Emerging Non-Volatile Memory 2018 - Market and Technology Report by Yole Développement

February © 2015
From Technologies to Market
Emerging Non-
Volatile Memory
(NVM) 2018
SAMPLE
FromTechnologies
to Market
Cover source: Getty Images
© 2018

2
Biography & contact
ABOUT THE AUTHORS
Simone Bertolazzi,Ph.D.
Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division.
He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memory
technologies, their related materials and fabrication processes.
Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed
novel flash memory device based on heterostructures of 2D materials and high-κ dielectrics.
Contact: bertolazzi@yole.fr
Yann de Charentenay
Yann de Charentenay works as a Technology & Market Senior Analyst for Yole Développement (Yole). As part of the
Semiconductor division, Yann is strongly involved in the technology & market analysis of the applications of disruptive
technologies and components: memory, MEMS and sensors... Yann is daily contributing to the development of Yole’s activities
with a dedicated collection of market & technology reports as well as custom consulting projects.
Prior his mission at Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique (CEA, France)
as well as a consultant at Algoe (France). He has spoken in numerous international conferences and has authored or co-
authored numerous press articles.
Yann graduated from the University of Compiegne (France) with a master degree in innovation management. He is also
graduated from INP Phelma (Grenoble, France) with a master degree in materials science.
Contact: decharentenay@yole.fr
©2018 | www.yole.fr | Emerging Non-Volatile Memory - Sample

3
4DS,A*STAR,Adesto,Aeroflex,Apple,Atmel,Avalanche, Buffalo, Canon, CEA Leti, Cisco, CNE, Crocus, Crossbar, Cypress, Dell,
EBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated
Circuit Co., Ltd, Gemalto, Giesecke & Devrient, GigaDevice, GlobalFoundries, Google, Hefei Chang Xin, H-Grace, Hikstor, HLMC,
Honeywell, HP, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Macronix, Materion, Maxim,
Mediatek, Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia,
Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum, Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI,
Sino King Technology, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum, STMicroelectronics,
Stanford University, STEC, Sun, Syntiant,TDK,Tezzaron,TMS,Tohoku University, TEL,TEL Magnetic Solutions,Teledyne e2v,Toshiba,
Towerjazz,TPSCO,Tsinghua Unigroup ,TSMC, UMC,Violin Memory,Weebit,Western Digital,Winbond, XFab, XMC,Yangtze River
Storage Technologies, new Chinese emerging NVM players and more.
COMPANIES CITED IN THIS REPORT

4
TABLE OF CONTENTS
Executive summary
Standard memory market introduction
Market and technology overview
• NAND
• DRAM
• NVDIMM
• Niche stand-alone memory
• Embedded MCU/SoC memory
Memory market players overview
China memory landscape
Emerging NVM overview
Emerging NVM applications
Market segments
• Industrial,Transportation & Consumer Electronics
Applications
• Enterprise Storage SCM Applications
• Client SCM Applications
• Mass Storage NAND Applications
• Embedded NVM in Microcontrollers (MCUs)
• Embedded Cache Memory in Mobile Devices
• Embedded Cache Memory in High-End Processors
• Embedded NVM for Artificial Intelligence
13
44
54
86
95
100
127
138
MRAM/STT-MRAM technology, forecast, and players
• Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
RRAM technology, forecast, and players
PCM technology, forecast, and players
Other emerging NVM
General conclusions
Noteworthy news 2017-2018
Yole Développement’s presentation
190
215
242
263
270
280
286

5
MARKET RESEARCH – SCOPE AND METHODOLOGY
Market research scope:
o This report surveys emerging non-volatile memory technologies, their applications and markets.
o An introduction to standard memory, flash NAND, DRAM, NVDIMMs is given in order to provide an overall analysis of
memory technology & market trends
o The market study focuses on the following emerging non-volatile technologies: (STT-)MRAM, RRAM and PCM.
o We have not included memory types that are in early research phase, i.e. zero capacitor (ZRAM), quantum dot RAM and
polymer printed memory, as we believe these are unlikely to be widely commercialized before 2023.
o We did not include FRAM in our market study. Although conventional FRAM has currently a larger market (~$240M in
2017) compared to other emerging memories, it will remain a static niche market (CAGR2017-2023≈3.7%).
o New memories could emerge in the next 5 years, such as HfO2-based FeFET and NRAM. Although promising, these
memories are still at the early stages and there is lack of certainty about their future adoption in commercial products. Due
to lack of detailed information, we could not include these technologies in our market projection study.
o Market estimates pertain to the 2017 – 2023 time period and are given in USD (with $1.1 = 1€)
Methodology:
o Our research is derived from:
• Primary information sources: direct interviews with companies across the value chain (memory manufacturers, IP
companies, equipment and materials suppliers, etc.)
• Secondary information sources: conferences, web sites, newsletters, etc.
o All data, graphs, tables, and calculations in this report are part ofYole Développement’s investigation.

6
2017 REPORT UPDATES
New content compared to the 2016 version
 Redefinition of embedded market segments, highlighting newly emerging AI applications as well as eDRAM/SRAM
replacement in mobile AP and high-end processors
 Updated market forecast for phase-change memory (PCM), (STT-)MRAM, and RRAM
 Updated analysis of technical trends for PCM, (STT-)MRAM, and RRAM
 Updated analysis of the stand-alone and embedded memory markets
 Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players
 In-depth analysis of NVDIMM technology and its market
 Analysis of PCM’s development history, including the latest news on Micron and Intel’s 3D XPoint activities
 Review of materials suppliers and equipment players
 Analysis of 3D XPoint products, and comparison with Samsung’s Z-NAND
 Examination of newly emerging technologies, including FeFET and NRAM
 Updated analysis of new entrants and startup funding
 Analysis of memory technologies for artificial intelligence (AI) applications

© 2018
Standard Memory Market
Introduction

8
SOLID-STATE STAND-ALONE MEMORY – MARKET STATUS
Stand-alone memory market revenue evolution:
• $XXB in 2015: CAGR ~ +X%
• CAGRDRAM ~ -XX%
• CAGRNAND ~ +XX%
• $XXB in 2016: CAGR ~ -X%
• CAGRDRAM ~ -XX%
• CAGRNAND ~ +XX%
• $XXB in 2017: CAGR ~ +XX%
• CAGRDRAM ~ +XX%
• CAGRNAND ~ +XX%
NAND and DRAM dominate the stand-alone memory market
achieving together more than XX% of sales.
Record DRAM sales were recorded in 2017 (~$XXB) due to high
demand from mobile products and servers which has driven tight supply and
upward price pressure on DRAM chips.
DRAM sales keep growing in 2018: expected CAGRDRAM ~ +XX%
Semiconductor Memory Market 2017

© 2018
NVDIMM Market and
Technology Overview
Source: SNIA 2018

10
NVDIMM – TECHNOLOGY AND MARKET
Key NVDIMM players
Expected increasing adoption of NVDIMM-N in servers
NVDIMM-N market
in 2017 ~$XX

© 2018
Embedded MCU/SoC
Memory Overview
Source: STMicroelectronics

12
EMBEDDED MEMORY – MARKET SIZE
• Embedded memory is a submarket of the MCU/SoC
markets. It is generally not estimated because it is not a
stand-alone market.
o MCU memory business:
o NVM: $XXB, equal to XX% of MCU cost
o SRAM: $XXB, equal to XX% of MCU cost
o Mobile AP memory business:
o SRAM ~ $XXB, equal to XX% of AP cost
o High-performance processor memory business
o SRAM ~ $XXB, equal to XX% of CPU cost
• Total 2017 embedded memory ~ $XXB. This
represents 19% of the stand-alone memory business. In
the long-term, emerging NVM could also replace SRAM in
processor business.
Yole Développement © October 2018
~ $23.7B

© 2018
Memory Market Players
Overview

14
STAND-ALONE MEMORY - SUPPLY CHAIN
Key market players
Market
concentration
has increased
over the last few
years: 5 players
owns XX% of
the business
NAND DRAM NOR / 3D XPoint
Alliance:
Toshiba Sandisk/WD
Acquired Inotera memory from Nanya in Dec. 2016
• Samsung, Micron, SK Hynix,Toshiba and Sandisk/WD are dominating the stand-alone memory business.
• In June 2018, Toshiba completes $18B sale of its memory business to an investment group led by Bain Capital (US).
The consortium includes Apple, SK Hynix, Dell, and Seagate Technology.
3D
JV IM Flash Technologies
(NAND collaboration
ending soon after 3rd generation
3D NAND development)
WD acquired Sandisk
in 2016
JV IM Flash Technologies
(3D XPoint collaboration
ending soon after 2nd generation
XPoint development)

15
NAND MEMORY – MAIN MARKET PLAYERS
• A highly-concentrated market dominated by Samsung (~XX%) followed by the Japanese-US alliance of Toshiba and Sandisk (the latter
was acquired by Western Digital in 2016) with a market share of ~XX%. SK Hynix is the next in the line together with Micron.
2017 NAND memory players market share by revenue
Total NAND market
in 2017 ~$XXB

16
DRAM MEMORY – MAIN MARKET PLAYERS
2017 DRAM memory players market share by revenue
• A highly-concentrated market (3 main players) dominated by Korean (Samsung and SK Hynix) and US (Micron) players.
• Taiwanese players (Nanya,Winbond, Powerchip) achieve an overall market share of ~XX%.
Total DRAM market
in 2017 ~$XXB

© 2018
China Memory Landscape
Source: STMicroelectronicsSource: DOIT Media Group
China’s fabs entering in production in 2019 (orange)

18
CHINA MEMORY EXPANSION & EMERGING NVM PLAYERS

© 2018
Emerging NVM Overview
Image credit: Dreamstime

20
OVERVIEW OF EMERGING NVM TECHNOLOGY

21
EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)

22

© 2018
Emerging Non-Volatile
Memory Applications
Memristor for
cybersecurity
Image credit: Brian Long
University of California, Santa Barbara

24
EMERGING NVM – APPLICATIONS
Emerging NVM Applications
Industry &
Transportation &
consumer
electronics
Enterprise
Storage
Client SCM
Mass Storage
Memory
NVM in
Microcontrollers
Cache in Mobile
Devices
Cache in High-
End processors
NVM for Artificial
Intelligence
Industrial Automation
Journal Memory
Automotive
SCM
NAND
Memory
Smartphones
&Tablets
NVDIMM-N
General Purpose
Automotive
Work Station
Notebook
Smart card
Stand alone Embedded
Increasing density Increasing density
IoT
AI at the edge
Smart Meters

25
EMERGING NVM – APPLICATIONS

26

27
(STT-)MRAM – TECHNOLOGY AND MARKET TRENDS

28
RRAM – TECHNOLOGY AND MARKET TRENDS

29
PCM – TECHNOLOGY AND MARKET TRENDS

30
OTHER EMERGING NVM TECHNOLOGIES

31
RELATED REPORT

Ever-growing data generation driven by mobile
devices, the cloud, the internet of things (IoT), and
big data, as well as novel AI applications, requires
continuous advancements in memory technologies.
Flash NAND (non-volatile) and Dynamic Random
Access Memory (DRAM - volatile) are the stand-
alone workhorse options, and will maintain their
leading position for another several years thanks
to new technical solutions that enable further
scalability. However, there exists a large speed-
capacity gap between NAND and DRAM, one which
must be reduced to improve overall performance of
computing systems. Storage-class memory (SCM)
serves precisely this purpose and has long been
awaited.
Hitherto, emerging non-volatile memories (NVMs) –
e.g. phase-change memory (PCM), magnetoresistive
random access memory (MRAM), spin transfer
torque MRAM (STT-MRAM) and resistive RAM
(RRAM) – have been restricted to niche applications
because of poor scalability, high cost, and a lack
of support from major memory makers. In 2015,
Micron and Intel presented a new SCM technology,
3D XPoint, which uses phase-change memory
(PCM) materials that the companies researched for
more than 15 years. The first 3D XPoint products
– OptaneTM
Solid State Drives (SSDs) and storage
accelerators – were introduced by Intel in 2017, and
persistent-memory modules (OptaneTM
Dual Inline
Memory Modules (DIMMs)) are expected in 2019.
Despite the coming end of the Intel-Micron joint
venture (IMFT), Micron has confirmed its continuing
strategic involvement with 3D XPoint by announcing
its acquisition of Intel’s stake in IMFT, along with
plans to introduce its own 3D XPoint products
(QuantXTM
) in 2019.
Over the next three years, 3D XPoint sales will grow
by more than one order of magnitude thanks to
Intel’s dominant position in the enterprise processor
business. Optane DIMMs will be sold in combination
with the latest generation of Intel’s Xeon server
processors (i.e. Cascade Lake). Moreover, Intel’s
new brand strategy for client systems that includes
Optane caching pre-installed (Intel Core i+), will
support sales growth.
Due to the rise of 3D XPoint sales, SCM is expected
to be the dominant application for emerging NVMs
in the coming years, reaching more than 90% of the
emerging NVM market by 2019.
EMERGING NON-VOLATILE MEMORY 2018
Market & Technology report - November 2018
EMERGING NVM SALES WILL GROW BY MORE THAN ONE ORDER OF
MAGNITUDE IN THE NEXT THREE YEARS, THANKS TO SCM APPLICATIONS
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
KEY FEATURES
• 2017 - 2023 market forecast in units,
Gbit, $US, and number of wafers
• Competitive landscape and market
dynamics
• Emerging non-volatile memory
(NVM) - potential applications and
market drivers
• Technology roadmap, with time-to-
market
• Price evolution, by application and
technology
• Technology description and main
technical trends by technology,
along with overview of main players,
and roadmap
WHAT’S NEW
• Redefinition of embedded market
segments, highlighting newly
emerging artificial intelligence (AI)
applications as well as eDynamic
Random Access Memory
(eDRAM)/Static Random Access
Memory (SRAM) replacement in
mobile AP and high-end processors
• Updated market forecast for
phase-change memory (PCM),
spin transfer torque MRAM (STT-
MRAM) and resistive RAM (RRAM)
• Updated analysis of technical trends
for PCM, (STT-)MRAM, and RRAM
• Updated analysis of the stand-alone
and embedded memory markets
• Updated analysis of China’s
memory market, and a detailed list
of emerging Chinese NVM players
• In-depth analysis of Non-Volatile
Dual Inline Memory Modules
(NVDIMM) technology and its
market
• Analysis of PCM’s development
history, including the latest news
on Micron and Intel’s 3D XPoint
activities
• Review of materials suppliers and
equipment players
• Analysis of 3D XPoint products,
and comparison with Samsung’s
Z-NAND
• Examination of newly emerging
technologies, including Ferroelectric
Field-Effect Transistor (FeFET) and
Nanotube RAM (NRAM)
• Updated analysis of new entrants
and startup funding
• Analysis of memory technologies
for artificial intelligence (AI)
applications
(Yole Développement, November 2018)
2017
~$99M
2018
~$280M
2019
~$1.08B
CAGR2017-2019
~230%
Embedded NonVolatile Memory - Microcontrollers (MCU)
Industrial and transportation and consumer electronics
Entreprise storage-class memory (SCM)
Client storage-class memory
Emerging non-volatile memory market – breakdown by application
In the stand-alone business, emerging NVMs will
not replace DRAM and NAND but will be used in
combination with them inside memory modules,
e.g. SSDs, DIMMs, and NVDIMMs. In 2023, PCM
will maintain its lead in the stand-alone memory
market thanks to the increasing adoption of 3D
XPoint as an enterprise and client SCM. It is worth
noting that Samsung and Toshiba took a different
IN THE NEXT FIVE YEARS, PCM-BASED 3D XPOINT WILL DRIVE THE STAND-
ALONE EMERGING NVM MARKET, WHEREAS STT-MRAM WILL LEAD
EMBEDDED TECHNOLOGY

EMERGING NON-VOLATILE MEMORY 2018
EMERGING NVM PLAYERS WILL USE “TROJAN HORSE” STRATEGIES TO INTRODUCE
THEIR TECHNOLOGIES TO THE MEMORY MARKET
In the stand-alone business, emerging NVM brings
new features and functionalities, but at a higher price.
Thus, new solutions must be found for triggering this
NVM’s market penetration. Among big IDMs, Intel
has a unique position: it is both a stand-alone memory
supplier and a Central Processing Unit (CPU) leader.
Intel can combine its 3D XPoint products with its
new generation of Xeon processors, which will act
as the aforementioned Trojan horse for introducing
3D XPoint into the data-center technology market.
STT-MRAM developers are rather small companies
(e.g. Everspin, Avalanche, Spin Memory) that view
memory module suppliers (Smart Modular, for
example) as the ideal partner for entering the
enterprise storage market. These module suppliers
are midsized companies inclined to develop niche
applications in the early stages.
In the embedded business, the top foundries are
the key decision makers: they can promote the
adoption of new embedded NVM in applications such
as MCUs or cache memory. Therefore, it is critical
for IP memory companies to convince foundries to
develop edge-node (28/22nm) technology platforms
for emerging NVM, a goal that has already been
achieved by STT-MRAM players. In fact, RRAM has
been adopted at 22nm by TSMC, but other foundries
are hesitating to scale down to 28/22nm.
Yole Développement invites you to read our comprehensive
analysis on the ecosystem and market landscape,
highlighting the challenges and opportunities towards
large adoption of emerging NVM.
strategic path by developing 3D NAND-based SCM
solutions such as Z-NAND (Samsung) and XL-Flash
(Toshiba, showcased in August 2018). However,
these technologies will be used in enterprise SSDs
and will not compete with DDR4-compatible Optane
DIMMs, which we expect will represent more than
50% of overall 3D XPoint sales.
Resistive RAM (RRAM) was expected to be the first
stand-alone technology to compete with 3D XPoint,
but it has suffered repeated delays due to technical
challenges. We presume that RRAM could return
in the race for SCM after 2020, and possibly start
competing with NAND for mass storage applications.
Spin transfer torque MRAM (STT-MRAM), thanks to
its high speed and high endurance, is promising for
enterprise storage SCM. However, its success will
be much lower compared to stand-alone PCM due
to higher costs, greater fabrication complexity, and
challenging scalability.
Compared to stand alone, the embedded emerging
NVM market is relatively small, representing ~3% of
the emerging NVM market in 2017. The market is
dominated today by RRAM, since only a few RRAM-
based microcontrollers (MCUs) are available on the
market. However, all top foundries are now getting
ready with 28/22nm technology processes for STT-
MRAM whereas RRAM adoption has been delayed
by approximately two years by SMIC and UMC.
Therefore, we expect that STT-MRAM will be the
first to take-off in the coming years and will lead the
embedded emerging NVM market, especially MCUs,
which represent the most important embedded
segment.
Emerging memory will first replace eFlash, which is
facing major scaling challenges due to rising fabrication
complexity/costs for technology nodes ≤ 28nm. The
adoption of STT-MRAM as an embedded cache
memory (SRAM or eDRAM) in high-end processors
and mobile AP will occur later due to more strict
scalability requirements (≤ 14nm).
AI on the edge is the most innovative application
for embedded emerging NVM. Crossbar recently
demonstrated various AI applications, i.e. face
recognition, through the use of RRAM chips. We
expect that such RRAM-based AI devices will enter
the market after 2021.
Examples of market entry strategies for stand-alone
and embedded emerging non-volatile memory*
Evolution of the emerging non-volatile memory market – breakdown
by technology for stand-alone and embedded memories
~$6.4M ~$1.1B
~$273M ~$6.1B
2018 2023
Resistive random access
memory (RRAM)
(Spin transfer torque)
magnetoresistive random
access memory ((STT)MRAM)
Phase-change memory (PCM)
Stand-alone
Embedded
Source: Everspin
Source: STMicroelectronics
Stand-alone chip provider Modules Systems
FlashCoreTM
Module
OptaneTM
DIMM
XeonTM
Processor
Embedded NVM IP** provider
STT-MRAM
Enterprise-Storage
Players
3D XPoint
IoT, general purpose
and automotive MCUs***
integrators
Foundries
Bundle
* Non exhaustive list of companies
**Non Volatile Memory Intellectual Property
***Microcontrollers

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
4DS, A*STAR, Adesto, Aeroflex, Apple, Atmel, Avalanche, Buffalo, Canon, CEA Leti,
Cisco, CNE, Crocus, Crossbar, Cypress, Dell, EBay, EMC, Evaderis, Everspin, Facebook,
Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated
Circuit Co., Ltd, Gemalto, Giesecke Devrient, GigaDevice, GlobalFoundries, Google,
Hefei Chang Xin, H-Grace, Hikstor, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon,
Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Materion, Macronix, Maxim, Mediatek,
Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University,
NEC, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum,
Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI, Sino King Technology,
SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum,
STMicroelectronics, Stanford University, STEC, Sun, Syntiant, TDK, Tezzaron, TMS, Tohoku
University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba, Towerjazz, TPSCO, Tsinghua
Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC,
Yangtze River Storage Technologies, new Chinese emerging NVM players and more…
Find more
details about
this report here:
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Simone Bertolazzi,
PhD is a Technology
Market analyst at Yole
Développement (Yole) working with the
Semiconductor Software division. He is
member of the Yole’s memory team and
he contributes on a day-to-day basis to the
analysis of nonvolatile memory technologies,
their related materials and fabrication
processes. He (co-) authored more than
ten papers in high-impact scientific journals.
Simone obtained a PhD in physics in
2015 from École Polytechnique Fédérale
de Lausanne (Switzerldand), where he
investigated novel flash memory cells based
on heterostructures of 2D materials and
high-k dielectrics.
AUTHORS

Executive summary 13
Standard memory market introduction 44
Market and technology overview 54
NAND
DRAM
NVDIMM
Niche stand-alone memory
Embedded MCU/SoC memory
Memory market players overview 86
China memory landscape 95
Emerging NVM overview 100
Emerging NVM applications 127
Market segments 138
Industrial, transportation consumer
Electronics applications
Enterprise storage SCM applications
Client SCM Aapplications
Mass storage NAND applications
Embedded NVM in Microcontrollers (MCUs)
Embedded cache memory in mobile devices
Embedded cache memory in high-end
processors
Embedded NVM for artificial intelligence
MRAM/STT-MRAM technology, forecast,
and players 190
Technology description, roadmap, time to
market/application, forecast by application, key
players, key products, main trends
RRAM technology, forecast, and players 215
PCM technology, forecast, and players 242
Other emerging NVM 263
General conclusions 270
Noteworthy news 2017-2018 280
Yole Développement’s presentation 286
TABLE OF CONTENTS (complete content on i-Micronews.com)
OBJECTIVES OF THE REPORT
Present an overview of the semiconductor memory market:
• NAND, DRAM, NVDIMM, embedded MCU, and mobile AP - main markets, market forecast,
and main trends
• Current technological status and roadmap for the coming years
• Market landscape
Provide an understanding of emerging NVM applications:
• A total of eight application fields - four for stand-alone and four for embedded: total addressable
market, market drivers and challenges, technology roadmap, players, main trends
• Roadmap with time-to-market, by application
Deliver market forecasts for emerging NVM businesses:
• 2017 - 2023 market forecast in units, Gb, $US/Gb, and number of wafers
• Price evolution, by application and technology
• Forecast for eight applications and three technologies (MRAM/STT-MRAM, RRAM, PCM)
Describe emerging NVM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price,
time-to-market
• Roadmap with technology nodes, chip-density evolution, and main players
• Latest product development status for each key market player
Detail and analyze the competitive landscape:
• Recent acquisitions and funding
• Latest company news
• Key players, by technologies and applications
YanndeCharentenay
works as a Technology
Market Senior Analyst for
Yole Développement (Yole). Yann is strongly
involved in the technology market analysis
of the applications of disruptive technologies
and components: memory, MEMS and
sensors... Prior his mission at Yole, Yann
was engaged as a marketing engineer at
the Commissariat à l’Energie Atomique
(CEA, France) as well as a consultant at
Algoe (France). He has spoken in numerous
international conferences and has authored
or co-authored numerous press articles.
Yann graduated from the University of
Compiegne (France) with a master degree in
innovation management. He is also graduated
from INP Phelma (Grenoble, France) with a
master degree in materials science.

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• Japan Rest of Asia - Takashi Onozawa:
+81-80-4371-4887 – onozawa@yole.fr
• Greater China - Mavis Wang:
+886 979 336 809 – wang@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
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The present document is valid 24 months after its publishing date:
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate
finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon
and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and Image Sensors,
Compound Semiconductors, RF Devices Technologies, Solid-State Lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
MEDIA EVENTS
• i-Micronews.com website related @Micronews e-newsletter
• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Structure, process and cost analysis
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)

2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE
Life Sciences
Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o Bio Technologies
Power
Wireless
o RF Devices Technology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o Semiconductor Manufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS, Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

4 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization
of innovative optical systems
• Financial services (due
diligence, MA with our
partner)
www.yole.fr
o Syndicated reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays, forums,…
www.i-Micronews.com
o Monitors
• Monthly and/or Quarterly
update
• Excel database covering supply,
demand, and technology
• Price, market, demand and
production forecasts
• Supplier market shares
www.i-Micronews.com/reports

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto

ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators, end-
users and software
developers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quarterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quarterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronews e-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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