1. YoichiroImamura
Email: immr56jiji@gmail.com
jiji-immr_56@ab.auone-net.jp
Mobile: 070-1316-8060
Home Address: Yatabe 34-22, Tsukuba-City, Ibaraki-Pref.
Date of Birth: 25th-March’56
Nationality: Japan
Quality Manger
Plant Manager / Business Unit Quality Manger / Wafer Fab Quality Manger / Failure Analysis Lab Manager
Creative talented to drive settlement of technical issues in production line and also in customer site through
comprehensive marketing plan/situation, understanding the gap between customer requirement/product
performance. Strong initiator to realize “Build In Quality” in Business Plan execution. Excellent communicator
able to positively represent company or factory at all our customer visit/audit, and scientific society,
Acknowledge for capability to build product value in each process, boost company revenues by each process
prioritizing. Be a playing manager to be no bounds of the responsibility.
Professional Strength
・Process Development ・Project Management ・Staff Leadership
・Statistical Process Control ・Customer Communication ・Staff Education
・Monitoring Methodology ・Change Control ・Compliance Management
・Product Failure Analysis ・Test Module Design ・Staff Evaluation
・ISO Audit ・Quality Assurance ・Quality System
・Continuous Improvement ・8D (CA/PA) ・Device Structure
Core Competencies & Value Offered
Production Process Control Knowledge: Define key parameters to be monitor based on FMEA (Failure Mode and
Effect Analysis). Analyze process anomaly from statistical data, Cp/Cpk etc. Enhance PDCA
(Plan/Do/Check/Action) to drive continuous improvement.
Quality System: Understand customer requirement and establish it into Quality System. Drive customer audit and
ISO activity. Make clear assurance responsibility.
Cross Functional Communication: Act as playing manager across organizations internally and also externally.
Align business direction among relative organization; Business team, Factory site, Subcon, etc. for priority,
strategy, tactics, indices, in order to maximize team performance and business result. Negotiate critical issue with
stakeholder to close gap. Lead collaboration work with internal team; Engineering, Manufacturing, Facility and
Plant manager.
Staff Leadership: Train and motivate highly qualified and experienced engineering and manufacturing. Align
future plan for personal education with staff. Fairly evaluate staff performance by daily communication and
periodical F2F review. Support yearly education plan of staff. As a Technical Ladder in Texas Instruments, I

2. sometimes had technical training or lecture for engineering and/or my staff. I also supported technical issue for
my bright area by editing some technical & customer document for my staff.
Technical Initiation: Design and develop new tool by individual idea and technical perspectives, for instance new
TEG (Test Element Group) proposal to make easy of process monitor and maximize process yield.
Selected Performance Highlight
Prefer active state rather than Ataraxia. Like to attach problem and resolve critical issue with team. In my history,
51% in Wafer Fab process Development, 22% in Wafer fab production sustaining, 27% in Quality at HQ.
Cost Reduction Projects in Wafer Fab
Executed a lot of cost reduction activities in Wafer Fab Engineering through PM (Preventive Maintenance), VA
(Value Analysis) & VE (Value Evaluation), COO (Cost Of Ownership), Cp/Cpk, six sigma, CA (Corrective
Action)/PA (Preventive Action), etc. Resulted in better TAT average/sharp TAT distribution/stable process yield &
probe yield (from ~60% to ~80%).
Developed many devices and projects in Wafer Fab
Launched below devices on time. Contributed fill out wafer fab loading through success of many projects in wafer
fab. Support wafer loading for production cost reduction/better strategic device loading portfolio.
(1) CCD (Charged Coupled Device) for digital camera; auto focus, security and medical.
(2) DRAM (Dynamic Random Access Memory) of 1Mbit and 4Mbit
(3) LCD drivers for general applications
(4) GENERIC Logic devices for cost reduction
(5) ANALOG devices for hard disk driver, Maxtor, HGST, Seagate
(6) Proposed new TEG (Test Element Group) design and structure to monitor critical process performance
Support Wireless Terminal Business Unit in Japan market
Fully supported new Wireless Business in Japan as Quality manager. As the result, 75% of Texas Instruments
Japan revenue came from Wireless business sales in the year (~1B$). Rightly took pride in this achievement in
my job history.
CQE always gets customer complain, and is not to be a thankless job. However I got words of customer praise
when I had resolved very big problem of our package issue, only one time. At that time, we had to stop customer
production for few months. Total cost damage of customer and our business was huge. However I could close
this big problem without collapse of business relationship together. I visited the customer 2 or 3 times every week,
and informed our status and schedule update to get customer reliance until closed it. It was my best practice of
customer support experience.
(1) Built good reliance with US business team, not only Quality team, and customers
(2) Got an agreement of our team activity & analysis priority with all our customers, and manage those in my
team
(3) Developed new FA work flow and instruct/propose technical solution to realize it
(4) Shared customer major issue/failure rate/suspected root cause, then aligned the priority to be solved with
US business team
(5) Proposed and executed periodical quality meeting with each customer
(6) Organize urgent quality meeting with US, France, Japan team in order to decide our action plan
(7) Improved device quality in few device generations, for instance OMAP16xx, 24xx, 34xx. The indices were
customer return rate and failure rate in customer production line and also field failure rate in DPPM, for

3. instance from ~300DPPM to ~20DPPM in leakage related failure.
(8) Finalize 8D report for customer submission, communicate/negotiate among business team and production
site of issue origin. Edited and modified 8D report, additional analysis/simulation/another verification/new
counter action. Prioritized analysis cycle time and 8D report by device (Generic or Automotive device) and
by customer.
(9) Managed FA (Failure Analysis) report cycle time
Support Automotive Customer Business
Especially supported Japan North Area customers for automotive products.
Career Progression
Texas Instruments Incorporated, Tokyo Japan
Semiconductor manufacturing company with 12$B sales world wide with manufacturing sites in the United
States, Europe, and Asia
Customer Quality Engineering, Manager, May’09 ~ June’14
+ Mainly charged for Tokyo and North Japan area customers
+ Continuously Improved device quality, provide 8D report, maintained customer communication, for consumer
and automotive devices
+ Satisfied customer on specific device quality issues by full support of technical knowledge, report content and
presentation
Wireless Terminal Business Unit Customer Quality Engineering Manager, Sep’05 –
April’09
+ Managed Wireless Terminal Business Unit, Customer Quality team under American Boss. Supported all
customer issues and contributed quick production ramp of customer projects of major Japan mobile phone
companies, Mitsubishi, SHARP, NEC, Panasonic, Fujitsu.
+ Resolved all customer issues, mainly product quality issues (production/field failure rate, test coverage,
package design, logistics and Assy’) with WW team by discussion and communication with HW/SW team,
product engineering, and reliability specialists.
+ Executed production line audit of Texas Instruments internal site and Subcon in Japan, Taiwan, Thailand,
Philippines, etc.
+ Directly helped US Business for critical quality issues on customer production based on WW Wireless Division
QA manager request, because blight QA engineer on production control methodology is very rare.
+ Provide a lot of documents to help customer understanding of various technical and reliability issues, for
example; PCN (Process Change Notice), Wafer Fab Process Information, Failure Mode Mechanism, 8D report
content and the meaning, Audit Documents, etc.
+ Nominated Internal Technical Conference several times
+ Presented Quality & Reliability Symposium in Dallas
Process Development Engineer in MIHO Wafer Factory, April’83 – August’05
+ Achieved many projects to success as Project Leader, Logic Devices.
+ Developed new process technologies for new products by individual technical knowledge, CCD (Charged
Coupled Device), and Memory devices.
+ Realized cost reduction by process flow simplification
+ Obtained a patent of original process methodology

4. + Support high volume production ramp and sustained the production, Memory Devices.
+ Continuously improved test yield
+ Nominated Internal Technical Conference several times
+ Published technical report on Semiconductor Magazine one time, to Japan Applied Physics two times.
Process Development Engineer in Hatogaya Factory, 1981 – 1983
+ Developed process conditions for new product, imaging products, CCD line sensor and area sensor
+ Stabilized process performance and realize simple process control
Award & Election
+ Elected MGTS (Member, Group Technical Staff) by excellence in technical contribution to Texas Instruments in
1997.
+ Patent Incentive Award in 1996
+ Patent Incentive Award in 2001
Education
+ Graduated Tokyo University of Agriculture and Technology, Master course of Inorganic Industrial Chemistry
+ Graduated Chiba University, Industrial Chemistry
+ Graduated National Institute of Technology, Miyakonojyo College
Computer Skill & Qualification
+ Word, Excel, Power Point, MS Project
+ Numerous internal training of Management, Quality, Statistical process control, FMEA, VA/VE, Six sigma,
Ethics, Harassment, etc.
+ Authorized Chief Engineer of Specific Chemicals
+ AED (Automated External Defibrillator)
Language
English: Business level
Japanese: Native
A Graduation Thesis
- Study of Lattice Transition Kinetics of NiCo alloy
- Decomposition Characteristic Study of Inorganic Material, ex; Calcium Carbonate.
- Analysis and study between Rare Metal Concentration in Hot Spring and Geological Feature at the Japan
Fossa Magna

5. Experienced Analysis method by equipment list
- Ion Chromatography
- Gas Chromatography
- X-ray Diffraction Analysis
- XRF (X-ray Fluorescence Analytical Method)
- RBS（Rutherford Backscattering Spectrometry）
- DTA（Differential Thermal Analysis）
- EPMA (Electron Probe Micro Analysis)
- EDX (Energy Dispersive X-ray spectroscopy)
- SEM (Scanning Electron Microscopy)
- TEM (Transmission Electron Microscope)
- FT-IR (Fourier Transform Infrared Spectroscopy)
- Auger (Auger electron spectroscopy)
- Others, qualitative & quantitative analysis