantero, Nanya, NationalTsing Hua University, NEC, NetApp, Nike, Nokia, Numen, Numonyx,
NXP, Panasonic, Qualcomm, Quantum, Rambus, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Smart
ModularTechnologies, SMIC, Sony, Spansion, Spin Memory, Spintec, Spreadtrum, STMicroelectronics, Stanford
University, Syntiant,TDK,Tezzaron,Tohoku University,TEL,TEL Magnetic Solutions,Teledyne e2v,Toshiba,Towerjazz,
TPSCo,Tsinghua Unigroup ,TSMC, UMC,Violin Memory,Weebit,Western Digital,Winbond, XFab, XMC,YMTC,
various emerging Chinese NVM players, and more.
COMPANIES CITED IN THIS REPORT

5
REPORT OBJECTIVES
• Present an overview of the semiconductor memory market:
• Stand-alone (NAND, DRAM, NOR, etc.) and embedded memory (eFlash, SRAM): main markets, trends
• Technology status, and roadmap for the coming years
• Provide an understanding of emerging NVM applications:
• Market drivers & challenges, technology roadmap, players, and main trends are provided for a total of 10 application
fields: 5 for stand-alone and 5 for embedded.A roadmap with time-to-market (by application) is provided.
• Offer market forecasts for emerging NVM business:
• 2019-2025 market forecast in US$, M Gb, number of dies, wafer starts.
• Price evolution, by application and technology
• Forecast for 10 applications and 3 technologies (MRAM, RRAM, PCM)
• Describe emerging NVM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market
• Roadmap with technological nodes, and chip density evolution with main players
• Latest product development status for each key market player
• Detail and analyze the competitive landscape:
• Recent acquisitions and funding
• Latest company news
• Key players, by technologies and applications

6
2020 REPORT UPDATES
New content compared to the 2018 version
 Assessment of two newly-emerging market applications
 Embedded non-volatile memory for Analog IC products (EEPROM/eFlash replacement)
 Stand-alone code / data storage (NOR Flash replacement)
 Re-definition of the storage class memory (SMC) market segment with breakdown into the following categories:
 Persistent Memory, i.e. non-volatile memory modules based on emerging NVM media (e.g. 3D XPoint)
 Low-latency storage, i.e. solid-state drive for datacenter and client applications
 Updated analysis of the overall stand-alone and embedded memory markets
 Updated market forecast and technical trends for PCM, MRAM, and RRAM
 Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players
 Analysis of Intel Optane’s NVDIMM and SSD: market and technology, ecosystem, present and future competitors (e.g. Micron’s X100).
 Description of the latest foundries’ technology processes and analysis of new IC products incorporating embedded emerging NVM.
 Analysis of In-Memory-Computing (IMC) approaches Neural Network (NN) computation with emerging memories.
 Update on newly-emerging technologies, including new ferroelectric memories and nanotube RAM (NRAM)
 Updated analysis of new entrants and startup funding
 Comprehensive list of companies’ announcements, press releases, industry news and highlights from the IEDM ’19 conference.

77
REPORT METHODOLOGY
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information

8
WHO SHOULD BE INTERESTED IN THIS REPORT?
IC manufacturers and vendors, and IP sellers:
o Evaluate the market potential of future technologies
and products for new applicative markets
o Screen potential new suppliers for introducing new
disruptive technologies
o Monitor and benchmark your competitors’
advancements
Memory players :
o Evaluate the market potential of emerging memory
technologies
o Screen potential applications and partners
o Monitor and benchmark your competitors’
advancements
Open foundries and IDMs:
o Spot new opportunities and define diversification strategies
o Position your company in the future of memory
technologies
Equipment & material manufacturers:
o Understand emerging memory business and ecosystem
dynamics
o Discern the differentiated value of your products and
technologies in this market
o Identify new business opportunities and prospects
Financial & strategic investors:
o See the potential of new memory technologies
o Obtain a list of key companies and start-ups

9Emerging Non-Volatile Memory 2020 | Sample | www.yole.fr | ©2020
STAND-ALONE MEMORY MARKET – NAND AND DRAM
• NAND and DRAM account for ≈XX% of the overall stand-alone memory market.
• Combined NAND and DRAM revenue was ≈ $XXX billion in 2019, down XX% from 2019.
2019 Memory Market - Breakdown byTechnology
Total Stand-Alone Market in 2019 ≈ $XXXB
Revenuein$B
GrowthofRevenue(%)

10
STAND-ALONE MEMORY MARKET – OTHERTECHNOLOGIES
• DRAM and NAND together represent ~XX% of the
stand-alone memory market.
• The remaining ~XX% of the market (~$XXB) consists of:
- Flash NOR (~$XX)
- EEPROM, EPROM, Mask PROM/ROM, etc. (~$XX)
- Volatile RAM (~$XX)
• Asynchronous SRAM
• Synchronous SRAM
- Non-Volatile RAM (~$XX)
• nvSRAM
• BBSRAM
• FeRAM
- Stand-alone emerging NVMs (~$XX)
• Compared to NAND and DRAM, these markets are
much less volatile and relatively more stable.
Total Stand-Alone Market in 2019 ~ $XX billions

11
EMBEDDED MEMORY - MARKET SIZE ESTIMATE
o MCU memory business:
oNVM: ~ $XX, equal to XX% of the MCU market
oSRAM: ~ $XXB, equal to XX% of the MCU market
o Mobile AP memory business:
oSRAM: ~ $XXB, equal to XX% of the AP market
o CPU and GPU memory business
oSRAM: ~ $XXB, equal to XX% of the CPU market
oSRAM: ~ $7B, equal to XX% of the GPU market
• Total embedded memory market ~$XXB.
Embedded Memory Market
Breakdown byTechnology
Embedded Memory Market Estimate
~ $XXB

12
EMERGING NVM – APPLICATION OVERVIEW
Emerging NVM applications
Fast / Reliable
Memory
Code / Data
Storage
Persistent
Memory
Low-Latency
Storage
NVM in
Analog ICs
NVM in MCU,
SoC,ASIC, etc.
Cache Memory
(Last Level)
NVM for AI
Stand-alone Embedded
Increasing capacity Increasing capacity
• Industrial
automation
• Transport
• Aerospace
• Medical
• Gaming
• Network &
Infrastructure
NVRAM NOR-like NVDIMM
• Datacenters
• Workstations
• XIP memory
• IoTs
• Consumer
• Automotive
Drives
• Client SSDs
• Enterprise:
- SCM-based SSD
- Storage Accelerators
- Network cards
-Write cache in SSD
- Journaling, log, data
buffering and streams
EEPROM / eFlash-like
in Analog ICs
• Data/code storage and
trimming in:
-PMIC
- Sensors
- Audio
- LED drivers
MCUs and SoCs
In-Memory
Computing ICs
ASICs and ASSPs:
• IoT /Wearables
• General Purpose
• Automotive
• Memory buffers:
- Display Driver ICs
- CMOS Image Sensors
CPU
Mobile AP • AI inference

13
STAND-ALONE EMERGING MEMORY MARKET OPPORTUNITIES
Density and price positioning for stand-alone applicationsPriceperGb($/Gb)
10 Mb 100 Mb 1Gb 10Gb 100Gb
Stand-alone Emerging NVM
Established stand-alone memory
1Tb1 Mb0.1Mb
0.1
100
1
10
0.01
1,000
0.001
10,000
(NV)SRAM
FRAM
EEPROM
Persistent Memory
Low-Latency Drives
Fast/Reliable Memory
Code/Data Storage
© Yole Development, January 2020
NOR
DRAM
NAND
Low density Medium density High density
Note: the bubble size is
indicative of the market size

14
EMERGING MEMORY -TECHNOLOGIES AND KEY PLAYERS
PCM: Phase-Change Memory
RRAM: Resistive Random-Access Memory
STT-MRAM: Spin-TransferTorque Magnetic RAM

OVERVIEW OF EMERGING NVM TECHNOLOGIES

17
FORECAST 2019-2025

18
MRAM TECHNOLOGY, ROADMAP AND PLAYERS

19
PCM TECHNOLOGY, ROADMAP AND PLAYERS

20
RRAM TECHNOLOGY, ROADMAP AND PLAYERS

21
FOCUS ON 3D XPOINT

2222
NAND DRAM NOR 3D XPoint
Alliance: Kioxia-WD Micron acquired Inotera memory from Nanya in 2016
WD acquired
SanDisk in 2016
Intel-Micron JV - IMFT
(from 2006 to 2019)
STAND-ALONE MEMORY BUSINESS - MAIN PLAYERS
Cypress and Spansion
merged in 2014
In 2018, SK hynix and
Cypress entered into a JV
for NAND Flash business
Micron is the
only player
focusing on all
the four
major stand-
alone
technologies
JV SkyHigh Memory

23
EMBEDDED EMERGING NVM BUSINESS
Key partnerships and developments for the top players
Foundry / IDM
Other /To be
announced
RRAM Players Bulk 22nm
(sampling)
Bulk 28/22nm
(in development)
22nm FinFET
(in development)
28/22nm
(STT-)MRAM
Players
22nm bulk
(pre-production)
22nm FD-SOI
(pre-production)
28nm FD-SOI
(mass production)
28/22nm bulk
(in development)
22nm FinFET
(pre-production)
28/22nm
PCM Players 28nm FD-SOI
(sampling)
 Strategic alliances are essential for mass adoption of emerging NVM

24
CHINA MEMORY LANDSCAPE AND OTHER EMERGING NVM

25
Contact our
SalesTeam
for more
information
25
Contact our
SalesTeam
for more
information
Neuromorphic Sensing
and Computing 2019
Status of the Memory
Industry 2019
MRAMTechnology and
Business 2019
DRAM & NAND Service
– Memory Research
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement

26
Contact our
SalesTeam
for more
information
26
Contact our
SalesTeam
for more
information
LPDDR4 Memory
Comparison 2019
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting

27
CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US & Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• ChrisYouman, Senior Sales Director for Eastern US & Canada
Email: chris.youman@yole.fr – +1 919 607 9839
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business Development
(India & ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Ohtake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan & Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Toru Hosaka, Business Development Manager (Japan)
Email: toru.hosaka@yole.fr - +81 90 1775 3866
• Korea: Peter Ok, Business Development Director
Email: peter.ok@yole.fr - +82 10 4089 0233
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809 / +86 136 61566824
• Europe & RoW: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
o FINANCIAL SERVICES (in partnership withWoodside Capital
Partners)
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• CamilleVeyrier, Director, Marketing & Communication
Email: veyrier@yole.fr - +33 472 83 01 01
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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About Yole Développement | www.yole.fr | ©2020

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