Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm. The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs. The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. COMPLETE TEARDOWN WITH: - Detailed Photos - Precise Measurements - Material Analysis - Manufacturing Process Flow - Supply Chain Evaluation - Manufacturing Cost Analysis - Selling Price Estimation - Comparison with previous technology choices from Sony More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
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44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
April 2014 – Version 1 – Written by Romain Fraux

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Glossary
1. Overview / Introduction 4
– Executive Summary & Reverse Costing Methodology
2. Camera Module Supply Chain & Companies Profile 7
– iPhone 5S Camera Module Supply Chain
– Companies Profile (Sony, LG Innotek)
3. iPhone 5S Teardown 12
4. Physical Analysis 15
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Camera Module 18
– Camera Module View & Dimensions
– Camera Module X-Ray
– Camera Module Disassembly
– CMOS Image Sensor 33
– View & Dimensions
– Pads, Tungsten Grid
– TSV Connections
– CIS Pixels
– Logic Circuit (Transistors, SRAM)
– Cross Section: Camera Module 50
– Overview
– Driver (Assembly & Process) & MLCC
– Ceramic Substrate, IR Filter & FPC
– Lenses, Housing, VCM
– Cross Section: CMOS Image Sensor 71
– Overview
– Pad Trenches
– Pixel Array Circuit
– Logic Circuit
– TSVs
5. CIS Manufacturing Process Flow 90
– Global Overview
– Logic Circuit Front-End Process
– Pixel Array Circuit Front-End Process
– BSI + TSV + Microlenses Process
– CIS Wafer Fabrication Unit
6. Cost Analysis 97
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– CMOS Image Sensor Cost 102
– Logic Circuit Front-End Cost
– Pixel Array Front-end Cost
– BSI & TSV Front-End Cost
– Color Filters & Microlenses Front-End Cost
– Total Front-End Cost
– Back-End: Tests & Dicing
– CIS Wafer and Die Cost
– Camera Module Assembly Cost 114
– Lens Module Cost
– VCM Actuator Cost
– Final Assembly Cost
– Camera Module Cost 119
Contact 122

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• This full reverse costing study has been conducted to provide insight on technology data and
manufacturing cost of the iPhone 5S camera module.
• The iPhone 5S iSight camera module holds a 8Mpixel resolution with dimensions of 8.5 x 7.8 x 5.7mm
and features 33% increase in light sensitivity compared to the previous iPhone according to Apple.
• This light sensitivity improvement is mainly due to the new CIS supplied by SONY and specifically
made for Apple which features a 1.5µm pixel size compared to 1.4µm for the previous sensor. This
rising of pixel size by keeping a similar CIS cost has been made possible by the use of the Exmor-RS
technology of SONY. This technology consists in a stacking of two separate chips: a pixel array circuit
and a logic ISP circuit. The circuits are connected together by the use of copper Through Silicon Via
(TSV), thus making a real 3D device.
• This technology offers 3 advantages: a reduction of the CIS die due to the stacking of the circuits, an
optimization of the processes for both circuits due to the separation of the pixels and the logic
transistors, and an optimization of the supply chain because logic circuits can be outsourced to
foundries.
• The camera module is equipped with “classics” 5-elements lens module and VCM auto-focus
actuator.

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Camera Module
with Flex Top View
Camera Module
with Flex Back View
Flex Marking
Camera Module with
Flex Global View
Connector 2x16 Positions
Flex PCB

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Barrel with Lenses
Metal Housing
Coil
Plastic housing #3
Ceramic Substrate
Plastic housing #1
Top Metal Cover
IR Filter
Camera Module Disassembly

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Reverse costing analysis represents the best cost/price evaluation given the publically available
data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a
+/- 10% correction on the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
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