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From Technologies to Market
Emerging Non-
Volatile Memory
(NVM) 2017
Sample
From Technologies to Market
2. 2
Biography & contact
ABOUT THE AUTHORS
Yann de Charentenay
Yann has worked forYole Développement in the fields of MEMS, materials, and compound semiconductors since 2003. He has
contributed to more than 60 marketing and technological analyses.
Contact : decharentenay@yole.fr
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
Santosh Kumar
Santosh Kumar works as a SeniorTechnology & Market Research Analyst atYole Développement, the "More than Moore" market
research and strategy consulting company. He is involved in the market, technology, and strategic analysis of microelectronic
assembly and packaging technologies. He received a bachelor’s degree and a master’s degree in Engineering from the Indian
Institute ofTechnology (IIT) Roorkee and the University of Seoul, respectively. He has published more than 40 papers in peer-
reviewed journals and has obtained two patents. He has presented and given talks at numerous conferences and technical
symposiums related to advanced microelectronics packaging.
Contact: kumar@yole.fr
3. 3
COMPANIES CITED IN THIS REPORT
4DS,A*STAR,Adesto,Aeroflex,Altis,Apple,Atmel,Avalanche, Buffalo, CEA Leti, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, Ebay,
EMC, Evaderis, Everspin, Facebook, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated Circuit Co., Ltd, Gemalto, Giesecke &
Devrient, Global Foundries, Google, Hefei Chang Xin, H-Grace, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon, Innovative
Silicon, Intel, ITRI, Knowm, Lenovo, Macronix, Maxim, Mediatek, Microchip, Micron-Elpida, Morpho, Nantero, Nanya, National
Tsing Hua University, NEC, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum, Rambus - Unity,
Renesas, Samsung, Sandisk, Seagate, SGI, Sino King Technology, SK Hynix, Skyera, Smart Modular Technologies, SMIC, Sony,
Spansion, Spin Transfer Technology, Spreadtrum, STMicroelectronics, Standford University, STEC, Sun, Symetrix,TDK,Tezzaron,
TMS,Tohoku University,Toshiba,Towerjazz,TPSCO,Tsinghua Unigroup ,TSMC, UMC,Violin Memory,Weebit,Western Digital,
Winbond, XMC,Yangtze River Storage Technology
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
4. 4
EMERGING NON-VOLATILE MEMORY (NVM) - TECHNOLOGIES & MARKETS 2016
Table of contents
Executive Summary
Standard Memory Market Introduction
NAND Market Overview
DRAM Market Overview
Niche” Stand-Alone Memory Overview
Embedded SoC Memory Overview
Memory Market - Players Overview
China Memory Landscape
Emerging NVM Overview
Emerging NVM Applications
Industrial ,Transportation & Consumer Electronics
Applications
Enterprise Storage SCM Applications
Client SCM Applications
Mass Storage NAND Applications
12
43
52
60
66
71
79
88
95
121
133
136
146
150
Microcontrollers (MCUs) application
Mobile Devices SRAM applications
Embedded L3 Cache High Performance applications
Embedded NVM SoC Application
MRAM/STTMRAMTechnology, Forecast, and Players
Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
RRAMTechnology, Forecast, and Players
Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
PCMTechnology, Forecast, and Players
Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
Other emerging NVM
General Conclusions
Appendix &Yole Presentation
156
178
183
190
195
222
250
270
275
281
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
5. 5
MARKET RESEARCH - SCOPE AND METHODOLOGY
• Market research scope:
• This report surveys emerging non-volatile memory technologies and markets
• An introduction to standard memory, flash NAND, and DRAM is given in order to provide an overall analysis of memory
technology & market trends
• This report includes the following emerging non-volatile technologies:
• MRAM/STTMRAM
• RRAM
• PCM
• We haven’t included memory types that are in early research phase, i.e. NRAM, zero capacitor (ZRAM), quantum dot RAM,
carbon nanotubes, and polymer printed memory, as we expect these are unlikely to be widely commercialized before 2021.
Also, we haven’t include FRAM technology because scalability improvements are limited and thus this technology won’t
change the memory market landscape.
• Market estimates pertain to the 2016 – 2022 time period and are given in USD (with $1.1 = 1€)
• Methodology:
• Our research is derived from:
• Primary information sources: direct interviews with companies across the value chain (detector manufacturers,
camera manufacturers, camera distributors, end-users)
• Secondary information sources: conferences, web sites, newsletters, etc.
• All data, graphs, tables, and calculations in this report are part ofYole Développement’s investigation
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
6. 6
REPORT OBJECTIVES
• Present an overview of the semiconductor memory market:
• NAND, DRAM, embedded MCU, and mobile CPU - main markets, market forecast, and main trends
• Current technological status and roadmap for the coming years
• Market landscape
• Provide an understanding of emerging NVM applications:
• For eight application fields, 4 for stand alone (industrial & transportation, enterprise storage SCM, Client SCM, mass storage) and 4 for
embedded application (Microcontrollers, mobile devices, Embedded L3 cache high performance, Embedded NVM SoC): total
addressable market, market drivers and challenges, technology roadmap, players, main trends
• Roadmap with time-to-market by application
• Offers market forecasts for emerging NVM business:
• 2016 - 2022 market forecast in units, Gbit, US$/Gbit, and number of wafers
• Price evolution by application and technology
• Forecast for six applications and 3 technologies (MRAM/STTMRAM, RRAM, PCM)
• Detail emerging NVM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market
• Roadmap with technological nodes, and chip density evolution with main players
• Latest product development status for each key market player
• Describe and analyze the competitive landscape:
• Recent acquisitions and funding
• Latest company news
• Who the key players are by technologies and applications
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
8. 8
OVERALL SOLID-STATE STAND-ALONE MEMORY - MARKET STATUS
Stand-alone memory market revenue
evolution:
• $XX B in 2014: CAGR = + XX%
• $XX B in 2015 : CAGR ~ +X %
• $XX B in 2016: CAGR ~ - X%
NAND and DRAM dominate the
stand-alone memory market,
representing XX % of stand alone
memory sales.
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
9. 9
STAND-ALONE MEMORY - SUPPLY CHAIN
Key market players
Market
concentration
has increased
over the last few
years : 5 players
owns 95% of the
business
NAND DRAM NOR/PCM
Alliance: Toshiba Sandisk/WD
Acquired Inotera memory from Nanya in Dec 2016
• Samsung, Micron, SK Hynix,Toshiba andWestern Digital – Sandisk are dominating the business
• Toshiba is selling off its NAND memory business => Big change in the competitive landscape ! Many players have joined bid to buy
Toshiba NAND memory business: Current players : SK Hynix, Micron,WD ; New players : Foxconn, Apple, Google, Broadcom etc.
• The consortium led by Innovation Network of Corp. of Japan, Development Bank of Japan, U.S private equity Bain
Capital and SK Hynix is most likely to win the bid forToshiba lucrative NAND business
JV Flash Technologies since 2006
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
10. © 2016
Overview of Embedded SoC
Memory
Source : ST Microelectronics
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
14. © 2016
Emerging NVM Overview
Source: Crossbar
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
15. 15
STAND-ALONE MEMORY - 2016 POSITION
Commercial products performance
Emerging
memory has
non-volatility,
low power, and
speed
advantages -
but price and
scalability are
obstacles to
competing
with DRAM
and NAND
16. 16
EMERGING MEMORY - RECENT STAND-ALONE PRODUCTS
Time-to-market is often delayed
Emerging NVM sampling
is often delayed because
of technical/production
or commercial issues.
As in other markets,
companies often
underestimate the
difficulty of introducing a
new technology.
2014 2015 2016 2017
100 Mb
10 Mb
1 Gb
10 Gb
Sampling
Time-to-Market
Chip maximum density (bit)
Yole Développement © July 2017
2013
100 Gb
Project stopped
PCM
RRAM
MRAM
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
17. 17
EMERGING NON-VOLATILE MEMORY
Market evolution
Emerging
NVM is
expected to
reach ~4% of
total
memory
market by
2022
Total ~ $XX B
Total ~ $XX B Total ~ $XX B
1st wave 2nd wave
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
18. 18
EMERGING NVM MARKET – MARKET FORECAST BY TECHNOLOGY (2016-2022)
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
20. 20
EMERGING NVM - SUPPLY CHAIN
Many players are
involved in the
emerging NVM
ecosystem.
Enterprise storage
end-users will
influence the
emerging NVM
supply chain to
meet their
requirements.
Integrated device manufacturers (IDMs)
Foundries
Start-up/fabless or IP companies
Mobile MPU or MCU players
Equipment makers
Enterprise storage end-users
(data centers, social networks, and
ebusiness players)
Recent new entrant
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
21. 21
MEMORY MARKET PLAYERS - CANNIBALIZATION TRENDS
Thanks to
emerging
memory IP,
foundries
would like to
take a share of
the big stand-
alone memory
pie!
Stand-alone memory business ~ $80B
dominated by IDM players
Foundry business = $55B
Emerging Memory
< $100M
NAND
HDD business = $25B
By acquiring Sandisk,
Western Digital integrated
NAND technology which
threatened its HDD
business.Western Digital is
also key contender to buy
Toshiba memory business
DRAM
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
23. 23
EMERGING NVM - APPLICATIONS
Emerging NVM Applications
Industry &
Transportation &
consumer
electronics
Enterprise
Storage
Client SCM
Mass Storage
Memory
Micro
Controllers
(MCUs)
Mobile Devices
Embedded L3
cache high
performance
Embedded NVM
SoC
Industrial Automation
Smart Meter
Journal Memory
Automotive
Storage-Class
Memory (SCM)
NAND
Memory
Smartphones
& Tablets
Volatile DRAM
General Purpose
Automotive
Work Station
Notebook
Smard card
Stand alone Embedded
Increasing density
Increasing density
IoT
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
24. 24
Embedded NVM
SoC
Embedded L3 cache
high performance
Mobile devices
SRAM
Microcontrollers
(MCU’s)
Mass storage
Client SCM
Enterprise storage
SCM
Industrial,
transportation, and
consumer
electronics
2015 2016 2017 2018 2019 2020 2021 2022
EMERGING NVM – TIME-TO-MARKET
MRAM/STT
MRAM
PCM RRAMBy application and with first playersEmbeddedStandalone
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
25. 25
EMERGING MEMORY - POTENTIAL APPLICATIONS
Density and price positioning
With emerging
NVM scalability
improvement,
mainstream
applications
targeted by
DRAM and
NAND will be
accessible
Chip maximum
density
1
1,000
10
100
0.1
PriceperGbit
($/Gb)
10,000
10 Mb 100 Mb 1 Gb 10 Gb 100 Gb
Industrial, Transportation, and CE
($690M)
Bubble size
corresponds
toTAM market
size in 2016
Low density Medium
density
High density
Enterprise
Storage
SCM M
(~ $ 2B)
Mobile Devices
SRAM
(~ $11B)
Micro
controllers
($8B)
1 Mb
Emerging NVM
scalability
improvement
Yole Développement © July 2016
DRAM
$45B
Flash NAND
$31B
0.01
Enterprise
Storage/Client
SCM S
(~ $ 5 B)
SRAM HPC
(~ $6B)
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
26. 26
EMERGING NVM - MARKET FORECAST BY APPLICATION (2016-2022)
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
29. 29
RRAM - PLAYER POSITIONING
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
30. 30
PCM - PLAYER POSITIONING
PCM business
revives with
Micron/Intel
comeback
©2017 | www.yole.fr | Emerging Non-Volatile Memory | Sample
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www.i-Micronews.com
43. 43©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS byYole Développement
o MEMS & SENSORS
− Acoustic MEMS and Audio Solutions 2017
− 3D Imaging & Sensing 2017
− Microspectrometers Markets and Applications 2017
− Status of the MEMS Industry 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D Business Update: Market & Technology Trends 2017*
− Advanced QFN: Market & Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
*2016 version still available / **To be confirmed
44. 44©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017*
− Silicon Power Mosfet: Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
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− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017**
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Automotive Lighting 2017 - Technology, Industry and Market Trends
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and Lasers - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management for LED and Power 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation
− Risk and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Micropumps: Patent Landscape Analysis 2017
− GaN Technology: Top-100 IP Profiles 2017
− MicroLEDs: Patent Landscape Analysis 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
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45. 45©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
46. 46©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting
More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
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product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 8,500+
monthly visitors, the 11,500+
weekly readers of @Micronews
e-newsletter
Seven main events planned for
2017 on different topics to
attract 140 attendees on average
Gain new leads for your business
from an average of 300
registrants per webcast
Contacts: CamilleVeyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing & Communication Project Managers.
48. 48©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
o FINANCIAL SERVICES
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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