Sam Mahin-Shirazi

Ithaca, New York Area United States

Doctoral Research Assistant at Integrated Electronics Engineering Center (IEEC)

Electronics / Computer Hardware

- Extensive packaging materials expertise, particularly in package and board level assembly reliability, failure analysis and Surface Mount Technology (SMT) process - In-depth understanding of microstructure and thermo-mechanical response of lead-free solder joints - Certified Lean Six Sigma Green Belt with knowledge of Design Of Experiments (DOE), statistical analysis and Failure Modes and Effects Analysis (FMEA) - Experience with Printed Circuit Board (PCB), reflow oven and stencil printing printing • Material Characterization Techniques: SEM, EBSD, EDX •Thermal Analysis Testing: Differential Scanning Calorimetry (DSC),Thermal Gravimetric Analysis (TGA) •Board-level and joint