CSP LED Lighting Modules - 2017 Report by Yole Developpement

From Technologies to Market
CSP LED
Lighting Modules
2017
Technology,
Manufacturing and
ApplicationsTrends
Market and Technology Report
SAMPLE

2
To understand
how CSP LEDs
modify the
device and
module
landscape, and
identify real
opportunities
associated to
the technology.
UNDERSTAND CSP LEDTECHNOLOGY:
• Difference with other packages.
• Impact on manufacturing process.
• Potential for cost reduction.
UNDERSTAND CHANGES IN SYSTEM DESIGN AND INTEGRATION RULES:
• Impact on optical design.
• Impact on thermal management.
• Impact on electrical management.
UNDERSTAND PERFORMANCES IN APPLICATIONS:
• Positioning of CSP LEDs compared to middle power, high power LED and COB LED modules.
• Opportunities for CSP LEDs in applications.
UNDERSTAND COMPETITIVE LANDSCAPE AND SUPPLY CHAIN:
• Key players.
• Impact on the LED supply chain.
REPORT OBJECTIVES
©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

3
• In this report we looked at the CSP values from the integrator
perspective.
• It means we used our deep understanding of application requirements
together with our insights in LED packages architectures and long
lasting system (LED luminaires) design capabilities.
• We investigated architectures, electrical and thermal behaviors and
optical characteristics of CSP LED’s .
• We performed samples light flux and color point characterizations
under different current and temperature settings, together with
luminance measurement at PISEO's lab.
• Then we integrated all the gathered parameters in our LED based
system models and performed optical simulations using ZEMAX Optic
Studio 16.
• By using the models and optical simulations we were able to understand
how the different CSP LED types would perform depending on the
application.
• Based on this deep understanding we were then able to draw
conclusions on the values of CSP LED depending on the applications.
How did we get to evaluate CSP LED values?
METHODOLOGY
100 200 400 600 800 1000
-40 264 536 937 1325 1588 1864
-10 254 515 902 1277 1529 1793
10 248 503 879 1244 1491 1739
30 241 489 857 1209 1438 1668
50 235 477 829 1164 1371 1579
60 231 468 813 1133 1333 1533
70 227 459 793 1102 1294 1487
80 222 448 771 1070 1255 1441
Ambianttemperature(°C)
current (mA)
System flux (lm)
100 200 400 600 800 1000
-40 -34 -28 -16 -3 9 22
-10 -4 2 14 26 39 51
10 16 22 34 46 58 71
30 36 42 53 65 78 90
50 56 61 73 85 97 109
60 66 71 83 95 107 119
70 76 81 93 105 117 129
80 86 91 103 115 126 138
Ambianttemperature(°C)
Tjunction (°C)
Driving current If (mA)
Embedded Projector lighting system - Optical design optimization and system performance calculation
Sce PISEO – Zemax Optical Studio 16 / Piseo configurator

4
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

5
REPORT METHODOLOGY
Technology analysis methodology Information collection

6
o About the Authors of the Report P5
o Report Objectives P6
o Companies Cited in This Report P7
o Glossary P8
o Methodology P9
o Executive Summary P10
o Status of the LED Industry and Recent Trends P40
 Status of the LED Industry
• Introduction - Segmentation of Packaged LEDs
• History of the LED Industry
• Market Landscape
• Industrial Landscape
• Key Highlights
• Packaged LED Revenue Forecast - Split by Application
• 2015 & 2016 in a Nutshell
• Future Trends
• LED Market Trends
• Displays
• General Lighting
 Recent Trends in the LED Industry
• Overview
• Product Diversification (Level 1)
• LED Filaments
• COB LEDs
• Flip Chip (FC) LEDs
• Chip Scale Packaged (CSP) LEDs
• Application Diversification - Automotive Lighting
• Product Diversification (Level 2) - UV LEDs
• Vertical Integration - LED Module
• Conclusion
o CSP LED Applications Landscape P61
 Overview
 Flash
 Backlighting
 General Lighting
 Automotive Lighting
o CSP LED Device P68
 Introduction to CSP LED Device
• Definition
• Benefits
 CSP LED Device Family Description
• Introduction
• Size Criterion
• Power Density Criterion
• CSP or Not CSP?
• Power Criterion
 CSP LED Device Technology
• Difference with Other Packages
• Chip Level
• Package Level
• CSP LEDs Structure
• Overview
• Focus on Packaging
• CSP LEDs in the LED Package Proliferation
• Flip Chip CSP LEDs vs High Power Type LEDs
• Wafer Level CSP LED vs High Power Type LED
• Vertical Thin Film CSP LED vs High Power Type LED
• Flip Chip packaged CSP LED vs High Power Type LED
TABLE OF CONTENT (1/3)

7
o CSP LED Device P68
 CSP LED Device Manufacturing Process
• Conventional LED Manufacturing Process
• Flip Chip CSP LED Manufacturing Process
• Wafer Level CSP LED Manufacturing Process
• CSP LEDs vs Conventional LEDs
• Impact on Supply / Value Chain
• Overview
• Highlights on Phosphor Sheet / Film Suppliers
 CSP LED Device Cost / Price
• Potential for Cost Reduction
• The Case of CSP Architecture for Low and Middle Power LEDs
• The Case of CSP Architecture for High Power LEDs
• Price Positioning of CSP LEDs (Vs. Traditional LEDs)
• Price Positioning of CSP LED Modules (Vs. Traditional Modules)
 CSP LED Device Industry
• Key Players Identified
• Highlights on US and European Players
• Highlights on Japanese Players
• Highlights on Korean Players
• Highlights on Taiwanese and Chinese Players
• Trends - Flow Chart Comparison between Standard, CSP and COB LEDs
 CSP LED Market
 CSP LED Market Volume (2012 - 2021)
o CSP LED Lighting Module P112
 Objectives, Methodology and Synthesis
• From Device Characteristics to Performance in Application
• System Design and Performance Assessment
• Impact of CSP LED Device on System/Module Design
• CSP LED System/Module Performance in Application
 Definition and Types of LED Lighting Modules
• Definitions
• LED Module in the Global LED Value Chain
• The Different Types of LED Modules - Taxonomy
• The Different Types of LED Modules - Positioning
 Main Functions in LED Lighting Modules
• System Structure
• Parameter Interdependence
 Optical Design of CSP LED Lighting Modules
• Optical Management inside LED Devices
• CSP LED Optical Behavior
• Light Side Emission of a Package Free CSP LED Device
• Introduction
• Discontinuities
• Consequences
• Influence of CSP LED Package on Emission Profile
• Light Emission Profile
• CSP LED FWHM
• Observations
• Measurement on Cube and Rim CSPs
• Light Emitting Surface (LES) and Beam Angle
• Optical Management in the Application
• Luminance Control
• Optical Integration - Single LED and Arrays
• Shadowing Effect in Close Pack Arrangements
• Main Consequences and Opportunities of the Optic Properties of CSP LEDs

8
o CSP LED Lighting Module P112
 Thermal Management of CSP LED Lighting Modules
• Why Thermal Management is Required for LED Systems?
• Importance of Thermal Management for LED Reliability
• Thermal Path inside the CSP LEDs
• CSP Thermal Architecture Compared to Standard LEDs
• Thermal Resistance of CSP LEDs
• Maximal Junction Temperature of CSP LEDs
• Influence Parameters on Thermal Resistance
• Size and Power
• Package Type
• Substrate/PCB
• Contact Pads
• Thermal Resistance in the Application
• Reliability of CSP LEDs Compare to Traditional LED Components
• Major Trends in Thermal Management
• Main Consequences and Opportunities of the Thermal Properties of CSP LEDs
 Electrical Management of CSP LED Lighting Modules
• Electrical Behavior
• Resistive Behavior
• Binning Repartition
• Multiple LEDs Arrangements
• Introduction
• Middle and High Power LED Modules
• CSP LED Modules
• LED Modules Operating Window
• LED Balancing Circuit (Electrical Behavior)
• Electrical Static Discharge (ESD) and Electrical Over Stress (EOS)
• Electrical Static Discharge (ESD) Protection in LED Package
• Electrical Static Discharge (ESD) Protection in LED Global System
• Electrical Management - Minimal Spacing
• Main Consequences and Opportunities of the Electrical Properties of CSP LEDs
 Precautions for CSP LED Integration into Modules
• Handling Precautions
• PCB Design for Optimal Performance
• Solder Recommendations
• Reflow Process for CSP LEDs
 CSP LED Lighting Module Performance in Applications
• Is a CSP a Cost Effective High Power LED or a Super Mid Power LED?
• CSP LEDs in Lighting Products - Positioning
• CSP LED vs COB LED
• CSP LEDs in Lighting Products - Opportunities
• Opportunities for Accent Lighting
• Cost Value for Accent Lighting
• Opportunities for Spot Light Integration
• Opportunities for Global Indoor Application (i.e.: General Lighting)
• Integration in General Lighting Applications - Pros & Cons
• Integration in General Lighting Applications - Case Study
• Spotlighting
• Downlight
• Outdoor Lighting
• Linear Tube
• High Bay
• Lamp
• Spectrum Control with CSP LEDs
• CSP LEDs Diversity
• The Different Types of LED Modules - Positioning
• CSP LED Module Positioning vs Other Technologies
• Market Trends - Share of CSP LED Module Revenue (2016 vs. 2021)
o Conclusion P208
o Appendix - About Yole Développement P211
o Appendix - About PISEO P230

9
Pars MUKISH (Business Unit Manager - LED/OLED, Sapphire and Lighting Systems - Yole Développement)
• Pars MUKISH holds a master’s degree in Materials Science & Polymers from ITECH in France and a master’s degree in Innovation & Technology Management from EM Lyon, also
in France. He works at Yole Développement, the "More than Moore" market research and strategy consulting company, as Senior Market and Technology Analyst in the fields of
LED, OLED, Lighting Technologies and Compound Semiconductors, carrying out technical, economic and marketing analyses. In 2015, Pars has also taken on responsibility for
developing LED/OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst for
several years at the French Research Center CEA.
Pierrick BOULAY (Market & Technology Analyst - LED/OLED and Lighting Systems - Yole Développement)
• Pierrick BOULAY works as a Market and Technology Analyst in the fields of LED, OLED and Lighting Systems, carrying out technical, economic and marketing analysis at Yole
Développement, the "More than Moore" market research and strategy consulting company. He has experience in both LED lighting, including general and automotive lighting,
and OLED lighting. In the past, he mostly worked in R&D departments for LED lighting applications. Pierrick holds a master’s degree in Electronics from ESEO in France.
Dr. Olivier ANDRIEU (System Architect & Senior Research and Innovation Consultant - PISEO)
• Dr Olivier Andrieu is an R&D Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team to
perform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking into
account mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and more
recently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level.
Joël THOME (General Manager & Senior Research and Innovation Consultant - PISEO)
• Joel Thome is the General Manager & Senior Research & Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Joel Thome performs numerous
technical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s R&D team. With a Master’s Degree in mechanical
engineering, Joel has been working in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business,
marketing and R&D senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes including
strategic roadmaps and project portfolio management. Today, Joel Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the Cluster
Lumière association.
Grégory DUCHENE (Senior Optical Systems Engineer - PISEO)
• As a Senior Optical Systems Engineer, Grégory Duchêne is in charge of optics related projects at PISEO. He has created numerous innovative designs for optical systems, based
on spectral optimization and light conversion approaches. These disruptive solutions, developed in collaboration with other PISEO experts, are dedicated to general lighting,
automotive and imaging applications. Gregory also collaborates with Yole Développement analysts to perform comprehensive technical and marketing analyses focusing on LED
lighting modules. Before PISEO, he worked for over ten years on the development of optical designs, including control benches, LED-based lighting systems, CMOS and CCD
sensors, signal processing solutions and more. Gregory Duchene has a Master’s Degree in optics from the Institut d’Optique Graduate School (IOGS - France).
ABOUT THE AUTHORS OFTHE REPORT

11
• Flashlight is the main applications for CSP LEDs. Due to their small form factor and ability to deliver high lumen output, CSP LEDs have a fast
growth in this market. Moreover, a trend in flashlight application is to use multiple LEDs to implement a dual color flash.
• TV manufacturers are using CSP LED because of their small for factor and their large beam angle. It allow to reduce the thickness of the panel and
reduce the number of LEDs used in.
• General lighting is the latest industry using CSP LEDs in luminaire. It will be used for large area lighting, spot lighting applications or to bring new
functionalities like tunable white applications.
• CSP LED are being developed to be used in headlamp application for automotive lighting with higher reliability compared to traditional LEDs.
Overview
CSP LED APPLICATIONS LANDSCAPE
2016 2017
Back Light
Unit forTV
General
Lighting
Flash for
Smartphone
2014
Applications:
Some
Integrators:
2015
Time
Automotive
Lighting
Probably :

12
What is Chip Scale Package (CSP)?
• CSP are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Silicon ICs was driven by
miniaturization, improved thermal management, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever
shrinking die. Chip Scale Packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging (e.g.:
module packaging for LED). It is therefore a natural evolution for such packaging innovation to proliferate into other industries (such as the LED
industry).
• Basically, a CSP represents a single chip direct mountable package that have the same size as the chip.
• In reality, the package must have an area no larger than 1.2 times that of the die.
• Regarding LED device, CSPs are made of blue Flip Chip LED die on which a phosphor layer is coated (as main application of such package is
General Lighting).
• Flip Chip technology is an enabling technology to develop CSP as such package require no wire bonding (to have package size at the chip scale level).
• As getting rid of several process steps of traditional LED packaging, CSPs are also impacting the industry structure with some LED chip
manufacturers directly supplying their products to LED module manufacturers.
Definition
CSP LED DEVICE - INTRODUCTION
TSMC Chip Scale Package
Source: TSMC
Samsung Chip Scale Package
Source: Samsung

13
While
traditional LEDs
are split in
different
categories, CSP
LEDs are part
of both high or
mid-power
LEDs.
CSP LEDs Definition - Power Density Criterion
CSP LED DEVICE - FAMILY DESCRIPTION
LEDs technologies have their own power range :
• Middle Power LED : 0 < MP < 1W
• CSP LED : 1 < CSP < 7W
• High Power LED : 3 < HP < 8,5W
CSP LEDs can be separated into 2 groups
according to their power range :
• Middle Power CSP: from 1W to 3W
• High Power CSP: from 3 to 7 W
Middle Power LEDHigh Power LEDCSP LED
High Power LED
Middle Power LED
CSP LED
High Power
Middle Power

14
CSP LEDs Structure - Focus on Packaging
CSP LED DEVICE -TECHNOLOGY
User perspective is focused on external packaging properties, more than internal structure.
• Two types of packaging can
be observed, according to
the presence or not of walls
around the LED.
• Cube design
• Rim design
• The “cube design” appears
new on the market and
offer singular optical
properties.
• The “rim design” has a
conventional behavior
compared to the cube
design
"Cube Design"
CSP Packaging without walls
"Rim Design"
CSP Packaging with walls
Silicone
Encapsulated
Package Free Ceramic Substrate Entirely Package
Vertical thin
film
X
Wafer Level
Chip
Flip Chip X

15
LED chip
Phosphor
SMD pads – cathode/anode
Underfill
• The last known CSP structure is a packaged Flip Chip LED
• Like the Vertical Thin Film CSP, this packaged FC structure enables to introduce an ESD protection diode inside the LED
package
Flip Chip packaged CSP LED vs High PowerType LED
CSP LED DEVICE -TECHNOLOGY
Get the power in / out
Power to light conversion
Spectral converter (White LED)
Optical extraction functions : light
extraction, internal reflection
Thermal extraction
Lens
LED chip
Encapsulate
Reflector
Substrate
Bond wire Die attach substrate
SMD pads – cathode/anode
Lead frame
Thermal pad
Flip Chip packaged CSP LEDHigh Power type LED
Silicone Over mold
Substrate
White Silicone

16
Flip Chip CSP LED Manufacturing Process
CSP LED DEVICE - MANUFACTURING PROCESS
Die formation by
epitaxy
Singulation
EpiWafer LED Chips on EpiWafer
Chip transfer & binningPhosphor dispensing
Chip formation
Attach on substrate
Thermal pad Thermal pad
Die
Substrate
Transfer & Singulation
Cutting tape
Flip Chip CSP LED
In the Flip Chip CSP LED manufacturing process, interconnection, encapsulation and lens attach steps have been removed compared
to conventional LED process
LED Packaging

17
• LED CSP ASP is clearly at an intermediate level between Mid Power and High Power LED.
• The price level reflects the success of the cost breakdown made by suppressing a large part of the packaging.
• However, the ratio Power to Cost is similar to the other packages and not technology dependent. The price is also market oriented, with
a clear trend of lm/$ control.
Price Positioning of CSP LEDs (Vs.Traditional LEDs)
CSP LED - COST / PRICE
Type of LED ASP
Traditional middle power LEDs $0,01 to $0,10
CSP middle power LEDs $XX
CSP high power LEDs $XX
Traditional high power LEDs $XX
4
3
2
1
Power
Range
(W)
0,500 0,25
CSP LEDs
Middle Power - High
Power
Traditional
Middle
Power LEDs
Traditional High Power
LEDs
Single
LED ASP1
($)
0,75 ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

18
In 2013,
Lumileds was
the first to
commercialize
LEDs in CSP
format. But several
other
manufacturers
(mostly Taiwanese)
and material
suppliers were also
following the same
development
trends.
Key Players Identified
CSP LED - INDUSTRY
US:
Xxx, Lumileds,
Xxx
South Korea:
Seoul, Xxx (…)
Taiwan:
Edison Opto,
Xxx(…)
China:
Xxx (…)
Germany:
Osram1
Japan:
Xxx, Xxx, Nichia,
(…)
UK:
Xxx
1Manufacturer of CSP-like LEDs

19
CSP LEDs
represented a
market volume
of 2.3B units in
2016 and should
grow to a size of
Xx B units in
2021.
As a reference, in
2016, HP LEDs
represented a volume
of 25.4B units , and
MP LED a volume of
76.7 Bunits.
CSP LEDVolume Forecast (2012 - 2021)
CSP LED - MARKET
Note: CSP LEDs “are / will be” used both in middle power and high power LEDs.

20
CSP LED
Devices have
specific
characteristics
which offer
certain
advantages but
also require
particular
attention for
integration.
Impact of CSP LED Device on System/Module Design
CSP LED LIGHTING MODULE - OBJECTIVES, METHODOLOGY AND SYNTHESIS
Electrical
Management
To ensure optimal
performances
Optical Design
To shape the light beam
Thermal
Management
To ensure life time and
luminous efficacy
• Less thermal interfaces
• Xxx
• Xxx
• Small soldering surface
• Small size permitting close pack
• Xxx
• Xxx
• Small dimensions
• Xxx
• Xxx
Key System/Module
Parameters
Key characteristics of CSP LED Devices Impact on System/Module
• Xxx
• Heat sink to keep a low Tj
• Xxx
• Xxx
• Xxx
• Take special precautions (design,
manufacturing, logistics)
• Need for a perfect optical alignment
• Xxx
• Xxx
Beneficial property Critical property that may impact module integration ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

21
CSP LED shows
a direct thermal
path from active
layer to solder
pads
Thermal Path inside the CSP LEDs
CSP LED LIGHTING MODULES - THERMAL MANAGEMENT
• Direct connection to metal parts (solder
bump, lead frame) allows good thermal
conduction between materials.
• Low number of interfaces participates to
the improvement of the thermal
conduction.
• Difference between the LED chip
temperature and the solder pad
temperature is reduced compared to
standard LED chip
Wafer Level CSPFlip Chip CSP
Heat
production
areas
Heat
transfer
Active layer
Xxx
Xxx
Solder pads
Xxx
Active layer
Solder pads

22
• High Power LED & CoB modules:
• High luminous efficacy with moderate
luminous density.
• Cree XQ-E module:
• Cree XQ-E has the same internal structure as
HP and MP LED (chip connected with wire
bonds), but its size is closer to CSP LED.
• XQ-E follows High Power LED tendency.
• CSP LED module:
High luminous density but moderately effective.
• Mid Power LED module:
High efficacy but very poor luminous density.
Luminous performances of CSP LED modules are
closer to CoB and High Power LED modules
than Mid Power LED modules.
Those performances can be correlated to the
internal structure as shown by Cree XQ-E LED
which has a chip scaled size but wire bonded.
Is a CSP a Cost Effective High Power LED or a Super Mid Power LED?
CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS
Luminous performances of different LED technology modules

23
CSP LED allows
more flux than
a Mid Power
LED, with a
better cost than
High Power
LED
CSP LEDs in Lighting Products - Positioning
• CSP LED have clearly been created by the major
LED manufacturer to fill the gap between Mid
Power LED and High Power LED.
• This technology doesn’t have the required
qualities to directly compete Mid Power LED
neither High Power LED.
• lm/$ is too low compared to the achievable
lm/$ based on Mid Power LED.
• Lower performances than High Power LED:
lm/W, optical properties, thermal properties.
• However, properties like embedded power, light
flux performance, diversity of color, CCT, CRI
allow much more possibilities than those achieved
with mainstream Mid Power LED.
• This open the way for intermediate products,
between core market and high level positioning,
which suffer today from low competitivity or bad
perceived performance.
Mid Power
LED
CSP
LED
High
Power
LED
Product
performances
More flux
Less cost
Office
Retail
Hospitality
Lamps…
Highbay Outdoor
Accent Lamps …
System cost

24
CSP LED Module Positioning vs OtherTechnologies
High Bay / Low Bay
Spot Lighting
Troffer
Downlight
Linear Lighting
Street Lighting
WallWasher
Middle Power LED
Module
High Power LED
Module
COB LED Module
MAIN
LUMINAIRE
TYPE
LAMP
Can be used but not mainstream  Custom solution mostly
Mainstream technology
CSP LED Module
Opportunities to be evaluated
Automotive Headlamp
Complete analysis in the report!

25
CSP LEDs
represented less
than 1% of LED
module
business in
2016.
It should
represent more
nearly 6% by
2021.
MarketTrends

26
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Chip-scale packages (CSPs) are new to the LED
industry, but are the mainstay of the traditional
semiconductor industry, where they improve
reliability, thermal management and enable smaller
packages.
CSP LEDs can be less than a tenth of the size of high
and middle power LEDs, increasing power density
and simplifying integration into final products.
This new architecture can also lower thermal
resistance, improve reliability and widen viewing
angles compared to other traditional packages.
However, there are also several challenges to
overcome at the device manufacturing and module
integration levels. These include color uniformity,
chemical stability, given there is little to no sealing
off from the external environment, and control of
optical properties like the radiation pattern.
In this context, Yole Développement estimates
that CSP LED modules represented less than 1%
of the LED module business in 2016. However,
with strong potential in multiple applications
and the lighting industry getting experience with
integrating such technology, we forecast a market
share of nearly 6% by 2021.
This report provides a comprehensive analysis of
CSP LED devices, with analyses including: chip and
package technology, manufacturing processes, related
costs/prices, industry and market trends. The report
details deeply analyses CSP LED lighting module
design, with focuses including: optical design, thermal
and electrical management and precautions for CSP
LED integration.
CSP LED LIGHTING MODULES
Market & Technology report - February 2017
CSP LEDS: A PROMISING SOLUTION WITH CHALLENGES TO OVERCOME
CSP LED lighting modules: a potential revolution for the LED industry?
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• CSP LED device technology,
manufacturing and industry
• CSP LED application landscape
• CSP LED module pros and cons,
and impact on supply/value chain
• CSP LED module design: thermal
management, optical design, power
supply and driver
OBJECTIVES OF THE REPORT
Objectives are to understand:
CSP LED technology:
• Differences from other packages
• Impact on manufacturing processes
• Potential for cost reduction
Changes in system design
and integration rules:
• Impact on optical design
• Impact on thermal management
• Impact on electrical management
Performances in applications:
• Positioning of CSP LEDs compared
to mid-power, high-power LEDs
and COB LED modules
• Opportunities for CSP LEDs in
applications
Competitive landscape and supply
chain:
• Identify key players
• Impact on the LED supply chain
(Yole Développement, February 2017)
LED lighting module market revenue in 2021
Breakdown by module technology in US$
Others
(Middle power LED module,
high power LED module,
COB LED module)
94.4%
CSP LED
module
5.6%
A CSP LED market size multiplied by more than 3 since 2016
AFTER SMARTPHONES AND TVS, A POTENTIAL REVOLUTION IN GENERAL
AND AUTOMOTIVE LIGHTING APPLICATIONS?
CSP LEDs add value through power density offered
from a small surface. The first targeted application
was smartphone flashes. As smartphones get
thinner and add functions, so too must integrated
components/modules.
The small form factor and wide beam angle of CSP
LEDs have also driven their use in TV backlighting
units. Wide beam angles mean the pitch between
LEDs can be larger, reducing the number of devices
needed and in turn lowering backlight cost.
But CSP LEDs are also a means to develop new
functions in lighting products. Some general lighting
applications are likely to adopt these light sources
to reduce the cost of the lamp/luminaire. Their
small size enables LED clusters, similar to chip-
on-board (COB) LED modules but with more
functionality. CSP LED clusters promise tunable
white, human centric light (HCL), intended to
promote a person’s well-being, mood and health,
and others smart lighting functions.
Last but not least, high luminance and uniformity
will mean CSP LEDs enter automotive headlamp
applications, which requires high intensity and
beam shape control. New developments in
• Thermal Management Technology
and Market Perspectives in Power
Electronics and LEDs 2017
• LED Packaging 2017: Market,
Technology and Industry Landscape
•Automotive Lighting: Technology,
Industry, and Market Trends
• UV LEDs - Technology, Manufacturing
and Application Trends
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CSP LED LIGHTING MODULES
COMPANIES CITED IN THE REPORT (non exhaustive list)
Apple, ATS, Audi, BMW, BREE Optronics, Bright LED, Carclo, Cree, Dow Corning, Edison Opto, Epistar,
ETI, Everlight, Fraen, Genesis Photonic Inc., Haeusermann, Hakko, Harvatek, Honglitronics, Huawei, ITRI,
Jufei, Kathod, Kingbright, Ledil, Lextar, LG, Lite On, Luminus Devices, Mason, Maven Optronics, Mercedes-
Benz, MLS, Nationstar, Nichia, Oasis, Opel, Optotech, Osram, Philips Lumileds, Plessey Semiconductors,
Refond, Samsung, Sanan, Seoul Semiconductors, Toshiba, Toyoda Gosei, Tridonic, Trilux, TSMC, Unistars
Mercury, Unity Opto, Wellypower...
matrix headlamps will include CSP LEDs to increase
matrix resolution, enhance driver vision and improve
Advanced Front Light Systems (AFLS) in combination
with cameras.
In this report, Yole Développement maps the CSP LED
application landscape. It analyses CSP LED lighting
module performance in general lighting applications,
identifying opportunities, describing case studies, and
comparing positioning against other module technologies.
CSP LED application landscape
2016 2017
Backlighting
unit forTV
General
lighting
Flash
smartphone
2014
APPLICATIONS:
EXAMPLE OF
INTEGRATORS:
2015
Time
Automotive
lighting
Probably:
SIMPLIFIED MANUFACTURING PROCESS IMPACTS THE SUPPLY/VALUE CHAIN
Comparison between standard, COB and CSP LED module
manufacturing chain
COB is considered as a module itself. Therefore, there is no need for a module
manufacturer in the manufacturing chain.
CSP LEDs can be made by chip manufacturers because most of the package steps are removed.
However,additional expertise is required, for example in applying phosphores
LED Chip
manufacturing
Standard LED package
manufacturing
Standard LED module
manufacturing
LED Chip
manufacturing
LED Chip + CSP LED manufacturing
COB LED manufacturing
Standard low / middle /
high power LED
module
COB LED
module
CSP LED
module
CSP LED module
manufacturing
LED die / Chip Packaged LED
Light / LED
module
CSP LED technology eliminates some package
assembly and die attach stages. This is likely to
benefit to LED chip manufacturers, who can develop
packages and supply them directly to LED module
manufacturers more easily, bypassing their traditional
customers, and so increasing their profits. Vertically
integrated LED manufacturers can also decrease
their packaging costs. However, adopting the
technology requires development of new expertise,
modifying the traditional packaging landscape. For
example, phosphor and encapsulant deposition
processes will move from dispensing to phosphor
sheet/film deposition or molding. This evolution
affects equipment and material suppliers, who have
to develop new solutions.
Operationally, Lumileds was the first company to
commercialize LEDs in CSP format in 2013. The
company was rapidly followed by several other
players, mostly Taiwanese. But some others, like
Osram, still have doubts about the necessity of
such technology, and instead are positioned toward
traditional middle and high power LEDs, including
COBs.
This debate is also relevant at the LED module level,
where CSPs cause some difficulties. For example,
during PCB design, special care should be given
to copper traces and solder masks for optimum
performance. Some critical properties, like their
small soldering surfaces and sideways light emission,
may impact module integration. And while the
benefits of CSP LEDs are not yet clear for them, they
question the real opportunity of this solution.
This report provides insights into the changes in
manufacturing and integration processes CSP LEDs
bring, and potential consequences on the supply/value
chain. Additionally, it analyses real opportunities for such
technologies based on simulations and case studies.

Find more
details about
this report here:
MARKET TECHNOLOGY REPORT

About the authors of the report 5
Report objectives 6
Companies cited in this report 7
Glossary 8
Methodology 9
Executive summary 10
Status of the LED industry and recent trends 40
Status of the LED industry including
- Introduction - Segmentation of packaged LEDs
- History of the LED industry
- Packaged LED revenue forecast - Split by application
- 2015 and 2016 in a nutshell
- Future trends
- LED market trends
Recent trends in the LED industry
- Overview
- Product diversification (Level 1)
- Application diversification - Automotive lighting
- Product diversification (Level 2) - UV LEDs
- Vertical integration - LED module
- Conclusion
CSP LED application landscape 61
Overview
Flash
Backlighting
General lighting
Automotive lighting
CSP LED devices 68
Introduction to CSP LED devices
- Definition
- Benefits
CSP LED device family description
- Introduction
- Size criterion
- Power density criterion
- CSP or not CSP?
- Power criterion
CSP LED device technology
- Differences from other packages
- CSP LED structures
- CSP LEDs in LED package proliferation
- Flip Chip CSP LEDs vs high power-type LEDs
- Wafer Level CSP LEDs vs high power-type LEDs
- Vertical thin film CSP LEDs vs high power-type LEDs
- Flip Chip packaged CSP LEDs vs high power-type LEDs
CSP LED device manufacturing process
- Conventional LED manufacturing process
- Flip Chip CSP LED manufacturing process
- Wafer Level CSP LED manufacturing process
- CSP LEDs vs conventional LEDs
- Impact on supply/value chain
CSP LED device cost/price
- Potential for cost reduction
- The case of CSP architecture for low and middle
power LEDs
- The case of CSP architecture for high power LEDs
- Price positioning of CSP LEDs vs. traditional LEDs
- Price positioning of CSP LED modules vs. traditional
modules
CSP LED device industry
- Key players identified
- Highlights of US and European Players
- Highlights of Japanese Players
- Highlights of Korean Players
- Highlights of Taiwanese and Chinese Players
- Trends - Flow chart comparison between standard,
CSP and COB LEDs
CSP LED market
- CSP LED market volume (2012 - 2021)
CSP LED lighting module 112
Chip singulation
- Objectives, methodology and synthesis
- From device characteristics to performance in applications
- System design and performance assessment
- Impact of CSP LED device on system/module design
- CSP LED system/module performance in application
Definition and types of LED lighting modules
- Definitions
- LED module in the overall LED value chain
- The different types of LED modules – Taxonomy
- The different types of LED modules – Positioning
Main functions in LED lighting modules
- System structure
- Parameter interdependence
Optical design of CSP LED lighting modules
- Optical management inside LED devices
- CSP LED optical behavior
- Sideways light emission of a package-free CSP LED device
- Influence of CSP LED package on emission profile
- Light emission profile
- Light Emitting Surface (LES) and beam angle
- Optical management in the application
- Luminance control
- Optical integration - Single LED and arrays
- Shadowing effect in close pack arrangements
- Main consequences and opportunities of the optical
properties of CSP LEDs
Thermal management of CSP LED lighting modules
- Why is thermal management required for LED
systems?
- Importance of thermal management for LED reliability
- Thermal path inside the CSP LEDs
- CSP thermal architecture compared to standard LEDs
- Thermal resistance of CSP LEDs
- Maximal junction temperature of CSP LEDs
- Influence parameters on thermal resistance
- Thermal resistance in the application
- Reliability of CSP LEDs compare to traditional LED
components
- Major trends in thermal management
- Main consequences and opportunities arising from the
thermal properties of CSP LEDs
Electrical management of CSP LED lighting modules
- Electrical behavior
- Resistive behavior
- Binning distribution
- Multiple LED arrangements
- LED module operating window
- LED balancing circuit (electrical behavior)
- Electrical Static Discharge (ESD) and Electrical Over
Stress (EOS)
- Electrical Static Discharge (ESD) protection in LED
package
- Electrical Static Discharge (ESD) protection in LED
global system
- Electrical management - Minimal spacing
- Main consequences and opportunities of the electrical
properties of CSP LEDs
Precautions for CSP LED integration into modules
- Handling precautions
- PCB design for optimal performance
- Solder recommendations
- Reflow process for CSP LEDs
CSP LED lighting module performance in applications
- Is a CSP a cost effective high power LED or a super
mid power LED?
- CSP LEDs in lighting products - Positioning
- CSP LED vs COB LED
- CSP LEDs in lighting products - Opportunities
- Opportunities for accent lighting
- Cost value for accent lighting
- Opportunities for spot light integration
- Opportunities for global indoor application (i.e.:
general lighting)
- Integration in general lighting applications - Pros and cons
- Integration in general lighting applications - Case studies
- Spectrum control with CSP LEDs
- CSP LED diversity
- The different types of LED modules - Positioning
- CSP LED module positioning vs other technologies
- Market trends - Share of CSP LED module revenue
(2016 vs. 2021)
Conclusion 208
Appendix - About Yole Développement 211
Appendix - About PISEO 230
TABLE OF CONTENTS (complete content on i-Micronews.com)
Pars MUKISH holds a master’s degree
in materials science and polymers from
ITECH in France and a master’s degree in
innovation and technology management
from EM Lyon in France. Since 2015,
Mukish has taken on responsibility for
developing LED, OLED and sapphire
activities as Business Unit Manager at Yole
Développement. Previously, he worked as
Marketing Analyst and Techno-Economic
Analyst for several years at the French
Research Center, CEA.
Pierrick BOULAY works as Market
and Technology Analyst in the fields of
LED, OLED and lighting systems, doing
technical, economic and marketing analysis
at Yole Développement, the “More than
Moore” market research and strategy
consulting company. He has experience
in both LED lighting, including general
lighting and automotive lighting, and OLED
lighting. In the past, he mostly worked
in RD departments for LED lighting
applications. Pierrick holds a master degree
in Electronics from ESEO in France.
YOLE DÉVELOPPEMENT
Dr Olivier ANDRIEU is RD Project
Director and Mechatronic and LED System
Architect at PISEO. He is working in
collaboration with Yole Développement’s
team to perform comprehensive technical
analyses of innovative LED-based optical
systems and markets. His expertise is based
on the development of disruptive solutions
taking into account mechanical, electronic,
optic and thermal issues to achieve application
requirements. Previously, Dr Andrieu worked
for EFI Automotive as head of innovation and
more recently for Philips Lighting where he
developed and implemented numerous LED
lighting solutions on a global level.
Joel THOME is the General Manager and
Senior Research and Innovation Consultant
at PISEO. In collaboration with Yole
Développement’s team, Thome performs
numerous technical and market analyses
focusing on LED solutions, in addition to
developing innovative optical solutions
with PISEO’s RD team. With a master’s
degree in mechanical engineering, Thome
has worked in the lighting industry for more
than 25 years. After beginning his career at
Philips Lighting, he has recently held various
global business, marketing and RD senior
management positions. During this period
he developed strong expertise in lighting
controls, LED technology and innovation
processes including strategic roadmaps and
project portfolio management. Today, Thome
is also the administrator of the GIL-Syndicat
du Luminaire trade union organisation and
the Cluster Lumière association.
PISEO

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Founded in 1998, Yole Développement has grown to become a group of companies
providing marketing, technology and strategy consulting, media and corporate finance
services. With a strong focus on emerging applications using silicon and/or micro
manufacturing, the Yole Développement group has expanded to include more than 50
collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays,
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ABOUT PISEO
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and cutting edge characterization equipment, all situated
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industrial global leader, delivers a whole set of services
to the industry throughout the entire product life cycle.
Therefore, PISEO runs projects from applied research
up to product recycling, including market analysis,
technology scouting, strategic planning and industrial
design.
CONTACTS
More info on www.piseo.fr
Press contact: Joël Thomé, PISEO General Manager
(thome.joel@piseo.fr)

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TERMS AND CONDITIONS OF SALES

Presentation of Yole
Développement
With Focus on Solid
State Lighting (LED,
OLED…) and Display
Activities
Corporate Presentation

28
Yole Développement
FromTechnologies to Market
©2017 | www.yole.fr | CSP LED Lighting Module | Sample

29
Our 30 analysts
operate in the
following areas.
FIELDS OF EXPERTISE
Compound Semi.
Imaging
Photonics
Batteries / Energy Management
Power Electronics
Displays
Solid State Lighting
(LED, OLED…)
Advanced Packaging
MEMS Sensors
RF (Devices Technologies)
Advanced Substrates
MedTech
Manufacturing

30
Consulting and Analysis
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• Patent Investigation and patent infringement risk
analysis
• Teardowns Reverse Costing Analysis
• Cost SimulationTool
www.i-Micronews.com/reports
Financial services
• MA (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management optimization
www.yolefinance.com / www.bmorpho.com
Media
• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication webcast services
• Events
www.i-Micronews.com
4 BUSINESS MODELS

31
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation Business maker
www.bmorpho.com
MA operations
Due diligences
www.yolefinance.com
Test Measurement
Expertise
Research Innovation
www.piseo.fr

32
OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Yole Inc.
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Phoenix
Yole Korea
Seoul

33
RESEARCH PRODUCTS - CONTENT COMPARISON
Custom analysis scope is defined with
you to meet your information and
budget needs
Breadth of the analysis
Depthoftheanalysis
Custom
Analysis
Workshops
Standard Reports

34
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
RD centers
Our analysts
provide market
analysis,
technology
evaluation, and
business plan
along the entire
supply chain.
SERVING THE ENTIRE SUPPLY CHAIN

35
We are working
accross
multiples
industries to
understand the
impact of More-
than-Moore
technologies
from device to
system.
SERVING MULTIPLE INDUSTRIAL FIELDS
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systems
Industrial and
defense
Energy

36
o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in:
• MEMS Sensors.
• RF devices and technologies.
• Imaging.
• Medical Technologies (MedTech).
• Photonics.
• Advanced packaging.
• Manufacturing.
• Power electronics.
• Batteries Energy management.
• Compound semiconductors.
• LED.
• Displays.
o You are looking for:
• An analysis of your product market.
• A review of your competitors evolution.
• An understanding of your manufacturing and production costs.
• An understanding of your industry technology roadmap and related Ips.
• A clear view on the evolution of the supply chain.
Our team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the
challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 18 years, we worked on more than 1?500 projects, interacting with technology professional and high level opinion makers from the main players of the industry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com

37
MARKET ANDTECHNOLOGY REPORTS byYole Développement
o MEMS SENSORS
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus
2017
− MEMS Microphones, Speakers and Audio Solutions 2017
− Status of the MEMS Industry 2017
− MEMS Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017
− Sensor Modules for Smart Building 2017
− Sensing and Display for AR/VR/MR 2017 (Vol 1)
− MEMS Packaging 2017
− Magnetic Sensors Market and Technologies 2017**
− Microspectrometers Markets and Applications 2017**
o RF DEVICES AND TECHNOLOGIES
− RF Components and Modules for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o IMAGING OPTOELECTRONICS
− 3D Imaging Sensing 2017
− Status of the CMOS Image Sensor Industry 2017
− Camera Module for Consumer and Automotive Applications 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Active Imaging and Lidars 2017 (vol 1)
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Sensors for HomeCare 2017
− Sensors for Medical Robotics 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market Technology Trends 2017
− 3D Business Update: Market Technology Trends 2017
− Advanced QFN: Market Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− Advanced Packaging for Memories 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment Materials for Fan Out Technology 2017
− Equipment Materials for 3D T(X)V Technology 2017
− Emerging Non Volatile Memories 2017
** To be confirmed
OUR 2017 REPORTS PLANNING (1/2)

38
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power Mosfets Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends in Power Electronics 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017
− Thermal Management for LED and Power 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017
o DISPLAYS
− Microdisplays and MicroLEDs 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− QD for Display Applications 2017
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Emerging Display Technologies 2017**
o SOLID STATE LIGHTING (LED, OLED…)
− UV LEDs 2017 - Technology, Manufacturing and Application Trends
− Agricultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs 2017 - Technology, Manufacturing and Application Trends
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− CSP LED Lighting Modules 2017
− LED Packaging 2017 - Market, Technology and Industry Landscape
PATENT ANALYSIS by Knowmade
− 3D Monolithic Memory: Patent Landscape Analysis
− Microfluidic Diagnostic: Patent Landscape Analysis
− GaN Technology: Top-100 IP profiles**
− Uncooled Infrared Imaging: Patent Landscape Analysis**
− MEMS Microphone: Patent Landscape Analysis**
− MEMS Microphone: Knowles' Patent Portfolio Analysis**
− MicroLEDs: Patent Landscape Analysis**
− Microbolometer: Patents used in products**
− Micropumps: Patent Landscape Analysis**
− Flexible batteries: Patent Landscape Analysis**
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
** To be confirmed
OUR 2017 REPORTS PLANNING (2/2)

39
o MEMS SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications Market 2016: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
OUR 2016 PUBLISHED REPORTS LIST

40
• Consulting and Specific Analysis
• North America: Steve LAFERRIERE, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr - +1 31 06 008 267
• Greater China: MavisWANG, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• Japan Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• RoW: Jean-Christophe ELOY, President CEO,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
• Report business
• North America: Steve LAFERRIERE, Director of Northern America Business Development
Email: laferriere@yole.fr - +1 31 06 008 267
• Europe: Lizzie LEVENEZ, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Japan Asia: Miho OTHAKE, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
• Greater China: MavisWANG, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• Financial services
• Jean-Christophe Eloy, CEO President
Email eloy@yole.fr - +33 4 72 83 01 80
• General
Email: info@yole.fr - +33 4 72 83 01 80
CONTACT INFORMATION
Follow us on

41
About Solid State Lighting (LED,
OLED…) and Display Activities

42
We are active
throughout the
value chain:
from substrates
to systems!
And we interact
with industrial /
RD players
from each level!
Yole is active throughout the value chain (Example of LED and Sapphire activities)
FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES
Substrate
SiC / Sapphire / Silicon /
Bulk GaN / Engineered
substrates
LED epi-
wafer
Mesa LED, Flip Chip LED,
Vertical LED structures
LED dies-
on-wafer
LED dies
Front-end Level 0 - Epitaxy
• Nucleation layer
• n-type layer
• Active layers (MQW)
• p-type layer
Back-End Level 0 - Packaging
• Substrate separation Bonding
• Die singulation
• Testing Binning
LED systems and applications
Front-end Level 1 - Device Production
• Inspection
• Masking / Lithography
• Etching
• Metallization / Contacts / Mirrors
Back-End level 1 - Packaging
• Die Attach Interconnections
• Phosphors
• Encapsulation Optics
• Testing Binning
Packaged LEDs
Module Packaging
• Substrates (PCB)
• Encapsulation Optics
• Heatsink
• Testing Binning
LED modules

43
“What’s Behind
the Crystal Ball?”
Only analysts that
follow the
industry on a daily
basis (trough
interviews) and
developed market
modeling tools
based on
discussions with
key players of the
industry.
Insights on Forecast Methodology (Example of LED and Sapphire activities)
APPLICATION
Forecast of standard
product market volume
(unit)
Ex.: Smartphone, TVs, lamps (…)
Definition of functions using
LEDs
Ex.: “Flash vs. Keypad” for
smartphone (…)
Definition of technical
requirements
Ex.: Efficacy, size (…)
Definition of LED
penetration rate and
competitiveness with
alternative technologies
Ex.: “OLED vs. LED” in smartphone
(…)
Forecast of LED market volume (unit)
Split by application, power type (low vs. medium vs. high
power), package type (single vs. multi-die…) (… )
Definition of LED
ASP
Per power type, packaged
type (…)
Forecast of LED market size ($)
Split by application, power type, package type
(… )
Definition of manufacturing flows for
front-end and packaging (process,
technologies, materials, yields…)
Split by application, power type, package type (…)
Forecast of LED manufacturing
equipment and material markets
(unit and $)
Ex.: Phosphors, encapsulant, dicing equipment
Definition of LED die
surface (mm²)
Definition of substrate die surface (mm²)
and epiwafer volume (unit)
Split by type of substrate (…)
Forecast of LED substrate
markets (unit and $)
Split by type of substrate (…)
Definition of sale
levels of key
manufacturers ($)
Ex: LED, packaging
materials, epitaxy
materials, manufacturing
equipment, MOCVD
reactor, substrate (…)
System Plus Consulting
expertise in reverse
costing / reverse
engineering

44
A team based
on persons
having
complementary
skills and
expertise.
AboutYole’s AnalystTeam
Pars MUKISH - Business Unit Manager - SSL Display
Pars MUKISH holds a master degree in Materials Science Polymers (ITECH - France) and a master degree in Innovation
Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED,
OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing
Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).
Dr. EricVIREY - Senior Market Technology Analyst - Sapphire Display
Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble (INPG - France). He
works as Market and Technology Analyst in the fields of Sapphire, LED / OLED and Display. In the last 12 years, he has held
various RD, engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at
Saint-Gobain Crystals, in charge of Sapphire and Optoelectronic products.
Pierrick BOULAY - Market Technology Analyst - SSL
Pierrick BOULAY holds a master degree in Electronics from ESEO (France). He works as Market and Technology Analyst
in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience
in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in RD
department for LED lighting applications.

45
A collection of
more than 15
reports on Solid
State Lighting
and Display.
Report collection
Previous Publications:
• Status of the LED Industry
• LED in Road and Street Lighting
• LED Front End
• GaN-on-Si Technology and Market
• Phosphors QDs - IP Landscape
2016 Publications:
• OLED For Lighting - February 2016
• Automotive Lighting - April 2016
• UV LED - August 2016
• Sapphire - September 2016
• OrganicTFT - October 2016
2017 Publications:
• Thermal Management for LED and Power Electronic - New
• MicroLEDs and MicroDisplays - New
• CSP LED Lighting Module - New
• Agricultural Lighting - New
• IR LED - New
• Display for Augmented Reality - New
• QD for Display Applications - New
• LED Packaging - Update
• Phosphors QDs - Update
• UV LED - Update
• LED Lighting Module - Update
• Automotive Lighting - Update
Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps (…).
• Supply value chain analysis: business models, relationships (…).
• In-depth analysis of applications and market drivers: challenges, inflection points (…).
• Market data ($, units, wafer starts…).

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