Combo sensors will shape a $3B market, which will drive changes in the value chain, competition, and sensor fusion. Combo sensors will almost triple from 2012 to 2013 2012 was seen by many as a turnkey year for consumer combo sensors, with high volume adoption in platforms such as Samsung Galaxy S smartphones. Since then, many developments have occurred, and the market acceptance of combo solutions has been extremely quick, not only for 6-axis IMU (adopted in a growing number of platforms) but also for 6-axis e-compass (shipments are reaching new records every month). In addition, 9-axis solutions are being introduced to the market and innovative solutions should follow: with integration of pressure sensing, processing units, and RF capabilities… The combo sensor market is estimated to be $446M in 2013, growing to $1.97B in 2018. This represents 21% of the global inertial consumer market in 2013, and will grow to an impressive 66% by 2018. While smartphones and tablets are now driving volume increases and adoption of combos, the picture should be different in 2018. The next market wave should come from wearable electronics, where long-term market potential is huge. While combo sensors will take a significant portion of total market share, opportunities will remain for discrete sensors: from accelerometers used in basic activity trackers to gyroscopes for camera module stabilization. The road was not so easy for inertial combos and some challenges still need to be solved. Outside of the offering, which is still smaller than with discrete sensors, combo sensors are sometimes said to be inaccurate or to create constraints for placement on the board (for magnetic field detection: a tiny magnetometer die is often preferred than a larger combo package). Footprint reduction was the only argument in favor of combos in the past. However it is fair to say that significant achievements have been made in the past couple of months. Most of the past yield issues have been solved, leading to lower price. In addition, combo solutions facilitate both qualification and testing at the integrator level, and development of sensor fusion. This report describes the motivations for each type of combo and analyzes the timing for market adoption for each end-application. Four players share 75% of the market, is there any room for newcomers? STMicroelectronics is the global leader in the inertial consumer sensor market with 42% market share. Only InvenSense and Bosch Sensortec are able to compete with it today. It is key to be able to control the different technologies or to establish the right partnerships to sell a large range of combo solutions. ST is just starting to sell its own magnetometer in 2013, while Bosch has been very active in launching new product lines since 2012... More information at http://www.i-micronews.com/reports/6-9-axis-sensors-consumer-inertial-combos-report/1/396/

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6 & 9 Axis Sensors
Consumer Inertial Combos
Combo sensors will shape a $3.0B market, which will drive changes in
the value chain, competition, and sensor fusion
InvenSense
STMicroelectronics LSM333D –
Source System Plus Consulting
STMicroelectronics LSM330 –
Source System Plus Consulting Meridan Bosch Sensortec Apple

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6 & 9 axis Sensors
Table of contents (1/2)
• Introduction, Definitions & Methodology 5
• Executive Summary 15
1. Market drivers for combo sensors 42
2. 2011-2018 market for inertial combo sensors 52
3. Application trends 61
A. Mobile phones and tablets
• Cell phones and tablets: market dynamics
• 2011-2018 inertial sensors market
• Trends for each type of sensor
B. Gaming
• 2011-2018 inertial sensors market
• Trends for each type of sensor
C. Other consumer electronics
• 2011-2018 inertial sensors market
• Trends for each type of sensor
D. Emerging applications: wearable electronics, remote controls, sports, toys…
• 2011-2018 inertial sensors market
• Trends for each type of sensor

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6 & 9 axis Sensors
Table of contents (2/2)
4. Competitive trends 161
A. Identification of players and market shares
• Identification of competitors
• Discrete accelerometer market shares
• Discrete magnetometer market shares
• Discrete gyro market shares
• 6-axis e-compass market shares
• 6-axis IMU market shares
• Competitors for 9-axis combos
B. STMicroelectronics, InvenSense and Bosch Sensortec technology comparison
A. STMicroelectronics
B. InvenSense
C. Bosch Sensortec
C. Supply chain and new business models
5. Sensor fusion: challenges and opportunities 254
A. Status of sensor fusion in 2013
B. Roadmap and applications
C. Sensor fusion impact and value creation
• Conclusion & perspectives 289

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Report Objectives
• This report covers:
– 3-axis accelerometers, 3-axis magnetometers, 3-axis gyroscopes, 6-axis e-compass, 6-axis IMUs, 9 axis combos
– All types of consumer applications
• Mobile phones
• Tablets
• Gaming, DSC, Laptops & Ultrabooks, etc.
• Emerging applications using motion sensors: wearable electronics, sports & fitness, toys etc.
• This report’s objectives are as follows:
– To provide a deep analysis on the impact for 6 and 9-axis combo solutions
• Challenges and opportunities for consumer MEMS combo sensors
• Impact of combo solutions: for end-markets, for sensor fusion, for the competitive landscape
– To provide a global overview of the market data for consumer inertial MEMS - key market metrics & dynamics:
• 2011-2018 unit shipments and revenue by level of integration (3/6/9-axis)
• Average selling price analysis and expected evolution
• Market share for each level of integration
– Application focus on key existing markets, and those that are emerging and showing the most promise
• Functionalities provided, status in 2013, major drivers for combo solutions, key players as well as global system trends
– To provide a clear understanding of the inertial MEMS value chain, infrastructure & players for the consumer business:
• Market shares, list of all major players and expected new entrants
• Description of key players’ ecosystem and supply chain
– In-depth analysis on the current technology and future developments for the 3 market leaders: STMicroelectronics, InvenSense and Bosch
Sensortec
• Selected teardown of key major sensors to show the device architecture today
• Development of new technologies and potential for combo sensors
– To analyze sensor fusion developments, including indoor navigation and context awareness
• Current developments for sensor hub
• Analysis on the sensor fusion application roadmap and value creation
• Impact expected from inertial combo solutions

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Who Should be Interested in this Report?
• MEMS device manufacturers
– Evaluate market potential of future technologies and
products
– Understand the differentiated value of your products
and technologies in this market
– Build roadmap for modules: what type of combos?
When?
– Identify new business opportunities
– Identify potential strategic partners or technology
providers
– Monitor and benchmark your competition’s
advancements
• MEMS foundries, material and equipment suppliers,
packaging and test houses
– Understand which applications will drive volumes in
2018
– Identify new business opportunities and prospects
• Microcontroller and Application Processor specialists
– Spot new opportunities and define diversification
strategies
• System integrators and developers ( mobile devices,
gaming, sports & fitness, etc.)
– Evaluate market potential of future technologies and
products to differentiate your own products
– Evaluate the benefits of using these new technologies in
your end-system; design architecture for the next
generation of systems
– Screen potential new suppliers able to provide new
functionalities, or cost and size savings
• R&D centers
– Evaluate market potential of future technologies and
products for new applicative markets
– Identify the best candidates for technology transfer
• Financial & strategic investors
– Understand the structure and value chain of the consumer
inertial sensor industry
– Estimate the value of players developing disruptive
products and technologies such as monolithic integration
and smart modules
– Get the global list of main key players and emerging start-
ups in this industry

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Companies Cited in this Report
94Fifty, Adidas, Aichi MI, AKM, Alps Electric, AMS, Analog Devices, Apple, Archos, Aruba Networks,
ASE, Atlas, Atmel, Babolat, Baolab, Blackberry, Bosch Sensortec, Broadcom, Cambridge Mechatronics,
Casio Micronics, CSR, DNP, Domintech, EMMicroelectronics, Epson, FitBark, Fitbit, Freescale, Fujitsu,
Full Flight Technology, Garmin, Gionee, GlobalFoundries, Google, Hana Microelectronics, Hillcrest Labs,
Hisense, Honeywell, HTC, Huawei, ICsense, Instabeat, Intel, InvenSense, Isentek, Jabra, JCAP, Kionix,
KYEC, Kyocera, LG, Lingsen Precision Industries, Marvell, Maxim, Mcube, Mediatek, Melexis, Memsic,
Metaio, Microsistemler, Microsoft, MiraMEMS, Mobiplex, Mosoro, Motorola, Movea, MultiDimension,
Technology, Murata , NEC, Nike, Nikon, Nintendo, Nokia, Nvidia, NXP, Nyko, Orbotix, Panasonic,
Pantech, Pebble, PNI Sensors, QFO Labs, QST, Qualcomm, Qualtre, Recon, Rohm, SAE Magnetics,
Samsung, Senodia, Sensitec, SensorPlatforms, Sharp, Sigurd, Sixense Entertainment, SMIC, Sony, Sony
Mobile , Spreadtrum, STMicroelectronics, TCL, Teledyne Dalsa, ThalmicLabs, TI, TomTom, Toshiba,
Tronics, TSMC, TUMEMS, Vuzix, Whistle, Withings, Xfab, Xiaomi, Xsens, Yamaha, ZTE…

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Introduction
Combo sensors will almost triple from 2012 to 2013
• 2012 was seen by many as a turnkey year for consumer combo sensors, with high volume adoption in platforms such as
Samsung Galaxy S smartphones. Since then, many developments have occurred, and the market acceptance of combo
solutions has been extremely quick, not only for 6-axis IMU (adopted in a growing number of platforms) but also for 6-axis
e-compass (shipments are reaching new records every month). In addition, 9-axis solutions are being introduced to the
market and innovative solutions should follow: with integration of pressure sensing, processing units, and RF capabilities…
• The combo sensor market is estimated to be $446M in 2013, growing to $1.97B in 2018. This represents 21% of the global
inertial consumer market in 2013, and will grow to an impressive 66% by 2018. While smartphones and tablets are now
driving volume increases and adoption of combos, the picture should be different in 2018. The next market wave should
come from wearable electronics, where long-term market potential is huge. While combo sensors will take a significant
portion of total market share, opportunities will remain for discrete sensors: from accelerometers used in basic activity
trackers to gyroscopes for camera module stabilization.
• The road was not so easy for inertial combos and some challenges still need to be solved. Outside of the offering, which is
still smaller than with discrete sensors, combo sensors are sometimes said to be inaccurate or to create constraints for
placement on the board (for magnetic field detection: a tiny magnetometer die is often preferred than a larger combo
package). Footprint reduction was the only argument in favor of combos in the past. However it is fair to say that significant
achievements have been made in the past couple of months. Most of the past yield issues have been solved, leading to
lower price. In addition, combo solutions facilitate both qualification and testing at the integrator level, and development of
sensor fusion. This report describes the motivations for each type of combo and analyzes the timing for market adoption for
each end-application.

8. © 2013 • 8
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Introduction
4 players share 75% of the market, is there any room for
newcomers?
• STMicroelectronics is the global leader in the inertial consumer sensor market with 42% market share. Only InvenSense and
Bosch Sensortec are able to compete with it today. It is key to be able to control the different technologies or to establish
the right partnerships to sell a large range of combo solutions. ST is just starting to sell its own magnetometer in 2013,
while Bosch has been very active in launching new product lines since 2012. InvenSense has just partnered with Melexis as
an alternative source to AKM for the magnetometer die in 9-axis solutions, although this is not official information.
• Price is still sharply dropping, with IMUs sold to some large volume customers below $1 in 2013. To stay in the race, the 3
leaders are going to introduce technical innovations: monolithic integration of 6 to 9-axis, use of TSV, chip scale packaging,
and active capping…
• Current challengers and newcomers are eyeing this combo opportunity and expect to take market share while the supply
chain is not yet mature. Kionix, Freescale, Alps Electric, Fairchild, Maxim and more than 10 other companies are targeting
this market space. New business models are built and more fabless companies are likely to be involved in the combo
market. Details on newcomer technologies and roadmaps are provided in the report.

9. © 2013 • 9
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Introduction
Value is moving to function delivery with embedded sensor
fusion
• Sensor fusion developments must be taken seriously. There has been hype about it for many years and now we
start to see commercial implementation. The first real products with sensor fusion are already on the market,
such as sensor hubs in the latest smartphones and tablets from Samsung and more recently by Apple, with the
M7 processor in iPhone 5S. In addition, GPS chipsets with indoor navigation capability relying on MEMS sensors
are now available from CSR, Qualcomm and Broadcom.
• The report provides a detailed understanding of the sensor fusion roadmap and how it will impact the MEMS
industry:
– New market opportunities: For instance, context awareness functionalities are on the roadmap of various players
– New architectures: Sensor hubs as MCUs or low-power application processor core play an increasing role, while standardization
initiatives are ongoing
– Technical impact: Better inertial performance can be requested for some functions
– Change in value repartition: Different types of companies are playing in the sensor fusion ecosystem. We see the first signs of
consolidation as collaborations along the value chain are set up (Qualcomm with Cisco Systems, Aruba acquisition of Meridian,
Apple acquisition of WiFiSLAM…)

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Strong drivers for 6-axis IMUs
Discrete
accel & gyro
6-axis IMU
package
• Value proposition of IMUs is strong now
– It is generally smaller as discrete sensors:
• Common package and ASIC die generally
– Price is now lower:
• Yield has improved since the first IMU generations
– Such sensor combo facilitates integration by OEMs:
• One unique component to qualify
• Possibility to benefit from an optimized sensor fusion
library from the combo maker
• The only limitations are:
– Lower component choice than for standalone
sensors, although IMU availability is improving
– Risk that combo sensor companies get a large part of
the sensor fusion added value

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Global Market Evolution
Combo sensors strongly impact the market!
• The global market is growing from $1.76B in
2012 to $2.99B in 2018
– 2.96B to 7.88B units from 2012 to 2018!
• The market for discrete sensors starts to
decrease
– However opportunities remains with
applications such as wearable electronics or
cameramodule OIS
• Combo sensors will represent the majority of
the market from 2016
– 6 axis IMUs and then 9-axis solutions should
dominate
– ASP keeps decreasing and competition is
stronger than ever! IMUs are priced bellow $1
in 2013 already!
• Smartphones remain the application that will
drive the market for the next few years
– Then wearable electronics is the most
promising high-volume opportunity at
medium to long term

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Geographic Overview of Current Major Consumer Inertial
Players

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Historical evolution of revenue/player

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3-axis accelerometers
Key players and time to market
2010 2011 2012 2013 2014 2015
Development/Prototyping Sampling Mass production
Baolab (ES)
Bosch Sensortec (D)
Domintech (TW)
Freescale (USA)
Kionix (USA)
mCube (USA)
Memsic (USA/CN)
MiraMEMS (CN)
Qualtre (USA)
STMicro (IT)
Legend:

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Major 3-Axis Magnetometer Products
…2005… 2009 2010 2011 2012 2013
YAS529
YAS532
• 1.5x1.5mm²
YAS530
• 2×2×0.8mm3
AK8970N
• 2.5x2.5x0.7mm3
AK8975
HSCDTD008A
Yamaha
AKM
Alps Electric
• 1.6x1.6x0.7mm3
HSCDTD004A
• 2×2×0.6mm3
• Start of production
• 5×5×1mm3
AK8963C
• 1.6x1.6x0.5mm3

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Magnetic gyroscope
A typical type of intelligent sensor fusion
• Benefits of magnetic gyros / virtual gyros are high
– Much lower power consumption than a real gyro
• <1mA (450uA for the sensors + 500uA for MCU that can be needed for processing)
– No limitation on measurement range: 2000°/s can be achieved
– Better start-up time than a real gyro (20ms vs. 50-100ms)
– Lower cost solution
– Compact solution: 3x3mm² today for Kionix
• However there are some limitations
– Rotation information is delivered with about 5° accuracy today (vs. 2° for a real gyro)
– Trade-off between accuracy and responsiveness
• Potential of such device is high
– Answers the requirement for many functions such as gesture interaction
– But not pointing, and may be limited for gaming so far. But accuracy may keeps improving in the future
– An opportunity exists for:
• Low end smartphones that cannot afford a real gyro
• Potential high-end phones that could include it in addition to a real gyro to bring a lower power alternative (for context
awareness that needs always-on sensors…)
– Such function is an additional driver for the 6-axis e-compass type of market (quantified in this report)
Source Kionix

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Latest Developments in Indoor Navigation
Example of hot developments
CSR SiRFstarV™ Architecture
and SiRFusion™ Platform
 Launched in 2012
 Process data from MEMS sensors
with GPS information
Qualcomm IZat
 Launched in Nov. 2012
 GPS integrated with Wi-Fi line
of products: Atheros
 Fusion with Wi-Fi information +
with MEMS motion sensors is
enabled
 Accuracy within 5 meters
Apple
 Acquired WiFiSlam for $20M in March 2013
 The technology enables indoor localization
and mapping by using WiFi fingerprint data,
combined with data from inertial sensors
Movea
 Demonstration of indoor navigation technology at CES 2013
 Technology uses inertial sensors and map matching
 Partners include SNCF (FR) and SK Planet (KR)
mCube
 Sensor agnostic software
library announced in June
2013
 Relies on inertial sensor
signal processing +
mapping data

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More slides from the report…

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Available MEMS Reports
MEMS Cosim+
MEMS Manufacturing
Cost Simulation Tool
Ferro-Electric
Thin Films
MEMS
Microphone
Thin Wafer
Handling
Technology Trends
for Inertials MEMS
RF Filters, PAs,
Antenna Switches &
Tunability for Cellular
Handsets
Trends in MEMS
Manufacturing &
Packaging
Ferro-Electric
Thin Films
Motion Sensors for
Consumer & Mobile
applications
Uncooled Infrared
Imaging Techology &
Market Trends
IMU & Gyro for
Defense, Aerospace
& Industrial
Status of the
CMOS Image
Sensors
New!New!
Sensor fusion of
acceleros, gyros &
magnetometers
Infrared Detectors
Technology &
Market Trends
New!
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MEMS Front-End
Manufacturing
Trends
MEMS for Cell
Phones and Tablets
MEMS Pressure
Sensor
Status of the
MEMS Industry
New!
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New!

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