2. Chuck Table
Main Function of Chuck Table
Mainly used to support and chuck the
semiconductor wafer when grinding and
dicing. It is applied in the process of thinning,
dicing, clearance, transportation and so on.
Silicon
Wafer
Chuck table
5. Chuck Table
Chucks and silicon photos
Transportation Chucks
Transportation ChucksFace side
6. Chuck Table
Characteristics
High flatness and parallelism.
Compact and uniform microstructure with high
strength.
Good permeability and uniform adsorption
affinity.
Long life time.
Dressing easily.
7. Chuck Table
Thinning chucks and machines
Disco company
Disco 810 , 83H/6 , 82IF , 800series , 8000
series
G&N company
G&N 300 , 400 , 500 , 700 , 940 , Multi Nano 3-
300
Strasbaugh company
7AF
Okamoto company
VG401 , VG502
ACCREFECH -Tokyo Seimitsu
PG200 、 PG300
AM company
VRG250S
8. Chuck Table
Disco machines
DGP 8760
Polishing machine
DFP 8140
DFP 8160
DFG
8540
DFG
8560
DAG 810
DFG 830
DFE 8060
DFG 81H/6
DFG 83H/6
DFG 82IF/8
8000
series
800
series
Silicon thinning machines Silicon polishing machines
IF series
Creep
series
DFG 841
Note: our chucks can match with the machines
marked with red characters.
10. Chuck Table
Thinning chucks with Disco machine
Grinding processes on Disco dicing machine
In-feed : Disco DFG
82IF/8 used this kind of
process. Front side
matched with
DFG
82IF/8
Back side
matched with
DFG 82IF/8
11. Chuck Table
Thinning chucks matched with Disco machine
Creep: Disco DFG 83H/6 used this kind of process
Front side ,
matched with
Disco 83H/6
21. Chuck Table
Precision parameter of dicing chuck
Material chuck size parallelism
Stainless steel and
porous ceramic
4" 2μm
6" 2μm
8" 3μm
12" 10μm
Note: We can make the precision according to the
customers’ requirements.
22. Chuck Table
Dicing machines
Disco company
automatic machine : 600series 、 6000series
semi-automatic : 300series 、 500series 、 600series 、
3000series
ADT company
ADT 7100series 、 7200series
ACCREFECH -Tokyo Seimitsu company
ACCREFECH A-WD series