3D Imaging & Sensing 2018 Reports by Yole Developpement

© 2018
Report
From Technologies
to Markets
3D Imaging &
Sensing
-
2018 Report
SAMPLE
© 2018

2
YOLE REPORT OBJECTIVES
Provide a clear understanding of applications and related technologies.
Company ecosystem identification and analysis:
• Major actors on a global basis
• Technical market segmentation
• Economic requirements by segment
• Key players by market and analysis
• Market size and market forecast in $M and M units
Use case analysis and market and technology trends involved:
• Determine applications range
• Detailed applications per market segment
• Technology identification for different products and processes
• Competing technologies
• Main technical challenges
Company
Ecosystem
Market
forecast
Technology
3D Imaging & Sensing – Market & Technology Report | www.yole.fr | ©2018
Use case
Market
Trend

3
METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenues (in $M)
Yole’s market forecast model is based matching several sources:
Information
Aggregation
Preexisting
information

4
TABLE OF CONTENTS (1/2)
o GLOSSARY 2
o TABLE OF CONTENTS 3
o COMPANY CITED 5
o REPORT OBJECTIVES 6
o METHODOLOGY 8
o EXECUTIVE SUMMARY 12
1 - INTRODUCTION 26
• What is 3D Imaging & Sensing?
• Market segmentation
• Noteworthy news
2- MARKET FORECAST 37
• Market forecast
• 2011 - 2023 3D Imaging & Sensing market(in Munits)
• 2011 - 2023 3D Imaging & Sensing ASP (in $)
• 2011 – 2023 3D Imaging & Sensing market (in $M)
3- ECOSYSTEM 49
• 3D Imaging & Sensing ecosystem mapping
• Mobile and consumer electronics ecosystem
4.1- APPLICATION TRENDS – MOBILE & CONSUMER 55
• Who can afford a smartphone?
• 2011–2022 Mobile handset forecast (in M units)
• 2011–2022 Penetration scenario of 3D cameras in
smartphones (in %)
• Mobile market trends
• Mobile application trends
4.2- APPLICATION TRENDS – MOBILE & CONSUMER 68
• Consumer market trend
• Consumer application trends
• Computing market trend
• Computing application trend
• Consumer robotics market trend
• Consumer robotics application trends
4.3 – APPLICATIONTRENDS – AUTOMOTIVE 87
• Automotive market trend
• Automotive applications trends
• Autonomous vehicles

5
TABLE OF CONTENT (2/2)
4.4 - APPLICATIONTRENDS – MEDICAL 104
• 2013 – 2023 Sensors for X-Ray CT forecast
• 2013 – 2023 Sensors for molecular imaging forecast
• 2013 – 2023 Sensors for 3D CBCT
• 2013 – 2023 OCT equipment forecast
4.5- APPLICATIONTRENDS – INDUSTRIAL & COMMERCIAL
103
• Commercial applications
• Industrial applications
• 2011–2023 3D imaging & sensing for commercial
applications forecast
• 2011-2023 3D imaging & sensing for industrial applications
forecast
• 2011- 2023 commercial robotics forecast
• 2011- 2023 automated guided vehicle forecast
4.6- APPLICATION TRENDS – SCIENTIFIC, DEFENCE & SPACE
116
• Surveying geosystems
• Geographical Information Systems
• Military drones
5.1- TECHNOLOGY APPLE IPHONE X TRUEDEPTH 138
5.2- TECHNOLOGYTRENDS - OPTICAL 3D 146
• Depth sensing technologies
• 3D imaging & sensing for consumer
• 3D imaging & sensing for the industry
• 3DTime of flight
• Simultaneous localization and mapping
5.3- TECHNOLOGYTRENDS - LIDAR 175
• 2011- 2022 lidar market forecast
• Lidar technology trends
5.4-TECHNOLOGYTRENDS – OTHER 3DTECHNOLOGIES
188
• Medical technology trends
• Industrial technology trends

6
II-VI,Abbott, ams,,Apple,ASC, BAE Systems, Bioptigen, Bosello, Canon, Continental, Core Photonics, Crystalvue,
Epcos, Faceshift, Fairchild, Faro, First Sensor, Finisar, Fujifilm, GE, Gestigon, IDS, Huvitz, IFM, IQE, iRobot, iRay,
Hamamatsu, Heptagon, Hexagon Metrology, Himax, Hokuyo, Hologic, Honeywell, Lee, Infineon, Keyence, Konica
Minolta, Kreon, LeddarTech, Leica, Linx, Lips, LMI, Lumentum, MantisVision, Medtech, Melexis, Namuga, Nidek,
Nikon, Nordson Dage, Nsi, Oculus, On Semi, Opto, Optopol, Orbbec, Pebbles, Olympus, Panasonic, Perceptron,
Philips Photonics, Pix4D, PMD, Quanergy, Sanan, Sensata, Samsung, Sensl, Sick, Siemens, Softkinetic, Soitec, Sony, St.
Jude Medical, STMicroelectronics,Teledyne Dalsa,Tetravue,Topcon,Toshiba,Trixell,Trinamix,Valeo,Varex,Varian,
Velodyne Lidar,Vieworks,Yxlon, Zimmer, Zeiss Meditech, and more…
COMPANIES CITED IN THIS REPORT

7
ABOUT THE AUTORS OF THIS REPORT
Biography & contact
Pierre Cambou
Pierre Cambou joined the imaging industry in 1999. Following an engineering degree from Université de Technologie de
Compiègne in parallel to a master of science from Virginia Tech in 1998, as well as graduating from Grenoble Ecole de
Management’s MBA, Cambou took several positions at Thomson TCS, which became Atmel Grenoble in 2001 and e2v
Semiconductors in 2006. In 2012 he founded Vence Innovation, now called Irlynx, in order to bring to market a disruptive man-
to-machine interaction technology. He joined market research and strategy consulting company Yole Développement (Yole) as
Principal Analyst,Technology & Market, Imaging in 2014, within the Photonics, Sensing & Display division.
Contact: cambou@yole.fr
Guillaume Girardin
Dr. Guillaume Girardin is Director of the Photonics, Sensing & Display Division at Yole Développement, part of Yole Group of
Companies. As director he also performs several technical activities covering sensing technologies, including solid-state lighting &
display, MEMS, sensors, actuators, imaging, photonics and optoelectronics fields.
Based on his valuable experience in the semiconductor industry, Guillaume manages the expansion of the technical and market
expertise of his team, by increasing synergies around imaging, lighting and display, and enlarging the optoelectronics scope. The
team interacts daily with leading companies allowing the analysts to collect a large amount of data and integrate their
understanding of the evolution of the market with technology breakthroughs. In parallel, Guillaume’s mission is focused on the
management of business relationships with leaders of the industry and the development of market research and strategy
consulting activities within theYole Group.
Dr Girardin holds a Ph.D. In Physics and Nanotechnology from the Claude Bernard University Lyon 1 (Lyon, France) and an M.Sc.
inTechnology and Innovation Management from EM Lyon School of Business (Lyon, France).
Contact: girardin@yole.fr
©2015 | www.yole.fr | Camera Module Industry3D Imaging & Sensing – Market & Technology Report | www.yole.fr | ©2018

8
WHATWE GOT RIGHT, WHATWE GOT WRONG
Technology and market forecast challenge
What we got right
o Introduction of 3D sensing in Mobile Q4 2017
o Use case of Mobile front 3D camera
o Involvement of STM and ams in the Apple 3D
sensing supply chain
o Opportunity for Sensor semiconductor and
3D camera module manufacturer is in line
with forecast
What we got wrong
o Apple used Structured Light approach notTime
of Flight for front 3D camera
o 3D imaging & sensing system used for Mobile is
therefore far more complex than imagined,
boosting the ASP
o Opportunity for Illumination (VCSEL
semiconductor) is x5 and optics for illumination
side x2.5

10
WHAT IS 3D IMAGING & SENSING?
Two distinctive approach but many bridges
3D imaging
and sensing
can be a heavy
computation
exercise
Stereo
Human vision
Stereo
Camera
Depth sensing
Camera
Depth Map
Image
Stereo
Images
3D Model 3D CAD – CGI
Stereo or 3D
Display
3D Imaging
3D Sensing

11
CROSS SEGMENTATION
3D imaging &
sensing is
everywhere
CTScanner
FlatpanelCT
ConeBeamCT
SFM
StereoCameras
Projectionbased
Timeofflight
Timegated
FT-OCT
SS-OCT
Lidar
Steablelaser
Flashlidar
SyntheticAperture
Phasedarrays
Scientific/Space
Defense
Industrial
Medical
Automotive
Consumer
X Ray CT Optical 3D Optical CT Lidar Radar Ultrasonic
Not covered
in this report

12
WHAT IS TAKEN INTO ACCOUNT BY THE ANALYSIS
From sub-components to systems
Analysis from
the sub
component
point of view
Courtesy of SystemPlus
3D Camera
Modules
SystemsSub-components
Sensor, optics
& illumination
Courtesy of PMDTech
Courtesy of Apple
Minimum resolution
50 pixels x 50 pixels arrays
Optics
Module Assy
IlluminatorSensor array
Wafers &
raw material
Courtesy of Sony

13
Embedded 3D
computationalPhotography
and video
MOBILE PHONE MARKET TRENDS
Mobile phone cameras have become multi-sensor optronics interfaces
3D cameras
on all devices
is still early
stage
Number of sensors
1 sensor
2 sensors
3 sensors
3+ sensors
20202012 2014 2016 2018 2022
• Main and
sub-camera
• LED flash
• Main and
sub camera
• Range finder
• LED flash
Catching up with
DSLR and video
cameras
New embedded 3D imaging
Courtesy of Panono
Courtesy of Sony
Embedded 3D
interactive
The world becomes interactive
• Dual main and
sub-camera
• 3D mapping
• VR localization
Courtesy of Microsoft
• Dual main or
sub-camera
• 3D mapping
• LED illuminator
©2016 | www.yole.fr | Status of the CMOS image sensor industry3D Imaging & Sensing – Market & Technology Report | www.yole.fr | ©2018

14
MOBILE FRONT 3D CAMERA
Use cases and opportunities of the front 3D camera
“Wow effect”,
technology
leadership, and
numerous
business
opportunities
for multiple
products
Enhanced
video call
Morphing
Security
(Facial recognition)
Gaming
(Avatar)
Easy
unlocking
 Background removal, direct eye-contact
 Morphing: real-time
filters (AR, face-swap)
on Facebook,
Snapchat, Instagram
Structured light approach not fully compatible with long
lasting application for now (High power consumption)

15
UNLOCKING THE NEXT DECADE
2027
2017
Beginning of the
3D imaging era
1.4Mp NIR GS Camera
ToF Proximity sensor
Flood IR Illuminator
7Mp RGB camera
FRONT Side
FRONT Side
Structured Light approach has been chosen as a
starting point for the 3D imaging era.The front 3D module
could evolve toward ToF technology in the future, showing
more reliability in direct sunlight and lower computation
need.
REAR Side
2D Camera
+3D Camera
for interaction
Multi-camera
System
for photography
Applications vs.Yole’s expectations
DOT IR Projector

16
MOBILE REAR 3D CAMERA
Use cases and opportunities of the Rear 3D camera
| 3D Imaging & Sensing | www.yole.fr | ©2018
Potentiality of
Augmented Reality
Use cases for Mobile remains a
hard call :
• Augmented sales pitch
• Augmented gaming
As far as 2018 appeal of use cases
are not yet market proven and
could remain a niche feature in the
future.
Is it worth
an added
3D sensing
hardware ?

17
Consumer
Automotive
Medical
Industry/Commercial
Scientific/Defense/Space
2023e - 3D Imaging & Sensing
revenue breakdown
by markets
Consumer
Automotive
Medical
Industry/Commer…
Scientific/Defense/Space
2017 - 3D Imaging & Sensing
revenue breakdown
by markets
3D IMAGING & SENSING MARKET FORECAST (IN $M)
3D Imaging &
Sensing is
becoming a
consumer market
2017
$2,062M
2023e
$18,524M
Courtesy of Apple
X9
CAGR +44%
Market 2017 2023e CAGR
Consumer 375 13,773 82%
Automotive 391 2,383 35%
Medical 186 240 4%
Industry/Commercial 841 1,658 12%
Scientific/Defense/Space 268 471 10%
TOTAL 2,062 18,524 44%

18
MOBILE MARKET TREND
Apple introduced its
trudepth camera end
of 2017 establishing
the trend for 3D
front facing cameras
Due to the high cost
of the solution the
wave has started on
conservative side in
terms of volume
We are less bulish for
rear 3D business case
as a lack of
momentum forVR is
not supporting the
trend
Adoption curve
of smartphone
features are
similar
3D camera adoption scenarios

19
3D IMAGING & SENSING MARKET FORECAST
From high end
to consumer
revenues
increase x10
fold
In the last two years
the market for 3D
imaging & sensing
hardware doubled.
Due to higher ASP cost
than initially envisioned
market horizon has
increased toward $18B
Consumer will reach
$14B by 2023

20
2018-2023 MOBILE AND CONSUMER 3D SENSING ECOSYSTEM
The consumer
ecosystem for 3D
sensing is a
complex
intermixing of
partnerships
Sensor
Illumination
Software &
Computing
3D System
Design
$6.2B market
in 2023
$2.2B market
in 2023
$2.7B market
in 2023
Optical path
3D camera
module Mfg
$4.4B market
in 2023
| 3D Imaging & Sensing | www.yole.fr | ©2018

21
3D IMAGING AND SENSING TECHNOLOGIES
Depth-sensing technologies in mobile devices
(Source:Yole Développement, 2018)
Stereo vision Structured light Time of Flight
Image resolution Several Mpix Max. 1–3 Mpix Max.VGA
Hardware
Simple cameras
Complex system
Demanding illumination
Complex system
Simple illumination
Complex sensors
Computation power High Medium Low
Limitations
May require illumination
in low light
Best indoors
Need power
Best indoors
Low resolution
Picture
(example)
Best suited for Robotic navigation 3D mapping Short-range gesture capture
Maturity High Medium Low
Players
Courtesy of ams
Courtesy of
PMDTech
Courtesy of Apple

22
3D IMAGING AND SENSING TECHNOLOGIES
Available approaches
3D is a new
frontier for
imaging
sensors.
Courtesy of
Lytro
Courtesy of
Lenovo
Courtesy of
Heliotis
Courtesy of
Intel
Courtesy of
Stereo Labs
Courtesy of
Keyence
Courtesy of
Light
Interferometric
(OCT) Time of Flight Structured light Laser
triangulation
Plenoptic Stereo vision Computational
Time-gated
Structure from
motion
Computed
tomography
Multiple
frame
3D
Single
frame
3D

23
3D IMAGING & SENSING MARKET FORECAST
On going market revolution
The age of 3D
is here
• 2017 kick-started 3D imaging & sensing revenues with revenues above $2B and quantities in the
order of 35 Million Units.
• Thanks to semiconductor miniaturization advances, new 3D technologies are able to serve the
consumer market which is now well under way in 2018. The expected volume growth is 89% CAGR
for the next 5 years, revenue wise growth is expected at 44% CAGR.
• Aside of consumer, automotive market for 3D imaging and sensing devices will see large growth of
35% CAGR in the next 5 years due to advancer driver assistance systems (ADAS) and autonomous
driving (AD) efforts.
• The initial growth in 3D imaging & sensing for medical is behind us and will follow the growth rate of
the industry of 4% as it will fight price erosion.

24
RELATED REPORTS

With the introduction of the iPhone X in
September 2017, Apple set the standard
for technology and use-case for 3D sensing
in consumer. Apple contrived a complex
assembly of camera modules and light sources
using structured light principles, along with an
innovative NIR global shutter image sensor
from STMicroelectronics. From our initial
depiction of the market in March 2017, the
main gap is in illumination ASP, which is greater
than expected. High expenses in dot and
flood illumination VCSELs from Lumentum/
II-VI/Finisar, along with the dot illuminator
optical assembly from ams, are the biggest
technology surprises powering Apple’s $1,000
smartphone.
Yole Développement (Yole) expects the global
3D imaging & sensing market to expand from
$2.1B in 2017 to $18.5B in 2023, at a 44%
CAGR. Along with consumer, automotive,
industrial, and other high-end markets will also
experience a double-digit growth pattern.
The transition from imaging to sensing
is happening before our eyes. Artificial
intelligence (AI)-powered devices and robotics
are gaining a better understanding of their
surroundings, and developing a new level of
interaction with humans. 3D imaging & sensing
technology is currently delivering on its early
promises. Despite half-successful attempts like
Xbox’s Kinect technology and Leap-Motion
hand controllers, 3D sensing is now tracking
towards ubiquitousness. Technology providers
of global shutter image sensors, VCSELs,
injection-molded and glass optics, DOEs, and
semiconductor packaging are all benefiting,
and this latest edition of Yole’s popular report
offers you key insights for navigating the 3D
imaging & sensing revolution.
A 3D IMAGING & SENSING MARKET REVOLUTION HAS BEGUN
3D IMAGING & SENSING 2018
Market & Technology report - June 2018
The iPhone X initiated a trend.What happens next?
3D imaging & sensing revenue breakdown by markets
WHAT’S NEW
• Updated mobile adoption rate/
ASP/revenue forecasts through
2023
• Forecast analysis per sub-
components
• Added scenario for mobile rear 3D
camera
• Expected supply chains from the
Android camp
• 3D imaging sensing ecosystem
update
• Updated trends for all markets
• Special technology focus on the
iPhone X release
• Technology cost breakdown
• New technologies
OBJECTIVES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
Ecosystem identification and analysis:
• Determination of the application
range
• Technical market segmentation
• Market trends and forecasts
• Key players, by market and
analysis
Analysis and description of markets
and technologies involved:
• Detailed applications per market
segment
• Major global actors
• Technology trends
• Main technical challenges
KEY FEATURES OF THE REPORT
• Market forecast (in Munits and $M)
through 2023
• Ecosystem mapping
• Application trends - mobile and
consumer, automotive, medical,
scientific, space, and defense
• Technology trends - optical 3D/
lidar/other WHAT’S NEXT?
In the consumer world, smartphone players
are now quickly revising their own 3D sensing
strategy. Oppo made the first announcement
beginning of the year with Orbeec, while
Xiaomi released the Mi 8 explorer edition
with Mantis as a technology partner. We
expect Huawei to release its own solution
soon, probably partnering with ams and Sunny
Optical. 3D-enabled smartphones started off
in-line with our previous forecast, which was
conservative due to the solution’s high cost.
In fact, players like Himax are currently paying
Consumer
$13.8B
CAGR: 82%
Automotive
$2.4B
CAGR: 35%
Medical
$0.2B
CAGR: 4%
Industry/Commercial
$1.7B
CAGR: 12%
Scientific/Defense
/Space
$0.5B
CAGR: 10%
Consumer
$0.4B
Automotive
$0.4B
Medical
$0.2B
Industry/
Commercial
$0.8B
2017
$2.1B
2023e
$18.5B
Courtesy of Apple
x9
CAGR 44%Scientific/Defense/Space
$0.3B
(Yole Développement, June 2018)

Mobile and consumer 3D sensing ecosystem in 2018-2023
3D IMAGING SENSING 2018
COMPLEX SUPPLY CHAIN CONSIDERATIONS
One of the key learnings from 2017 is the
impressive complexity of consumer 3D imaging
sensing hardware and software. In 2016 we
witnessed the sophistication of the Google
Tango-enabled smartphone, the Lenovo Phab 2
Pro, which included a PMD time of flight sensor,
an Omnivision NIR global shutter, and a Samsung
RGB image sensor. The current implementations
are not as simple as one would have initially
thought; in fact, complexity has increased. This
is not a first for Apple, which developed a similar
strategy for smartphone cameras - one that saw
the company radically increase camera module
complexity in early 2010’s, and subsequently
leave the competition behind.
In this context, the ecosystem must adapt
towards performance. Only a few players can
actually deliver at the level of market demand. A
few names of the supply chain:
1) Wafer and epiwafer manufacturers : SOITEC
and IQE;
2) Sensor semiconductor companies : Sony,
Samsung, Omnivision, STMicroelectronics, On
Semiconductor, and Panasonic;
3) VCSEL suppliers : Lumentum, Finisar, II-VI, ams-
Princeton Optronics, and Philips Photonics;
4) Packaging houses : Tong Hsing, Xintec;
5) Optical module companies : ams, Himax;
6) Module assembly players : LG Innotec, Sunny
Optical, Semco, and O-Film.
Unlike previous sensing components, the
responsibility of system design does not fall on
the OEM - instead, a specialist is required, such
as the Primesense team that Apple acquired in
2013, or other firms like Mantis, Orbbec, and ams,
which want play the “specialist” role in the new
3D imaging sensing ecosystem. Such players
orchestrate the final solution while allowing room
for the best in each sub-component category.
Is 3D imaging sensing now ripe for disruption?
Yole expects it will take at least 2 -3 years before
any new solution start dramatically lowering total
system cost.
2013-2023 penetration scenario for 3D cameras in smartphones
COMPANIES CITED IN THE REPORT (non exhaustive list)
II-VI, Abbott, ams, Anritsu, Apple, ASC, BAE Systems, Bioptigen, Bosello, Canon, Continental, Core Photonics,
Crystalvue, Epcos, Faceshift, Fairchild, Faro, Finisar, First Sensor, Fujifilm, GE, Gestigon, IDS, Huvitz, IFM,
IQE, iRobot, iRay, Hamamatsu, Heptagon, Hexagon Metrology, Himax, Hokuyo, Hologic, Honeywell, Lee,
Infineon, Keyence, Konica Minolta, Kreon, LeddarTech, Leica, Linx, Lips, LMI, Lumentum, Mantis Vision,
Medtech, Melexis, Namuga, Nidek, Nikon, Nordson Dage, Nsi, Oculus, On Semi, Opto, Optopol, Orbbec,
Pebbles, Olympus, Panasonic, Perceptron, Philips Photonics, Pix4D, PMD, Quanergy, Sanan, Sensata, Samsung,
Sensl, Sick, Siemens, Softkinetic, Soitec, Sony, St.Jude Medical, STMicroelectronics, Teledyne Dalsa, Tetravue,
Topcon, Toshiba, Trixell, Trinamix, Valeo, Varex, Varian, Velodyne Lidar, Vieworks, Yxlon, Zimmer, Zeiss
Meditech, and more.
the price for a lower-performance offering and
are struggling to get design-ins beyond AR/VR
headsets for Microsoft.
Once the alternative supply chains for Android
smartphones are in place, the adoption/
attachment rate should accelerate and move from
13.5% in 2018 to 55% in 2023. The attachment
on the phone’s rear (world) face remains a key
question, as AR/VR has yet to show proven
sales momentum. Yole nevertheless forecasts
an emergence of rear 3D camera, though with
limited penetration. Other notable next steps
should include expansion into other consumer
devices, and in automotive. In particular, consumer
robotics should highly benefit. The high-end
markets, i.e. medical, industrial, and scientific, are
already well-accustomed to the modality and will
accelerate adoption.
2013 2014 2015 2016 2017 2018e 2019e 2020e 2021e 2022e 2023e
2017 forecast – Accelerated 2017 forecast – Nominal 2017 forecast – Conservative Actual forecast
20%
40%
60%
80%
100%
Penetration of
fingerprint
sensors
Next
innovation
Rear 3D ?
Penetration of
dual rear
cameras
Penetration
of front 3D
cameras
Penetrationoftechnology(%)
Sensor
$2.7B market in 2023
Software computing 3D system design
Illumination
Optical path
3D camera module OEMs

MARKET TECHNOLOGY REPORT
Find more
details about
this report here:

Glossary 2
Table of contents 3
Companies cited 5
Report objectives 6
Methodology 8
Executive summary 12
Introduction 26
What is 3D imaging sensing?
Market segmentation
Noteworthy news
Market forecast 37
Market forecast
2011-2023 3D imaging sensing market
(in Munits)
2011-2023 3D imaging sensing ASP (in
$)
2011-2023 3D imaging sensing market
(in $M)
Ecosystem 49
3D imaging sensing - ecosystem
mapping
Mobile and consumer electronics
ecosystem
Application trends - Mobile 55
Who can afford a smartphone?
2011-2022 mobile handset forecast (in
Munits)
2011-2022 penetration scenario for 3D
cameras in smartphones (in %)
Mobile market trends
Mobile application trends
Application trends - Consumer 68
Consumer market trends
Consumer application trends
Computing market trends
Computing application trends
Consumer robotics market trends
Consumer robotics application trends
Application trends - Automotive 87
Automotive market trends
Automotive application trends
Autonomous vehicles
Application trends - Medical 104
2013-2023 forecast: sensors for X-Ray
CT
2013-2023 forecast: sensors for
molecular imaging
2013-2023 forecast: sensors for 3D
CBCT
2013-2023 forecast: OCT equipment
Application trends - Industrial
commercial 103
Commercial applications
Industrial applications
2011-2023 3D forecast: imaging sensing
for commercial applications
2011-2023 3D forecast: imaging sensing
for industrial applications
2011-2023 forecast: commercial robotics
2011-2023 forecast: automated guided
vehicles
Application trends - Scientific, defense,
and space 116
Surveying geosystems
Geographical information systems (GIS)
Military drones
Technology trends - Apple iPhone X
TrueDepth 138
Technology trends - Optical 3D 146
Depth-sensing technologies
3D imaging sensing for consumer
3D imaging sensing for the industry
3D Time-of-Flight
Simultaneous localization and mapping
Technology trends - LIDAR 175
2011-2022 lidar market forecast
Lidar technology trends
Technology trends - other 3D
technologies 188
Medical technology trends
Industrial technology trends
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the CMOS Image Sensor Industry
2017
• Camera Module Industry Market and
Technology Trends 2017
• Sensors for Robotic Vehicles 2018
• Apple iPhone X Teardown and
Identification of Key Components
• Intel RealSense D435 3D Active
IR Stereo Depth Camera
RELATED REPORTS
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AUTHORS
Pierre Cambou earned an
Engineering degree from Université
de Technologie de Compiègne and a
master’s of Science from Virginia Tech
in 1998, and graduated from Grenoble
Ecole de Management’s MBA. He joined
the imaging industry in 1999, holding
several positions at Thomson TCS,
which became Atmel Grenoble in 2001
and e2v Semiconductors in 2006. In 2012
Pierre founded Vence Innovation, now
called Irlynx, in order to bring to market
a disruptive man-to-machine interaction
technology. In 2014 Pierre joined
market research and strategy consulting
company Yole Développement (Yole) as
Principal Analyst, Technology Market
- Imaging, which is within the Photonics,
Sensing Display division.
Dr. Guillaume Girardin is Director
of the Photonics, Sensing Display
division at Yole Développement, part
of the Yole Group of Companies. As
director he oversees several technical
activities related to sensing technologies,
including solid-state lighting display,
MEMS, sensors, actuators, imaging,
photonics, and optoelectronics fields.
With his extensive experience in the
semiconductor industry, Guillaume
ably manages the growth of his team’s
technical and market expertise by
increasing synergies around imaging
and lighting/display, and enlarging the
optoelectronics scope. Through daily
interactions with leading companies,
his analysts collect large amounts of
data and integrate their understanding
of the market’s evolution with the
latest technological breakthroughs.
Guillaume also focuses on managing
business relationships with industry
leaders, as well as the development of
market research and strategy consulting
activities within the Yole Group.
Guillaume holds a Ph.D. in Physics
and Nanotechnology from the Claude
Bernard University Lyon 1 (Lyon,
France) and a M.Sc. in Technology and
Innovation Management from EM Lyon
School of Business (Lyon, France).
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and
image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced
Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
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CONSULTING AND ANALYSIS
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• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
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More information on www.i-micronews.com/reports

© 2018
Yole Développement
From Technologies to Market
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2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – 4 DIVISIONS
Life Sciences
Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o BioTechnologies
Power
Wireless
o RF DevicesTechnology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o SemiconductorManufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS,Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

3 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
MA with our partner)
www.yole.fr
o Syndicated reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays,forums,…
www.i-Micronews.com

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market,technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
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ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVINGTHE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators,end-
users and software
developpers
Device manufacturers
Suppliers:material,equipment,
OSAT,foundries…
Financial investors,RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
FromA to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting andKnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die andInterconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Integrated Passive Devices (IPD) 2018
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound technologies for Medical, Industrial and Consumer 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications– Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip– Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent LandscapeAnalysis
− RF Acoustic Wave Filters Patent LandscapeAnalysis
− NMC Lithium-Ion Batteries Patent LandscapeAnalysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ON L IN E ON SITE IN PERSON
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Events Webcasts
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to reach global audiences.
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campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility,networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly,and
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understanding each other is
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for meeting in-person.Events
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Targeted audience
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Benefit from the i-Micronews.com
traffic generated by the 11,200+
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10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier (veyrier@yole.fr),Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTINGANDSPECIFICANALYSIS,REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest ofAsia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: MavisWang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez,EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy,CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnershipwithWoodside
CapitalPartners)
• Jean-Christophe Eloy,CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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